JP2001143032A - Communication terminal equipment - Google Patents

Abstract

PROBLEM TO BE SOLVED: To integrate an information communication function and a storage function in a micromominiature module. SOLUTION: A communication module having a connector part to be connected detachably to host equipment is constituted by packaging an antenna element, an element for executing high-frequency signal processing, an element for executing base band signal processing, a memory element for the storage function in a casing whose thickness is 3.5 mm and less. Data are transmitted/ received to/from the host equipment via the connector part and data are transmitted/received to/from a radio transmitting/receiving network via the antenna element, so that the host equipment is connected to a radio communication network.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a novel communication terminal device in which an information communication function and a storage function are integrated in a small module, and for example, a host device such as a personal computer, a mobile phone, a video device, and an audio device. The present invention relates to a detachable ultra-small communication terminal device for connecting the terminal to a network.

[0002]

2. Description of the Related Art In recent years, data such as music, sound, and images have been digitized and can be easily handled by personal computers and mobile computers. Also,
An environment in which the band is compressed by an audio codec or an image codec and such data can be easily distributed using digital communication or digital broadcasting has been established.

[0003] In communication of such audio-video (AV) data, it has become possible to transmit and receive data outdoors by using a cellular phone, a cordless phone, or the like, and various home networks have been proposed even at home.

As a network for the above communication,
For example, 5GH as proposed in IEEE 802.11
Z-band home network, 2.45 GHz band LA
N, a small-scale network called "Bluetooth", a wireless communication system, and the like have been proposed, and are expected as a next-generation wireless network.

The use of these wireless networks at home or outdoors enables seamless exchange of various data, access to the Internet, transmission and reception of data on the Internet, and the like.

[0006] However, in order to realize such an environment, it is necessary to attach a communication function to a device, which is a so-called AV device for reproducing and recording music and video.

On the other hand, the digitization of AV data enables recording and storage in a computer storage such as a hard disk, a magneto-optical (MO) disk, or a semiconductor memory from the viewpoint of data recording and storage. This means that the conventional analog recording methods (for example, audio compact cassettes, VHS system video cassettes, so-called laser disks, etc.) having their own formats are being replaced.

In particular, a semiconductor memory such as a flash memory has a very small volume per recording capacity, and has a unique interface as a detachable memory module. However, a digital still camera, a video camera, a portable audio device, It has begun to be adopted in notebook personal computers and the like, and using this memory module, data such as music and images has been transferred, transplanted, recorded, and stored from device to device.

[0009]

As described above, personal AV devices are required to have an interface for connection to various networks, but for example, emphasis is placed on portability for individuals. In so-called mobile devices that are made, it is extremely burdensome to provide multiple communication ports and incorporate multiple communication hardware.
It is hindering its spread.

[0010] In addition, mounting various wireless communication means is very burdensome for a portable device. In particular, simultaneous mounting of a plurality of different communication means using a wireless communication method requires the same band or different bands. This may cause problems such as interference and mutual interference, which is not preferable.

On the other hand, in the above-mentioned memory module, data transfer, porting, and storage are usually performed by inserting and removing the module itself, but these operations are very complicated.
The improvement is awaited.

The present invention has been proposed in view of such a conventional situation, and can easily provide a communication function without imposing a large burden on a host device such as an AV device, and can transmit various data. An object of the present invention is to provide a new communication terminal device capable of transmitting and receiving without using a communication function without inserting and removing a module.

[0013]

Normally, in communication using a network, especially in wireless communication means, it is sufficient that one function can be used according to the environment where the apparatus is placed, and it is almost impossible to use a plurality of functions at the same time. You can say

Therefore, if a communication function is mounted in a so-called memory module, it is possible to provide a detachable communication module using an interface of the memory module with an AV device on the host side. Conceivable.

The present invention has been devised based on such a concept, and has an antenna element, an element for performing high-frequency signal processing, a connector, which has a connector portion detachably connected to a host device, and a base. An element for performing band signal processing and a memory element for a storage function are mounted on a housing having a thickness of 3.5 mm or less.

