JP2001185648A - Semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a semiconductor device for facilitating a wiring step and improving the degree of freedom of designing wirings. SOLUTION: The semiconductor device comprises a plurality of IC packages 11 having connecting terminals 12a to 12d on an upper surface and connecting terminals of different application from that of connecting terminals 3 of a bottom, a mounting board 2 for mounting the plurality of the packages 11, and a connecting board 13 for connecting the terminals 12a, 12b of the upper surfaces of the two packages 11 to the terminals 12c, 12d of the upper surface. Thus, the wirings of the board 2 connected to the terminals of the bottom can be reduced. The wiring step of the board 2 is facilitated, and the degree of freedom of designing the wirings of the board 2 can be improved.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device in which IC packages are connected to each other.

[0002]

2. Description of the Related Art FIGS. 11 and 12 are a perspective view and a front view, respectively, showing a conventional IC package.
Is an IC package generally called a BGA (Ball Grid Array) package, and 2 is a mounting board on which the IC package 1 is mounted. 3 is the IC package 1
The connection terminals 4 provided on the bottom surface of the substrate are solder for connecting the connection terminals 3 on the bottom surface thereof and predetermined wiring of the mounting board 2.

Next, the operation will be described. When mounting the IC package 1 on the mounting substrate 2, the IC package 1 is mounted on a predetermined location of the mounting substrate 2, and the connection terminals 3 provided on the bottom surface of the IC package 1 and predetermined wiring of the mounting substrate 2 are connected. The connection is made by solder 4.

[0004]

Since the conventional IC package is configured as described above, when a plurality of IC packages 1 are mounted on the mounting board 2, the plurality of IC packages 1 are mounted.
Since the wiring of the mounting board 2 must be performed according to the connection terminals 3 provided on the bottom surface of the C package 1, the wiring of the mounting board 2 becomes crowded, and the wiring process becomes difficult. There was a problem that the degree of freedom in designing was reduced. Also, the I mounted on the mounting board 2
When the number of the C packages 1 is large, a large number of wirings can be formed by forming multiple layers of wirings on the back surface and inside together with the front surface of the mounting substrate 2. However, there is a problem that the wiring process becomes difficult, and a burden is increased in designing the mounting substrate 2.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and has as its object to provide a semiconductor device which facilitates a wiring process and improves the degree of freedom in wiring design.

[0006]

In a semiconductor device according to the present invention, connection terminals are provided on a top surface and a bottom surface, respectively.
A plurality of IC packages including connection terminals for different purposes from the connection terminals on the top surface and the connection terminals on the bottom surface;
It has a mounting board on which the C package is mounted and connection lines for connecting connection terminals on the upper surfaces of the two IC packages.

A semiconductor device according to the present invention has a plurality of IC packages each having connection terminals provided on a side surface and a bottom surface, and a plurality of IC packages each having a connection terminal different from the connection terminals on the side surface and the bottom surface. It has a mounting substrate for mounting the packages and connection lines for connecting the connection terminals on the side surfaces of the two IC packages.

In the semiconductor device according to the present invention, connection terminals are provided on the upper surface, the side surface, and the bottom surface, respectively, and the plurality of connection terminals are different from the connection terminals on the upper surface, the side surface, and the bottom surface. It comprises an IC package, a mounting board on which a plurality of IC packages are mounted, and connection lines for connecting connection terminals on the top surface and connection terminals on the side surfaces of the two IC packages.

In the semiconductor device according to the present invention, the connection terminal on the top surface or the connection terminal on the side surface of the IC package may
The C package is provided along two opposing sides, and the connection terminals of the two opposing sides are arranged in the same order for each application. A plurality of IC packages are mounted in tandem so as to face each other in the same order, and connection lines connect connection terminals of two adjacent IC packages.

In the semiconductor device according to the present invention, the connection terminal on the top surface or the connection terminal on the side of the IC package is
The connection terminals are provided along the four sides of the C package, and the connection terminals of the two sides facing each other are arranged in the same order for each application. Multiple I
The C packages are mounted in rows and columns, and the connection lines connect the connection terminals of two adjacent IC packages.

In the semiconductor device according to the present invention, the connection terminal on the top surface and the connection terminal on the side surface of the IC package have the
The connection terminals are provided along two opposing sides of the C package, and the connection terminals on the upper surfaces of the two opposing sides are arranged in the same order for each application, and the side surfaces of the two opposing sides are connected. The terminals are arranged in the same order for each application, and the mounting board mounts a plurality of IC packages in tandem such that the sides having the connection terminals face in the same order for each application, and the connection lines are two adjacent ICs. The connection terminals on the upper surface of the package and the connection terminals on the side surface are connected.

In the semiconductor device according to the present invention, the connection terminal on the top surface and the connection terminal on the side surface of the IC package have the
The connection terminals on the upper surface of the two sides facing each other are arranged in the same order for each application, and the connection terminals on the side surfaces of the two sides facing each other are provided along the four sides of the C package. Arranged in the same order for each application, the mounting board mounts a plurality of IC packages in rows and columns such that sides having the connection terminals face in the same order for each application, and the connection line is formed of two adjacent IC packages. The connection terminals on the top surface and the connection terminals on the side surface are connected to each other.

