JP2001162492A - Tool manufacturing method and tool manufacturing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a technique of manufacturing for a tool having a long service life and a minute diameter. SOLUTION: In this method of manufacturing the sintered diamond tool by grinding a sintered diamond by use of a diamond grinding wheel, ultrasonic torsional vibration is applied to the diamond when grinding the diamond.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION The present invention relates to a method for manufacturing a semiconductor device having a diameter of 0.3 mm.
The present invention relates to a technique for manufacturing the following sintered diamond tool.

[0002]

In the field of semiconductors, a hole (through hole or blind hole) having a diameter of 0.15 to 0.2 mm is formed in a silicon substrate, or a hole having a diameter of about 0.05 mm is formed in a silicon nitride substrate. It is required to make holes. In addition, in a plasma etching electrode, it is required to form a hole having a diameter of 0.2 to 0.3 mm in a silicon substrate. In the field of sensors, it is required to make a hole having a diameter of 0.2 to 0.3 mm in a glass substrate. Further, in electronic device parts, it is required to form a hole having a diameter of 0.2 to 0.3 mm in an alumina substrate. In addition, in the spinning nozzle, it is required to form a hole having a diameter of about 0.1 mm.
That is, it is required to form a hole having a small diameter in various products.

[0003] At present, micro-tools used for drilling fine-diameter holes in hard brittle materials such as silicon nitride, silicon carbide and other ceramics are produced by electrodeposition or metal bonding. However, because of high wear and short life, there is no situation where it can be used for mass production on a line. Therefore, an object of the present invention is to provide a technique for manufacturing a tool having a long life and a fine diameter.

[0004]

In order to extend the life of the tool, diamond is preferably used as the tool material. Even so-called cemented carbide materials are inferior to diamond. Therefore, in order to extend the life of the tool, the use of sintered diamond was considered as the tool material.

Conventionally, in the case of a material called a cemented carbide, the diameter is 0.3 mm or less, for example, 0.05 m
m. The reason is that even if it is processed to such a fine diameter, in the case of cemented carbide, since the grinding resistance is small compared to the rigidity, it does not bend, so the grinding process is not performed. It was possible. However, unlike the case of cemented carbide, in the case of sintered diamond, it has heretofore been considered impossible to grind to a diameter of 0.3 mm or less.

[0006] Actually, a tool made of sintered diamond having a diameter of 0.3 mm or less has not been provided. And while research on such points is being pushed hard,
The inventor of the present invention has found that when the sintered diamond is processed by the ultrasonic torsional vibration grinding, the processing is possible even if the diameter reaches 0.3 mm or less.

The present invention has been achieved based on such findings. That is, the above-mentioned problem is a method of manufacturing a sintered diamond tool by grinding a sintered diamond using a diamond grinding whetstone, wherein ultrasonic grinding is applied during the grinding. The problem is solved by a method for manufacturing a sintered diamond tool.

[0008] In particular, grinding a sintered diamond using a diamond grinding wheel has a diameter of 0.3 mm.
A method for manufacturing a sintered diamond tool of the following (particularly 0.01 mm or more), wherein ultrasonic torsional vibration is applied during the grinding is solved by a method for manufacturing a sintered diamond tool. .

[0009] An apparatus for manufacturing a sintered diamond tool by grinding a sintered diamond using a diamond grinding wheel, comprising: a diamond grinding wheel; The problem is solved by an apparatus for manufacturing a tool made of sintered diamond, comprising: holding means for holding a set diamond material; and ultrasonic torsional vibration means for applying ultrasonic torsional vibration to the diamond grinding wheel.

[0010] In particular, grinding a sintered diamond with a diamond grinding wheel has a diameter of 0.3 mm.
An apparatus for producing a sintered diamond tool having the following (particularly, 0.01 mm or more), a diamond grinding wheel, and holding means for holding a sintered diamond material to be ground by the diamond grinding wheel: Ultrasonic torsional vibration means for applying ultrasonic torsional vibration to the diamond grinding wheel is provided.

An apparatus for producing a sintered diamond tool by grinding a sintered diamond using a diamond grinding wheel, comprising: a diamond grinding wheel; Holding means for holding a set diamond material; ultrasonic torsional vibration means for applying ultrasonic torsional vibration to the diamond grinding wheel; and bending for preventing bending of the sintered diamond material ground by the diamond grinding wheel. The present invention provides a device for manufacturing a tool made of sintered diamond, characterized by comprising a prevention means.

[0012] In particular, a diameter of 0.3 mm is obtained by grinding a sintered diamond using a diamond grinding wheel.
An apparatus for producing a sintered diamond tool having the following (particularly, 0.01 mm or more), a diamond grinding wheel, and holding means for holding a sintered diamond material to be ground by the diamond grinding wheel: Ultrasonic torsional vibration means for applying ultrasonic torsional vibration to the diamond grinding wheel, and a bending preventing means for preventing bending of a sintered diamond material ground by the diamond grinding wheel. The problem is solved by an apparatus for manufacturing a sintered diamond tool.

[0013]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A tool manufacturing method according to the present invention is a method for manufacturing a sintered diamond tool by grinding a sintered diamond using a diamond grinding wheel. This is a method for manufacturing a sintered diamond tool that acts on vibration. In particular,
The diameter of less than 0.3 mm (particularly 0.0
1 mm or more), which is a method for producing a sintered diamond tool in which ultrasonic torsional vibration is applied during the grinding.

