JP2001174849A - Liquid crystal display device and its manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a liquid crystal display device capable of suppressing disconnection of connecting wirings connecting the wirings formed under the interlayer insulating film of an active element array substrate and its manufacturing method. SOLUTION: A substrate which has plural active elements, plural first wirings 2 electrically connected to the active elements, a second wiring 9 electrically connecting the wirings 2 each other, the interlayer insulating film 7 formed upward the active elements, the first wirings 2 and the second wiring 9 and plural pixel electrodes formed on the film 7 and in which the film 7 has an opening part 15 upward the second wiring 9 and the first wirings 2 and the second wiring 9 are electrically connected with connecting wirings 11 and contact holes 7b, 7c, is produced and an active element array substrate is obtained by electrically separating the first wirings 2 each other by cutting a part of the second wiring 9 in the substrate.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] The present invention relates to a liquid crystal display device.

[0002]

2. Description of the Related Art In recent years, a liquid crystal display device, particularly an active matrix type liquid crystal display device in which an active element is arranged as a switching element in each pixel, has been widely used. An active matrix type liquid crystal display device is configured by sandwiching liquid crystal between an active element array substrate and a counter substrate. The active element array substrate is configured such that a plurality of pixel electrodes are arranged in a matrix on the substrate, and a plurality of active elements are arranged so as to correspond to each of the pixel electrodes.

Conventionally, there has been proposed a liquid crystal display device in which the aperture ratio is increased by forming a pixel electrode on an uppermost layer in an active element array substrate. Such a liquid crystal display device and a method of manufacturing the same are described, for example, in Shinjo et al., “High aperture ratio 11.3 inch SVGA TFT-LCD fabricated by a shortened process method”, 1996 Active Matrix Liquid Crystal Display International Association (AM). -LCD
96) Proceedings, pp. 201-204 (M. Sinjou et.
al., A High Aperture Ratio 11.3 inch-diagonal SVGA
TFT-LCDs Fabricated by Reduced Process Method, Dig
est of Technical Papers 1996 International Worksho
p on Active-Matrix Liquid Crystal Displays (AM-LCD
96), pp. 201 to 204) are known.

FIG. 5 is a plan view showing the structure of an active element array substrate constituting a conventional liquid crystal display device. As shown in FIG. 5, a plurality of thin film transistors (TFTs) 24, a drive signal line 22 also serving as a gate electrode of the TFT, and a video signal line 26 serving also as a source electrode of the TFT are formed on a substrate 21. I have. Further, an interlayer insulating film 27 is formed so as to cover the TFT 24, the drive signal line 22, and the video signal line 26.
A pixel contact hole is formed in a portion corresponding to the drain electrode 25 of FIG. The pixel electrode 28 is an interlayer insulating film 2
7 and formed on the TFT through a pixel contact hole.
Is electrically connected to the drain electrode 25.

[0005] On the substrate 21, test signal lines 29 and 32 for supplying a test signal for inspecting the presence or absence of a defect such as disconnection of each wiring are provided. The test signal line 29 is
It is electrically connected to the drive signal line 22 via the connection wiring 31 so that the test signal can be supplied to all the drive signal lines collectively. Similarly, the test signal line 32 is electrically connected to the video signal line 26 via the connection wiring 34 so that a test signal can be collectively supplied to all the video signal lines. Note that the electrical connection between the drive signal line 22 and the test signal line 29 and the electrical connection between the video signal line 26 and the test signal line 32 are separated by dividing the board after the inspection.

By using such an active element array substrate, by forming pixel electrodes on an interlayer insulating film, it is possible to extend the pixel electrodes to above the drive signal lines and the video signal lines. , The liquid crystal display device having a large aperture ratio can be obtained. Further, by forming the interlayer insulating film to be thick, the capacitance between the pixel electrode and the driving signal line and the video signal line can be reduced, and occurrence of crosstalk can be suppressed.