In the semiconductor device according to the present invention, the connection terminals on the upper surface are used for address signals and the connection terminals on the side surfaces are used for data signals, or the connection terminals on the upper surface are used for data signals and the connection on the side surface is used. The terminal is used for an address signal.

In the semiconductor device according to the present invention, of the connection terminals provided along the four sides of the IC package, one of the two opposite sides is used for an address signal, and the other is used for an address signal. A connection terminal between two opposing sides is used for a data signal.

In the semiconductor device according to the present invention, the connection line
It is a connection substrate.

In the semiconductor device according to the present invention, the connection line
This is a connection wiring.

In the semiconductor device according to the present invention, the connection terminals on the side surfaces are connected by a connection board, and the connection terminals on the upper surface are connected by connection wiring.

According to the semiconductor device of the present invention, the connection terminals are connected to each other on the upper surface, the connection terminals on the upper surface and the side surfaces,
At least one of the top and bottom connection terminals, the side connection terminals, and the side and bottom connection terminals are connected.

[0019]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described below. Embodiment 1 FIG. FIGS. 1 and 2 are a perspective view and a front view, respectively, showing an IC package of a semiconductor device according to a first embodiment of the present invention.
Reference numeral 2 denotes a mounting board on which the IC package 11 is mounted. Three
Are connection terminals provided on the bottom surface of the IC package 11;
Are solders for connecting the connection terminals 3 on the bottom surface and predetermined wirings of the mounting board 2. Reference numerals 12a to 12d denote connection terminals provided on the upper surface of the IC package 11 along four sides, respectively. The connection terminals 12a to 12d are provided so that the ICs are used for different purposes from the connection terminals 3 on the bottom surface.
It is connected to a chip inside the package 11 and has a connection terminal between two sides facing each other, for example,
Connection terminal 12a, connection terminal 12b, and connection terminal 12
c and the connection terminals 12d are connected to the chip inside the IC package 11 so as to be arranged in the same order for each application.

FIGS. 3 and 4 show a first embodiment of the present invention.
FIGS. 2A and 2B are a perspective view and a front view showing a semiconductor device on which an IC package according to the present invention is mounted.
A plurality of IC packages 11 are arranged in rows and columns such that sides having connection terminals for the same application face in the same order, ie, connection terminals 12a and connection terminals 12b and connection terminals 12c and connection terminals 12d face each other. Has been implemented. Reference numeral 13 denotes a connection board (connection line) that connects the connection terminals 12a and 12b and the connection terminals 12c and 12d of two adjacent IC packages 11.

Next, the operation will be described. As shown in FIG. 1 and FIG.
Connection terminals 12a to 12d are provided along the two sides, respectively, and these connection terminals 12a to 12d are connected to a chip inside the IC package 11 so as to be used for a purpose different from the connection terminals 3 on the bottom surface. I have. For example,
If the internal chip is a memory,
Although connection terminals for a power supply, an address signal, a data signal, and a control signal are required, the connection terminals 12a and 12b on the upper surface are used for address signals, and the connection terminals 12c and 12d on the upper surface are used for data signals. Use. Then, the connection terminal 3 on the bottom is used for the remaining power supply and control signal. With this configuration, since the connection terminals 3 on the bottom surface are used only as connection terminals for power and control signals, the wiring of the mounting board 2 connected to the connection terminals 3 on the bottom surface can be reduced. The wiring process of the substrate 2 can be facilitated, and the degree of freedom in wiring design of the mounting substrate 2 can be improved.

The connection terminals 12 of the IC package 11
a and the connection terminals 12b, and the connection terminals 12c and the connection terminals 12d are connected to the chip inside the IC package 11 so as to be arranged in the same order for each application. For example, as described above, the connection terminals 12a and 12
b is used for an address signal, and the connection terminals 12c and 12d on the upper surface are used for a data signal.
When a plurality of IC packages 11 are mounted in rows and columns as shown in FIG.
a and connection terminals 12b are both used for address signals and in the same order, while connection terminals 12c and connection terminals 12d of two adjacent IC packages 11 are both used for data signals and are the same. Because of the order, the connection terminals 12a and 12b of the two IC packages 11 adjacent to each other and the connection terminal 12c
And the connection substrate 13 that connects the connection terminals 12d to each other by the shortest path, thereby improving the wiring efficiency. With this configuration, the connection substrate 1
3 can be used without being crossed or branched, and a simple wiring having parallel and the same length can be used, and each connection board 13 uses a common one for address signals, In addition, a common signal can be used for data signals, and the manufacturing of the connection substrate 13 and the wiring process can be facilitated.

