JP2001177216A - Machining method of printed-wiring mother board, and printed-wiring mother board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce total manufacturing cost of a printed-circuit board. SOLUTION: On a printed-wiring mother board 11, a reference mark 16, a push-back reference hole 13, and a mark for reference holes 14a to 15b are printed with a land or a pad 12a and a pattern 12b, the push-back reference hole 13 and the reference holes 14a to 15b are punched by an NC punching machine or the like, and a known machining procedure such as etching is carried out. Then, printed circuit boards 1 to 10 are subjected to push-back. An L-shaped cutting mold C, having sides C1 and C2 accurately crossing at right angles, is used for cutting sides 11a and 11b according to the reference holes 14a and 14b. Then, the mother board 11 is rotated by 180 decrees, and the same cutting mold C is used for cutting sides 11c and 11d according to the reference holes 15a and 15b. The cutting mold C can cut and machine the mother board 11 of various dimensions, thus eliminating the need for preparing various dies, reducing the cost of the dies, and hence reducing the total manufacturing cost.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] The present invention relates to a printed wiring board.

[0002]

2. Description of the Related Art In recent years, there has been remarkable progress in downsizing electronic devices. In addition, there is a strong trend for diversification and differentiation of designs, and there is an increasing demand for printed circuit boards used in electronic devices to be smaller, deformed, and thinner.

[0003] Even if a printed circuit board as a product is required to be miniaturized, deformed, and thinned, a chip mounter and an automatic insertion machine for mounting electronic components to the printed circuit board are required to be substantially larger than a certain size due to transportation. , A rectangular shape (at least one side is a straight line, and all or a part of the side perpendicular to the straight line is a straight line).

Therefore, conventionally, a plurality of small printed circuit boards are formed in a rectangular printed wiring board (hereinafter, referred to as a mother board), and a V-shaped cut is made at a boundary between the individual printed circuit boards. For example, a V-cut method (Japanese Industrial Standards (JIS) terminology) has been adopted in which electronic components are mounted on an automatic insertion machine and then cut individually. However, in this method, the printed circuit board is square.

[0005] In order to make the printed circuit board a deformed shape, the shape of the printed circuit board is formed by press working, and a part of the printed circuit board is joined by perforation (JIS terminology) or a push back (J
According to the IS terminology) method, a method has been adopted in which an odd-shaped printed circuit board is punched out and pushed back to its original state.

As a processing method, the above-mentioned technology was developed by the efforts of the predecessors, but recently, international competitiveness, particularly cost competitiveness, has emerged as a major problem. Differences in labor costs are a problem for all items, and in particular, differences in mold costs are not negligible.

Conventionally, in order to mount electronic components with high precision, for example, a mother board including ten printed circuit boards (actually, a large number of printed circuit boards, such as 50 or 100) is required to print ten single-sided printed boards. The external shapes of the circuit board and the mother board are simultaneously pressed, and the outer shapes of the ten printed circuit boards and the mother board are simultaneously pressed after the NC holes are formed on a double-sided board. At that time, dimensional accuracy was maintained by press working based on a reference hole (JIS term) or a reference mark (JIS term).

[0008] However, simultaneous press working of ten printed circuit boards requires ten identical dies, so that there is a drawback that the die cost is very high. Therefore,
There is a method in which one or two dies are used for the part of the printed circuit board, press work is performed while shifting the mother board, and then the outer periphery is removed by pressing the mother board with an external mold. Some have been implemented.

[0009] However, the above method is still insufficient to compete with cheap products overseas. That is, in order to produce different types of products, for example, products A, B, C, and D, it is inevitable that a mold for a printed circuit board is required for each product. There was a problem that the cost became large.

