JP2001134220A - Light emitting diode display device - Google Patents
Light emitting diode display deviceInfo
- Publication number
- JP2001134220A JP2001134220A JP31814399A JP31814399A JP2001134220A JP 2001134220 A JP2001134220 A JP 2001134220A JP 31814399 A JP31814399 A JP 31814399A JP 31814399 A JP31814399 A JP 31814399A JP 2001134220 A JP2001134220 A JP 2001134220A
- Authority
- JP
- Japan
- Prior art keywords
- emitting diode
- reflector
- light emitting
- display device
- display
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/302—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements characterised by the form or geometrical disposition of the individual elements
- G09F9/3023—Segmented electronic displays
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Illuminated Signs And Luminous Advertising (AREA)
- Led Device Packages (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、各種機器に搭載さ
れる発光ダイオード表示装置に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a light emitting diode display mounted on various devices.
【０００２】[0002]
【従来の技術】従来から、発光ダイオードを光源とした
表示装置として、７セグメントＬＥＤディスプレイ等が
広く知られているが、ＬＥＤの発光輝度が低い点を補償
するための各種の工夫が成されている。例えば、個々の
発光ダイオードについて反射鏡と集光レンズ機能を持た
せるため樹脂モールド加工を施すことが知られている。
しかしながら、このような樹脂モールド加工を施した発
光ダイオードを基板上に取り付けて結線することは、生
産性が悪くコスト高になる。この問題を解消するため
に、上記のような個々の発光ダイオードに樹脂モールド
加工を施したものに代えて、基板に絞り加工等により窪
みを設けて、その底部に発光ダイオードを配置し、絞り
加工の側壁を反射面とすることで、発光ダイオードの輝
度向上を図ることも知られている（例えば、特開平２−
３３１８５号公報参照）。2. Description of the Related Art Hitherto, as a display device using a light emitting diode as a light source, a 7-segment LED display and the like have been widely known. I have. For example, it is known that individual light emitting diodes are subjected to resin molding in order to have a reflecting mirror and a condenser lens function.
However, attaching a resin-molded light emitting diode on a substrate and connecting the wires results in poor productivity and high cost. In order to solve this problem, instead of the individual light emitting diodes subjected to resin molding as described above, a depression is provided by drawing or the like on the substrate, and the light emitting diode is arranged at the bottom thereof, and the drawing is performed. It is also known to improve the brightness of the light emitting diode by making the side wall of the light reflecting surface (see, for example,
No. 33185).
【０００３】[0003]
【発明が解決しようとする課題】しかしながら、上記の
ような構成としたところで、加工上の手間が多く、依然
としてコスト低減は僅かである。そこで、比較的に簡単
な反射用の部材（以下、リフレクタという）を用いた発
光ダイオード表示装置について、図５乃至図８を参照し
て説明する。この表示装置は、樹脂成形品でなるリフレ
クタ１２を基体ケースとし、その裏面内側にプリント基
板１４を装入し、表面１２ａに文字又は記号を印刷（表
示部以外を遮光）したフィルムテープ１３を貼り付けた
構成とされている。プリント基板１４上には、チップ状
の発光ダイオード（以下、ＬＥＤという）１５が搭載さ
れ、ワイヤボンディング１６により基板回路に結線され
ている。リフレクタ１２には、フィルムテープ１３の印
刷による文字又は記号を点灯表示するための開孔１２ｂ
の他、７セグメント表示用の開孔１２ｄが形成されてい
る。これら開孔１２ａ，１２ｂは、表面側を大径とした
ラッパ形状とされ、それによる壁の傾斜面により出射光
の反射効果を上げるようにしている。ＬＥＤ１５はリフ
レクタ１２の開孔１２ｂ，１２ｄに対向して配置されて
いる。開孔１２ｂでは文字等が印刷されたフィルムテー
プ１３があることで表示が成される。However, with the above-described structure, much labor is required for processing, and the cost reduction is still slight. Therefore, a light-emitting diode display device using a relatively simple reflecting member (hereinafter, referred to as a reflector) will be described with reference to FIGS. In this display device, a reflector 12 made of a resin molded product is used as a base case, a printed circuit board 14 is mounted on the inner surface of the back surface, and a film tape 13 on which characters or symbols are printed (a part other than the display portion is shielded) is adhered on a front surface 12a. It is configured to be attached. A chip-shaped light emitting diode (hereinafter, referred to as an LED) 15 is mounted on the printed board 14 and connected to a board circuit by wire bonding 16. The reflector 12 has an opening 12b for lighting and displaying characters or symbols printed on the film tape 13.