In the first embodiment, connection terminals 12a to 12a along four sides on the upper surface of IC package 11 are provided.
Although 2d is provided, connection terminals may be provided along two opposing sides of the IC package 11, respectively. For example, in FIG. 1, if both the address signal and the data signal can be covered only by the connection terminals 12c and 12d,
c and the connection terminal 12d are used for address signals and data signals, and the connection terminal 3 on the bottom surface is used for the remaining power supply and control signals. In this case, the number of the connection terminals 12a and the connection terminals 12b can be reduced, and the number of the connection substrates 13 for connecting the connection terminals 12a and the connection terminals 12b can be reduced. , And the wiring process can be further facilitated.

In the first embodiment, the four connection terminals 12a to 12d on the top surface of the IC package 11 and the connection terminal 3 on the bottom surface are connection terminals for different purposes, but are partially provided in common. For example, connection terminals for control signals may be provided on both the top and bottom surfaces of the IC package 11. In this case, the degree of freedom in wiring design of the mounting board 2 and the connection board 13 can be further improved.

Further, in the first embodiment, when the IC package 11 is a memory, the connection terminals 12 on the upper surface are used.
In the above example, the connection terminal 12a and the connection terminal 12b are used for an address signal, and the connection terminal 12c and the connection terminal 12d on the top surface are used for a data signal. However, if the uses of the connection terminals 12a to 12d on the top surface and the connection terminals 3 on the bottom surface are made different, the wiring process of the mounting board 2 is facilitated according to the design as appropriate, and the wiring design of the mounting board 2 is improved. It is possible to improve the degree of freedom, facilitate the manufacturing of the connection board 13 and the wiring process, and improve the degree of freedom in the wiring design of the connection board 13.

As described above, according to the first embodiment, the four connection terminals 12 a are provided on the upper surface of the IC package 11.
With the provision of ~ 12d, the wiring of the mounting substrate 2 connected to the connection terminals 3 on the bottom surface can be reduced, and the wiring process of the mounting substrate 2 is facilitated, and the degree of freedom in the wiring design of the mounting substrate 2 Can be improved. Also, IC
Four connection terminals 12a to 12d on the upper surface of package 11
And the connection terminals 3 on the bottom surface are connection terminals for different purposes, so that the four connection terminals 12a to 12d on the top surface
And the number of connection terminals on the top surface and the bottom surface can be reduced as compared with the case where the connection terminals 3 on the bottom surface are connection terminals for the same application, and the configuration of the IC package 11 can be simplified. it can. Further, according to the design as appropriate, the wiring process of the mounting board 2 is facilitated, the degree of freedom in the wiring design of the mounting board 2 is improved, and the manufacturing and the wiring process of the connection board 13 are facilitated. 13 can improve the degree of freedom in wiring design. Further, the connection terminals 12a and 12b and the connection terminals 12c and 12d of the IC package 11 are connected to the chip inside the IC package 11 so as to be arranged in the same order for each application. The wiring in the connection board 13 does not cross or branch, a simple wiring having parallel wiring and the same length can be used, and each connection board 13 is a common one for address signals. Using
A common one can be used for data signals,
The manufacturing of the connection board 13 and the wiring process can be facilitated. Further, since the connection terminals 12a to 12d on the upper surface of the IC package 11 are connected by the connection board 13, impedance matching between the connected IC packages 11 can be easily achieved.

Embodiment 2 FIG. 5 and 6 are a perspective view and a front view, respectively, showing a semiconductor device mounted with an IC package according to a second embodiment of the present invention.
4 is a connection terminal 12 of two adjacent IC packages 11
This is a connection wiring (connection line) for connecting a to the connection terminals 12b and between the connection terminals 12c and the connection terminals 12d.
Other configurations are the same as those in the first embodiment.

Next, the operation will be described. In the first embodiment, the connection terminals 12a on the upper surface of the IC package 11
In the second embodiment, the connection terminals 12a to 12d on the upper surface of the IC package 11 are connected by the connection wiring 14, as shown in FIGS. . The connection wiring 14
Since it is flexibly configured to bend freely, the wiring process can be facilitated and the IC
Since the connection terminals 12a to 12d on the top surface of the package 11 and the connection terminals 3 on the bottom surface can be connected, the design and wiring steps can be further facilitated.

Embodiment 3 7 and 8 are a perspective view and a front view, respectively, showing an IC package of a semiconductor device according to a third embodiment of the present invention.
5 d are connection terminals provided on the side surface of the IC package 11 along the four sides, respectively.
5a to 15d are connected to a chip inside the IC package 11 so as to be used for a purpose different from that of the connection terminal 3 on the bottom surface, and are connected to two sides facing each other, for example, the connection terminal 15a. The connection terminal 15b and the connection terminal 15c and the connection terminal 15d are connected to a chip inside the IC package 11 so as to be arranged in the same order for each application. Other configurations are the same as those of the first embodiment.