Further, the above-mentioned push-back method provides a large number of printed circuit boards in a single mother board, disposes the products after mounting and soldering electronic components, and takes out the products, so that the cost is very excellent. However, there were the following problems. One is that as the thickness of the printed circuit board, or motherboard, decreases, the reliability of the holding force after pushback decreases. In other words, when pushing back a thin object with a thickness of 0.2 mm or 0.4 mm, warping of the mother plate, impact during transportation, external force when mounting electronic components on the mounter, insertion of electronic components with an automatic insertion machine Due to external force at the time, force due to expansion and contraction due to temperature change in the jet solder bath, etc.
The problem is that the printed circuit board falls off the motherboard.

If a part of the printed circuit board falls off before mounting the electronic parts, the mounter or the automatic insertion machine which operates automatically tries to attach the electronic parts also to the dropped parts, so that the electronic parts fall. Not only is it wasted, it can also cause machine failure. Also, if the printed circuit board falls into the machine, it may cause a failure. Similarly, a drop in a solder bath not only causes a waste of parts but also causes a machine failure.

Another problem is that as the number of printed circuit boards provided in a single motherboard by pushback increases, the number of defective products increases. Assuming that one of a large number (for example, 100) of printed circuit boards provided on one mother board is defective, a mounter or an automatic insertion machine attaches electronic components only by marking a defective mark. Waste occurs. Also, when the defective printed circuit board is removed, the electronic components will be mounted in a place where there is no printed circuit board as in the case of dropping, so that
The same problem as described above occurs. However, even if one or two printed circuit boards are defective, it is costly to discard the entire mother board, and it is not preferable in terms of effective use of resources.

On the other hand, it is natural to make efforts to improve quality control and eliminate defective products. Under such circumstances, a method has been adopted in which a defective printed circuit board is extracted from a mother board, a good printed circuit board is inserted therein, and then mounted on a mounter or an automatic insertion machine.

[0014]

As described above, there are factors that hinder improvement in cost competitiveness in the manufacture of printed circuit boards, and by solving these factors, cost competitiveness can be increased.

[0015]

According to a first aspect of the present invention, there is provided a method for processing a printed wiring board, comprising a plurality of printed circuit boards provided by a push-back method. In processing the rectangular printed wiring mother board, the position of the reference hole is marked at the same time as the pattern of the printed circuit board, the reference hole is opened based on the marking, and after the push-back of the printed circuit board, the reference The two orthogonal sides of the rectangle are press-cut with an L-shaped blade using the hole as a reference. First, the pattern, that is, the printed circuit is formed by marking the position of the reference hole simultaneously with the pattern of the printed circuit board. The relative position between the plate and the reference hole can be extremely accurate. To simultaneously mark the position of the pattern and the position of the reference hole, the position (mark) of the reference hole should be printed when the land, pad, pattern connecting the land and the pad of the printed circuit board is formed by screen printing or the like. Good. That is, the pattern and the mark may be printed simultaneously. Then, if a reference hole is formed by accurately drilling the mark at the position of the mark using an NC drill or the like, the relative position between the pattern and the reference hole becomes extremely accurate.

After the printed wiring is formed by performing known processing such as etching, the printed circuit board is subjected to push-back processing, and then two orthogonal sides of the rectangle are formed with an L-shaped blade with respect to the reference hole. Press cutting. As described above, the mounter and the automatic insertion machine require that two sides perpendicular to the printed wiring board exist, but do not require that the printed wiring board be an accurate rectangle.
Therefore, if two sides that are perpendicular to each other are cut out accurately by press cutting with an L-shaped blade, the remaining two sides may be cut at low cost such as shearing. After cutting the first two sides, the printed wiring mother board may be turned 180 degrees and press-cut with the same blade.

The L-shaped blade can be used irrespective of the size of the printed wiring board, as long as the length of each side of the blade is longer than the length of the side of the printed wiring board to be cut. . That is, since a single blade can cut a printed wiring board having various dimensions, it is not necessary to prepare dies having various dimensions in accordance with the dimensions of the printed wiring board. Accordingly, the cost of the mold can be reduced, the manufacturing cost of the printed circuit board can be reduced, and the cost competitiveness can be improved.

