JP2001171835A - Electronic parts-separating/conveying mechanism - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic part-separating/conveying mechanism of a simple structure capable of being effectively used for handling very small chip-like electronic parts. SOLUTION: This mechanism has a rotary disc 20 having a number of through-holes 21 in the vertical direction, a guide body 30 fixed and mounted while kept into contact with a bottom surface of the rotary disc 20, and a hollow chute 43 for dropping chip-like electronic parts one by one to the through-holes 21 of a part receiving position, and the chip-like electronic parts are separated and conveyed one by one by the rotation of the rotary disc 20. The hollow chute 43 has a feeding space of a circular cross section, and the through-holes 21 of the rotary disc have the circular shape.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component separation and transport mechanism for separating and transporting chip-shaped electronic components one by one, and more particularly to a structure suitable for separating extremely small chip components.

[0002]

2. Description of the Related Art FIG. 7 shows a conventional electronic component separating / conveying mechanism. A conveying groove 2 corresponding to a chip-shaped electronic component 10 is provided on an intermittent rotary table 1 which rotates in a horizontal plane. The electronic components 10 are sequentially supplied to the transport groove 2. And the intermittent rotary table 1
The chip-shaped electronic components 10 are sequentially conveyed with the intermittent rotation of.

A well-known technique of this kind is Japanese Utility Model Publication No. 3-446.
No. 42 is known.

[0004]

By the way, recently, miniaturization of chip-shaped electronic parts has progressed, and 1005 types (1 mm long) have been developed.
× 0.5mm in width), 0603 type (0.6mm in height × 0.
Ultra-small chip components such as 3 mm) have also been put to practical use.

[0007] In the conventional mechanism shown in FIG. 7, the chip-shaped electronic component 1 is transferred from the parts feeder 3 to the transport groove 2 of the intermittent rotary table 1.
When supplying 0, it is necessary to have high dimensional accuracy and positioning accuracy in the rotation direction and the depth direction of the transport groove 2.
Further, the gap between the fixed guide 4 for guiding the chip-shaped electronic component 10 entering the transport groove 2 so as not to protrude and the outer periphery of the intermittent rotary table 1 needs to be sufficiently small. For this reason,
In order to handle extremely small chip components, it is necessary to increase the positioning accuracy of the intermittent rotary table 1, the processing accuracy of the transport groove 2, and the like, and furthermore, to make the gap between the fixed guide 4 and the outer periphery of the intermittent rotary table 1 small. It becomes difficult to respond.

SUMMARY OF THE INVENTION In view of the foregoing, it is an object of the present invention to provide an electronic component separating and conveying mechanism which is suitable for handling extremely small chip-shaped electronic components and has a simple structure.

[0007] Other objects and novel features of the present invention will be clarified in embodiments described later.

[0008]

In order to achieve the above object, an electronic component separating and conveying mechanism according to the present invention has a rotating disk having a large number of through-holes in a vertical direction and a rotating disk having a bottom surface thereof. And a hollow chute for dropping the chip-shaped electronic components one by one into the through hole at the component receiving position, and separating the chip-shaped electronic components one by one by rotating the rotary disk. And transported.

In the electronic component separating and conveying mechanism, it is preferable that the hollow chute has a feeding space having a circular cross section, and the through hole of the rotating disk is circular.

[0010] Further, it is preferable that a pin or a blow-off means for blowing air to prevent the chip-shaped electronic component from falling into the hollow chute on one of the chip-shaped electronic components dropped into the through hole is provided.

[0011]

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view of an electronic component separating / conveying mechanism according to an embodiment of the present invention.

FIG. 1 is a front sectional view showing an embodiment of an electronic component separating / conveying mechanism according to the present invention, showing a rotary disk and a mechanism around the rotary disk. FIG. 2 shows chip-shaped electronic components mounted on the rotary disk. FIG. 3 is a front sectional view showing a feeder unit to send out and a mechanism around the feeder unit, FIG.
FIG. 4 is a plan view showing a feeder unit that sends out chip-shaped electronic components to the rotating disk and a mechanism around the feeder unit. FIG. 5 is a cross-sectional view of a hollow chute for dropping chip-shaped electronic components onto the rotating disk and its surroundings. FIG. 6 is a view for explaining the operation of the rotating disk at the chip-like electronic component receiving position and the take-out position.

In these figures, reference numeral 20 denotes a rotating disk which rotates in a horizontal plane, and a large number of circular through holes 21 are formed in the peripheral portion of the rotating disk 20 at equal angular intervals in the vertical direction. The center of the rotary disk 20 is fixed to a rotary drive shaft 25, and the rotary drive shaft 25 is rotatably supported by a bearing 27 fixed to a support frame 26. The rotation drive shaft 25 is configured to be rotationally driven by an electric motor 28 attached to the support frame 26 side. On the support frame 26 side, a guide body 30 is fixedly arranged so as to be in contact with the peripheral edge bottom surface of the rotating disk 20. This guide body 30 is shown in FIG.
As shown in (B), the lower opening of the circular through hole 21 at the periphery of the rotating disk is closed to prevent the chip-shaped electronic component 10 that has entered the circular through hole 21 from dropping. However, as described later, FIG.
A fine vacuum suction port 55 is open at the component receiving position in FIG.