FIG. 9 shows an IC according to a third embodiment of the present invention.
It is a front view showing a semiconductor device mounted with a package,
In the figure, the connection terminals face the mounting board 2 in the same order for each application, that is, the connection terminals 12a and 12b, the connection terminals 15a and 15b, and the connection terminals 12c and 12d, A plurality of IC packages 11 are mounted in rows and columns such that the connection terminals 15c and the connection terminals 15d face each other. Reference numeral 13 denotes a connection terminal 12a and a connection terminal 12b of two adjacent IC packages 11.
And a connection board 16 for connecting the connection terminals 12c and the connection terminals 12d to each other, and a connection board 16 for connecting the connection terminals 15a and the connection terminals 15b and the connection terminals 15c and the connection terminals 15d of two adjacent IC packages 11 to each other. (Connection line).

Next, the operation will be described. As shown in FIG. 7 and FIG.
Connection terminals 12a to 12d are provided along the two sides, respectively, and these connection terminals 12a to 12d are connected to a chip inside the IC package 11 so as to be used for a purpose different from the connection terminals 3 on the bottom surface. I have. Also, I
Connection terminals 15a to 15d are provided on the side surface of the C package 11 along four sides, respectively, and these connection terminals 15a to 15d are provided in an IC package so as to be used in a different application from the connection terminals 3 on the bottom surface. 11 is connected to the chip inside. For example, when the internal chip is a memory, the memory includes a power supply, an address signal,
Although connection terminals for data signals and control signals are required, the connection terminals 12a to 12d on the upper surface are used for address signals, and the connection terminals 15a to 15d on the side surfaces are used for data signals. Then, connect the connection terminal 3 on the bottom to the remaining power source,
And the use of control signals. With this configuration, since the connection terminals 3 on the bottom surface are used only as connection terminals for power and control signals, the wiring of the mounting board 2 connected to the connection terminals 3 on the bottom surface can be reduced. The wiring process of the substrate 2 can be facilitated, and the degree of freedom in wiring design of the mounting substrate 2 can be improved.

The connection terminals 12 of the IC package 11
a and connection terminal 12b, connection terminal 15a and connection terminal 15
b, the connection terminal 12c and the connection terminal 12d, and the connection terminal 15c and the connection terminal 15d are connected to the chip inside the IC package 11 so as to be arranged in the same order. For example, as described above, the connection terminals 12 a to 12
d is used as an address signal, and as shown in FIG. 3, when a plurality of IC packages 11 are mounted in rows and columns, as shown in FIG. 9, connection between two adjacent IC packages 11 is performed. The connection substrate 13 that connects the terminals 12a and the connection terminals 12b and the connection terminals 12c and the connection terminals 12d can be connected by the shortest path, and the wiring efficiency can be improved. When the connection terminals 15a to 15d on the upper surface are used for data signals as described above, and a plurality of IC packages 11 are mounted in rows and columns as shown in FIG. 3, as shown in FIG. In addition, the connection terminal 15a and the connection terminal 15b of the two adjacent IC packages 11 and the connection board 16 that connects the connection terminal 15c and the connection terminal 15d can be connected by the shortest path, thereby improving the wiring efficiency. be able to. With this configuration, the connection board 13 and the connection board 1
6 can be used without being crossed or branched, and a simple wiring having parallel and the same length can be used, and each connection board 13 connects the connection terminals 12a and 12b to each other. The connection terminal 12c and the connection terminal 12d can be connected to each other by using a common terminal.
Reference numeral 6 denotes a common connection for connecting the connection terminals 15a and 15b, and a common connection for connecting the connection terminals 15c and 15d. 16 manufacture,
And the wiring process can be facilitated.

In the third embodiment, the connection terminals 12a to 12a along the four sides on the upper surface of the IC package 11 are provided.
2d, and the connection terminals 15a to 15d are respectively provided along the four sides of the side surface.
2a to 12d are deleted, and the connection terminals 15a to 15
Only d may be provided. In this case, by replacing the function of the connection terminals 12a to 12d on the upper surface described in the first embodiment with the connection terminals 15a to 15d on the side surfaces, the same effect as in the first embodiment can be obtained.

In the third embodiment, the connection terminals 12a to 12a are connected along the four sides on the upper surface of the IC package 11.
2d and connection terminals 15a to 15d are provided along the four sides of the side surface.
The connection terminals may be provided along two opposing sides of one. For example, in FIG. 7, if only the connection terminals 12c and 12d can cover an address signal and only the connection terminals 15c and 15d can cover a data signal,
The connection terminal c and the connection terminal 12d are used for an address signal, the connection terminal 15c and the connection terminal 15d are used for a data signal, and the connection terminal 3 on the bottom surface is used for the remaining power supply and control signals. In this case, the connection terminal 12a and the connection terminal 12b, the connection terminal 15a and the connection terminal 15b can be reduced, and the connection board 13 that connects the connection terminal 12a and the connection terminal 12b, and the connection terminal 15a The number of connection boards 16 for connecting to the terminals 15b can be reduced, and the manufacture of the IC package 11, the connection boards 13, and the connection boards 16 and the wiring process can be further facilitated.