By using the communication terminal device (communication module) having the above configuration, a communication function can be easily provided to the host device. Specifically, data is transmitted / received to / from the host device via the connector unit, and data is transmitted / received to / from the wireless transmission / reception network via the antenna element. The communication network is connected.

Therefore, for example, if a plurality of types of communication modules corresponding to various communication systems are prepared and replaced with a module corresponding to each communication system according to an environment, a purpose, and a situation, any communication means can be used. Is possible.

Further, when the communication terminal device of the present invention is viewed as a memory module, it can communicate with various devices such as other devices and personal computers through the communication function. Means that the same function as the one added to is added.

[0019]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a communication terminal device (communication module) to which the present invention is applied will be described in detail with reference to the drawings.

Each of the memory modules proposed so far has a thickness of 3.5 mm or less. The basic idea of the present invention is to integrate an information communication function and a storage function by mounting an element for realizing a communication function in such an ultra-small memory module and to provide a completely new ultra-small communication module. Idea.

Hereinafter, a specific structure of a communication module in which elements for realizing a storage function and a communication function are mounted in a housing similar to a so-called memory stick (product name) will be described.

The total thickness of the memory stick is 2.8.
mm, and the memory for the storage function is 50.0 mm x
It is housed in a 21.45 mm rectangular housing. The volume including the housing is 3 ml or less. The housing is made of a molded body such as an ABS resin or a liquid crystal polymer (LCP), and is divided into an upper lid and a lower lid.

In this embodiment, elements for adding a storage function and a communication function are densely mounted in such a limited space.

FIG. 1 shows the appearance of a communication module to which the present invention is applied. A terminal row 2 serving as a connector for connecting to a host device is provided at one end of a rectangular casing 1. Is provided.

Therefore, the communication module of the present invention
It is necessary to have an input / output interface for exchanging data with the host device.

Although any input / output interface can be adopted, as described above, the present invention is basically based on integrating communication functions into the memory modules proposed so far. In this case, the input / output interface of a commercially available memory module is used as it is. Therefore, in this example, the input / output interface of the memory stick is used as it is.

Various elements having a communication function and a storage function are mounted in the housing 1, and FIGS. 2 and 3 show the mounted state. The mounted elements are mainly a storage function memory element 3, an element (baseband LSI) 4 for performing baseband signal processing, an element (RF module) 5 for performing high-frequency signal processing, and an antenna element 6. .

These elements have a thickness of 0.2 m in this example.
m and is accommodated in a limited space in the housing 1 having an overall thickness of 2.8 mm or less.

At one end of the flexible wiring board 7, a connection terminal section 7a is provided corresponding to the terminal row 2 provided on the housing 1, and the connection terminal section 7a is electrically connected to the terminal row 2. With the connection, data can be exchanged with the host device via the terminal array 2.

Since the housing 1 is rectangular, in this example, the storage function memory element 3, baseband LSI 4, RF module 5,
The antenna elements 6 are arranged.

This is determined from the viewpoint of minimizing the loss. When the arrangement is changed, the wiring becomes complicated, and as a result, the loss increases, and the interference by the RF module 5 and the antenna element 6 becomes a problem.

Each element is a so-called chip component, and as shown in FIG. 4, is mounted together with other general components 8 on a flexible wiring board 7 on which various wiring patterns and connection terminals are formed.

A radio wave absorber 9 is provided so as to fill the space between the baseband LSI 4 and the RF module 5 and the space in the housing 1.

Next, the configuration and function of each element will be described.

First, the RF module 5 has a function of detecting and reproducing a high-frequency signal input from the antenna element 6 and converting it into a baseband signal.

The functional elements constituting the RF module 5 include a resonator, a filter, a capacitor, an inductor, and the like. Usually, these are mounted as chip components, but here, in the limited space as described above. In order to accommodate them, they are designed to be built in a multilayer substrate so as to minimize the thickness of the entire device.

FIG. 5 shows an example of the RF module 5. In this RF module 5, an inner layer or an outer layer of a ceramic substrate (or an organic substrate) 51
A resonator (filter) 52, a capacitor 53, an inductor 54, and the like are incorporated by multi-layer technology and are built in. The functional elements are electrically connected by wiring patterns, through holes, and the like that connect them, and the ceramic substrate 51 itself operates as one functional component.