A tool manufacturing apparatus according to the present invention is an apparatus for manufacturing a sintered diamond tool by grinding a sintered diamond using a diamond grinding wheel, comprising: a diamond grinding wheel; A holding means for holding a sintered diamond material ground by a grindstone, and an ultrasonic torsional vibration means for applying ultrasonic torsional vibration to the diamond grinding whetstone. In particular, an apparatus for producing a sintered diamond tool having a diameter of less than 0.3 mm (particularly, 0.01 mm or more) by grinding a sintered diamond using a diamond grinding wheel, comprising: ,
The apparatus comprises a holding means for holding a sintered diamond material ground by the diamond grinding wheel, and an ultrasonic torsional vibration means for applying ultrasonic torsional vibration to the diamond grinding wheel. An apparatus for producing a sintered diamond tool by grinding a sintered diamond using a diamond grinding wheel, comprising: a diamond grinding wheel; and a sintered diamond material ground by the diamond grinding wheel. Holding means, ultrasonic torsional vibration means for applying ultrasonic torsional vibration to the diamond grinding wheel, bending prevention means for preventing bending of the sintered diamond material ground by the diamond grinding wheel Is provided. In particular, a diameter of 0.3 mm or less (especially 0.01 m) is obtained by grinding a sintered diamond using a diamond grinding wheel.
m or more), a device for manufacturing a sintered diamond tool, comprising: a diamond grinding wheel, holding means for holding a sintered diamond material ground by the diamond grinding wheel, and a diamond grinding wheel. Ultrasonic torsional vibration means for applying ultrasonic torsional vibration, and bending preventing means for preventing bending of the sintered diamond material ground by the grinding wheel for diamond grinding.

The details will be described below. FIG. 1 is an overall schematic view of a sintered diamond tool manufacturing apparatus according to the present invention,
2 and 3 are explanatory views of ultrasonic torsional vibration grinding using the tool for manufacturing a sintered diamond tool according to the present invention. In each of the drawings, reference numeral 1 denotes a work provided with a sintered diamond material 1a serving as a tool manufactured by performing ultrasonic torsional vibration grinding. The work 1 has a base (for example, a cemented carbide material such as WC) 1b on which a sintered diamond material (length is, for example, 0.5 to 3 mm) 1a is provided. Has become. The work chuck 2 is configured to rotate by receiving a force from the rotation driving unit.

Reference numeral 3 denotes a diamond grindstone for grinding the sintered diamond material 1a and the cemented carbide base 1b on the tip side of the work 1 held by the work chuck 2. The grindstone 3 is rotatably mounted as can be seen from FIG. The grindstone 3 receives the rotational driving force from the driving source via the belt 4 and comes into contact with the sintered diamond material 1a or the cemented carbide base 1b to grind it.

Reference numeral 5 denotes a rotating body. The rotating body 5 is provided in contact with the work 1 and on the opposite side of the grindstone 3 with the work 1 interposed therebetween. Thereby, the rotating body 5
Has a function of preventing the work 1 from bending. Reference numeral 6 denotes an ultrasonic oscillator, and ultrasonic torsional vibration is applied to the grindstone 3 via a horn (not shown) or the like. Accordingly, the sintered diamond material 1a and the base 1b made of cemented carbide are ground by the grindstone 3 subjected to the ultrasonic torsional vibration.

Using the above apparatus, the sintered diamond material was subjected to ultrasonic torsional vibration grinding. That is, as shown in FIG. 3, for example, the sintered diamond material 1 rotating counterclockwise.
The grindstone 3 which rotates in the clockwise direction and has a peripheral portion that is ultrasonically torsional vibrated is pressed against the base material 1a or the cemented carbide base 1b, and is ground. As a result, a sintered diamond tool for machining a fine hole having a diameter of 0.05 to 0.3 mm, which has been considered impossible so far, was obtained.

Since this tool is made of a sintered diamond material, it has a much longer life than a tool made of cemented carbide.

[0020]

According to the present invention, a sintered diamond tool having a much longer life than that of a cemented carbide and having a diameter of 0.3 mm or less for machining a fine hole can be obtained.

[Brief description of the drawings]

FIG. 1 is an overall schematic view of an apparatus for manufacturing a tool made of sintered diamond.

FIG. 2 is an explanatory view of an ultrasonic torsional vibration grinding process.

FIG. 3 is an explanatory view of an ultrasonic torsional vibration grinding process.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Work 1a Sintered diamond material 1b Base 2 Work chuck (holding means) 3 Diamond grindstone 5 Rotating body (bending prevention means) 6 Ultrasonic oscillator (ultrasonic torsional vibration means)

Claims (5)

[Claims] 1. A method of manufacturing a sintered diamond tool by grinding a sintered diamond using a diamond grinding wheel, wherein ultrasonic torsion vibration is applied during the grinding. Manufacturing method of diamond tools. 2. The method for producing a sintered diamond tool according to claim 1, wherein the diameter of the sintered diamond tool produced by ultrasonic torsional vibration grinding is 0.3 mm or less. 3. An apparatus for manufacturing a sintered diamond tool by grinding a sintered diamond using a diamond grinding wheel, comprising: a diamond grinding wheel; An apparatus for manufacturing a sintered diamond tool, comprising: holding means for holding a set diamond material; and ultrasonic torsional vibration means for applying ultrasonic torsional vibration to the diamond grinding wheel. 4. An apparatus for manufacturing a sintered diamond tool by grinding a sintered diamond using a diamond grinding wheel, comprising: a diamond grinding wheel; Holding means for holding a set diamond material; ultrasonic torsional vibration means for applying ultrasonic torsional vibration to the diamond grinding wheel; and bending for preventing bending of the sintered diamond material ground by the diamond grinding wheel. An apparatus for manufacturing a sintered diamond tool, comprising: a prevention means. 5. The sintered diamond tool according to claim 3, wherein the diameter of the sintered diamond tool produced by ultrasonic torsional vibration grinding is 0.3 mm or less. Manufacturing equipment.