The feeder section 40 has a ball feeder 41 and a linear feeder 42 connected to a component supply port above the ball feeder 41 as shown in FIGS. 3 and 4, and a hollow chute 43 is connected to the end of the linear feeder 42. ing. That is, the hollow chute 4 is inserted into the component feed path 42a of the linear feeder 42.
3, a feeding space 43a having a circular cross section communicates therewith. The ball feeder 41 and the linear feeder 42 send out the chip-shaped electronic component 10 toward the distal end of the linear feeder 42 by the vibration of the vibration source, and send it out to the feeding space 43 a of the hollow chute 43. The chip-shaped electronic component 10 that has advanced in the feeding space 43a of the hollow chute 43 falls by its own weight toward the lower end opening of the hollow chute 43 in FIG. And
The lower end opening of the hollow chute 43 faces and communicates with the circular through-hole 21 arriving at the component receiving position S1 of the rotating disk 20.

As shown in FIG. 6A, a pin 5 for preventing the drop of the chip-shaped electronic component 10 in the hollow chute 43 on one of the chip-shaped electronic components 10 which has fallen into the circular through hole 21.
A drop prevention means 50 capable of driving the device 1 in the projecting direction is provided below the hollow chute 43. The pin 51 is held by a holding member 52 fixed to the support frame 26 by a hollow chute 43.
From the protruding state protruding into the feeding space 43a.
It is slidably held back and forth within a range of a retracted state that does not protrude to 3a. The driving of the pin 51 in the protruding direction is performed by pushing a flange 53 fixed to the pin 51 with an air cylinder 54 attached to the holding member 52 side. The retraction of the pin 51 is performed by a return spring 58 around the pin.

The feeding space 43a of the hollow chute 43
In order to ensure the feeding of the chip-shaped electronic components 10 in the
As shown in FIGS. 5 and 6A, a fine (sufficiently smaller than the cross-sectional shape of the chip-shaped electronic component) vacuum suction port 55 is provided at the component receiving position S1 of the guide body 30, and the vacuum suction path 56, The vacuum suction hose 57 is connected to a vacuum source (negative pressure source) via a path.

A position where the rotary disk 20 is rotated by 180 ° from the component receiving position S1, for example, is a component extracting position S2, and as shown in FIG.
The chip-like electronic component 10 in the device 1 can be taken out by suction and holding.

The length of the circular through hole 21 of the rotating disk 20 is set to be equal to or slightly shorter than the length of the chip-shaped electronic component 10. If the length of the circular through-hole 21 is longer than that of the chip-shaped electronic component 10, the lower part of the second chip-shaped electronic component enters the circular through-hole 21, causing breakage when the rotating disk 20 is rotated and transferred.

Next, the overall operation of this embodiment will be described.

The chip-shaped electronic component 10 sent from the ball feeder 41 of the feeder section 40 is
The chip-shaped electronic component 10 is aligned in a line on the second component feeding path 42a and advances into the feeding space 43a of the hollow chute 43, and the chip-shaped electronic component 10 is hollowed by vacuum suction from the vacuum suction port 55 at the component receiving position S1 and gravity. The chute 43 falls. Then, as shown in FIG. 6 (A), the rotary disk 20 enters the circular through hole 21 of the rotating disk 20 which is waiting (stopped) at the component receiving position S1.
Then, the pin 51 of the drop prevention means 50 is
3, a hollow chute 4 on one of the chip-shaped electronic components 10 projecting into the feed space 43a and falling into the circular through hole 21.
The chip-shaped electronic component 10 in 3 is pressed to prevent its fall.

In this state, the rotating disk 20 is
Is stopped by rotating by one arrangement pitch, and the next circular through-hole 21 arrives at the component receiving position S1. At this timing, the pin 51 of the drop prevention means 50 retreats to release the chip-shaped electronic component 10 and drop the chip-shaped electronic component 10 into the circular through hole 21. Thus, the circular through hole 21
The chip-shaped electronic components 10 are sequentially separated and stored therein. 6 (B) due to the intermittent rotation of the rotating disk 20.
The chip-shaped electronic component 10 which has reached the component take-out position S2 is sucked and held by the suction nozzle 60 waiting just above the chip-shaped electronic component 10 and taken out.

The count position S3 is set immediately before the component take-out position S2. After the presence of the chip-shaped electronic component 10 in the through hole 21 is detected by the optical sensor or the like at the count position S3, the component take-out position S2 is set. In the above, the chip-shaped electronic component 10 may be taken out and taken out by the suction nozzle 60.

Further, a position immediately after the component take-out position S2 is set as a remaining amount detection position S4. At the remaining amount detection position S4, the presence or absence of the chip-shaped electronic component 10 is detected by an optical sensor or the like, and the suction nozzle 60
May be detected.