The RF module 5 is formed as one chip component by mounting another chip component 55 and an RF semiconductor LSI 56 on the ceramic substrate 51 containing these functional elements.

Here, the RF semiconductor LSI 56 is mounted on the ceramic substrate 51 by flip-chip connection, and an increase in thickness due to the connection is suppressed. Flip chip connection is a mounting method in which a protruding electrode called a bump is formed on an electrode on the surface of a semiconductor chip, and the electrodes of the wiring board and the bump are turned upside down and connected by so-called face-down bonding. In this example, RF
A bump (for example, a solder bump) 57 is formed on the semiconductor LSI 56.
This is aligned with the electrode of the ceramic substrate 51, and is heated and melted to perform face-down bonding. According to this flip chip connection,
For example, as compared with wire bonding, a space for arranging wires is not required, and the size in the height direction can be significantly reduced.

The baseband LSI 4 is an LSI having a controller for controlling communication signal processing and a memory function described later, or a function for controlling an interface function when a communication module is inserted into the host-side interface. In some cases, by using the communication function mounted on the communication module of this example, by storing personal information and provider information when an Internet connection is established, connection to a specific site can be semi-automatically performed. It also has a function to enable transmission and reception of information.

The baseband LSI 4 has a single LS
It is ideal if it can be configured as an I chip, but since it is necessary to incorporate various functions, it is usually configured by combining a plurality of LSI chips.

At this time, in consideration of the space factor and the like, it is advantageous to adopt a vertical stacking structure using flip-chip connection as in the case of the RF module 5 described above.

FIG. 6 shows an example of a baseband LSI 4 in which two LSI chips are stacked vertically.

The baseband LSI 4 is in a vertically stacked state in which a second semiconductor LSI (for example, a flash ROM) 42 is mounted on a first semiconductor LSI 41 and these are mounted on an intermediate substrate (interposer substrate) 43. It is configured as a chip size package.

The first semiconductor LSI 41 and the second semiconductor LSI 42 are flip-chip connected to each other, and have a structure for suppressing the dimension in the height direction. In particular,
A bump 42a is formed on the second semiconductor LSI 42, and is face-down bonded in alignment with the electrode of the first semiconductor LSI 41.

The first semiconductor LSI 41 on which the second semiconductor LSI 42 is mounted is further mounted on the intermediate substrate 43. In this case, the first semiconductor LSI 41 and the intermediate substrate 43 are electrically connected between the electrodes by wire bonding using the wires 44. Even when three or more semiconductor chips are stacked vertically, it is possible to perform electrical connection while suppressing the dimension in the height direction by appropriately combining flip chip connection and wire bonding.

Then, the first semiconductor LSI 41,
The second semiconductor LSI 42 is molded and protected by a resin 45, and is electrically and mechanically fixed to the flexible wiring board 7 by soldering the intermediate substrate 43 using solder balls 46.

The storage function memory element 3 is a so-called semiconductor memory, and temporarily stores various data obtained through communication and temporarily stores music, voice, image data, and the like sent from the host device.

The capacity of the storage function memory element 3 can be increased three-dimensionally by connecting memory buses to each other via an interposer.

FIG. 7 shows an example of the configuration of the storage memory element 3 which has a four-layer structure to increase the capacity.

Each semiconductor memory chip 31 is flip-chip connected to an intermediate substrate (interposer substrate) 32 via a bump 31a, and these are stacked in four stages. Connection between intermediate substrates 32 and lowermost intermediate substrate 3
2 and the flexible wiring board 7 are connected by soldering using solder balls 33.

As the semiconductor memory chip 31, a chip thinned to, for example, about 100 μm or less by polishing or the like is used to suppress the overall thickness. Also, an extremely thin flexible wiring board or the like is used for the intermediate board 32,
Again try to keep the overall thickness down. Thus, the capacity can be increased without greatly increasing the overall thickness.