In addition, an opening 12d for 7-segment display is formed. These apertures 12a and 12b are formed in a trumpet shape with a large diameter on the surface side, and the inclined surface of the wall thereby enhances the reflection effect of the emitted light. The LED 15 is disposed to face the openings 12 b and 12 d of the reflector 12. In the opening 12b, a display is made by the presence of the film tape 13 on which characters and the like are printed.
【０００４】ところが、上記の構成にあっては、その組
立てラインにおいてリフレクタ１２へプリント基板１４
を装入する際に、プリント基板１４の取り扱いを慎重に
しなければ、ＬＥＤ１５のワイヤボンディング１６が断
線するといった問題がある。また、ＬＥＤ１５の発光輝
度を上げるには、上記構成において、リフレクタ１２へ
プリント基板１４を装入後、プリント基板１４とリフレ
クタ１２との隙間に、乳白色エポキシ樹脂をモールドし
て、レンズ効果を出すようにしているが、このモールド
工程での熱の影響でリフレクタ１２に反りが発生するこ
とがあり、歩留まりが低下し、コストアップとなる。ま
た、文字等を表示するための印刷したフィルムテープ１
３を必要とする。However, in the above configuration, the printed circuit board 14 is connected to the reflector 12 on the assembly line.
If the printed circuit board 14 is not carefully handled when inserting the LED, there is a problem that the wire bonding 16 of the LED 15 is broken. In order to increase the light emission brightness of the LED 15, in the above configuration, after mounting the printed circuit board 14 on the reflector 12, a milky white epoxy resin is molded into a gap between the printed circuit board 14 and the reflector 12 to obtain a lens effect. However, warping of the reflector 12 may occur due to the influence of heat in the molding process, which lowers the yield and increases the cost. In addition, a printed film tape 1 for displaying characters and the like
Requires 3
【０００５】本発明は、上述した問題点を解決するため
になされたものであり、比較的に簡単な構成で安価に、
組立て工程における発光ダイオードの基板への結線の断
線を防止することができ、また、リフレクタに反りが発
生するといったことなく発光ダイオードによる表示の輝
度を上げることができる発光ダイオード表示装置を提供
することを目的とする。SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and has a relatively simple structure at a low cost.
Disclosed is a light emitting diode display device that can prevent disconnection of a connection of a light emitting diode to a substrate in an assembling process, and can increase display brightness by a light emitting diode without causing warpage of a reflector. Aim.
【０００６】[0006]
【課題を解決するための手段】上記目的を達成するため
に請求項１に記載の発明は、プリント基板上に搭載さ
れ、ワイヤボンディングにより結線された発光ダイオー
ドを光源とし、表示用のリフレクタに背面側からプリン
ト基板を装入してなる発光ダイオード表示装置におい
て、ワイヤボンディング上に透明樹脂を付着させ、この
透明樹脂がリフレクタに形成された表示用の開孔に対向
するように構成したものである。According to a first aspect of the present invention, a light emitting diode mounted on a printed circuit board and connected by wire bonding is used as a light source, and a back surface is provided on a display reflector. In a light emitting diode display device in which a printed board is inserted from the side, a transparent resin is attached on wire bonding, and the transparent resin is configured to face a display opening formed in the reflector. .
【０００７】上記構成においては、ワイヤボンディング
上に透明樹脂を付着させたので、この透明樹脂によるレ
ンズ効果が得られ、そのため発光ダイオードによる文字
等の表示の輝度を上げることができる。それと同時に、
組立て工程において、ワイヤボンディングの断線発生を
防止することができる。In the above configuration, since the transparent resin is attached on the wire bonding, a lens effect is obtained by the transparent resin, and therefore, the brightness of display of characters and the like by the light emitting diode can be increased. At the same time,
In the assembling process, the occurrence of disconnection of wire bonding can be prevented.
