JP2001164352A - Method for manufacturing hot dip metal plated complex wire - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a manufacturing method of a hot dip metal plated complex wire, by which surface quality is excellent without developing non-plated part and the hot dip metal plated complex wire having stable sticking strength of the plated metal can stably and continuously be manufactured. SOLUTION: A wire in molten metal is passed through a through-hole in a horn of an ultrasonic vibration generating device, and thus, the ultrasonic vibration is applied over the whole periphery of wire metal to carry out the sticking of the molten metal. The inner diameter of the through-hole in the horn of the above ultrasonic vibration generating device may desirably be 1.5D0-2.0D0 to the wire diameter (D0) of the wire metal.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a technique for manufacturing a hot-dip composite wire, and more particularly, to a method for manufacturing a hot-dip composite wire capable of improving the surface quality of a hot-dip composite wire and the adhesive strength of a plating film.

[0002]

2. Description of the Related Art FIG. 2 shows a layout of a conventional method of manufacturing a hot-dip composite wire, and a seed wire fed from a payoff 1 includes a degreasing tank 2, a water cooling tank 3, an pickling tank 4, and a water cooling tank. After passing through 3, the flux is applied to the surface in the flux bath 5 and then preheated in the preheating device 6, and then immersed in the hot dipping bath of the hot dipping bath 7 to melt on the surface of the seed wire metal. After the metal is adhered, the molten metal is solidified by cooling in a cooling device 9 of air cooling or water cooling, and the molten metal is wound around a winding device 12 as a hot-dip composite wire. 8 is a dipping roll, 10 is an anti-vibration roll, and 11 is a head sheave.

In such a method for manufacturing a hot-dip composite wire, the most important factors are whether there is no plating, the surface quality is good, and the adhesive strength of the plating film is stable.

[0004] As prior art relating to the improvement of hot-dip plating, (1) JP-A-4-157147 "Flux for hot-dip Zn-Al alloy plating" and (2) JP-A-4-154950 "Fe-Zn alloy plating" Steel sheet manufacturing method ".

In the former example (1), a specific amount of SnCl ₂ , ZnCl ₂ , an alkali metal element and / or
Alternatively, it is a method of eliminating a non-plating state when plating a molten Zn-Al alloy by adding a chloride of an alkaline earth metal.

In the latter case (2), a specific element is added (Al, M) to a hot-dip Zn plating bath containing a specific amount of Fe.
g, Si, Cu, Bi, Ti, and P, one or more of which are added so that the total amount is 0.01 to 0.50%). This is a method for producing a hot-dip Fe-Zn alloy-plated steel sheet having excellent rust resistance.

[0007]

The above prior arts (1) and (2) are intended to improve the properties of a hot-dip composite material by adding a flux or a trace addition element. This is a method to improve the properties of the hot-dip composite by adding a small amount of additional elements. However, it is difficult to control the type and concentration of the additives in the plating bath. It is very difficult to continuously and stably produce long hot-dip composite materials, and it is difficult to use these technologies for hot-dip composite wire manufacturing technology. There was a face.

Therefore, an object of the present invention is to provide a hot-dip composite wire having excellent surface quality without any unplated portions and also having a stable adhesive strength of a plating film, capable of stably and continuously producing a hot-dip composite wire. An object of the present invention is to provide a method for manufacturing a plated composite wire.

[0009]

According to the present invention, there is provided a method for manufacturing a hot-dip composite wire, which comprises passing a seed wire in a molten metal through a through-hole in a horn of an ultrasonic vibration generator so that the entire seed wire metal is removed. It consists of a method of applying ultrasonic vibration over the circumference to adhere the molten metal.

The present invention relates to a method for producing a plated composite wire by applying an external force of ultrasonic vibration to the surface of the seed wire in the molten metal in a state where the seed wire is immersed in the molten metal. When ultrasonic vibration is applied to the metal surface, the ultrasonic wave has a straight line due to its characteristics, so if ultrasonic vibration is applied from one of the seed wire metals, the characteristics of the plating composite wire only on the added side are improved. Therefore, a through hole having a predetermined dimension is provided in the horn (tip) of the ultrasonic vibration generator, and when the seed wire metal passes through the through hole, the seed wire metal surface is formed inside the through hole. Ultrasonic vibration was applied over the entire circumference to produce a uniform plated composite wire.