The antenna element 6 naturally functions as an antenna, and various forms can be used. Here, a chip antenna is used.

The chip antenna is a so-called multi-layer, in which vias are formed by punching or the like on a green sheet made of an oxide such as alumina or a vitreous simple substance such as SiO ₂ , or a mixture thereof, and then laminating and firing. It can be manufactured by the simultaneous firing process, and the dielectric constant of the material is 5
It can be set relatively freely from about 300 to about 300. Therefore, the effective wavelength of the antenna element 6 is
This can be shortened by the so-called “factor of the root ε”, which is very effective for downsizing the antenna.

FIG. 8 shows an outline of the structure of the chip antenna and how power is supplied from the flexible wiring board 7.

The antenna element (chip antenna) 6 is mounted on the end opposite to the terminal row 2 serving as a connector for a host device. Further, the antenna element 6 is mounted adjacent to the RF module 5 as a structure for minimizing the loss of the power supply to the antenna element 6.

Here, the chip antenna used as the antenna element 6 has a so-called inverted-F structure, has a chip antenna internal wiring having an effective length of λ / 4, and one end thereof is flexible. It is structured to be short-circuited to the ground (ground) wiring pattern 71 on the surface of the wiring board 7. Further, the antenna element 6 has a feeding point 61 at an intermediate point thereof, from which feeding and power distribution of the RF signal to the internal wiring of the chip antenna are performed.

As shown in FIG. 9, the antenna element 6 may be provided with a capacitive stub (metal strip-shaped pattern) 62 at the tip of the inverted F structure, so that the effective length of the antenna element can be further reduced. Become.

The flexible wiring board 7 on which the antenna element 6 is mounted has a two-layer structure (two-sided structure) of a back surface having a solid ground wiring pattern 72 on the entire surface and a surface layer for leading signal lines. A signal input / output from the RF module 5 is supplied to the antenna element 6 through a line whose impedance is controlled.

More specifically, as shown in FIG. 8, the signal lines 73 to the RF module 5 provided on the surface layer are placed inside the gap formed in the ground wiring pattern 71 formed on the same plane. It is wired to the ground wiring pattern 71 via a gap at equal intervals, and forms a so-called coplanar line. The high-frequency line is not limited to the coplanar line, but may be, for example, a microstrip line.

The ground wiring pattern 71 on the surface layer side
Are electrically connected to the ground wiring pattern 72 on the back side by, for example, via holes 74 and the like, so as to reliably fulfill the function as ground.

The ground wiring pattern 72 on the back surface
Are not formed up to the position where the antenna element 6 is mounted. If the ground wiring pattern 72 on the back surface is formed up to the position where the antenna element 6 is mounted, the antenna element 6 may not function.

FIG. 10 and FIG. 11 show examples of the high-frequency line of the flexible wiring board 7.

In the communication module of the present invention, the antenna element 6 is actually
It is necessary that almost the entire surface be grounded except for the surface on which is formed (mounted).

FIG. 10 shows a so-called grounded coplanar line, in which ground wiring patterns 71 and 72 are formed on the back and front surfaces of the base material 7b, respectively, and a signal line 73 is provided between the ground wiring patterns 71 on the front surface.
Are formed with predetermined gaps G1 and G2.

By adopting such a configuration, for example, the thickness H and the dielectric constant of the base 7b, the width W of the signal line 73,
By setting the two gaps G1 and G2, a line having a constant impedance can be manufactured in an infinite number of combinations.

The other is a so-called microstrip line shown in FIG. The microstrip line includes a ground wiring pattern 72,
The signal line 73 is provided on the surface. In this case, the substrate 7
A line having a constant impedance can be manufactured by the thickness H, the dielectric constant, and the width W of the signal line 73.

As described above, in order to realize an ultra-small communication module, a wiring board having at least two wiring layers of a substantially solid ground layer and a signal layer is required. Not limited to this, various types of multilayer wiring boards, wiring boards using other types of materials such as ceramics as base materials, and the like can also be sufficiently used.

In the case of a multilayer wiring board, for example, the ground wiring pattern does not necessarily need to be exposed on the back surface, but can be formed in an inner layer or the like.