Further, in the third embodiment, the four connection terminals 12a to 12d on the upper surface of the IC package 11 are used for address signals, and the four connection terminals 1 on the side surface are used.
5a to 15d are used for the purpose of the data signal. Conversely, the four connection terminals 12a on the upper surface of the IC package 11 are used.
To 12d may be used for data signals, and the four connection terminals 15a to 15d on the side surfaces may be used for address signals.

Further, in the third embodiment, the four connection terminals 12a to 12d on the upper surface of the IC package 11 are used for address signals, and the four connection terminals 1 on the side surface are used.
5a to 15d are used for the purpose of the data signal, but as in the first embodiment, the connection terminals 12a and 1
2b, the side connection terminal 15a and the connection terminal 15b are used for address signals, and the top connection terminal 12c and the connection terminal 1
2d, the side connection terminal 15c and the connection terminal 15d may be used for data signals, and similar effects can be obtained.

Furthermore, in the third embodiment, the four connection terminals 12a to 12d on the top surface and the four connection terminals 15a to 15d on the side surface of the IC package 11 and the connection terminal 3 on the bottom surface have different connection terminals. However, connection terminals for control signals may be provided on the top surface, the side surface, and the bottom surface of the IC package 11, respectively. In this case, the mounting board 2 and the connection board 1
3, and the degree of freedom in designing the wiring of the connection board 16 can be further increased.

As described above, according to the third embodiment, the four connection terminals 12 a are provided on the upper surface of the IC package 11.
To 12d, and four connection terminals 15a to 15d on the side surface.
Is provided, the number of wirings of the mounting board 2 connected to the connection terminals 3 on the bottom surface can be reduced as compared with the conventional technique and the first embodiment, and the wiring process of the mounting board 2 is facilitated. At the same time, the degree of freedom in wiring design of the mounting board 2 can be improved. The four connection terminals 12a to 12d on the top surface and the four connection terminals 15a to 15d on the side surface of the IC package 11 and the connection terminal 3 on the bottom surface are:
By using the connection terminals for different applications, the four connection terminals 12a to 12d on the upper surface and the four connection terminals 1 on the side surface are provided.
As compared with the case where the connection terminals 5a to 15d and the connection terminal 3 on the bottom surface are used for the same purpose, the total number of connection terminals on the top surface, the side surface and the bottom surface can be reduced, and the configuration of the IC package 11 can be reduced. It can be simplified. In addition, according to the design as appropriate, the wiring process of the mounting board 2 is facilitated,
The degree of freedom in wiring design of the mounting board 2 is improved, and the connection board 1
In addition to facilitating the manufacture of the connection board 3 and the connection board 16 and the wiring process, the degree of freedom in the wiring design of the connection board 13 and the connection board 16 can be improved. Further, the connection terminals 12a and 12b of the IC package 11, the connection terminals 15a and 15b, the connection terminals 12c and 12d, and the connection terminals 15c and 15d
IC package 1 so that it is arranged in the same order for each application
1 is connected to the chip inside, so that the wiring in the connection board 13 and the connection board 16 does not cross or branch, and a simple one having parallel wiring and the same length is used. And a common one can be used as each connection board 13 and each connection board 16,
The manufacturing of the connection board 13 and the connection board 16 and the wiring process can be facilitated. Furthermore, since the connection terminals 12a to 12d on the upper surface of the IC package 11 are connected by the connection substrate 13, and the connection terminals 15a to 15d on the side surfaces are connected by the connection substrate 16,
Impedance matching between the C packages 11 can be easily achieved.

Embodiment 4 FIG. 10 is a front view showing a semiconductor device on which an IC package according to a fourth embodiment of the present invention is mounted. In FIG.
Connection wiring for connecting the connection terminals 12a and 12b of the C package 11 and between the connection terminals 12c and 12d of the C package 11;
One connection terminal 15a and the connection terminal 15b, and a connection wiring (connection line) for connecting the connection terminal 15c and the connection terminal 15d. Other configurations are the same as those of the third embodiment.

Next, the operation will be described. In the third embodiment, the connection terminals 12a on the upper surface of the IC package 11
And the connection terminals 12b and between the connection terminals 12c and the connection terminals 12d are connected by the connection board 13, and the connection terminals 15a and the connection terminals 15b on the side surfaces and the connection terminal 1 are connected.
Although the connection terminals 5c and the connection terminals 15d are connected by the connection board 16, in the fourth embodiment, as shown in FIG. 10, the connection terminals 12a and the connection terminals 12b on the top surface of the IC package 11 and the connection terminals 12c are connected to each other. Connection terminal 12
d are connected by connection wiring 14, and connection terminals 15 a and 15 b on the side surface are connected by connection wiring 17, and connection terminals 15 c and connection terminals 15 d are connected by connection wiring 17. Since the connection wiring 14 and the connection wiring 17 are flexibly configured to bend freely, the wiring process can be facilitated, and the connection terminals 12a to 12d on the upper surface of the IC package 11 and the connection terminals on the side surface. 15a to 15d, connection terminals 12a to 1 on the upper surface
Connection between 2d and connection terminal 3 on bottom, connection terminal 15 on side
a-15d can be connected to the connection terminal 3 on the bottom.
The design and wiring steps can be facilitated.

