JP2001170797A5 - - Google Patents

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Publication number
JP2001170797A5
JP2001170797A5 JP2000218046A JP2000218046A JP2001170797A5 JP 2001170797 A5 JP2001170797 A5 JP 2001170797A5 JP 2000218046 A JP2000218046 A JP 2000218046A JP 2000218046 A JP2000218046 A JP 2000218046A JP 2001170797 A5 JP2001170797 A5 JP 2001170797A5
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2000218046A
Other languages
Japanese (ja)
Other versions
JP3849842B2 (ja
JP2001170797A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from JP2000218046A external-priority patent/JP3849842B2/ja
Priority to JP2000218046A priority Critical patent/JP3849842B2/ja
Priority to TW089120637A priority patent/TW527253B/zh
Priority to US10/089,067 priority patent/US6915944B1/en
Priority to DE60040311T priority patent/DE60040311D1/de
Priority to DE60033552T priority patent/DE60033552T2/de
Priority to PCT/JP2000/006957 priority patent/WO2001024968A1/ja
Priority to AT00964695T priority patent/ATE354451T1/de
Priority to EP00964695A priority patent/EP1231016B1/en
Priority to EP06076345A priority patent/EP1762329B1/en
Priority to AT06076345T priority patent/ATE408475T1/de
Publication of JP2001170797A publication Critical patent/JP2001170797A/ja
Publication of JP2001170797A5 publication Critical patent/JP2001170797A5/ja
Publication of JP3849842B2 publication Critical patent/JP3849842B2/ja
Application granted granted Critical
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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JP2000218046A 1999-10-05 2000-07-18 はんだ付け用フラックス、はんだぺ一スト、電子部品装置、電子回路モジュール、電子回路装置、及び、はんだ付け方法 Expired - Lifetime JP3849842B2 (ja)

Priority Applications (10)

Application Number Priority Date Filing Date Title
JP2000218046A JP3849842B2 (ja) 1999-10-05 2000-07-18 はんだ付け用フラックス、はんだぺ一スト、電子部品装置、電子回路モジュール、電子回路装置、及び、はんだ付け方法
TW089120637A TW527253B (en) 1999-10-05 2000-10-04 Soldering flux, soldering paste and soldering process
AT00964695T ATE354451T1 (de) 1999-10-05 2000-10-05 Lötmittel, lötpaste und lötverfahren
AT06076345T ATE408475T1 (de) 1999-10-05 2000-10-05 Lötmittel, lötpaste und lötverfahren
DE60033552T DE60033552T2 (de) 1999-10-05 2000-10-05 Lötmittel, lötpaste und lötverfahren
PCT/JP2000/006957 WO2001024968A1 (fr) 1999-10-05 2000-10-05 Flux de soudure, pate de soudure et procede de soudage
US10/089,067 US6915944B1 (en) 1999-10-05 2000-10-05 Soldering flux, solder paste and method of soldering
EP00964695A EP1231016B1 (en) 1999-10-05 2000-10-05 Soldering flux, solder paste and method of soldering
EP06076345A EP1762329B1 (en) 1999-10-05 2000-10-05 Soldering flux, soldering paste and method of soldering
DE60040311T DE60040311D1 (de) 1999-10-05 2000-10-05 Lötmittel, Lötpaste und Lötverfahren

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP11-284859 1999-10-05
JP28485999 1999-10-05
JP2000218046A JP3849842B2 (ja) 1999-10-05 2000-07-18 はんだ付け用フラックス、はんだぺ一スト、電子部品装置、電子回路モジュール、電子回路装置、及び、はんだ付け方法

Publications (3)

Publication Number Publication Date
JP2001170797A JP2001170797A (ja) 2001-06-26
JP2001170797A5 true JP2001170797A5 (sh) 2005-12-15
JP3849842B2 JP3849842B2 (ja) 2006-11-22

Family

ID=26555632

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000218046A Expired - Lifetime JP3849842B2 (ja) 1999-10-05 2000-07-18 はんだ付け用フラックス、はんだぺ一スト、電子部品装置、電子回路モジュール、電子回路装置、及び、はんだ付け方法

Country Status (1)

Country Link
JP (1) JP3849842B2 (sh)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10319888A1 (de) 2003-04-25 2004-11-25 Siemens Ag Lotmaterial auf SnAgCu-Basis
JP2005072173A (ja) * 2003-08-22 2005-03-17 Senju Metal Ind Co Ltd 電子部品およびソルダペースト
WO2007018288A1 (ja) 2005-08-11 2007-02-15 Senju Metal Industry Co., Ltd. 鉛フリーソルダペーストとその応用
JP4535050B2 (ja) * 2005-09-27 2010-09-01 パナソニック電工株式会社 熱硬化性樹脂組成物及びその製造方法
EP2052805B1 (en) * 2006-08-04 2016-09-28 Panasonic Intellectual Property Management Co., Ltd. Bonding material, bonded portion and circuit board
JP5411503B2 (ja) * 2006-08-28 2014-02-12 パナソニック株式会社 熱硬化性樹脂組成物及びその製造方法並びに回路基板
JP5052857B2 (ja) * 2006-10-13 2012-10-17 株式会社フジクラ 導電性組成物およびこれを用いた導電体、導電回路の形成方法
JP5468199B2 (ja) * 2006-11-22 2014-04-09 日立化成株式会社 導電性接着剤組成物、電子部品搭載基板及び半導体装置
EP2196514B1 (en) 2007-10-03 2013-01-23 Hitachi Chemical Company, Ltd. Adhesive composition, electronic-component-mounted substrate and semiconductor device using the adhesive composition
JP5373464B2 (ja) * 2008-04-23 2013-12-18 パナソニック株式会社 導電性ペーストおよびこれを用いた実装構造体
JP5464463B2 (ja) * 2008-09-25 2014-04-09 パナソニック株式会社 熱硬化性樹脂組成物及び回路基板
CN101728354B (zh) * 2008-10-27 2013-07-10 松下电器产业株式会社 电子设备及其制造方法
CN102576766A (zh) * 2009-10-15 2012-07-11 日立化成工业株式会社 导电性粘接剂、太阳能电池及其制造方法、以及太阳能电池模块
JP5900350B2 (ja) * 2011-01-27 2016-04-06 日立化成株式会社 導電性接着剤組成物、接続体及び太陽電池モジュール
JP5952849B2 (ja) * 2014-03-25 2016-07-13 岡村製油株式会社 フラックス及びソルダペースト
US10813228B2 (en) * 2018-06-22 2020-10-20 Indium Corporation Preventing post reflow interconnect failures in VIPPO solder joints via utilization of adhesive material

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