【０００８】請求項２の発明は、請求項１に記載の発光
ダイオード表示装置において、透明樹脂がレンズ効果を
奏するように略半球状に形成されているものである。こ
の構成においては、透明樹脂のレンズ効果が高まる。According to a second aspect of the present invention, in the light emitting diode display according to the first aspect, the transparent resin is formed in a substantially hemispherical shape so as to exhibit a lens effect. In this configuration, the lens effect of the transparent resin is enhanced.
【０００９】請求項３の発明は、請求項１又は請求項２
に記載の発光ダイオード表示装置において、プリント基
板とリフレクタ内面との間は空隙とされているものであ
る。この構成においては、従来のように上記空隙に樹脂
をモールドしないので、リフレクタに反りを発生するよ
うなことがなくなる。[0009] The invention of claim 3 is claim 1 or claim 2.
In the light-emitting diode display device described in (1), a gap is provided between the printed board and the inner surface of the reflector. In this configuration, since the resin is not molded into the above-described gap as in the related art, warpage of the reflector does not occur.
【００１０】請求項４の発明は、請求項１乃至請求項３
のいずれかに記載の発光ダイオード表示装置において、
リフレクタの開孔はそれ自体で表示文字又は記号を形成
しており、該リフレクタの開孔表面に非印刷の光拡散用
フィルムを貼り付けたものである。この構成において
は、表示文字等を印刷した光拡散用フィルムを必要とし
なくなる。[0010] The invention of claim 4 is the invention of claims 1 to 3.
The light emitting diode display device according to any one of the above,
The aperture of the reflector itself forms a display character or symbol, and a non-printing light diffusion film is attached to the surface of the aperture of the reflector. In this configuration, a light diffusion film on which display characters and the like are printed is not required.
【００１１】[0011]
【発明の実施の形態】以下、本発明の一実施形態に係る
発光ダイオード表示装置について、図１乃至図４を参照
して説明する。発光ダイオード表示装置１は、樹脂成形
品でなる表示用のリフレクタ２をケース状基体とし、そ
の裏面内側にプリント基板（ＰＣＢ）４を装入し、リフ
レクタ２の表面２ａに光拡散用のフィルムテープ３（非
印刷の光拡散用フィルム）を貼り付けたものとされてい
る。プリント基板４上には、光源となるチップ状の発光
ダイオード（ＬＥＤ）５が搭載され、ワイヤボンディン
グ６により基板回路に結線されている。リフレクタ２に
は、それ自体で文字又は記号を点灯表示するための開孔
２ｂの他、７セグメント表示用の開孔２ｄが形成されて
いる。これら開孔２ｂ，２ｄの回りには、内方に突出し
た形で、これらを取り囲むように一体的に壁部２ｃ，２
ｃ’が形成されている。開孔２ｄは、表面側が大径のラ
ッパ形状とされている。ＬＥＤ５は開孔２ｂ、２ｄ等に
対峙した位置に配設されている。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a light emitting diode display according to an embodiment of the present invention will be described with reference to FIGS. The light-emitting diode display device 1 has a display reflector 2 made of a resin molded product as a case-like base, a printed circuit board (PCB) 4 inserted into the back surface thereof, and a light-diffusing film tape on the front surface 2a of the reflector 2. 3 (non-printing light diffusion film). A chip-shaped light emitting diode (LED) 5 serving as a light source is mounted on the printed board 4, and is connected to a board circuit by wire bonding 6. The reflector 2 has an opening 2b for displaying characters or symbols by itself and an opening 2d for displaying 7 segments. Around these openings 2b and 2d, walls 2c and 2 are integrally formed so as to protrude inward so as to surround them.
c ′ is formed. The opening 2d has a trumpet shape with a large diameter on the surface side. The LED 5 is provided at a position facing the openings 2b, 2d and the like.