According to this embodiment, the following effects can be obtained.

(1) The chip-shaped electronic component 10 is moved from the hollow chute 43 in the feeding space 43a having a circular cross section to the circular through hole 21.
And it is not necessary to align the directions when supplying chip-shaped electronic components.

(2) The chip-shaped electronic component 10 is inserted into the chute 43 and the circular through hole 21 of the feeding space 43a having a circular cross section.
(Either of the square chip component and the cylindrical chip component) is not a surface contact, but a line contact, and has little friction, and is less likely to be caught by solder scum or the like attached to an electrode portion of the chip-shaped electronic component.

(3) The inner diameter of the circular through-hole 21 and the length in the vertical direction do not need to be processed with high precision.
It can easily cope with extremely small chip parts such as 05 type and 0603 type.

In the above embodiment, the rotating disk 2
Although it has been described that 0 rotates intermittently, continuous rotation can be performed at a low speed, and the problem of positioning accuracy of the rotating disk 20 can be solved.

The drop prevention means provided at the lower portion of the hollow chute 43 blows air into the feed space 43a instead of protruding the pin, and hollows one chip-shaped electronic component dropped into the through hole 21. A configuration may be adopted in which the chip-shaped electronic component in the chute is prevented from falling.

Although the embodiments of the present invention have been described above, it is obvious to those skilled in the art that the present invention is not limited to the embodiments and various modifications and changes can be made within the scope of the claims. There will be.

[0031]

As described above, according to the electronic component separating / conveying mechanism of the present invention, the rotating disk having a large number of through holes in the vertical direction is fixedly arranged so as to be in contact with the bottom surface of the rotating disk. And a hollow chute for dropping the chip-shaped electronic components one by one into the through hole at the component receiving position, and separating the chip-shaped electronic components one by one by the rotation of the rotating disk. Can be transported. On this occasion,
The chip-shaped electronic component is configured to drop from the hollow chute into the through-hole, eliminating the need for directional alignment when supplying the chip-shaped electronic component, reducing the friction associated with the movement of the chip-shaped electronic component, and removing solder residue attached to the component. The problem of being caught hardly occurs. In addition, the inner peripheral dimension of the through-hole, the length dimension in the vertical direction, and the like do not require particularly high-precision processing, and it can easily cope with extremely small chip components such as 1005 type and 0603 type. As a result, it is possible to realize a separation and transport mechanism for chip-shaped electronic components suitable for ultra-small chip-shaped electronic components such as 1005 type and 0603 type.

[Brief description of the drawings]

FIG. 1 is an embodiment of an electronic component separation and transport mechanism according to the present invention, and is a front sectional view showing a rotating disk and a mechanism around the rotating disk.

FIG. 2 is a front sectional view showing a feeder unit for sending out chip-shaped electronic components to a rotating disk and a mechanism around the feeder unit in the embodiment.

FIG. 3 is a plan view showing a rotating disk and a mechanism around the rotating disk in the embodiment.

FIG. 4 is a plan view showing a feeder unit for sending chip-shaped electronic components to a rotating disk and a mechanism around the feeder unit in the embodiment.

FIG. 5 is a cross-sectional view of a hollow chute for dropping a chip-shaped electronic component on a rotating disk and its periphery in the embodiment.

FIG. 6 is a diagram illustrating the operation of the rotating disk at the chip-like electronic component receiving position and the take-out position in the embodiment.

FIG. 7 is a plan view of a conventional mechanism.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Intermittent rotary table 2 Transport groove 3 Parts feeder 4 Fixed guide 10 Chip-shaped electronic component 20 Rotating disk 21 Circular through hole 25 Rotation drive shaft 26 Support frame 27 Bearing 28 Electric motor 30 Guide body 40 Feeder part 41 Ball feeder 42 Linear feeder 43 Hollow chute 43a Feeding space 50 Fall prevention means 51 pin

 ──────────────────────────────────────────────────続 き Continuation of the front page (72) Inventor Akihiro Kato 1-13-1 Nihonbashi, Chuo-ku, Tokyo TDC Corporation F term (reference) 3F072 AA14 GA06 GC04 GG06 GG11 GG19 KC01 KC05 KC06 KC07 KC17 KC18 KE11 KE13

Claims (3)

[Claims] 1. A rotating disk having a large number of through holes in a vertical direction, a guide body fixedly arranged so as to be in contact with the bottom surface of the rotating disk, and a chip-shaped electronic component inserted into the through hole at a component receiving position. A hollow chute for dropping one by one, and separating and transporting the chip-shaped electronic components one by one by rotating the rotary disk. 2. The electronic component separating and conveying mechanism according to claim 1, wherein the hollow chute has a feeding space having a circular cross section, and the through hole of the rotating disk is circular. 3. The device according to claim 1, further comprising: a pin for preventing the chip-shaped electronic component from falling in the hollow chute on one of the chip-shaped electronic components dropped into the through-hole, and a drop-preventing means by blowing air. 3. The electronic component separation and transport mechanism according to 2.