Further, instead of providing a ground wiring pattern on the flexible wiring board 7 itself, it is also possible to form a ground surface on the inner surface of the housing 1 facing the flexible wiring board 7, for example.

The main components (elements) constituting the communication module of the present invention have been described above.
A radio wave absorber 9 is provided so as to fill a space between the baseband LSI 4 and the RF module 5 and in the housing 1.

The radio wave absorber 9 is formed in a wiring portion or a part of a space as shown in FIG.
It acts to prevent unnecessary radiation of the module 5) and to suppress spatial electromagnetic resonance called cavity resonance.

In the radio wave absorber 9 shown in FIGS. 2 and 3,
The radio wave absorber 9 disposed between the RF module 5 and the baseband LSI 4 is provided mainly for the purpose of preventing unnecessary radiation of the RF module 5 which is a digital unit. The radio wave absorber 9 installed in the space is provided for the purpose of suppressing spatial electromagnetic resonance.

As the material of the radio wave absorber 9, a material obtained by pulverizing a magnetic material having high magnetic permeability, such as ferrite or metal, and mixing it with an adhesive resin or the like is used. The element is mounted in such a manner as to be mounted on the flexible wiring board 7 like other elements.

The radio wave absorber 9 is not limited to the above-mentioned molded product, but may be of any form such as a sheet or a paste.

Although the example of the communication module to which the present invention is applied has been described above, the present invention is not limited to this example, and various modifications can be made.

For example, in the above-described example, each element is mounted on the flexible wiring board 7 and accommodated in the housing 1, but as shown in FIG. The wiring pattern P may be formed on the wall surface, and the RF module 5, the baseband LSI 4, the storage function memory element 3, the other general parts 8, and the like may be directly mounted thereon.

However, in this case, the housing 1 needs to have heat resistance enough to withstand a heat treatment step such as reflow, and it is preferable to use a liquid crystal polymer (LCP) or the like.

Further, as for the radio wave absorber 9, in the previous example, the configuration in which the molded body is disposed on the flexible wiring board 7 is shown. However, as shown in FIGS. The shape may be such that the entire surface is filled.

In this case, a paste-like radio wave absorber is applied, the upper cover 1a is put on the lower cover 1b as the housing 1, and heat treatment is performed to assemble and seal the housing 1 and form the radio wave absorber. Can be performed at once.

The RF module 5 and the baseband L
The SI 4, the storage function memory element 3 and the like are also entirely coated with the radio wave absorber, so that the moisture resistance reliability and the electrostatic breakdown resistance can be particularly improved.

Further, the antenna element 6 is also a chip antenna in the above example, but as shown in FIG.
MID (Molded Interconnect Device)
The dipole antenna DP of, for example, λ / 2 may be formed by forming a plating pattern using a two-stage forming method such as e). When the entire surface is filled with the radio wave absorber as in the previous example, the antenna element 6 cannot be placed in the housing 1, and the combination with the antenna formation as in this example is preferable.

When the antenna element is formed on the surface of the housing 1, the flexible wiring board 7 is connected by a coaxial cable or the like.
It is necessary to connect between the RF input / output terminal and the dipole antenna DP so that power can be supplied.

Alternatively, the antenna element can be formed on the protrusion 1c provided on the housing 1.

FIG. 16 shows a protruding portion 1 protruding from the host device main body when the communication module is inserted into the host device.
This is an example in which c is provided in the housing 1 and the dipole antenna DP is formed here.

The antenna element is not limited to the above-described dipole antenna, but may be, for example, a bow as shown in FIG.
A -tie antenna BT is also possible. In addition, known antennas such as an inverted F antenna and a patch antenna can be formed, and a chip antenna can be mounted on this portion.

As a result, the radiated electromagnetic field from the antenna is not trapped in the host device, and the original radiation characteristics of the antenna can be obtained.

As described above, an ultra-small communication module is formed, and its connector is inserted into a host (for example, AV equipment, a telephone, a personal computer, etc.) to access the Internet using a communication function. Conversely, by taking music and image data from the Internet and temporarily storing it in the internal memory of the module, all data and information communication and recording functions can be easily given to the host device. It becomes possible.