【００１２】さらには、ワイヤボンディング６上に透明
なシリコンボンド（透明樹脂）７を付着させ、この透明
樹脂７をリフレクタ２に形成された表示用の開孔２ｂ，
２ｄに臨むように対向させている。この透明樹脂７は、
レンズ効果を奏するように略半球状に形成される。リフ
レクタ２の少なくとも開孔２ｂ，２ｄの壁面は乳白色と
され、表面２ａはグレー等の低明度の彩色に着色され
る。また、プリント基板４とリフレクタ２の内面との間
は空隙とされている。同基板４の裏面には外部の回路に
接続するためのリード端子８が導出されている。Further, a transparent silicon bond (transparent resin) 7 is adhered on the wire bonding 6, and the transparent resin 7 is attached to the opening 2 b for display formed in the reflector 2.
They face each other so as to face 2d. This transparent resin 7 is
It is formed in a substantially hemispherical shape so as to exhibit a lens effect. At least the wall surfaces of the apertures 2b and 2d of the reflector 2 are made milky white, and the surface 2a is colored in a low lightness color such as gray. There is a gap between the printed board 4 and the inner surface of the reflector 2. Lead terminals 8 for connection to an external circuit are led out from the back surface of the substrate 4.
【００１３】上記のように構成された表示装置におい
て、外部回路からの駆動信号に基づいて所定の位置のＬ
ＥＤ５が点灯又は点滅され、開孔２ｂ，２ｄ及び光拡散
用のフィルムテープ３を通してその光が出射・投光され
ることにより、文字等の表示が行われる。ここに、ワイ
ヤボンディング６上に略半球状の透明樹脂７を付着させ
たことによりレンズ効果が高まり、ＬＥＤ５から出射さ
れる光を集光して投光できるので、文字等の表示の輝度
を上げることができる。それと同時に、装置の組立て工
程において、ワイヤボンディング６の断線が発生するこ
とを防止することができる。In the display device configured as described above, L at a predetermined position is determined based on a drive signal from an external circuit.
The ED 5 is turned on or off, and the light is emitted and projected through the openings 2b and 2d and the film tape 3 for light diffusion, thereby displaying characters and the like. Here, by attaching the substantially hemispherical transparent resin 7 on the wire bonding 6, the lens effect is enhanced, and the light emitted from the LED 5 can be collected and projected, so that the brightness of the display of characters and the like can be increased. be able to. At the same time, it is possible to prevent the wire bonding 6 from being broken in the assembly process of the device.
【００１４】また、輝度が上がることから、プリント基
板４とリフレクタ２の内面との間は空隙のままでよい。
そのため、従来のようにその空隙に樹脂をモールドする
必要がなくなり、リフレクタ２に反りを生じるようなこ
とがなくなり、製造上での歩留まりが高まる。なお、ワ
イヤボンディング６部へ透明樹脂７を付着する工程が必
要になるが、従来の樹脂モールドに比べてその作業は簡
単である。また、リフレクタ２の開孔２ｂ，２ｄの壁面
が乳白色であり、表面２ａが低明度に着色されているこ
とで、発光表示部とのコントラストが高まり、表示効果
が上がる。また、リフレクタ２は、それ自体の開孔２ｂ
で文字又は記号を点灯表示するため、光拡散用フィルム
テープ３に表示文字等を印刷したものを必要としない。Since the brightness is increased, the gap between the printed board 4 and the inner surface of the reflector 2 may be left as it is.
Therefore, there is no need to mold a resin into the gap as in the related art, so that warpage of the reflector 2 does not occur, and the production yield is increased. Although a step of attaching the transparent resin 7 to the wire bonding 6 is required, the operation is simpler than the conventional resin mold. In addition, since the walls of the openings 2b and 2d of the reflector 2 are milky white and the surface 2a is colored with low brightness, the contrast with the light emitting display unit is increased, and the display effect is improved. The reflector 2 has its own opening 2b.
, The characters or symbols are lit on and displayed, so that what is printed with the display characters and the like on the light diffusion film tape 3 is not required.