In order to take advantage of this L-shaped blade, the length of each side of the L-shaped blade is sufficiently longer than the length of the side to be cut. It should be left. For example, a printed wiring board handled by a processor has a long side of 200 to 500 mm and a short side of 100 to 30 mm.
If it is in the range of 0 mm, the long side is over 500 mm,
It suffices to have one L-shaped blade having a short side exceeding 300 mm. In other words, it is sufficient that there is one L-shaped blade having a size suitable for the maximum size of the printed wiring board that may be handled.

Further, as described above, when a large number of printed circuit boards are simultaneously subjected to pushback processing, the same number of molds for pushback as the number of printed circuit boards are required, so that the mold cost becomes very expensive. 2. Description of the Related Art One or two pushback molds are used to perform a pushback process while shifting a printed wiring board.

In this method, positioning is required every time the printed wiring board is shifted, and therefore a push-back reference hole must be provided. The relative position between the pushback reference hole and the printed circuit board (pattern) must be accurate.

According to a second aspect of the present invention, there is provided a method of processing a printed wiring board, wherein a plurality of printed circuit boards are processed by a push-back method to form a substantially rectangular printed wiring board. At the same time, the position of the pushback reference hole is marked, the pushback reference hole is opened based on the marking, and after the pushback of the printed circuit board, the two orthogonal sides of the rectangle with reference to the pushback reference hole. Is press-cut with an L-shaped blade.

In this processing method, the position of the push-back reference hole is marked simultaneously with the pattern of the printed circuit board. This allows the pattern, ie, the relative position between the printed circuit board and the pushback reference hole, to be very accurate. To simultaneously mark the position of the pattern and the position of the pushback reference hole, use the land on the printed circuit board,
When a pattern connecting pads, lands and pads is formed by screen printing or the like, the position (mark) of the pushback reference hole may be printed. That is, the pattern and the mark may be printed simultaneously. If the position of the mark is accurately punched by an NC drilling machine or the like to form a pushback reference hole, the relative position between the pattern and the pushback reference hole becomes extremely accurate.

After forming the printed wiring by performing known processing such as etching, the push-back processing of the printed circuit board is performed with reference to the push-back reference hole. Then, two orthogonal sides of the rectangle are press-cut with an L-shaped blade using the pushback reference hole as a reference.

According to the processing method of the second aspect, two orthogonal sides required by the mounter and the automatic insertion machine can be accurately cut out by press cutting with an L-shaped blade. Since the pushback reference hole is used as a reference at the time of press cutting, there is no need to provide a reference hole for press cutting. Therefore, the cost can be reduced by the amount of the marking of the reference hole and the drilling.

If two orthogonal sides are first accurately press-cut with an L-shaped blade, the remaining two sides may be cut at a low cost such as shearing. Alternatively, after cutting the first two sides, the printed circuit board may be turned 180 degrees and press-cut with the same blade.

By using the L-shaped blade, the cost of the mold can be reduced, the manufacturing cost of the printed circuit board can be reduced, and the cost competitiveness can be improved, as in the first aspect. As described above, the merit of the L-shaped blade can be utilized by adopting the configuration of claim 3.

A printed wiring board according to a fourth aspect of the present invention is a substantially rectangular printed wiring board on which a plurality of printed circuit boards are provided by a push-back method, wherein a boundary line between the printed circuit board and the outside thereof is provided. Since a part is formed as a connection part into which an adhesive can be injected or filled, the printed circuit board can be bonded to the outside at the connection part. This adhesion can prevent the printed circuit board from falling off during transportation, mounting of electronic components, soldering, and the like.

Also, when a defective printed circuit board is removed and a good printed circuit board is inserted and then mounted on a mounter or an automatic insertion machine, the newly inserted printed circuit board is injected or filled with an adhesive. Can be prevented from falling off. Therefore, problems caused by the detachment of the printed circuit board are prevented. Further, even if one or two printed circuit boards are defective, it is not necessary to discard the printed wiring board, so that resources can be effectively used.