[0007]

In the above-mentioned active element array substrate, after the inspection using the test signal lines is completed, the substrate is used to electrically separate the video signal lines and the drive signal lines from the respective test signal lines. Is divided. For this reason, an opening 35 is usually formed in the interlayer insulating film 27 in a region corresponding to the dividing line of the substrate in order to suppress fragment scattering at the time of dividing the substrate. However, in the active element array substrate constituting the conventional liquid crystal display device, there is a problem that disconnection of the connection wiring is likely to occur near the opening 35 of the interlayer insulating film.

Hereinafter, a method of manufacturing an active element array substrate constituting a conventional liquid crystal display device will be described with reference to FIG. 6, and a mechanism of occurrence of disconnection of connection wiring will be described.

First, after a drive signal line 22, a test signal line 29 and other wiring 30 are formed on a substrate 21, an interlayer insulating film 27 is formed. Next, after the interlayer insulating film 27 in at least a part of the drive signal line 22 and a region corresponding to the opening 35 is removed, a conductive film 31a is formed (FIG. 6A). Subsequently, a positive photosensitive resist 36 is applied on the conductive film 31a and is exposed (FIG. 6).
(B)). At this time, a thin film portion 36a is formed at the edge of the interlayer insulating film around the opening 35 because the coating thickness of the resist is reduced. Subsequently, the resist 36 is developed, and a resist pattern 36b is formed on the unexposed portions (FIG. 4C). At this time, the exposed portions of the resist are removed, and a slight decrease in film thickness occurs in the unexposed portions. In the thin film portion 36a of the resist, the resist pattern may disappear due to the decrease in the film thickness during the development. Next, the conductive film 31a is etched using the resist pattern 36b as a mask to form the connection wiring 31. In the portion where the resist pattern 36b has disappeared, a disconnection portion 31b is formed in the connection wiring 31 (FIG. 4).
(D)).

As a method for preventing the occurrence of a disconnection, a thin film portion is prevented from being formed at the time of applying a resist.
It is conceivable to (1) reduce the thickness of the interlayer insulating film, and (2) increase the thickness of the resist. However, in the former, the parasitic capacitance between the pixel electrode and the drive signal line and the video signal line increases in the pixel region, and there is a concern that the image quality characteristics such as crosstalk may be degraded. In the latter case, there is a concern that productivity may decrease due to extension of production tact.

SUMMARY OF THE INVENTION In view of the above problems, the present invention provides a liquid crystal display device capable of suppressing the occurrence of crosstalk and the disconnection of connection wiring by using a thick interlayer insulating film in an active element array substrate, and manufacturing the same. The aim is to provide a method.

[0012]

In order to achieve the above object, a liquid crystal display device according to the present invention is a liquid crystal display device in which liquid crystal is sealed between two substrates facing each other, wherein one of the substrates is one of the substrates. A plurality of active elements, a plurality of first wirings electrically connected to the active element, a second wiring electrically connecting the first wirings, the active element, the first And an interlayer insulating film formed above the second wiring and the second wiring, and a plurality of pixel electrodes formed on the interlayer insulating film corresponding to each of the active elements, wherein the interlayer insulating film is An opening above at least one of the first wiring and the second wiring, wherein the first wiring and the second wiring are formed on the interlayer insulating film; The capacitor formed on the interlayer insulating film At least one of the first wiring and the second wiring is cut at an opening of the interlayer insulating film from a substrate which is electrically connected to the first wiring via a connection hole, and the first wirings are electrically connected to each other. It is a substrate obtained by separation. Note that a drive signal line and a video signal line can be exemplified as the first wiring, and a test signal line for detecting a defect can be exemplified as the second wiring. With this configuration, it is possible to provide a liquid crystal display device in which the occurrence of crosstalk is suppressed and the disconnection of the connection wiring is suppressed by using the interlayer insulating film as a thick film in the active element array substrate.