Also, the baseband LSI flash R
OM, EPROM, etc., user's personal information, for example,
Write account information and password of Internet provider, PIN code of mobile phone, etc.,
By including frequently used Internet site information, it is possible to semi-automatically acquire and transmit information intended by the user.

Specifically, the communication module of the present invention comprises:
For example, a wireless LAN (Loca
l Area Network).

As shown in FIG. 18, in a wireless LAN system 101 connected to a public communication network 140, communication devices 102 (102a to 102e) serving as gateways,
In order to realize data communication between the communication module 103 and the host device 104 on which the communication module 103 is mounted, a Bluetooth system is employed.

[0092] The Bluetooth system is used by five companies in Japan and Europe.
It is a name for short-range wireless communication technology that started standardization activities in May 1998. In this Bluetooth system, data communication is performed by constructing a short-range wireless communication network having a maximum data transmission speed of 1 Mbps (effectively 721 Kbps) and a maximum transmission distance of about 10 m. In this Bluetooth system, 2.4 GHz ISM (Industrial Scien
tific Medical) The communication module 103 and the host device 104 adopt a frequency hopping spread spectrum technique in which 79 channels having a bandwidth of 1 MHz are set in the frequency band and channels are switched 1600 times per second.
(104a-104d).

Each host device 104 included in the short-distance wireless communication network to which the Bluetooth system is applied adopts a slave master system, and controls a master device that determines a frequency hopping pattern in accordance with processing contents and a master device. Of the communication destination slave device. The master device can simultaneously perform data communication with seven slave devices at a time. The subnet composed of a total of eight devices including the master device and the slave device is “picon”.
The host device 104 in the piconet, that is, the slave device included in the wireless LAN system 101, can be a slave device of two or more piconets at the same time.

The wireless LAN system 101 shown in FIG.
Is a communication device 102 (102a to 102) that transmits and receives data to and from a public communication network 140 such as the Internet network.
e) and a short-range wireless communication network 13 which is a short-range wireless communication network.
0, a communication module 103 for transmitting and receiving control packets containing user data and the like to and from the communication device 102 in a Bluetooth system via a Bluetooth system 0, and a host for inputting and outputting control packets containing user data and the like to and from the communication module 103. It is composed of devices 104 (104a to 104e).

The host device 104 is connected to the communication module 10
3 is an electronic device mechanically connected to and operated by a user. As the host device 104, for example, a PD
A (Personal Digital Assistant) 104a, digital camera 104b, mail processing terminal 104c, EMD
(Electronic Music Distribution) terminal 104d and the like.

The communication device 102 is a short-range wireless communication network 13
The communication module 103 is connected to the public communication network 140 via a control packet and is connected to the public communication network 140 via the communication module 103. As the communication device 102, a personal computer 102a having a modem or the like for connecting to a public communication network 140, for example, cdmaOne (Code
Division Multiple Access) or W-CDMA (Wi-
de Band-Code Division Multiple Access) mobile phone 102b, TA / modem 102c, STB
(Set Top Box) 102d, for example, a quasi-public system 102e such as a base station for connecting the communication module 103 conforming to the Bluetooth system and the public communication network 140.

The public communication network 140 includes, for example, an Internet network connected to the personal computer 102a via a telephone line, a mobile communication network (Mobile Network) connected to the mobile phone 102b, and TA /
ISDN (Integrated Servo) connected to the modem 102c
vices Digital Network) / B (broadband) -ISD
N, a satellite communication network (Broadcas) connected to the STB 102d.
ting), WLL connected to the semi-public system 102d
(Wireless local loop). Public communication network 140
, An information providing server 141, a mail server 142, an EMD server 14
3. The community server 144 is connected. The information providing server 142 receives a request from the host device 104 via the communication module 103 and the communication device 102, and transmits various information according to the request to the host device 104. The mail server 142 manages the electronic mail, and transmits and receives the electronic mail to and from the host device 104 via the communication device 102 and the communication module 103. Furthermore, E
In the MD server, the communication device 102 and the communication module 1
The music information is transmitted to the EMD terminal 104d of the host device 104 via the host computer 103 to manage the music providing service. Furthermore, in the community server, for example, the digital camera 104b of the host device 104 stores, for example, street corner information,
It provides a news information download service and the like, and manages uploading of information from the host device 4 and the like.