When the adhesive is injected into the boundary, there is a possibility that the adhesive spreads over a wide range of the boundary due to a capillary phenomenon. This makes it difficult to remove the printed circuit board. Therefore, in the printed wiring board according to the fifth aspect, the printed wiring board according to the fourth aspect is provided with through holes that define both ends of the connection portion. Since the through hole blocks the capillary phenomenon, the adhesive remains only at the connection portion, and the removal of the printed circuit board does not become difficult.

Further, when the adhesive is injected or because of the large injection amount, the adhesive may overflow and flow out to the surface of the printed circuit board. The structure according to claim 6 is designed to cope with this, and the connection portion is provided with a hole or a recess for injecting an adhesive. If a hole or dent is provided, even if the injection amount is a little large, it will stay in the hole or dent,
The overflow of the adhesive can be prevented. Also, since the holes or depressions are targeted, the injection position is also accurate, which also prevents the adhesive from adhering to the surface of the printed circuit board.

[0031]

Embodiments of the present invention will now be described in detail with reference to the drawings.

[0032]

FIG. 1 shows a printed wiring board (hereinafter, referred to as a printed wiring board) of this embodiment.
It is called motherboard. FIG. In the initial state, the outer shape of the mother plate 11 has so-called burrs as shown by a random line 11r and is not arranged.
It is cut into a substantially rectangular shape by cutting at d. Note that the side 11a and the side 11b are orthogonal to each other. These sides 11a to 11d
Will be described later.

The motherboard 11 is provided with a plurality of printed circuit boards 1, 2, 3,... 10 having lands or pads 12a and patterns 12b connecting the lands or pads 12a. The outer periphery of each of the printed circuit boards 1 to 10 is cut by pushback. Although a state in which the surface mount IC and the chip component CP are mounted on the printed circuit board 6 is shown, it is merely an example and is not limited to the surface mount product. For example, it may be a DIP-IC or a component with leads. Therefore, the land or pad 12a illustrated in the printed circuit board 10 may be perforated.

The odd-numbered printed circuit boards 1, 3, 5,...
In the figure, push-up reference holes 13 (13a-1, 13b-1, 13c-1..., 13a-2, 13b-2, 13c-2. It is provided in pairs up and down. The push-back reference hole 13a-1 is located at the lower left corner of the base plate 11 (side 11a and side 11b).
The distance along the side 11a from the point (intersection of) is b1 and the distance along the side 11b is b2. Pushback reference holes 13a-1, 13b-1, 13c-1 ...
Are arranged at equal intervals, and a straight line passing through their centers is a side 11a
Is parallel to Similarly, the push-back reference hole 13a-
2, 13b-2, 13c-2 ... are also arranged at equal intervals,
The straight line passing through the centers is also parallel to the side 11a. Also, a pair of push-back reference holes 13a-1 and 13a
-2, 13b-1 and 13b-2, 13c-1 and 13c-
The straight lines connecting the centers of 2... Are parallel to the side 11b.

The lower left corner of the base plate 11 has a lower left corner (side 11a).
And a side along the side 11b), a reference hole 14a is provided with a distance a1 along the side 11a and a distance a2 along the side 11b as a center, and a distance from the side 11a is on the right side of the reference hole 14a. A reference hole 14b centering on the position of a2 is provided. A reference hole 15a is located at the upper right corner,
Reference holes 15b are provided along 1c, respectively.

Further, the distance from the side 11a to the left side of the push-back reference hole 13a-1 is
A reference mark 16 is provided centered on the position corresponding to 2. The fiducial marks 16 are printed circuit boards 1, 2, 3,.
..Ten lands or pads 12a and patterns 12b
(For example, screen printing). At the time of printing, marks indicating the positions of the push-back reference holes 13, 14a, 14b, 15a, and 15b are also printed. The push-back reference holes 13 and the reference holes 14a to 15b are based on the marks. It has been drilled at the correct location and with the correct diameter using an NC drilling machine. After these holes are formed, the base plate 11 is subjected to a known process such as etching to form lands or pads 12a and patterns 12b.