In the above liquid crystal display device, it is preferable that the diameter of the contact hole is 5 to 30 μm. This is because disconnection of the connection wiring can be suppressed more reliably.

In the liquid crystal display device, it is preferable that the connection wiring is made of the same material as the pixel electrode. This is because the manufacturing process can be simplified.

In the liquid crystal display device, the connection wiring is made of at least one selected from indium tin oxide (hereinafter, referred to as "ITO"), Al, an Al alloy, Ag, and an Ag alloy. Is preferred. IT
O is a pixel electrode of a transmission type liquid crystal display device, and Al, Al
Alloys, Ag, and Ag alloys are useful materials for pixel electrodes of reflective liquid crystal display devices. Therefore, by using such a material for the connection wiring, the pixel electrode and the connection wiring can be made of the same material, and the manufacturing process can be simplified.

In the liquid crystal display device, it is preferable that the interlayer insulating film is mainly composed of an organic material. This is because an interlayer insulating film having a suitable thickness can be easily formed.

In order to achieve the above object, a method of manufacturing a liquid crystal display device according to the present invention includes a step of forming a plurality of active elements on a substrate, and a step of forming a plurality of active elements on the substrate which are electrically connected to the active elements. Forming a first wiring and a second wiring separated from the first wiring, and forming an interlayer insulating film above the active element, the first wiring and the second wiring. Forming an opening above at least one of the first wiring and the second wiring in the interlayer insulating film; and forming an opening in the first wiring and the second wiring in the interlayer insulating film. Forming a contact hole above, forming a connection wiring on the interlayer insulating film, and electrically connecting the first wiring and the second wiring via the connection wiring and the contact hole And the first Electrically connecting the lines via the second wiring, forming a pixel electrode on the interlayer insulating film corresponding to each of the active elements, and forming a pixel electrode on the interlayer insulating film. Cutting at least one of the first wiring and the second wiring to electrically separate the first wirings from each other. In addition, as the first wiring, a driving signal line and a video signal line can be exemplified, and as the second wiring, a test signal line for detecting a defect can be exemplified.

With this configuration, it is possible to suppress the occurrence of crosstalk and the disconnection of the connection wiring by using the interlayer insulating film as a thick film in the active element array substrate.

In the above manufacturing method, the diameter of the contact hole is preferably 5 to 30 μm. This is because disconnection of the connection wiring can be suppressed more reliably.

In the above-mentioned manufacturing method, it is preferable that the connection wiring is made of the same material as the pixel electrode. This is because the manufacturing process can be simplified.

In the above-mentioned manufacturing method, it is preferable that the connection wiring is made of at least one selected from ITO, Al, Al alloy, Ag and Ag alloy. I
TO is a pixel electrode of a transmissive liquid crystal display device, and Al, A
1 alloy, Ag and Ag alloy are materials useful as pixel electrodes of a reflection type liquid crystal display device. Therefore, by using such a material for the connection wiring, the pixel electrode and the connection wiring can be made of the same material, and the manufacturing process can be simplified.

In the above-mentioned manufacturing method, it is preferable that the interlayer insulating film is mainly composed of an organic material. This is because an interlayer insulating film having a suitable thickness can be easily formed.

[0023]

DESCRIPTION OF THE PREFERRED EMBODIMENTS A liquid crystal display device according to the present invention is an active matrix type liquid crystal display device in which an active element is arranged as a switching element in each pixel. In one example of the structure of the liquid crystal display device according to the present invention, the active element array substrate and the opposing substrate are arranged to face each other via a spacer, and liquid crystal is held between the two substrates.

The active element array substrate is a substrate obtained by cutting electrical connection between specific wirings from a substrate on which a plurality of pixel electrodes, active elements and various wirings are arranged.

FIG. 1 is a plan view showing an example of the structure of an active element array substrate constituting a liquid crystal display device according to the present invention. FIG. 2 is a cross-sectional view along the line AA ′ in FIG. 1, and FIG. 3 is a cross-sectional view along the line BB ′ in FIG. FIGS. 1 to 3 show the structure of the active element array substrate before disconnecting the electrical connection between specific wirings.

