JP2001139344A5 - - Google Patents

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Publication number
JP2001139344A5
JP2001139344A5 JP1999315622A JP31562299A JP2001139344A5 JP 2001139344 A5 JP2001139344 A5 JP 2001139344A5 JP 1999315622 A JP1999315622 A JP 1999315622A JP 31562299 A JP31562299 A JP 31562299A JP 2001139344 A5 JP2001139344 A5 JP 2001139344A5
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JP
Japan
Prior art keywords
mol
lead
free low
sro
bao
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1999315622A
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Japanese (ja)
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JP2001139344A (en
JP4061792B2 (en
Filing date
Publication date
Application filed filed Critical
Priority to JP31562299A priority Critical patent/JP4061792B2/en
Priority claimed from JP31562299A external-priority patent/JP4061792B2/en
Publication of JP2001139344A publication Critical patent/JP2001139344A/en
Publication of JP2001139344A5 publication Critical patent/JP2001139344A5/ja
Application granted granted Critical
Publication of JP4061792B2 publication Critical patent/JP4061792B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Claims (5)

下記酸化物基準のモル％表示で、
Ｐ２Ｏ５ １５〜５０、
ＳｎＯ ２〜３５、
ＺｎＯ ５〜４５、
Ｂ２Ｏ３ ０．１〜３０、
ＭｇＯ ０〜３５、
ＣａＯ ０〜３５、
ＳｒＯ ０〜３５、
ＢａＯ ０〜３５、
Ａｌ２Ｏ３ ０〜１０、
Ｉｎ２Ｏ３ ０〜１０、
ＷＯ３ ０〜１０、
Ｌｉ２Ｏ ０〜３、
Ｎａ２Ｏ ０〜３、
Ｋ２Ｏ ０〜３、
から実質的になり、ＭｇＯ＋ＣａＯ＋ＳｒＯ＋ＢａＯが０〜３５モル％であり、Ａｌ２Ｏ３＋Ｉｎ２Ｏ３＋ＷＯ３が０〜１０モル％であり、Ｌｉ２Ｏ＋Ｎａ２Ｏ＋Ｋ２Ｏが０〜３モル％であり、かつ、ＳｎＯのＺｎＯに対するモル比が１未満である無鉛低融点ガラス。In terms of mol% based on
P 2 O 5 15-50,
SnO 2-35,
ZnO 5-45,
B 2 O 3 0.1-30,
MgO 0-35,
CaO 0-35,
SrO 0-35,
BaO 0-35,
Al 2 O 3 0-10,
In 2 O 3 0-10,
WO 3 0~10,
Li 2 O 0-3,
Na 2 O 0-3,
K 2 O 0-3,
And MgO + CaO + SrO + BaO is 0 to 35 mol%, Al 2 O 3 + In 2 O 3 + WO 3 is 0 to 10 mol%, Li 2 O + Na 2 O + K 2 O is 0 to 3 mol%. And the lead-free low melting glass whose molar ratio of SnO to ZnO is less than 1. ＡｌAl ２2 ＯO ３3 を含有し、その含有量が５モル％以下である請求項１に記載の無鉛低融点ガラス。The lead-free low-melting glass according to claim 1, wherein the content is 5 mol% or less. ＭｇＯ＋ＣａＯ＋ＳｒＯ＋ＢａＯが２モル％以上である請求項１または２に記載の無鉛低融点ガラス。The lead-free low-melting glass according to claim 1 or 2, wherein MgO + CaO + SrO + BaO is 2 mol% or more. 結晶化温度が軟化点よりも４０℃以上高い請求項１、２または３に記載の無鉛低融点ガラス。The lead-free low melting point glass according to claim 1, 2 or 3, wherein the crystallization temperature is 40 ° C or higher than the softening point. 低膨張セラミックスフィラーおよび耐熱顔料の少なくともいずれか一方と、請求項１〜４のいずれかに記載の無鉛低融点ガラスの粉末を含有するガラスフリット。A glass frit containing at least one of a low expansion ceramic filler and a heat-resistant pigment and a lead-free low-melting glass powder according to any one of claims 1 to 4 .
JP31562299A 1999-11-05 1999-11-05 Lead-free low melting glass and glass frit Expired - Fee Related JP4061792B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP31562299A JP4061792B2 (en) 1999-11-05 1999-11-05 Lead-free low melting glass and glass frit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP31562299A JP4061792B2 (en) 1999-11-05 1999-11-05 Lead-free low melting glass and glass frit