Land or pad 12a and pattern 12
b together with the push-back reference hole 13 and the reference holes 14a-
Since the mark for 15b is printed and the pushback reference hole 13 and the reference holes 14a to 15b are formed based on the mark, the pattern 12b, that is, the printed circuit boards 1 to 10, the pushback reference hole 13, and the reference hole are formed. 1
The relative position with respect to 4a to 15b becomes extremely accurate. Naturally, the relative positions of the printed circuit boards 1 to 10 (more precisely, their lands, pads 12a and patterns 12b) are also extremely accurate. Therefore, pushback described later and cutting of the sides 11a and 11b of the mother plate 11 can be performed very accurately.

The processing procedure of the mother plate 11 is as follows. First, as described above, the marks for the reference mark 16, the push-back reference hole 13, and the reference holes 14a to 15b are printed together with the land or pad 12a and the pattern 12b, and the push-back reference hole 13 and the reference holes 14a to 14b are printed.
A hole 5b is formed, and a known process such as etching is performed.

Next, pushback processing is performed using a pushback mold corresponding to the outer shape of the printed circuit boards 1 to 10. The pushback is defined and described in JIS, and thus the description is omitted. However, in the case of the present embodiment, in order to effectively use the material, two adjacent printed circuit boards (for example, printed circuit boards 1 and 2) are arranged upside down, and these two are simultaneously placed. A two-piece mold is used so that it can be punched and pushed back. Then, first, the push-back reference holes 13a-1, 13a-
2, the pushback of the printed circuit boards 1 and 2 and then the pushback reference holes 13b-1 and 13b-2.
Pushback of the printed circuit boards 3, 4 based on
Next, the push-back to the printed circuit board 10 is performed by repeating the push-back of the printed circuit boards 5 and 6 with reference to the push-back reference holes 13c-1 and 13c-2.

By the above processing, the mother plate 11 with burrs indicated by the turbulent line 11r is obtained. Can not. Also, the reference hole 14
Since the distance between a and the outer periphery (the random line 11r) is not accurate, it cannot be mounted on the electronic component mounting machine.

[0041] Then, through the transport section of the electronic component mounting machine,
In order to enable attachment, the sides 11a and 11b are cut and distances a1 and a2 between the reference holes 14a and the sides 11a and 11b.
(Many electronic component mounting machines require 5 mm for both a1 and a2.) Specifically, as shown in FIG. 1, the reference hole 1 is inserted into a press (not shown) equipped with an L-shaped blade C having two sides C1 and C2 which are perpendicular to each other.
4a, 14b, and press the sides 11a, 1b.
Cut 1b. The side 11a and the side 11b are straight lines orthogonal to each other. Then, the base plate 11 is rotated by 180 degrees, set between the reference holes 15a and 15b, and the sides 11c and 11d are cut by pressing.

As shown in FIG. 1, the side C1 of the L-shaped blade C
Is sufficiently longer than the side 11a of the base plate 11, and the side C2
Because it is sufficiently longer than the side 11b, it can be used regardless of the size of the mother plate 11. That is, since the cutting process of the base plate 11 of various dimensions can be performed by one blade die C, it is not necessary to prepare dies of various sizes according to the dimensions of the base plate 11. Accordingly, the cost of the mold can be reduced, the manufacturing cost of the printed circuit board can be reduced, and the cost competitiveness can be improved.

For example, a mother board 11 'shown in FIG. 2 is an example in which printed circuit boards A and B having different shapes are alternately arranged. Like the mother board 11 shown in FIG.
Cutting of a 'to 11d' is performed. However, side 11
The lengths of a 'to 11d' are different from the corresponding sides 11a to 11d of the mother plate 11 shown in FIG. But side 11
The length of a ′ is the L-shaped blade C used for cutting the base plate 11.
Is shorter than the side C1 and the length of the side 11b 'is shorter than the side C2. Therefore, the cutting can be performed using the same L-shaped blade C used for cutting the mother plate 11.