As shown in FIG. 1, a pixel electrode 8
And a plurality of pixels including active elements (hereinafter, this region is referred to as a “pixel region”). Around the pixel area, a drive signal line 2 and a video signal line 6 extending from the pixel area, test signal lines 9 and 12 for supplying a test signal to the wiring, and other wirings 10 and 13 are arranged. (Hereinafter, this area is referred to as a “peripheral area”).

First, the structure of the pixel area will be described.
As shown in FIGS. 1 and 2, a plurality of thin film transistors (hereinafter, referred to as “TFTs”) are arranged in a matrix on a substrate 1. The TFT includes a gate electrode formed on a substrate 1, a semiconductor layer 4 formed on the gate electrode via a gate insulating film 3, a source electrode and a drain electrode 5 electrically connected to the semiconductor layer 4. It is composed of
Note that the structure of the TFT is not limited to the above structure, and any structure conventionally used for an active matrix liquid crystal display device can be employed.

On the substrate 1, drive signal lines 2 are formed corresponding to each row of TFTs. The drive signal line 2 is TF
This is a wiring for supplying a drive signal to T. Also, TF
Video signal lines 6 are formed corresponding to each column of T.
The video signal line 6 is a wiring for supplying a video signal to the pixel electrode 8 via a TFT.

The gate electrode of each TFT is connected to the drive signal line 2 together with the gate electrodes forming another TFT adjacent in the row direction. The source electrode of each TFT is connected to the video signal line 6 together with the source electrodes of another TFT adjacent in the column direction. FIG.
As shown in FIG. 2 and FIG. 2, the drive signal line 2 can be formed integrally with the gate electrode.
It can be formed integrally with the source electrode.

Further, the substrate 1 includes a TFT and a drive signal line 2.
Further, an interlayer insulating film 7 is formed above the video signal line 6. The thickness of the interlayer insulating film 7 is preferably 1.5-3.
5 μm. As the interlayer insulating film 7, for example,
An organic material such as an acrylic resin can be used.

The pixel electrode 8 is formed on the interlayer insulating film 7. The pixel electrode 8 is electrically connected to the corresponding drain electrode 5 of the TFT via a pixel contact hole 7a formed in the interlayer insulating film 7. When forming a transmissive liquid crystal display device, a translucent material such as ITO can be used as the pixel electrode 8. When a reflective liquid crystal display device is formed, a non-translucent material such as Al, Ag, or an alloy thereof can be used.

Next, the structure of the peripheral area will be described.
As shown in FIG. 1, in the peripheral region, the drive signal line 2 and the video signal line 6 electrically connected to the TFT extend from the pixel region, and are electrically connected to the test signal lines 9 and 12, respectively. ing. Hereinafter, the structure of the portion where the drive signal line 2 and the test signal line 9 are electrically connected will be described.
This will be described with reference to FIG.

The drive signal line 2 and the test signal line 9 are arranged on the substrate 1 so as to be separated from each other. The test signal line 9 is a wiring for supplying a test signal to the drive signal line 2 when inspecting the TFT or the drive signal line 2 for defects. For example, as shown in FIG. 1, the test signal line 9 includes a plurality of branch portions 9a formed so as to correspond to each of the drive signal lines 2, and a wiring portion 9b that electrically connects the branch portions 9a to each other. Can be formed as a comb-shaped wiring.

Further, another wiring 10 is arranged on the substrate 1 in a gap between the test signal line 9 and the drive signal line 2.
The wiring 10 includes, for example, a relief line provided to supply a driving signal to the TFT in place of the video signal line 6 when the video signal line 6 is disconnected.

An interlayer insulating film 7 is formed on the substrate 1 on which each wiring is formed. The thickness and constituent material of the interlayer insulating film 7 are as described above.