[0011] The inner diameter of the through-hole in the horn of the ultrasonic vibration generator is defined as follows with respect to the wire diameter (D ₀ ) of the seed wire metal.
It is good for the 1.5D ₀ ~2.0D _0.

[0012]

FIG. 1 shows an embodiment of a method for manufacturing a hot-dip composite wire according to the present invention by a manufacturing layout. Since the basic parts of this manufacturing layout are the same as those in FIG. 2, the same parts as those in FIG. 2 are denoted by the same reference numerals as those in FIG. I want to.

In the method of this embodiment, a through hole 15 having an appropriate size corresponding to the diameter of the seed wire is provided at the tip of the horn 14 of the ultrasonic vibration generator 13 and the tip of the horn 14 of the through hole 15 is provided. The part is immersed in the plating bath of the hot-dip plating tank 7.

Then, necessary pretreatments (degreasing 2, water washing 3, pickling 4) were performed, and the flux-coated (5) and preheated (6) seed wire metal was supplied into the hot-dip plating tank 7. At this time, the seed wire is passed through the through-hole 15 and ultrasonic vibration is applied to the surface of the seed wire from the entire circumference, thereby activating the entire surface of the seed wire and melting the surface of the seed wire. By improving the wettability with metal, a plated composite wire having the required plating was manufactured.

The hot-dip composite wire produced by the method of the present invention had no unplated portion on the surface of the plated wire and had a stable adhesion strength of the plating film. In addition, a high-quality plated wire could be stably and continuously manufactured.

If the diameter of the through hole 15 at the tip of the horn is too small with respect to the wire diameter of the seed wire metal, the inner wall of the through hole 15 and the seed wire metal come into contact with each other due to deviation of the seed wire metal, and the surface of the seed wire metal Suffer from flaws. On the other hand, if the through hole 15 is too large with respect to the wire diameter of the seed wire metal, sufficient ultrasonic vibration additional force cannot be obtained on the surface of the seed wire metal, and the effect of improving the plating surface quality and the strength of the plating film cannot be obtained. I can't get it. In the output range of the sonic vibration generator 13 used in the present embodiment, the inner diameter of the through hole 15 at the tip of the horn is 1.5 D with respect to the wire diameter D ₀ of the seed wire metal.
_{0 to} 2.0 D ₀ was a range in which the effect of ultrasonic vibration could be confirmed.

[0017]

As described above, according to the present invention, a hot-dip composite wire having excellent surface quality with no non-plated portions and the like and stable adhesive strength of a plating film can be stably and continuously manufactured. The object of the present invention is to provide a method for producing a hot-dip composite wire; the object can be achieved, and it can be said that the effect of implementing the object is great.

[Brief description of the drawings]

FIG. 1 is a production layout explanatory view showing an embodiment of a method for producing a hot-dip composite wire according to the present invention.

FIG. 2 is an explanatory view of a production layout showing an example of a conventional method for producing a hot-dip composite wire.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Payoff apparatus 2 Degreasing tank 3 Water cooling tank 4 Pickling tank 5 Flux tank 6 Preheating apparatus 7 Hot-dip plating tank 8 Immersion roll 9 Cooling apparatus 10 Anti-vibration roll 11 Head sheave 12 Winding device 13 Ultrasonic vibration generator 14 Horn 15 Penetration port

Claims (2)

[Claims] 1. A seed wire metal is immersed in a molten metal in the atmosphere, the molten metal is adhered to the surface of the seed wire metal, and then the molten metal is solidified to produce a plated composite wire. A method of manufacturing a hot-dip composite wire, wherein ultrasonic wire is applied over the entire circumference of the seed wire metal to adhere the molten metal by passing the seed wire through a through-hole in a horn of an ultrasonic vibration generator. 2. An inner diameter of a through-hole in a horn of the ultrasonic vibration generator is defined by a diameter (D ₀ ) of a seed wire metal.
1.5D ₀ ～2.0D to _0, the manufacturing method of hot-dip plated composite wire of claim 1, wherein.