In the fourth embodiment, the connection terminals 12a to 12d on the upper surface and the connection terminals 15a to 15d on the side surface are both connected by the connection wiring 14 and the connection wiring 16, but the connection terminals 15a to 15d on the side surface are connected. The connection may be made by the connection board 17, and the connection terminals 12 a to 12 d on the upper surface may be connected by the connection wiring 14. In this case, the IC package 1 to be connected is connected by connecting the connection terminals 15a to 15d on the side surfaces by the connection board 16.
1 can be easily matched, and by connecting the connection terminals 12a to 12d on the upper surface by the connection wiring 14, the connection wiring 14 is flexibly configured to bend freely. Step can be facilitated, and the effectiveness of both the connection board 16 and the connection wiring 14 can be utilized, and
The wiring process can be facilitated.

[0042]

As described above, according to the present invention, connection terminals are provided on the upper surface and the bottom surface, respectively, and a plurality of IC packages comprising connection terminals for different uses from the connection terminals on the upper surface and the connection terminals on the bottom surface. And a mounting board for mounting a plurality of IC packages, and a connection line for connecting the connection terminals on the upper surface of the two IC packages. Therefore, the wiring process of the mounting board can be facilitated, and the degree of freedom in the wiring design of the mounting board can be improved. In addition, the connection terminal on the top surface and the connection terminal on the bottom surface of the IC package are connection terminals for different purposes, so that the connection terminal on the top surface and the connection terminal on the bottom surface are connection terminals for the same purpose. In comparison, the total number of connection terminals on the top surface and the bottom surface can be reduced, and the configuration of the IC package can be simplified. In addition, according to the design as appropriate, the wiring process of the mounting substrate is facilitated, the degree of freedom of the wiring design of the mounting substrate is improved, the manufacturing of the connection lines and the wiring process are facilitated, and the wiring design of the connection substrate is performed. The effect that the degree of freedom of can be improved is obtained.

According to the present invention, the connection terminals are provided on the side surface and the bottom surface, respectively, and the plurality of I terminals composed of the connection terminals for different applications from the connection terminals on the side surface and the connection terminal on the bottom surface are provided.
Since the package includes a C package, a mounting substrate for mounting a plurality of IC packages, and a connection line for connecting the connection terminals on the side surfaces of the two IC packages, the mounting substrate connected to the connection terminals on the bottom surface is formed. The number of wirings can be reduced, the wiring process of the mounting board can be facilitated, and the degree of freedom in wiring design of the mounting board can be improved. In addition, the connection terminals on the side surface and the connection terminal on the bottom surface of the IC package are connection terminals for different applications, so that the connection terminal on the side surface and the connection terminal on the bottom surface are connection terminals for the same application. In comparison, the total number of connection terminals on the side and bottom surfaces can be reduced, and the configuration of the IC package can be simplified. In addition, according to the design as appropriate, the wiring process of the mounting substrate is facilitated, the degree of freedom of the wiring design of the mounting substrate is improved, the manufacturing of the connection lines and the wiring process are facilitated, and the wiring design of the connection substrate is performed. The effect that the degree of freedom of can be improved is obtained.

According to the present invention, the connection terminals are provided on the upper surface, the side surface, and the bottom surface, respectively, and the plurality of IC packages are composed of the connection terminals on the upper surface, the connection terminals on the side surface, and the connection terminals on the bottom surface. And multiple I
Since it is configured to include the mounting board for mounting the C package and the connection lines connecting the connection terminals on the top surface and the connection terminals on the side surfaces of the two IC packages, the mounting substrate connected to the connection terminals on the bottom surface is formed. The number of wirings can be reduced, the wiring process of the mounting board can be facilitated, and the degree of freedom in wiring design of the mounting board can be improved. Also, the connection terminals on the top and side surfaces and the connection terminals on the bottom surface of the IC package are connection terminals for different purposes, so that the connection terminals on the top and side surfaces and the connection terminals on the bottom surface have the same purpose. As compared with the above-described configuration, the total number of connection terminals on the top surface, the side surface, and the bottom surface can be reduced, and the configuration of the IC package can be simplified.
Also, according to the design as appropriate, the wiring process of the mounting board is facilitated, and the degree of freedom in the wiring design of the mounting board is improved,
The effect of facilitating the manufacturing of the connection lines and the wiring process and improving the degree of freedom in the wiring design of the connection board can be obtained.

According to the present invention, the connection terminal on the upper surface or the connection terminal on the side surface of the IC package is provided along each of two opposing sides of the IC package, and the connection terminal between the two opposing sides is provided. Are arranged in the same order for each application, and the mounting board mounts a plurality of IC packages in tandem such that the sides having the connection terminals face in the same order for each application, and the connection line is formed of two adjacent ICs.
Since the connection terminals of the package are configured to be connected to each other, a simple connection line having the same length can be used without any crossover or branching of the connection lines. A common one can be used, and the manufacturing of the connection line and the wiring process can be facilitated.