In the interlayer insulating film 7, contact holes 7b and 7c are formed in regions corresponding to the positions above the drive signal lines 2 and the test signal lines 9, respectively. The diameter of the contact holes 7b and 7c is usually 5 to 30 μm, preferably 5 to 15 μm.

The connection wiring 11 is formed on the interlayer insulating film 7. The connection wiring 11 is formed so as to cover at least a part of the drive signal line 2 and the test signal line 9,
The drive signal line 2 and the test signal line 9 are connected to the contact holes 7b.
And 7c are electrically connected.

The connection wiring 11 can be made of a conductive material different from that of the pixel electrode 8, but is preferably made of a common conductive material with the pixel electrode 8. In particular,
ITO, Al, Ag, or an alloy thereof can be used.

The structure of the portion where the video signal line 6 and the test signal line 12 are electrically connected in the peripheral area is such that the drive signal line 2 and the test signal line 9 are electrically connected. The structure can be substantially the same as the portion. That is, the branch portion 12a and the wiring portion 12b
Are arranged so as to be separated from each other, and the wiring 13 is arranged in a gap therebetween. On the substrate 1, an interlayer insulating film 7 having contact holes 7d and 7e is formed on the video signal line 6 and the test signal line 12, and the connection wiring 1 is formed on the interlayer insulating film 7.
4 are formed, and the video signal line 6 and the test signal line 12 are connected to the connection wiring 14 and the contact holes 7d and 7e.
And a structure electrically connected via the.

In the peripheral region, there is a region where the opening 15 is formed in the interlayer insulating film 7. The opening 15 cuts a part of the test signal lines 9 and 12, specifically, the branch portions 9a and 12a when electrically separating the drive signal lines 2 and the video signal lines 6, for example. This is equivalent to a cutting line for cutting.

As shown in FIG. 1, the opening 15 can be formed in a groove shape above the test signal lines 9 and 12. Specifically, it can be formed above the branch portions 9a and 12a so as to be orthogonal to the branch portions 9a and 12a. The width of the opening 15 is 0.1
About 2 mm is appropriate.

The active element array substrate can be manufactured as follows.

FIG. 4 is a diagram for explaining a manufacturing process of the active element array substrate in the manufacturing method of the present invention, and is a cross-sectional view of the same region as FIG.

First, after a first conductive film is formed on the substrate 1, the first conductive film is patterned to form the drive signal line 2, the test signal line 9, and the wiring 10. As shown in FIG. 1, the drive signal line 2 is formed in a shape connected to the gate electrode. As the first conductive film, for example, Ti / Al / Ti
Were laminated in a film thickness of 100/200/100 nm, respectively.
Layered films can be used. As a method for forming the first conductive film, a sputtering method using an Ar gas can be employed.

Next, after a silicon nitride film is formed as a gate insulating film, amorphous silicon is formed and patterned to form a semiconductor layer. As a method for forming each film, for example, a plasma enhanced chemical vapor deposition method can be adopted.

Next, after forming a second conductive film, it is patterned, and the drain electrode of the TFT (corresponding to 5 in FIG. 1) and the video signal line (corresponding to 6 in FIG. 1). , Test signal lines (corresponding to 12 in FIG. 1) and wiring (FIG. 1).
This corresponds to 13. ) Is formed. As shown in FIG.
The video signal line is formed in a shape connected to the source electrode. As the second conductive film, for example, Ti / Al / Ti
Were laminated in a film thickness of 100/200/100 nm, respectively.
Layered films can be used. As a method for forming the second conductive film, a sputtering method using an Ar gas can be employed.

