JP3339018B2 - Tool processing method and tool processing device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a method and an apparatus for processing a tool made of sintered diamond.

[0002]

In the field of semiconductors, a hole (through hole or blind hole) having a diameter of 0.15 to 0.2 mm is formed in a silicon substrate, or a hole having a diameter of about 0.05 mm is formed in a silicon nitride substrate. It is required to make holes. In addition, in a plasma etching electrode, it is required to form a hole having a diameter of 0.2 to 0.3 mm in a silicon substrate. In the field of sensors, it is required to make a hole having a diameter of 0.2 to 0.3 mm in a glass substrate. Further, in electronic device parts, it is required to form a hole having a diameter of 0.2 to 0.3 mm in an alumina substrate. In addition, in the spinning nozzle, it is required to form a hole having a diameter of about 0.1 mm.
That is, it is required to form a hole having a small diameter in various products.

[0003] At present, micro-tools used for drilling fine-diameter holes in hard brittle materials such as silicon nitride, silicon carbide and other ceramics are produced by electrodeposition or metal bonding. However, because of high wear and short life, there is no situation where it can be used for mass production on a line. By the way, in order to extend the life of the tool, diamond is preferable as the tool material. So-called cemented carbide materials,
Inferior to diamond. Therefore, in view of extending the life of the tool, sintered diamond is preferable as the tool material.

[0004] However, it has heretofore been considered impossible to produce sintered diamond tools of small diameter.

[0005] Actually, a sintered diamond tool having a diameter of 0.3 mm or less has not been provided.

Incidentally, the diameter is 0.3 mm or less, for example, 0.0 mm.
Even in the case of 5 mm, a tool is obtained when a material called a cemented carbide is used. This is because even if it is processed to such a fine diameter, in the case of cemented carbide, since grinding resistance is small compared to rigidity, it does not bend, so it can be ground. I was

Accordingly, an object of the present invention is to provide a processing (manufacturing) technique for a tool made of a sintered diamond having a small diameter.

As the research on the above-mentioned problems has been earnestly promoted, the present inventor has processed a sintered diamond material by ultrasonic torsional vibration grinding. They have come to find that processing is possible even with diameters.

The present invention has been achieved based on the knowledge obtained.

That is, the above-mentioned problem is a method of processing a sintered diamond material into a tool by grinding using a diamond grinding wheel, and bringing the diamond grinding wheel into contact with the sintered diamond material. Process and
A step of rotating the diamond grinding wheel, a step of rotating the sintered diamond material, and a step of applying ultrasonic torsional vibration to the diamond grinding wheel. It is solved by a processing method.

[0010] A method for processing a sintered diamond material attached to a processing machine into a tool by grinding using a diamond grinding wheel, wherein the diamond grinding wheel and the sintered diamond material are brought into contact with each other. And a step of rotating the diamond grinding wheel,
The problem is solved by a method for processing a tool made of sintered diamond, comprising a step of rotating the sintered diamond material and a step of applying ultrasonic torsional vibration to the diamond grinding wheel.

In the above-mentioned method for machining a tool made of sintered diamond, it is preferable that the diamond grinding wheel is arranged such that the flat surface of the diamond grinding wheel is in contact with the sintered diamond material. Further, it is preferable that the diamond grinding wheel and the sintered diamond material are arranged such that the rotation axis of the diamond grinding wheel and the rotation axis of the sintered diamond material intersect each other.

Another object of the present invention is to provide an apparatus for processing a sintered diamond material into a tool by grinding using a diamond grinding wheel. The diamond grinding wheel and the diamond grinding wheel are held and rotated. First
Holding / rotating means, a second holding / rotating means for holding / rotating the sintered diamond material, a contact / separating means for contacting / separating the diamond grinding wheel and the sintered diamond material, Ultrasonic torsional vibration means for applying ultrasonic torsional vibration to a diamond grinding wheel is provided.