【００１５】なお、本発明は上記実施の形態の構成に限
られず種々の変形が可能である。例えば、上記実施形態
では、リフレクタ２の開孔はそれ自体で表示文字又は記
号を形成しているものを示したが、７セグメント表示を
除いて、開孔それ自体で表示文字等を形成することな
く、文字等を印刷した光拡散用フィルムを貼り付けても
よい。The present invention is not limited to the configuration of the above embodiment, and various modifications are possible. For example, in the above embodiment, the opening of the reflector 2 has been described as forming a display character or a symbol by itself. However, except for the 7-segment display, the opening itself forms a display character or the like. Instead, a light diffusion film on which characters or the like are printed may be attached.
【００１６】[0016]
【発明の効果】以上のように本発明の発光ダイオード表
示装置によれば、基板上に搭載された発光ダイオードの
ワイヤボンディング上に透明樹脂を付着させたので、こ
の透明樹脂のレンズ効果により、発光表示の輝度を上げ
ることができると同時に、組立て工程でのワイヤボンデ
ィングの断線を防止することができる。また、透明樹脂
が略半球状に形成されていることにより、透明樹脂のレ
ンズ効果が高まり、表示の輝度が高まる。また、輝度が
向上するために、樹脂モールドを施す必要がなくなり、
リフレクタに反りが発生するといったことが生じず、歩
留まりの向上、製造コストの削減が図れる。また、リフ
レクタの開孔それ自体で表示文字又は記号を形成するこ
とにより、表示文字等を印刷した光拡散用フィルムを必
要としなくなる。As described above, according to the light emitting diode display device of the present invention, since the transparent resin is adhered on the wire bonding of the light emitting diode mounted on the substrate, light is emitted by the lens effect of the transparent resin. The display brightness can be increased, and at the same time, disconnection of wire bonding in the assembly process can be prevented. Further, since the transparent resin is formed in a substantially hemispherical shape, the lens effect of the transparent resin is enhanced, and the display brightness is increased. Also, in order to improve brightness, it is not necessary to apply a resin mold,
Warpage does not occur in the reflector, so that the yield can be improved and the manufacturing cost can be reduced. Further, by forming the display characters or symbols by the opening of the reflector itself, the light diffusion film on which the display characters or the like are printed becomes unnecessary.
【図１】 本発明の一実施形態に係る発光ダイオード表
示装置におけるリフレクタの斜視図。FIG. 1 is a perspective view of a reflector in a light emitting diode display device according to an embodiment of the present invention.
【図２】 同表示装置におけるフィルムテープの正面
図。FIG. 2 is a front view of a film tape in the display device.
【図３】 同表示装置の組立て要領を示す側面図。FIG. 3 is a side view showing an assembling procedure of the display device.
【図４】 同表示装置におけるリフレクタの部分断面
図。FIG. 4 is a partial cross-sectional view of a reflector in the display device.
【図５】 従来の発光ダイオード表示装置におけるリフ
レクタの斜視図。FIG. 5 is a perspective view of a reflector in a conventional light emitting diode display device.
【図６】 従来の同表示装置におけるフィルムテープの
正面図。FIG. 6 is a front view of a film tape in the conventional display device.
【図７】 従来の同表示装置の組立て要領を示す側面
図。FIG. 7 is a side view showing how to assemble the conventional display device.
【図８】 従来の同表示装置におけるリフレクタの部分
断面図。FIG. 8 is a partial cross-sectional view of a reflector in the conventional display device.