Next, a photosensitive organic material is applied to form an interlayer insulating film 7. Subsequently, the interlayer insulating film 7 is exposed and developed,
In the pixel region, a pixel contact hole (corresponding to 7a in FIG. 1) is formed above the drain electrode, and in the peripheral region, contact holes 7b and 7c are formed above the drive signal line 2 and the test signal line 9. Then, a contact hole (corresponding to 7d and 7e in FIG. 1) is formed above the video signal line and the test signal line (corresponding to 12 in FIG. 1). The diameter of the contact hole is as described above. At the same time, the test signal line 9 and the interlayer insulating film 7 on the test signal line (corresponding to 12 in FIG. 1)
A groove-shaped opening 15 is formed.

Next, a third conductive film 11a is formed (FIG. 4A). As the third conductive film 11a, for example, I
TO or the like can be used, and the film thickness can be about 100 nm. The formation of the third conductive film 11a can be performed by, for example, a sputtering method using a mixed gas of Ar and O ₂ .

Next, a positive photosensitive resist 16 is spin-coated. The coating thickness of the resist 16 is 1.0 to 2.0 μm
About m is appropriate. At this time, the opening 1 of the interlayer insulating film is formed.
In the vicinity of 5, the thickness of the resist 16 becomes thinner than other portions, and a thin film portion 16a is formed. On the other hand, around the contact holes 7b and 7c,
Since the diameters of the contact holes 7b and 7c are sufficiently small, no thin film portion is formed.

Subsequently, with respect to the resist 16, the pattern of the pixel electrode is shielded from light in the pixel region, and the pattern of the connection wiring for electrically connecting the drive signal line 2 and the test signal line 9 is formed in the peripheral region. Then, ultraviolet rays 18 are irradiated through a photomask 17 which shields a pattern of a connection wiring for electrically connecting the video signal line and the test signal line (corresponding to 12 in FIG. 1) (FIG. 4B). )). At this time, the thin film portion 16a of the resist formed around the opening 15 is
It is exposed by ultraviolet rays 18.

Next, the resist 16 is developed to have a pixel electrode pattern in the pixel region, and a connection wiring pattern for electrically connecting the drive signal line 2 and the test signal line 9 in the peripheral region. , Video signal line and test signal line (Fig. 1
This corresponds to 12. ) Is formed (FIG. 4C). At this time, the resist thin film portion 16a existing around the opening 15 is removed.

Next, after the third conductive film 11a is etched using the resist pattern 16b as a mask, the resist pattern 16b is peeled off (FIG. 4D). This allows
Pixel electrodes (corresponding to 8 in FIG. 1) are formed in the pixel region, and the drive signal lines 2 and the test signal lines 9 are formed in the peripheral region.
And a connection wiring (corresponding to 14 in FIG. 1) for electrically connecting the video signal line and the test signal line (corresponding to 12 in FIG. 1). Thus, an active element array substrate is obtained.

The liquid crystal display device of the present invention is manufactured using the active element array substrate in the following manner.

First, a liquid crystal cell is formed by disposing the active element array substrate and the opposing substrate to face each other via a spacer, and sealing liquid crystal between the two substrates. Note that the counter substrate can be manufactured by forming a counter electrode on the substrate.

Next, a test signal is applied to the test signal lines 9 and 12 for the obtained liquid crystal cell, and it is confirmed whether or not the liquid crystal cell operates normally.

Next, a step of electrically separating the drive signal lines 2 and the video signal lines 6 of the active element array substrate is performed. The electrical separation between the drive signal lines 2 and the video signal lines 6 is performed by cutting a part of a specific wiring. For example, in the case of the active element array substrate having the structure shown in FIG. At 15, this is performed by cutting a part of the test signal lines 9 and 12, specifically, the branch portions 9a and 12a. The wiring can be cut by a method such as dividing the substrate or irradiating a laser.

Further, polarizing plates are arranged on both sides of the liquid crystal cell,
A liquid crystal display device can be obtained by appropriately arranging a backlight and the like.