If the side 11a is a straight line and a part of the side 11b is a straight line orthogonal to the side, the base plate 11 can be passed through the transporting section of the electronic component mounting machine and attached.
No precision is required for cutting 11d. Therefore, the sides 11c and 11d may be cut at low cost such as shearing. However, it is more efficient to perform two cuts with the same press as in the above example, and the dimensional accuracy is improved.

In any case, the cutting of the side 11a and the side 11c
Is performed separately, the dimensional variation is twice as large as in the case of using a mold that punches through the four sides 11a to 11d at the same time. This dimensional variation is not a problem because it depends on the positional accuracy of the reference holes 14a, 14b and the reference mark 16 irrespective of the distance between the sides 11a to 11c).

In the above example, the reference holes 14a, 14b,
Although 15a and 15b were previously opened, two of the push-back reference holes 13 were selected and the mother plate 1 was
1 is set on a press, and the side 11a, 11b or the side 11 is set.
When cutting c, 11d, the reference holes 14a, 14b, 1
5a and 15b may be opened.

The printed circuit boards 1 to 10 pushed back in this way can be subjected to an electrical test of all the printed circuit boards 1 to 10 while being attached to the mother board 11, that is, in a sheet form. From the mounting of the electronic components to the soldering operation, the operation can be automated and performed by an unmanned machine while being attached to the mother plate 11. Further, a great result can be obtained, for example, the soldered and completed electronic device can be tested at once without removing it from the motherboard 11.

However, if the printed circuit board is, for example,
1 may drop off due to warpage during the movement of the electronic component or during the mounting work of the electronic component, or may drop off due to a temperature change during the soldering work. Further, some of, for example, one of many printed circuit boards included in one mother board 11 may be defective.

Next, an example of dealing with such a problem (dropping from the mother plate or defective product) will be described. Although not shown in detail in FIG. 1, the outer peripheral portion of each of the printed circuit boards 1 to 10 (here, represented by the printed circuit board 1) has a shape shown in FIG. The boundary between the printed circuit board 1 and the mother board 11 (outline of the printed circuit board 1) shown in FIG. 3 is substantially triangular, but an injection hole 22 is provided at the approximate center of each side 21 and on both sides thereof. Is a restriction hole 2 having a larger diameter than the injection hole 22.
3 and 23 are provided. Each two regulating holes 23, 23
The portion sandwiched by is the connection portion 25. In this example, the injection hole 22 and the restriction holes 23 are formed in the mother plate 11 prior to the pushback described above, but may be formed simultaneously with the pushback.

Following the pushback, the adhesive from the injection needle 26 is dropped into the injection hole 22 as shown in FIG. The injection needle 26 is mounted on a known dispenser device (not shown), and the adhesive is automatically dropped into the injection holes 22 of all the printed circuit boards 1 of the motherboard 11 by a program of the dispenser device. . The amount of the adhesive dropped at this time is set to an amount just enough to reach the connection portion 25, and is adjusted by the dispenser device. In addition, the restriction holes 23, 23
5 prevents the adhesive that has penetrated into 5 from spreading along the side 21 by capillary action. Therefore, the adhesive stays only at the connection portion 25, and the other portions are not bonded.

Even when the amount of the dropped adhesive is too large, the excess adhesive remains in the regulating holes 23, 23 and the injection hole 22, so that the excess adhesive overflows and the printed circuit board 1 There is no danger of spilling on the surface of the surface. As described above, a part of the outer periphery of the printed circuit board 1 (the connection portion 25) is bonded to the mother board 11, so that the printed circuit board 1 falls off due to warpage, for example, during movement of the mother board 11 or mounting work of electronic components. There is no danger of dropping due to temperature change during soldering work.

