JP2001165799A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2001165799A5 JP2001165799A5 JP2000328153A JP2000328153A JP2001165799A5 JP 2001165799 A5 JP2001165799 A5 JP 2001165799A5 JP 2000328153 A JP2000328153 A JP 2000328153A JP 2000328153 A JP2000328153 A JP 2000328153A JP 2001165799 A5 JP2001165799 A5 JP 2001165799A5
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/429,099 US6453749B1 (en) | 1999-10-28 | 1999-10-28 | Physical sensor component |
US09/429099 | 1999-10-28 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2001165799A JP2001165799A (ja) | 2001-06-22 |
JP2001165799A5 true JP2001165799A5 (ja) | 2007-11-01 |
Family
ID=23701802
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2000328153A Pending JP2001165799A (ja) | 1999-10-28 | 2000-10-27 | 物理センサの構成装置 |
Country Status (4)
Country | Link |
---|---|
US (1) | US6453749B1 (ja) |
EP (1) | EP1096243B1 (ja) |
JP (1) | JP2001165799A (ja) |
DE (1) | DE60022719T2 (ja) |
Families Citing this family (33)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10117296A1 (de) * | 2001-04-06 | 2002-10-17 | Krupp Uhde Gmbh | Druckaufnehmer insbesondere für Wirbelschichtreaktoren |
US6769319B2 (en) * | 2001-07-09 | 2004-08-03 | Freescale Semiconductor, Inc. | Component having a filter |
US6787897B2 (en) * | 2001-12-20 | 2004-09-07 | Agilent Technologies, Inc. | Wafer-level package with silicon gasket |
WO2003091679A1 (en) * | 2002-04-25 | 2003-11-06 | Glaxo Group Limited | Magnetoacoustic sensor system and associated method for sensing environmental conditions |
US20050001316A1 (en) * | 2003-07-01 | 2005-01-06 | Motorola, Inc. | Corrosion-resistant bond pad and integrated device |
US7078796B2 (en) * | 2003-07-01 | 2006-07-18 | Freescale Semiconductor, Inc. | Corrosion-resistant copper bond pad and integrated device |
JP2006234481A (ja) * | 2005-02-23 | 2006-09-07 | Bridgestone Corp | センサモジュール及びセンサモジュールを備えた空気入りタイヤ |
US7231829B2 (en) * | 2005-03-31 | 2007-06-19 | Medtronic, Inc. | Monolithic integrated circuit/pressure sensor on pacing lead |
DE102005015643A1 (de) * | 2005-04-05 | 2006-11-02 | Huf Hülsbeck & Fürst Gmbh & Co. Kg | Betätigungsvorrichtung |
JP2007064837A (ja) * | 2005-08-31 | 2007-03-15 | Denso Corp | 圧力センサ |
JP2007114001A (ja) * | 2005-10-19 | 2007-05-10 | Denso Corp | 圧力センサ |
US7528468B2 (en) * | 2006-09-25 | 2009-05-05 | Freescale Semiconductor, Inc. | Capacitor assembly with shielded connections and method for forming the same |
US8887944B2 (en) | 2007-12-11 | 2014-11-18 | Tokitae Llc | Temperature-stabilized storage systems configured for storage and stabilization of modular units |
US9140476B2 (en) | 2007-12-11 | 2015-09-22 | Tokitae Llc | Temperature-controlled storage systems |
US9205969B2 (en) * | 2007-12-11 | 2015-12-08 | Tokitae Llc | Temperature-stabilized storage systems |
US20090145912A1 (en) * | 2007-12-11 | 2009-06-11 | Searete Llc, A Limited Liability Corporation Of The State Of Delaware | Temperature-stabilized storage containers |
US8215518B2 (en) * | 2007-12-11 | 2012-07-10 | Tokitae Llc | Temperature-stabilized storage containers with directed access |
US8377030B2 (en) * | 2007-12-11 | 2013-02-19 | Tokitae Llc | Temperature-stabilized storage containers for medicinals |
US8215835B2 (en) * | 2007-12-11 | 2012-07-10 | Tokitae Llc | Temperature-stabilized medicinal storage systems |
US9174791B2 (en) * | 2007-12-11 | 2015-11-03 | Tokitae Llc | Temperature-stabilized storage systems |
US8069680B2 (en) | 2007-12-11 | 2011-12-06 | Tokitae Llc | Methods of manufacturing temperature-stabilized storage containers |
US20110127273A1 (en) * | 2007-12-11 | 2011-06-02 | TOKITAE LLC, a limited liability company of the State of Delaware | Temperature-stabilized storage systems including storage structures configured for interchangeable storage of modular units |
US7591185B1 (en) * | 2008-04-23 | 2009-09-22 | Medtronic, Inc. | Pressure sensor configurations for implantable medical electrical leads |
JP4737727B2 (ja) * | 2009-06-26 | 2011-08-03 | 横浜ゴム株式会社 | タイヤ状態取得装置及びタイヤ状態監視システム |
US9447995B2 (en) | 2010-02-08 | 2016-09-20 | Tokitac LLC | Temperature-stabilized storage systems with integral regulated cooling |
US9372016B2 (en) | 2013-05-31 | 2016-06-21 | Tokitae Llc | Temperature-stabilized storage systems with regulated cooling |