An apparatus for processing a sintered diamond material into a tool by grinding using a diamond grinding wheel, comprising: a diamond grinding wheel; and a first holder for holding and rotating the diamond grinding wheel. A rotating means and a second holding means for holding and rotating the sintered diamond material;
Rotating means, contact / separation means for contacting / separating the diamond grinding wheel and the sintered diamond material, ultrasonic torsional vibration means for applying ultrasonic torsional vibration to the diamond grinding wheel, and the diamond The present invention is attained by a sintered diamond tool processing device comprising: a bending prevention means for preventing bending of a sintered diamond material ground by a grinding wheel.

[0014] In the above-mentioned sintered diamond tool processing apparatus, it is preferable that the diamond grinding wheel is disposed such that the flat surface of the diamond grinding wheel is in contact with the sintered diamond material. Further, it is preferable that the diamond grinding wheel and the sintered diamond material are arranged such that the rotation axis of the diamond grinding wheel and the rotation axis of the sintered diamond material intersect each other.

If the above-mentioned sintered diamond tool processing device is provided in a processing machine, the sintered diamond material attached to the processing machine can be processed as it is. Therefore, since the sintered diamond material attached to the processing machine can be machined into a tool in that state, the problem of mounting accuracy failure due to retrofitting the tool does not occur, which is preferable. Also, for example, even when the tool must be reworked due to wear or the like, the tool (tool material) can be machined with the tool attached to the processing machine, and complicated work such as removal and attachment can be avoided.

According to the present invention, a sintered diamond tool having a small diameter of 0.3 mm or less can be obtained.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A tool machining method according to the present invention is a method for machining a sintered diamond material into a tool by grinding using a diamond grinding wheel. A step of contacting the material, a step of rotating the diamond grinding wheel, and a step of rotating the sintered diamond material,
Applying ultrasonic torsional vibration to the diamond grinding wheel. Alternatively, a method of processing a sintered diamond material attached to a processing machine into a tool by grinding using a grinding wheel for diamond grinding,
Contacting the diamond grinding wheel with the sintered diamond material, rotating the diamond grinding wheel, rotating the sintered diamond material, and applying ultrasonic torsional vibration to the diamond grinding wheel. And a step of acting. In the above processing, the flat surface of the diamond grinding wheel is brought into contact with the sintered diamond material. Further, the diamond grinding wheel and the sintered diamond material are arranged such that the rotation axis of the diamond grinding wheel and the rotation axis of the sintered diamond material intersect each other.

The tool processing apparatus according to the present invention is an apparatus for processing a sintered diamond material into a tool by grinding using a diamond grinding wheel, which holds the diamond grinding wheel and the diamond grinding wheel. A rotating first holding / rotating means, a second holding / rotating means for holding / rotating a sintered diamond material, and an abutting / separating contact between the diamond grinding wheel and the sintered diamond material. A separating means; and an ultrasonic torsional vibration means for applying ultrasonic torsional vibration to the diamond grinding wheel. An apparatus for processing a sintered diamond material into a tool by grinding using a diamond grinding wheel, comprising: a diamond grinding wheel; and first holding and rotating means for holding and rotating the diamond grinding wheel. When,
Second holding / rotating means for holding / rotating the sintered diamond material, contacting / separating means for contacting / separating the diamond grinding wheel and the sintered diamond material, and an ultrasonic wave applied to the diamond grinding wheel. Ultrasonic torsional vibration means for applying torsional vibration, and deflection preventing means for preventing bending of the sintered diamond material ground by the diamond grinding wheel. The above apparatus is provided in a processing machine, and the sintered diamond material is a sintered diamond material attached to the processing machine. The diamond grinding wheel is arranged so that its flat surface is in contact with the sintered diamond material. In addition, the diamond grinding wheel is disposed such that the rotation axis of the diamond grinding wheel and the rotation axis of the sintered diamond material intersect each other. Hereinafter, this will be described in more detail.

FIG. 1 is an overall schematic view of a tool for processing a sintered diamond tool according to the present invention. In FIG. 1, reference numeral 1 denotes a processing machine. This processing machine 1 has a diameter of 0.01 to 0.3 m.
m of sintered diamond tools. Then, for example, a perforating process is performed by the processing machine 1.