The communication module 103 used in the above-described wireless LAN system is the communication module of the present invention described above, and has an internal configuration as shown in FIG. The antenna element 6, the RF module 5, the baseband LSI 4, and the storage function memory element 3 are accommodated in a single housing 1. For example, the RF module 5 stores a switch unit (SW), a receiving unit, a transmitting unit, and a hopping synthesizer unit. The baseband LSI 4 includes a baseband control unit, an interface unit, a personal information storage unit, a network setting storage unit, a RAM (Random Access Memory), a wireless communication CPU, and the like.
(Central Processing Unit), ROM (Read Only Mem)
ory), the memory controller is stored.

[0099]

As is apparent from the above description, by incorporating the wireless communication function in the memory module, it is possible to easily connect to an external network such as the Internet, and as a result, the memory module is infinite. In addition to obtaining the same effect as securing a large memory capacity,
All kinds of information such as music, images and data can be exchanged between devices in a seamless environment.

In addition, by using the interface of the memory module as a common interface, 2.4
GLAN, 5G home network, IEEE 802.11, Blue
Communication modules compatible with all communication methods, such as tooth, can be created or exchanged. As a result, there is no need to prepare many types of communication interfaces on the device side, and it is not only in terms of shape, weight, and cost. It is possible to reduce the burden on the user side.

Further, the size and thickness of the module itself can be reduced, and a mobile-type device can be provided with a network environment having excellent portability and mobility.

[Brief description of the drawings]

FIG. 1 is a schematic plan view showing an example of a communication module to which the present invention is applied.

FIG. 2 is a schematic plan view showing an example of a mounting state of each element constituting the communication module.

FIG. 3 is a schematic cross-sectional view showing an example of a mounting state of each element constituting the communication module.

FIG. 4 is an exploded plan view showing a state in which elements are mounted on a flexible wiring board.

FIG. 5 is a schematic diagram illustrating a cross-sectional structure of an RF module.

FIG. 6 is a schematic diagram illustrating a cross-sectional structure of a baseband LSI.

FIG. 7 is a schematic diagram showing a cross-sectional structure of a storage function memory element.

FIG. 8 is a schematic perspective view showing a partially cutaway mounting structure of the chip antenna to the flexible wiring board.

FIG. 9 is a schematic perspective view showing an example of a chip antenna provided with a capacitive stub.

FIG. 10 is a schematic cross-sectional view of a main part showing an example of a wiring board having a grounded coplanar structure.

FIG. 11 is a schematic cross-sectional view of a main part showing an example of a wiring board having a microstrip structure.

FIG. 12 is an exploded plan view showing an attached state of elements when wiring is formed on a housing.

FIG. 13 is an exploded schematic view showing a mounting example covered with a radio wave absorber.

FIG. 14 is a schematic diagram showing a sealed state in a mounting example covered with a radio wave absorber.

FIG. 15 is a schematic plan view showing an example in which an antenna element is formed on a housing.

FIG. 16 is a schematic plan view showing an example in which a dipole antenna is formed on a protruding portion of a housing.

FIG. 17 is a schematic plan view showing an example in which a bow-tie antenna is formed on a protruding portion of a housing.

FIG. 18 is a diagram illustrating a network including a wireless LAN system.

FIG. 19 is a block diagram illustrating an internal configuration of a communication module.