Therefore, the electronic component mounting device does not drop the electronic component in order to mount the electronic component in the hole from which the printed circuit board 1 has fallen, and the electronic component mounting device does not cause the machine to fall due to the dropped printed circuit board 1 or the electronic component. Will not break down. Similarly, the printed circuit board 1 does not fall in the solder bath, so that no parts are wasted or a machine failure occurs.

When a defective product is found in many printed circuit boards 1, the defective product is first removed from the mother board 11. As described above, since the printed circuit board 1 and the mother board 11 are bonded only with a small number of connection portions 25, the removal can be easily performed. Then, the non-defective printed circuit board 1 is pushed into the trace where the defective product has been removed, and the connection portion 25 is bonded. As a result, only the non-defective printed circuit board 1 of the mother board 11 can be used, so that it is possible to proceed to the next step of mounting, soldering or inspecting electronic components.

When the printed circuit board 1 is removed from the mother board 11 after completion, the printed circuit board 1 and the mother board 1
1 is bonded with only a small connecting portion 25,
This removal is easy. (Modification 1) As shown in FIG. 4, this example is an example in which two restriction holes 27, 27 are provided along the side 21 of the printed circuit board 1, and a portion sandwiched between them is a connection portion 25. . Further, in this example, a recess 29 is provided in the base plate 11 as a substitute for the injection hole 22 described above.

Also in this case, after the pushback, the adhesive is dropped into the concave portion 29 using an injection needle or the like. The dropped adhesive penetrates into the boundary between the mother board 11 and the printed circuit board 1, that is, the connection part 25 from the recess 29. Then, as in the case described above, excessive diffusion is prevented by the restriction holes 27, 27, and only the connection portion 25 remains.

Even when the amount of the dropped adhesive is too large, the excess adhesive remains in the restriction holes 27 and 27 and the recess 29, so that the excess adhesive overflows and the printed circuit board 1 There is no risk of spilling on the surface. In the configuration shown in FIG. 4, similarly to the example of FIG. 3, the printed circuit board 1 can be prevented from falling off, the defective product can be easily removed, and the good product newly pushed in can be reliably held. Therefore, the same excellent effects as in the example of FIG. 3 are exhibited. (Modification 2) In the example shown in FIG. 5, a hole 31 is formed at the boundary between the printed circuit board 1 and the mother board 11 before the pushback.
The hole 31 is filled with a connection member 32 made of a material such as a silicone rubber adhesive having a moderately strong adhesive force and capable of withstanding the temperature of the solder bath by a printing operation. On the other hand, FIG.
As shown in (c) and (d), a notch 33 a is provided at a position corresponding to the hole 31 in the die 33 for pushback. For this reason, in the punching step in the pushback, as shown in FIG.
Is punched out, but is not sheared as a whole. In addition, as shown in FIG. 5B, the connection member 32 and the printed circuit board 1 are connected to the circuit board side adhesive portion 35a.
The base plate 11 is bonded to the base plate 11 at the base plate side bonding portion 35b, and the connection member 32 deforms while maintaining the bonding when punching, and returns by pushing back. That is, the connection member 32 connects the mother board 11 and the printed circuit board 1 before and after the pushback.

As described above, since a part of the outer periphery of the printed circuit board 1 is connected to the mother board 11 via the connecting member 32, the printed circuit board 1 is moved while the mother board 11 is moving or the electronic parts are mounted. There is no danger of falling off due to warping during the work or dropping due to temperature changes during the soldering work.

Accordingly, the electronic component mounting apparatus does not drop the electronic component in order to mount the electronic component in the hole from which the printed circuit board 1 has fallen. Will not break down. Similarly, the printed circuit board 1 does not fall in the solder bath, so that no parts are wasted or a machine failure occurs.