As described above, in the present invention,
Wirings formed below the interlayer insulating film of the active element array substrate are electrically connected to each other through connection wires and contact holes formed on the interlayer insulating film. As described above, since the diameter of the contact hole is relatively small, even when a thick interlayer insulating film is used, in the resist coating step (FIG. 4B) for forming the connection wiring, the area around the contact hole is reduced. Thus, it is possible to prevent the coating thickness of the resist from being reduced. Therefore, since the resist pattern does not disappear around the contact hole, disconnection of the connection wiring can be suppressed.

In the above description, an example is shown in which the conductive film of the same quality as the connection wiring (ie, the third conductive film) is removed from the opening of the interlayer insulating film. It may be left. In this case, the remaining conductive film may be cut together with a test signal line in a wiring cutting step performed later.

Also, an example has been shown in which the electrical separation between the drive signal lines and the video signal lines is performed by forming an opening in the interlayer insulating film on the test signal line and cutting the test signal line. The present invention may be implemented by forming openings in the interlayer insulating film on the drive signal lines and the video signal lines, and cutting the drive signal lines and the video signal lines.

The active element is not limited to the TFT, but may be a two-terminal non-linear element such as MIM.

[0062]

As described above, the liquid crystal display device of the present invention is a liquid crystal display device in which liquid crystal is sealed between two substrates facing each other, wherein one of the substrates has a plurality of active elements. A plurality of first wirings electrically connected to the active element; a second wiring electrically connecting the first wirings to each other;
And an interlayer insulating film formed above the second wiring and the second wiring, and a plurality of pixel electrodes formed on the interlayer insulating film corresponding to each of the active elements, wherein the interlayer insulating film is An opening above at least one of the first wiring and the second wiring, wherein the first wiring and the second wiring are formed on the interlayer insulating film; Cutting at least one of the first wiring and the second wiring at an opening of the interlayer insulating film from a substrate electrically connected through a contact hole formed in the interlayer insulating film; Since the substrate is obtained by electrically separating the first wirings from each other, the occurrence of crosstalk is suppressed by using an interlayer insulating film as a thick film in the active element array substrate, and disconnection of the connection wiring is suppressed. It can be a crystal display device.

Further, according to the method of manufacturing a liquid crystal display device of the present invention, a step of forming a plurality of active elements on a substrate, and a step of forming a plurality of first active elements electrically connected to the active elements on the substrate. Forming a second wiring and a second wiring separated from the first wiring; and
Forming an interlayer insulating film above the first wiring and the second wiring; and forming an opening above at least one of the first wiring and the second wiring in the interlayer insulating film. Forming a contact hole above the first wiring and the second wiring in the interlayer insulating film; forming a connection wiring on the interlayer insulating film; Electrically connecting the second wiring to the second wiring via the connection wiring and the contact hole, and electrically connecting the first wirings to each other via the second wiring; Forming a pixel electrode corresponding to each of the active elements, and cutting at least one of the first wiring and the second wiring at an opening of the interlayer insulating film, and forming the first wirings with each other. Electrically separating the To include, in the active device array substrate, an interlayer insulating film by suppressing the occurrence of crosstalk as a thick film, and may be a liquid crystal display device which suppresses the disconnection of the connecting wires.

[Brief description of the drawings]

FIG. 1 is a plan view showing an example of an active element array substrate constituting a liquid crystal display device according to the present invention.

FIG. 2 is a sectional view taken along the line A-A 'of FIG.

FIG. 3 is a sectional view taken along line B-B 'of FIG.

FIG. 4 is a process cross-sectional view for explaining an example of a method for manufacturing an active element array substrate constituting the liquid crystal display device according to the present invention.

FIG. 5 is a plan view showing the structure of an active element array substrate constituting a conventional liquid crystal display device.

FIG. 6 is a process cross-sectional view for explaining a method for manufacturing an active element array substrate constituting a conventional liquid crystal display device.