US9625333B2 (en) | 2013-03-15 | 2017-04-18 | President And Fellows Of Harvard College | Tactile sensor |
US20150090030A1 (en) * | 2013-09-27 | 2015-04-02 | Infineon Technologies Ag | Transducer arrangement comprising a transducer die and method of covering a transducer die |
US10053269B2 (en) * | 2015-02-09 | 2018-08-21 | The Boeing Company | Multi-functional fiber optic fuel sensor system having a photonic membrane |
US9799580B2 (en) * | 2016-03-24 | 2017-10-24 | Nxp Usa, Inc. | Semiconductor device package and methods of manufacture thereof |
CN107290096A (zh) * | 2016-04-11 | 2017-10-24 | 飞思卡尔半导体公司 | 具有膜片的压力感测集成电路器件 |
US11837513B2 (en) * | 2019-07-17 | 2023-12-05 | Texas Instruments Incorporated | O-ring seals for fluid sensing |
US11408788B2 (en) * | 2020-03-31 | 2022-08-09 | Toyota Research Institute, Inc. | Variable geometry and stiffness control for fluid filled sensor |
Family Cites Families (31)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3574284A (en) * | 1967-06-26 | 1971-04-13 | Laucks Lab Inc | Pore pressure apparatus and method |
US3619742A (en) * | 1970-05-21 | 1971-11-09 | Rosemount Eng Co Ltd | Shielded capacitance pressure sensor |
US4034609A (en) * | 1976-01-02 | 1977-07-12 | Fuller David L | Digital sensing device |
US4177496A (en) * | 1976-03-12 | 1979-12-04 | Kavlico Corporation | Capacitive pressure transducer |
JPS59224534A (ja) * | 1983-06-03 | 1984-12-17 | Citizen Watch Co Ltd | 圧力電気変換器 |
US4571244A (en) * | 1984-05-07 | 1986-02-18 | Biogenesis, Inc. | System for removing gas bubbles from liquids |
JPS62194431A (ja) * | 1986-02-21 | 1987-08-26 | Citizen Watch Co Ltd | 圧力センサユニツト |
US4686764A (en) * | 1986-04-22 | 1987-08-18 | Motorola, Inc. | Membrane protected pressure sensor |
JPS62184447U (ja) * | 1986-05-15 | 1987-11-24 | ||
JPS6397833U (ja) * | 1986-12-15 | 1988-06-24 | ||
JPS6418036A (en) * | 1987-07-14 | 1989-01-20 | Mitsubishi Electric Corp | Pressure sensor |
US4909070A (en) * | 1987-10-12 | 1990-03-20 | Smith Jeffery B | Moisture sensor |
US4993265A (en) * | 1988-03-03 | 1991-02-19 | The Foxboro Company | Protected pressure sensor and method of making |
ATE112389T1 (de) | 1988-03-03 | 1994-10-15 | Foxboro Co | Geschützter drucksensor. |
FR2686692B1 (fr) | 1992-01-28 | 1996-08-23 | Jaeger | Capteur de pression a base de semi-conducteur et procede de fabrication. |
US5308939A (en) * | 1992-07-21 | 1994-05-03 | Fuji Koki Manufacturing Co., Ltd. | Pressure equalizing mechanism for a pressure switch |
JPH06132545A (ja) * | 1992-10-19 | 1994-05-13 | Mitsubishi Electric Corp | 圧力検出装置 |
JP3114403B2 (ja) * | 1992-12-22 | 2000-12-04 | 富士電機株式会社 | 半導体圧力センサ |
JPH07120340A (ja) | 1993-10-22 | 1995-05-12 | Honda Motor Co Ltd | 圧力センサ |
DE4413274A1 (de) | 1994-04-16 | 1995-10-19 | Sel Alcatel Ag | Drucksensor |
WO1996003629A1 (de) | 1994-07-21 | 1996-02-08 | Siemens Aktiengesellschaft | Schutzmembran für einen siliziumdrucksensor |
SE9402720D0 (sv) * | 1994-08-15 | 1994-08-15 | Gambro Ab | Insats för tryckgivare |
JPH08178778A (ja) * | 1994-12-27 | 1996-07-12 | Mitsubishi Electric Corp | 半導体圧力検出装置 |
US5889211A (en) | 1995-04-03 | 1999-03-30 | Motorola, Inc. | Media compatible microsensor structure and methods of manufacturing and using the same |
US5747694A (en) | 1995-07-28 | 1998-05-05 | Nippondenso Co., Ltd. | Pressure sensor with barrier in a pressure chamber |
US5600071A (en) | 1995-09-05 | 1997-02-04 | Motorola, Inc. | Vertically integrated sensor structure and method |
DE19626083C2 (de) * | 1996-06-28 | 2000-03-23 | Siemens Ag | Sensor-Bauelement |
DE19626084C2 (de) * | 1996-06-28 | 2003-04-17 | Infineon Technologies Ag | Drucksensorvorrichtung für eine Montage auf der Bestückungsoberfläche einer Leiterplatte |
DE19626086A1 (de) * | 1996-06-28 | 1998-01-02 | Siemens Ag | Auf der Bestückungsoberfläche einer Leiterplatte montierbares Drucksensor-Bauelement |
JPH112580A (ja) * | 1997-06-13 | 1999-01-06 | Matsushita Electric Works Ltd | 半導体圧力センサ |
US6191359B1 (en) * | 1998-10-13 | 2001-02-20 | Intel Corporation | Mass reflowable windowed package |
-
1999
- 1999-10-28 US US09/429,099 patent/US6453749B1/en not_active Expired - Lifetime
-
2000
- 2000-10-23 EP EP00122976A patent/EP1096243B1/en not_active Expired - Lifetime
- 2000-10-23 DE DE60022719T patent/DE60022719T2/de not_active Expired - Fee Related
- 2000-10-27 JP JP2000328153A patent/JP2001165799A/ja active Pending