When a defective product is found in a large number of printed circuit boards 1, the defective product is removed from the mother board 11, and a good printed circuit board 1 is simply pushed into the trace, thereby producing a new printed circuit board. The circuit board 1 and the mother board 11 are connected. As a result, only the non-defective printed circuit board 1 of the mother board 11 can be used, so that it is possible to proceed to the next step of mounting, soldering or inspecting electronic components.

When each printed circuit board 1 is removed from the mother board 11 after completion, the printed circuit board 1 and the mother board 1
1 is connected only by a small number of connecting members 32, so that this can be easily removed. In addition, since the center of the hole 31 is deviated toward the mother board 11, the connection member 32 is removed when the printed circuit board 1 completed as an electronic device is removed.
Adhere to the mother plate 11 and remain. That is, since the connecting member 32 remains on the side to be discarded, the discarding is easy. Also,
There is no need to remove the connecting member 32 from the printed circuit board 1.

The embodiments of the present invention have been described with reference to the examples. However, the present invention is not limited to such examples. For example, two sides are press-cut with an L-shaped blade. Needless to say, the present invention can be implemented in various ways without departing from the spirit of the present invention, such as a reference hole and a hole added in addition to the pushback reference hole.

[Brief description of the drawings]

FIG. 1 is an explanatory diagram of a shape of a printed wiring board according to an embodiment.

FIG. 2 is an explanatory diagram of a shape of a printed wiring board of another example.

FIGS. 3A and 3B are explanatory diagrams of a boundary portion of a printed circuit board in a printed wiring board according to an embodiment, FIG. 3A is a plan view, and FIG. 3B is a cross-sectional view along AA.

4A and 4B are explanatory diagrams of a boundary portion of a printed circuit board according to a first modification, wherein FIG. 4A is a plan view, and FIG.

5A and 5B are explanatory diagrams of a boundary portion of a printed circuit board according to Modification 2, in which FIG. 5A is a plan view, FIG. 5B is a BB cross-sectional view, and FIG. FIG. 5 is an explanatory view of a relationship with a hole.
(D) is a sectional view showing a cutout portion of the mold.

[Explanation of symbols]

 1 to 10: printed circuit board 11, 11 ': printed wiring board 12a: land, pad 12b: pattern 13: pushback reference hole 14a to 15b: reference hole 21: side (boundary line) 22: injection hole (hole) 23 ... regulating hole (through hole) 25 ... connecting part 27 ... regulating hole (through hole) 29 ... concave part (dent) 31 ... hole 32 ... connecting member (adhesive)

Claims (6)

[Claims] In processing a substantially rectangular printed wiring board provided with a plurality of printed circuit boards by a push-back method, a position of a reference hole is marked simultaneously with a pattern of the printed circuit board. Making a reference hole based on the marking, and after the push-back of the printed circuit board, press-cut two orthogonal sides of the rectangle with an L-shaped blade using the reference hole as a reference. Processing method of mother plate. 2. In processing a substantially rectangular printed circuit board provided with a plurality of printed circuit boards by a push-back method, a position of a push-back reference hole is marked simultaneously with a pattern of the printed circuit board. Making the push-back reference hole based on the marking, and after the push-back of the printed circuit board, press-cut two orthogonal sides of the rectangle with an L-shaped blade with reference to the push-back reference hole. A method for processing a printed wiring board, comprising the steps of: 3. The method of processing a printed wiring mother board according to claim 1, wherein the length of each side of the L-shaped blade is sufficiently longer than the length of each side to be cut. Processing method of printed wiring board. 4. A substantially rectangular printed wiring mother board having a plurality of printed circuit boards provided by a push-back method, wherein a part of a boundary between the printed circuit board and the outside thereof is injected or filled with an adhesive. A printed wiring board, wherein the printed wiring board has a connection portion capable of performing the following. 5. The printed wiring board according to claim 4, wherein a through-hole defining both ends of the connection portion is provided. 6. The printed wiring board according to claim 4, wherein a hole or a recess for injecting an adhesive is provided in the connection portion.