１ 発光ダイオード表示装置 ２ リフレクタ ２ｂ，２ｄ 開孔 ３ フィルムテープ（非印刷の光拡散用フィルム） ４ プリント基板 ５ 発光ダイオード（ＬＥＤ） ６ ワイヤボンディング ７ シリコンボンド（透明樹脂） REFERENCE SIGNS LIST 1 light-emitting diode display device 2 reflector 2 b, 2 d aperture 3 film tape (non-printing light diffusion film) 4 printed circuit board 5 light-emitting diode (LED) 6 wire bonding 7 silicon bond (transparent resin)
Claims (4)
ディングにより結線された発光ダイオードを光源とし、
表示用のリフレクタに背面側から前記プリント基板を装
入してなる発光ダイオード表示装置において、 前記ワイヤボンディング上に透明樹脂を付着させ、この
透明樹脂が前記リフレクタに形成された表示用の開孔に
対向するように構成したことを特徴とする発光ダイオー
ド表示装置。1. A light emitting diode mounted on a printed circuit board and connected by wire bonding as a light source,
In a light emitting diode display device in which the printed circuit board is loaded into a display reflector from the back side, a transparent resin is adhered on the wire bonding, and the transparent resin is inserted into a display opening formed in the reflector. A light emitting diode display device characterized by being configured to face each other.
に略半球状に形成されていることを特徴とする請求項１
に記載の発光ダイオード表示装置。2. The method according to claim 1, wherein the transparent resin is formed in a substantially hemispherical shape so as to exhibit a lens effect.
A light-emitting diode display device according to item 1.
間は空隙とされていることを特徴とする請求項１又は請
求項２に記載の発光ダイオード表示装置。3. The light emitting diode display device according to claim 1, wherein a gap is provided between the printed board and the inner surface of the reflector.
文字又は記号を形成しており、該リフレクタの開孔表面
に非印刷の光拡散用フィルムを貼り付けたことを特徴と
する請求項１乃至請求項３のいずれかに記載の発光ダイ
オード表示装置。4. The reflector according to claim 1, wherein the aperture of the reflector forms a display character or a symbol by itself, and a non-printing light diffusion film is attached to the surface of the aperture of the reflector. The light-emitting diode display device according to claim 3.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP31814399A JP4341122B2 (en) | 1999-11-09 | 1999-11-09 | Light emitting diode display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP31814399A JP4341122B2 (en) | 1999-11-09 | 1999-11-09 | Light emitting diode display device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2001134220A true JP2001134220A (en) | 2001-05-18 |
| JP4341122B2 JP4341122B2 (en) | 2009-10-07 |
Family
ID=18095985
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP31814399A Expired - Fee Related JP4341122B2 (en) | 1999-11-09 | 1999-11-09 | Light emitting diode display device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4341122B2 (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007507115A (en) * | 2003-10-01 | 2007-03-22 | エナートロン， インコーポレイテッド | Method and apparatus for LED light engine |
| JP2007199588A (en) * | 2006-01-30 | 2007-08-09 | Sony Corp | Console panel device and display unit |
| KR100862472B1 (en) * | 2008-02-29 | 2008-10-08 | 삼성전기주식회사 | Light emitting diode module for backlight unit and backlight using the same |
| CN102637389A (en) * | 2012-03-30 | 2012-08-15 | 深圳市立翔慧科光电科技有限公司 | LED (Light Emitting Diode) combined screen latching mechanism, LED unit screen and LED combined screen |
| EP2648177A3 (en) * | 2012-04-02 | 2014-04-02 | MENTOR GmbH & Co. Präzisions-Bauteile KG | Display device |
| KR20160042415A (en) * | 2016-04-05 | 2016-04-19 | 서울반도체 주식회사 | Light emitting device using color lens |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007507115A (en) * | 2003-10-01 | 2007-03-22 | エナートロン， インコーポレイテッド | Method and apparatus for LED light engine |
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| CN102637389A (en) * | 2012-03-30 | 2012-08-15 | 深圳市立翔慧科光电科技有限公司 | LED (Light Emitting Diode) combined screen latching mechanism, LED unit screen and LED combined screen |
| EP2648177A3 (en) * | 2012-04-02 | 2014-04-02 | MENTOR GmbH & Co. Präzisions-Bauteile KG | Display device |
| KR20160042415A (en) * | 2016-04-05 | 2016-04-19 | 서울반도체 주식회사 | Light emitting device using color lens |
| KR101711643B1 (en) | 2016-04-05 | 2017-03-03 | 서울반도체 주식회사 | Light emitting device using color lens |
Also Published As
| Publication number | Publication date |
|---|---|
| JP4341122B2 (en) | 2009-10-07 |
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