Reference numeral 2 denotes a holder provided in the processing machine 1, and the holder 2 holds a tool made of sintered diamond. In the drawing, a tool material before forming a tool, that is, a sintered diamond material 3 is shown, and this is processed to form a sintered diamond tool 3a. Further, the holder 2 is configured to be rotatable by a rotating means (not shown), and the sintered diamond material 3 is configured to rotate in the illustrated direction around a virtual axis in the vertical direction.

Reference numerals 4a and 4b are diamond whetstones.
The diamond grindstone 4a is arranged on the left side of the sintered diamond material 3, and the diamond grindstone 4b is arranged on the right side of the sintered diamond material 3. The diamond whetstones 4a and 4b are provided with moving means so as to be movable in the left-right direction. When the sintered diamond material 3 is processed, the diamond whetstone 4a comes close to the sintered diamond material 3 located therebetween. When the flat surfaces (principal surfaces) of 4a and 4b abut against the sintered diamond material 3 and the processing is completed, the flat surfaces (principal surfaces) of the diamond whetstones 4a and 4b are separated from the sintered diamond material 3. I have. The diamond grindstones 4a and 4b are connected to a rotating means (not shown). The direction opposite to the direction of rotation.
It rotates in the forward direction with respect to the rotation direction of the sintered diamond material 3).

The diamond whetstones 4a and 4b are horn 5
a, 5b, which are attached to the tips of the horns 5a, 6b.
5b acts on the diamond whetstones 4a and 4b.

Incidentally, a diamond grinding wheel 4a, a horn 5a,
And the ultrasonic torsional vibration grinding apparatus such as the ultrasonic vibrator 6a and the ultrasonic torsional vibration grinding apparatus such as the diamond whetstone 4b, the horn 5b, and the ultrasonic vibrator 6b are provided on the left and right. It was done.

In order to convert the sintered diamond material 3 attached to the processing machine 1 into the sintered diamond tool 3a by the ultrasonic torsional vibration grinding apparatus configured as described above, the moving means is operated and the diamond grindstone is operated. 4a is moved rightward and the diamond whetstone 4b is moved leftward. Thereby, the diamond whetstones 4a, 4
The flat surface b contacts the sintered diamond material 3.

At the same time or before and after that, the rotating means is operated to rotate the diamond grinding wheels 4a, 4b and the sintered diamond material 3 in the direction shown in the figure.

Further, the ultrasonic vibrators 6a and 6b are operated,
Ultrasonic torsional vibration is applied to the diamond whetstones 4a and 4b.

After a lapse of a predetermined time, the sintered diamond material 3 becomes a sintered diamond tool having a diameter of 0.01 to 0.3 mm.

When the machining of the tool is completed in this way, the diamond grindstones 4a and 4b are separated from the sintered diamond material 3 (sintered diamond tool 3a).

Thereafter, drilling or the like is performed by the processing machine 1 (the sintered diamond tool 3a).

In the above-described embodiment, the diamond whetstones 4a and 4b which have been subjected to ultrasonic torsional vibration from the left and right sides of the sintered diamond material 3 are brought into contact with each other. Of course, it is preferable that the ultrasonic torsional vibration is applied to both of the diamond grindstones 4a and 4b, but the ultrasonic torsional vibration may be applied only to one of the diamond whetstones 4a and 4b. In such a case, the diamond grindstone which has not been subjected to the ultrasonic torsional vibration does not perform the ultrasonic torsional vibration grinding, but has a function of preventing bending of the sintered diamond material 3 to be ground. .

When the diamond whetstones 4a and 4b are configured to be movable in the left-right direction of the sintered diamond material 3, the working mechanism for using the sintered diamond material 3 as the sintered diamond tool 3a is provided in the processing machine 1. It becomes easy to provide. If the processing mechanism of the present invention is provided in the processing machine 1 itself, the sintered diamond material 3 is attached to the holder 2 and then the sintered diamond tool 3 is mounted.
a. For this reason, if the sintered diamond tool 3a is attached to the holder 2 when the tool 3a is attached to the holder 2 after the sintered diamond tool 3a is attached to the holder 2, if the attachment accuracy is poor, drilling or the like is adversely affected. In the case where the tool 3a is made of sintered diamond, there is no problem in the mounting accuracy when the tool 3a made of sintered diamond is mounted, which is extremely convenient.