[Explanation of symbols]

 1, 21 Transparent substrate 2, 22 Drive signal line 3 Gate insulating film 4, 24 Semiconductor layer 5, 25 Drain electrode 6, 26 Drive signal line 7, 27 Interlayer insulating film 8, 28 Pixel electrode 9, 12, 29, 32 Test Signal lines 10, 13, 30, 33 Wiring 11, 14, 31, 34 Connection wiring 15, 35 Opening

──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) H01L 29/786 H01L 29/78 612C 624 (72) Inventor Junji Boshita 1006 Odakadoma, Kadoma City, Osaka Matsushita Inside Electric Industrial Co., Ltd. (72) Inventor Gohisa Asano 1006 Kadoma Kadoma, Osaka Prefecture Inside Matsushita Electric Industrial Co., Ltd. (72) Mitsuhiro Uno 1006 Kadoma Kadoma, Kadoma City, Osaka Matsushita Electric Industrial Co., Ltd. F-term (Ref.) HH09 HH14 HH38 KK08 KK18 MM08 PP15 QQ09 QQ37 QQ53 RR21 RR27 VV12 VV15 WW01 XX36 XX37 5F110 AA24 AA26 CC07 E E03 EE04 EE15 EE44 FF03 GG02 GG15 GG45 HL03 HL04 HL12 NN02 NN27

Claims (10)

[Claims] 1. A liquid crystal display device comprising a liquid crystal sealed between two substrates facing each other, wherein one of the substrates is
A plurality of active elements; a plurality of first wirings electrically connected to the active element; a second wiring electrically connecting the first wirings; the active element; An interlayer insulating film formed above the wiring and the second wiring, and a plurality of pixel electrodes formed on the interlayer insulating film corresponding to each of the active elements, wherein the interlayer insulating film comprises: An opening above at least one of the first wiring and the second wiring, wherein the first wiring and the second wiring are formed on the interlayer insulating film; Cutting at least one of the first wiring and the second wiring at an opening of the interlayer insulating film from a substrate electrically connected through a contact hole formed in the interlayer insulating film; 1
A liquid crystal display device, which is a substrate obtained by electrically separating the wirings from each other. 2. The contact hole having a diameter of 5 to 30 μm.
The liquid crystal display device according to claim 1, wherein m is m. 3. The liquid crystal display device according to claim 1, wherein the connection wiring is made of the same material as the pixel electrode. 4. The connection wiring is made of indium tin oxide, A
The liquid crystal display device according to any one of claims 1 to 3, wherein the liquid crystal display device is composed of at least one selected from the group consisting of 1, Al alloy, Ag, and Ag alloy. 5. The liquid crystal display device according to claim 1, wherein the interlayer insulating film is mainly composed of an organic material. 6. A step of forming a plurality of active elements on a substrate, a plurality of first wirings electrically connected to the active elements on the substrate, and a plurality of first wirings separated from the first wirings. Forming a second wiring, forming an interlayer insulating film above the active element, the first wiring, and the second wiring;
Forming an opening above at least one of the first wiring and the second wiring; forming a contact hole above the first wiring and the second wiring in the interlayer insulating film; Forming a connection wiring on the interlayer insulating film, and electrically connecting the first wiring and the second wiring via the connection wiring and the contact hole;
Electrically connecting the first wirings via the second wirings, forming a pixel electrode on the interlayer insulating film corresponding to each of the active elements, Cutting at least one of said first wiring and said second wiring at said opening to electrically separate said first wirings from each other. 7. A contact hole having a diameter of 5 to 30 μm.
7. The method for manufacturing a liquid crystal display device according to claim 6, wherein m is m. 8. The method according to claim 6, wherein the connection wiring is made of the same material as the pixel electrode. 9. The connection wiring is made of indium tin oxide, A
The method for manufacturing a liquid crystal display device according to any one of claims 6 to 8, comprising at least one selected from the group consisting of 1, Al alloy, Ag, and Ag alloy. 10. The method of manufacturing a liquid crystal display device according to claim 6, wherein the interlayer insulating film mainly comprises an organic material.