According to the present invention, the connection terminal on the upper surface or the connection terminal on the side surface of the IC package is provided along each of the four sides of the IC package, and the connection terminal between the two sides facing each other is used. The plurality of IC packages are mounted in rows and columns such that the sides having the connection terminals for the same application face in the same order in the mounting board, and the connection lines are formed between two adjacent IC packages. Because it was configured to connect the connection terminals,
Connection lines can be used without being crossed or branched, and a simple connection line having the same length can be used in parallel, and a common connection line can be used. And the wiring process can be facilitated.

According to the present invention, the connection terminal on the top surface and the connection terminal on the side surface of the IC package are provided along the two opposing sides of the IC package, respectively, and the connection terminal on the top surface of the two opposing sides is provided. The connection terminals are arranged in the same order for each application, and the connection terminals on the side surfaces of the two opposing sides are arranged in the same order for each application, and the mounting substrate has the same side having the connection terminal for each application. A plurality of IC packages are mounted in tandem so as to face each other in order, and the connection lines are configured to connect the connection terminals on the top surface and the connection terminals on the side surfaces of two adjacent IC packages. A simple connection line having the same length can be used, and a common connection line can be used. Production line, and the wiring process can be facilitated.

According to the present invention, the connection terminals on the upper surface and the connection terminals on the side surfaces of the IC package are provided along the four sides of the IC package, respectively, and the connection terminals on the upper surface of the two sides facing each other are provided. Are arranged in the same order for each application, and the connection terminals on the side surfaces of the two sides facing each other are arranged in the same order for each application, and the mounting substrate has the sides having the connection terminals in the same order for each application. A plurality of IC packages are vertically and horizontally mounted so as to face each other, and the connection lines are configured to connect the connection terminals on the upper surface and the connection terminals on the side surfaces of two adjacent IC packages. It is possible to use a simple connection line having the same length without connecting or branching, and a common connection line can be used. It can facilitate granulation, and the wiring process.

According to the present invention, the connection terminals on the upper surface are used for address signals and the connection terminals on the side surfaces are used for data signals, or the connection terminals on the upper surface are used for data signals and the connection terminals on the side surfaces are used. Since it is configured to be used for address signals, when the IC package is used as a memory, the wiring process of the mounting board is extremely facilitated, the degree of freedom in the wiring design of the mounting board is greatly improved, and The effects of extremely facilitating the manufacturing and wiring steps and greatly improving the degree of freedom in wiring design of the connection board are obtained.

According to the present invention, of the connection terminals provided along the four sides of the IC package, one of the two opposite sides is used for address signals, and the other is used for the other side. The connection terminal between the two sides is
Since it is configured to be used for data signals, when the IC package is used as a memory, the wiring process of the mounting board is extremely facilitated, the degree of freedom in the wiring design of the mounting board is greatly improved, The effects of extremely facilitating the manufacturing and wiring steps and greatly improving the degree of freedom in wiring design of the connection board are obtained.

According to the present invention, since the connection lines are configured to be connection substrates, an effect is obtained that impedance matching between the connected IC packages can be easily achieved.

According to the present invention, since the connection line is configured to be a connection line, the connection line is configured to be flexibly bent so that the wiring process can be facilitated. The effect is obtained.

According to the present invention, the connection lines are configured such that the connection terminals on the side surfaces are connected by the connection substrate and the connection terminals on the upper surface are connected by the connection wiring. By connecting
Since the impedance matching between the connected IC packages can be easily achieved, and the connection terminals on the upper surface are connected by the connection wires, the connection wires are flexibly configured to bend freely. The process can be facilitated, the effectiveness of both the connection substrate and the connection wiring can be utilized, and the effect of facilitating the wiring process can be obtained.

According to the present invention, at least one of the connection terminals on the top surface, the connection terminals on the top surface and the side surface, the connection terminals on the top surface and the bottom surface, the connection terminals on the side surface, and the connection terminals on the side surface and the bottom surface. Since any one of them is configured to be connected, the design and wiring steps can be facilitated.

[Brief description of the drawings]

FIG. 1 is a perspective view showing an IC package of a semiconductor device according to a first embodiment of the present invention.

FIG. 2 is a front view showing an IC package of the semiconductor device according to the first embodiment of the present invention;

FIG. 3 is a perspective view showing a semiconductor device mounted with an IC package according to the first embodiment of the present invention;

FIG. 4 is a front view showing a semiconductor device mounted with an IC package according to the first embodiment of the present invention.

FIG. 5 is a perspective view showing a semiconductor device mounted with an IC package according to a second embodiment of the present invention.

FIG. 6 is a front view showing a semiconductor device mounted with an IC package according to a second embodiment of the present invention.