As shown in FIG. 2, when the tip of the sintered diamond material 3 is machined, when the tool is worn out and no longer functions, the diamond grinding wheel 4a is used.
By performing the ultrasonic torsional vibration grinding with the abutment, it is possible to regenerate. At the time of this recycling processing, there is no complicated work such as removal and installation,
Further, since there is no problem of the mounting accuracy, it is extremely preferable.

The sintered diamond material 3 may be configured to be movable in the axial direction.
Further, the diamond grindstone may be configured to be movable in the axial direction of the sintered diamond material 3.

[0033]

According to the present invention, a sintered diamond tool having a much longer life than that of a cemented carbide and having a diameter of 0.3 mm or less, such as for machining a fine hole, can be obtained.

[Brief description of the drawings]

FIG. 1 is a general schematic view of a first embodiment of a tool processing apparatus made of sintered diamond.

FIG. 2 is a partial schematic view of a second embodiment of the tool processing apparatus made of sintered diamond.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Processing machine 2 Holder 3 Sintered diamond material 4a, 4b Diamond grindstone 5a, 5b Horn 6a, 6b Ultrasonic transducer

──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. ⁷ , DB name) B23P 15/32 B24B 1/04

Claims (7)

(57) [Claims] 1. A sintered diamond material having a diameter of 0.3 mm or less is ground by using a diamond grinding wheel.
A method of processing the tool into a lower tool, wherein: a step of bringing a flat surface of the diamond grinding wheel into contact with a sintered diamond material; a step of rotating the diamond grinding wheel; and rotating the sintered diamond material. And a step of applying ultrasonic torsional vibration to the diamond grinding wheel. 2. A method of processing a sintered diamond material attached to a processing machine into a tool having a diameter of 0.3 mm or less by grinding using a diamond grinding wheel, wherein the diamond grinding wheel is flat. Contacting the surface with the sintered diamond material; rotating the diamond grinding wheel; rotating the sintered diamond material; and applying ultrasonic torsional vibration to the diamond grinding wheel. And a method for machining a tool made of sintered diamond. Wherein the rotational axis of the diamond grinding stone and baked
It is in the direction where the rotation axis of the set diamond material intersects
Diamond grinding wheel and sintered diamond material
The sintering method according to claim 1 or 2, wherein
Diamond tool processing method . (4)Grinding with a diamond grinding wheel
By making the sintered diamond material 0.3mm or less in diameter
It is a device that processes the tool below,A diamond grinding wheel, A first holder that holds and rotates the diamond grinding wheel
Holding and rotating means, Second holding and rotating for holding and rotating the sintered diamond material
Means, Flat surface of the grinding wheel for diamond grinding and sintered diamond
Contact / separation means for contacting / separating from the material, Ultrasonic torsional vibration acts on the diamond grinding wheel
Ultrasonic torsion vibrating means for causing
Sintering diamond tool processing equipment . 5. A grinding method using a diamond grinding wheel.
To make sintered diamond material0.3mm or less in diameter
UnderAn apparatus for processing into a tool, comprising: a diamond grinding wheel; and a first holder for holding and rotating the diamond grinding wheel.
Holding and rotating means, and a second holding and rotating means for holding and rotating the sintered diamond material
Means, the grinding wheel for diamond grindingFlat surfaceAnd sintered diamond
Contacting / separating means for contacting / separating the material, and ultrasonic torsional vibration acting on the diamond grinding wheel
Ultrasonic torsional vibrating meansWhen, Sintered by the diamond grinding wheel
Deflection prevention means for preventing deflection of diamond material With
Tool making equipment made of sintered diamond
Place. 6. The sintered diamond material is mounted on a processing machine.
A sintered diamond material, said sintered diamond
The tool processing equipment manufactured by the company is provided in the processing machine.
The sintered diamond tool processing device according to claim 4 or 5, wherein: 7. A rotary shaft of a grinding wheel for diamond grinding and a sintering process.
It is in the direction where the rotation axis of the set diamond material intersects
It is characterized by having a diamond grinding wheel
The sintered diamond tool processing apparatus according to any one of claims 4 to 6 .