Publications (3)

Publication Number Publication Date
JP2001139344A JP2001139344A (en) 2001-05-22
JP2001139344A5 true JP2001139344A5 (en) 2005-06-02
JP4061792B2 JP4061792B2 (en) 2008-03-19

Family

ID=18067592

Family Applications (1)

Application Number Title Priority Date Filing Date
JP31562299A Expired - Fee Related JP4061792B2 (en) 1999-11-05 1999-11-05 Lead-free low melting glass and glass frit

Country Status (1)

Country Link
JP (1) JP4061792B2 (en)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003008092A (en) * 2001-06-20 2003-01-10 Mutsuo Munekata Laminated piezoelectric element and its manufacturing method as well as sealing material for laminated piezoelectric element
JP4092936B2 (en) * 2001-12-25 2008-05-28 日本電気硝子株式会社 Tin phosphate glass and composite materials
JP4682556B2 (en) * 2003-09-19 2011-05-11 日本電気硝子株式会社 Low melting point sealing composition, low melting point glass paste and low melting point glass tablet
JP4529173B2 (en) * 2004-06-11 2010-08-25 日本電気硝子株式会社 Glass for sealing and sealing method
WO2006064733A1 (en) 2004-12-16 2006-06-22 Matsushita Electric Industrial Co., Ltd. Plasma display panel, method for manufacturing same and sealing member
JP2006236609A (en) * 2005-02-22 2006-09-07 Nitto Denko Corp Dielectric layer and manufacturing method of substrate for forming dielectric layer
JP2006342018A (en) * 2005-06-09 2006-12-21 Nihon Yamamura Glass Co Ltd Zinc phosphate-based lead-free glass composition
JP2008186697A (en) * 2007-01-30 2008-08-14 Univ Of Tokyo Manufacturing method of panel body
JP2008300536A (en) * 2007-05-30 2008-12-11 Asahi Glass Co Ltd Glass coated light emitting element, and glass coated light emitting device
EP2151872A4 (en) 2007-05-30 2012-12-05 Asahi Glass Co Ltd Glass for optical device covering, glass-covered light-emitting element, and glass-covered light-emitting device
JP5458893B2 (en) * 2008-01-10 2014-04-02 旭硝子株式会社 Glass, coating material for light emitting device and light emitting device
JP5471095B2 (en) * 2009-07-09 2014-04-16 旭硝子株式会社 Sealing glass
US8536787B2 (en) * 2010-04-19 2013-09-17 Panasonic Corporation Glass composition, light source device and illumination device
WO2012014619A1 (en) * 2010-07-28 2012-02-02 日本電気硝子株式会社 Sealing glass and sealing composite material
JP5679519B2 (en) * 2010-07-28 2015-03-04 日本電気硝子株式会社 Sealing glass
JP5831839B2 (en) * 2010-07-28 2015-12-09 日本電気硝子株式会社 Glass for sealing
JP5569866B2 (en) * 2010-08-24 2014-08-13 日本電気硝子株式会社 Sealing glass tablet
CN102765884B (en) * 2011-05-06 2014-11-05 中国科学院过程工程研究所 Low-softening-temperature leadless glass powder for bonding, preparation method and application thereof
JP5990994B2 (en) * 2012-04-19 2016-09-14 セントラル硝子株式会社 A method for producing a glass powder material and a porous vitreous membrane.
JP7205043B2 (en) * 2019-10-15 2023-01-17 Ｙｅｊガラス株式会社 Low-melting stannous phosphate-based glass frit
CN111268911B (en) * 2020-02-21 2022-06-07 Oppo广东移动通信有限公司 Welding composition, shell assembly, preparation method and electronic equipment

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