[Explanation of symbols]

Reference Signs List 1 housing, 2 connector section, memory element for storage function, 4 baseband LSI, 5 RF module, 6 antenna element

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) H04L 12/28 H04L 11/00 310B (72) Inventor Junichi Toyoda 6-7 Kita Shinagawa, Shinagawa-ku, Tokyo 35 Inside Sony Corporation (72) Katsumi Okayama Inventor 6-7-35 Kita Shinagawa, Shinagawa-ku, Tokyo Sony Corporation (72) Inventor Hideyuki 6-35 Kita Shinagawa, Shinagawa-ku, Tokyo 6-35 Within Sony Corporation (72) Inventor Bin Iwashita 4-1-1 Kita Shinagawa, Shinagawa-ku, Tokyo Master Engineering Corporation F-term (reference) 5B035 BA05 BB09 CA08 5K011 AA01 AA06 AA15 DA01 DA26 JA01 JA06 KA02 5K033 AA04 AA09 BA15 DA01 DA17 DB12 5K067 AA34 AA42 BB01 BB21 EE02 FF01 KK01 KK15

Claims (22)

[Claims] An antenna element, an element for performing high-frequency signal processing, an element for performing baseband signal processing, and a memory element for a storage function have a connector portion detachably connected to a host device. A communication terminal device mounted on a housing of 3.5 mm or less. 2. The thickness including a housing is 2.8 mm or less, and the volume is 3 ml or less.
The communication terminal device according to claim 1. 3. The device according to claim 1, wherein a memory element for storage function, an element for performing baseband signal processing, an element for performing high-frequency signal processing, and an antenna element are arranged in this order from the connector section side. Communication terminal device. 4. The communication terminal device according to claim 1, wherein a radio wave absorber is arranged between at least the element for performing high-frequency signal processing and the element for performing baseband signal processing. 5. The communication terminal device according to claim 4, wherein a radio wave absorber is disposed in a space inside said housing. 6. The communication terminal device according to claim 4, wherein the element for performing high-frequency signal processing, the element for performing baseband signal processing, and the memory element for storage function are covered with a radio wave absorber. 7. The communication terminal device according to claim 1, wherein a wiring pattern is formed on at least a part of the housing. 8. The communication terminal device according to claim 1, wherein the antenna element is formed on a surface of the housing opposite to the connector. 9. The communication terminal device according to claim 1, wherein the antenna element is a chip antenna, and is built in the housing at a position opposite to the connector. 10. The communication terminal device according to claim 1, wherein the element for performing the high-frequency signal processing is formed by flip-chip bonding a semiconductor chip to a wiring board having a built-in functional element. 11. The device according to claim 1, wherein the functional element is at least one selected from a resonator, a filter, a capacitor, and an inductor.
The communication terminal device according to claim 10, wherein the communication terminal device is a seed. 12. The communication terminal device according to claim 1, wherein the element for performing the baseband signal processing is formed by stacking and bonding a plurality of semiconductor chips. 13. The communication terminal device according to claim 1, wherein the storage function memory is formed by stacking a plurality of semiconductor memories via an intermediate substrate. 14. The communication terminal device according to claim 13, wherein each semiconductor memory element is flip-chip bonded to the intermediate substrate. 15. The device according to claim 1, wherein each of the elements is mounted on a flexible wiring board, and a ground electrode pattern is formed in at least a region of the flexible wiring board facing the element that performs high-frequency signal processing. The communication terminal device according to claim 1. 16. The device according to claim 15, wherein the flexible wiring board is at least a double-sided wiring board, and the ground electrode pattern is formed on a surface opposite to a surface on which the respective elements are mounted. Communication terminal device. 17. Each of the elements is mounted on a housing on which a wiring pattern is formed, and a ground electrode pattern is formed in at least a region of the housing facing an element for performing high-frequency signal processing. 8. The communication terminal device according to claim 7, wherein: 18. The communication terminal device according to claim 17, wherein said ground electrode pattern is formed on an outer peripheral surface of said housing. 19. The data transmission / reception to / from a host device via the connector unit, and the transmission / reception of data to / from a wireless transmission / reception network via the antenna element. 2. The communication terminal device according to 1. 20. The communication terminal device according to claim 19, further comprising an input / output interface for exchanging data with said host device. 21. The communication terminal device according to claim 20, wherein an input / output interface of a commercially available memory module is used as said input / output interface. 22. The communication terminal device according to claim 1, wherein personal information of a user is stored in the element for performing the baseband signal processing.