FIG. 7 is a perspective view showing an IC package of a semiconductor device according to a third embodiment of the present invention.

FIG. 8 is a front view showing an IC package of a semiconductor device according to a third embodiment of the present invention.

FIG. 9 is a front view showing a semiconductor device mounted with an IC package according to a third embodiment of the present invention.

FIG. 10 is a front view showing a semiconductor device mounted with an IC package according to a fourth embodiment of the present invention.

FIG. 11 is a perspective view showing a conventional IC package.

FIG. 12 is a front view showing a conventional IC package.

[Explanation of symbols]

2 mounting board, 3 connection terminals, 4 solders, 11 IC packages, 12a to 12d, 15a to 15d, connection terminals, 13, 16 connection boards (connection wires), 14, 17 connection wires (connection wires).

Claims (13)

[Claims] 1. A plurality of IC packages each having connection terminals provided on an upper surface and a bottom surface, the connection terminals being different from the connection terminals on the upper surface and the lower surface.
A semiconductor device comprising: a mounting board on which the plurality of IC packages are mounted; and connection lines connecting connection terminals on upper surfaces of the two IC packages. 2. A plurality of IC packages each having a connection terminal provided on a side surface and a bottom surface, and a plurality of IC packages including connection terminals for different uses from the connection terminal on the side surface and the connection terminal on the bottom surface;
A semiconductor device comprising: a mounting board on which the plurality of IC packages are mounted; and connection lines connecting connection terminals on side surfaces of the two IC packages. 3. A plurality of IC packages each having connection terminals provided on an upper surface, a side surface, and a bottom surface, the plurality of IC packages including connection terminals for different uses from the connection terminals on the upper surface, the connection terminals on the side surfaces, and the connection terminals on the bottom surface. A semiconductor device comprising: a mounting board on which the IC package is mounted; and connection lines that connect the connection terminals on the upper surface and the connection terminals on the side surfaces of the two IC packages. 4. The connection terminal on the top surface or the connection terminal on the side surface of the IC package is provided along two opposing sides of the IC package, and the connection terminal on the two opposing sides is provided for each application. Arranged in the same order, the mounting board mounts a plurality of IC packages in tandem such that the sides having the connection terminals face in the same order for each application, and the connection lines are connected between the connection terminals of two adjacent IC packages. 3. The semiconductor device according to claim 1, wherein 5. The connection terminal on the top surface or the connection terminal on the side surface of the IC package is provided along each of four sides of the IC package, and the connection terminals on the two sides facing each other are in the same order for each application. And a plurality of IC packages are vertically and horizontally mounted on the mounting board such that sides having connection terminals for the same application face in the same order, and connection lines connect connection terminals of two adjacent IC packages. The semiconductor device according to claim 1, wherein the semiconductor device is connected. 6. The connection terminal on the top surface and the connection terminal on the side surface of the IC package are respectively provided along two opposing sides of the IC package, and the connection terminal on the top surface of the two opposing sides is used for the purpose. The connection terminals on the side surfaces of the two sides facing each other are arranged in the same order for each application, and the sides having the connection terminals face in the same order for each application in the mounting board. 4. The semiconductor device according to claim 3, wherein the plurality of IC packages are mounted in tandem, and the connection lines connect the connection terminals on the upper surface and the connection terminals on the side surfaces of two adjacent IC packages. 7. The connection terminal on the top surface and the connection terminal on the side surface of the IC package are respectively provided along four sides of the IC package, and the connection terminal on the top surface of the two sides facing each other is provided for each application. The connection terminals on the side surfaces of the two sides that are arranged in the same order and that oppose each other are arranged in the same order for each application, and the mounting board is configured such that the sides having the connection terminals face in the same order for each application. 4. A plurality of IC packages are mounted in rows and columns, and connection lines connect connection terminals on the top surface and connection terminals on the side surfaces of two adjacent IC packages.
13. The semiconductor device according to claim 1. 8. A connection terminal on an upper surface is used for an address signal and a connection terminal on a side surface is used for a data signal, or a connection terminal on the upper surface is used for a data signal and a connection terminal on a side surface is used for an address signal. The semiconductor device according to claim 7, wherein 9. Of the connection terminals provided along the four sides of the IC package, the connection terminal between two opposing sides is used for an address signal, and the other two sides are connected to each other. 8. The semiconductor device according to claim 5, wherein said connection terminal is used for a data signal. 10. The semiconductor device according to claim 1, wherein the connection line is a connection board. 11. The semiconductor device according to claim 1, wherein the connection line is a connection line. 12. The connection line according to claim 3, wherein the connection terminals on the side surface are connected by a connection board, and the connection terminals on the top surface are connected by a connection wiring. 8. The semiconductor device according to claim 1. 13. The connection wiring is at least one of connection terminals on an upper surface, connection terminals on an upper surface and a side surface, connection terminals on an upper surface and a bottom surface, connection terminals on a side surface, and connection terminals on a side surface and a bottom surface. 12. The semiconductor device according to claim 11, wherein