JPH07283440A - Light emitting diode lamp and light emitting display using the same - Google Patents

Light emitting diode lamp and light emitting display using the same

Info

Publication number
JPH07283440A
JPH07283440A JP7693794A JP7693794A JPH07283440A JP H07283440 A JPH07283440 A JP H07283440A JP 7693794 A JP7693794 A JP 7693794A JP 7693794 A JP7693794 A JP 7693794A JP H07283440 A JPH07283440 A JP H07283440A
Authority
JP
Japan
Prior art keywords
light emitting
emitting diode
printed circuit
lamp
diode lamp
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7693794A
Other languages
Japanese (ja)
Inventor
Hiromoto Ishinaga
宏基 石長
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Priority to JP7693794A priority Critical patent/JPH07283440A/en
Publication of JPH07283440A publication Critical patent/JPH07283440A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/50Bond wires
    • H10W72/531Shapes of wire connectors
    • H10W72/536Shapes of wire connectors the connected ends being ball-shaped
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/50Bond wires
    • H10W72/531Shapes of wire connectors
    • H10W72/5363Shapes of wire connectors the connected ends being wedge-shaped
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • H10W90/701Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Led Device Packages (AREA)
  • Led Devices (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

(57)【要約】 (修正有) 【目的】均一な発光が可能で、充分な輝度が得られるL
EDランプ並びに発光表示器を提供する。 【構成】LED素子4および金属ワイヤ5を含むリード
端子2,3の先端部は透明または半透明の透光性樹脂、
例えばエポキシ樹脂で封止した状態で、モールド部6が
形成されている。モールド部6から突出する一組のリー
ド端子2,3は、LED素子4の発光の方向(矢印Bの
方向)に折り曲げられるとともに、その突出先端部はモ
ールド部6の発光面6aと略同一面の外方に向くよう折
り曲げられている。このLEDランプ1は、発光面6a
がプリント基板7の表面が対向するよう装着されるの
で、点灯させたときには反射光のみが外部の拡散放射さ
れるので均一な発光状態を得ることができる。
(57) [Summary] (Modified) [Purpose] L that can provide uniform brightness and sufficient brightness.
An ED lamp and a light emitting display are provided. [Structure] Lead terminals 2 and 3 including LED element 4 and metal wire 5 have transparent or semi-transparent translucent resin at their tips.
For example, the mold portion 6 is formed in a state of being sealed with an epoxy resin. The pair of lead terminals 2 and 3 protruding from the mold portion 6 are bent in the light emitting direction of the LED element 4 (the direction of arrow B), and the protruding tip portion thereof is substantially flush with the light emitting surface 6a of the mold portion 6. It is bent to face outward. This LED lamp 1 has a light emitting surface 6a.
Since the printed circuit boards 7 are mounted so that their surfaces are opposed to each other, only the reflected light is externally diffused and radiated when turned on, so that a uniform light emitting state can be obtained.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、発光ダイオード(以下
LED)ランプに関し、特に発光の均一化を図るための
構造に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a light emitting diode (hereinafter referred to as LED) lamp, and more particularly to a structure for achieving uniform light emission.

【0002】[0002]

【従来の技術】LEDは動作電圧が低く、応答速度が速
く、小型で、かつ動作寿命が長い等の利点があるので、
各種電気機器の表示ランプとして使用されている。特
に、近年では、電気機器の小型化の要求に応じるため表
面実装型のLEDランプが使用されている。図3に示す
ように、従来の表面実装型のLEDランプ21は、対向
する一組のリード端子22,23と、この一組のリード
端子22の一方の先端部に取り付けられた発光ダイオー
ド素子24と、この発光ダイオード素子24と他方のリ
ード端子23とを接続する金属ワイヤ25とを透明また
は半透明の樹脂で封止したモールド部26とから構成さ
れている。そして、モールド部26から突出するリード
端子22、23は、発光ダイオード素子24の発光方向
とは反対方向(矢印A方向)に折り曲げられ、さらにそ
の先端部は実装面と同一面となるよう外方に折り曲げら
れている。
2. Description of the Related Art LEDs have advantages such as low operating voltage, fast response speed, small size, and long operating life.
It is used as an indicator lamp for various electric devices. In particular, in recent years, surface mount LED lamps have been used to meet the demand for miniaturization of electric devices. As shown in FIG. 3, the conventional surface mount type LED lamp 21 has a pair of lead terminals 22 and 23 facing each other and a light emitting diode element 24 attached to one end of the pair of lead terminals 22. And a molded portion 26 in which the metal wire 25 connecting the light emitting diode element 24 and the other lead terminal 23 is sealed with a transparent or semitransparent resin. Then, the lead terminals 22 and 23 protruding from the mold portion 26 are bent in a direction opposite to the light emitting direction of the light emitting diode element 24 (direction of arrow A), and the tip end thereof is outwardly flush with the mounting surface. It is bent into.

【0003】このLEDランプ21を複数個用いた発光
表示器が、表示灯としてあるいは液晶表示装置のバック
ライトとして使用されている。図4はこの発光表示器を
示す概略図である。発光表示器は、プリント基板27の
表面に形成された配線パターン上の所定の位置にLED
ランプ21がリード端子22,23の突出先端部にて半
田等で固着される。そして、プリント基板27の縁周辺
には上面にLEDランプ21からの光を拡散させるため
の拡散シート29が備えられた反射枠28が設けられて
いる。
A light emitting display using a plurality of the LED lamps 21 is used as a display lamp or a backlight of a liquid crystal display device. FIG. 4 is a schematic view showing this light emitting display. The light emitting indicator is an LED at a predetermined position on the wiring pattern formed on the surface of the printed board 27.
The lamp 21 is fixed by soldering or the like at the protruding tip portions of the lead terminals 22 and 23. A reflective frame 28 having a diffusion sheet 29 for diffusing light from the LED lamp 21 is provided on the upper surface around the edge of the printed board 27.

【0004】[0004]

【発明が解決しようとする課題】上記構成を有する発光
表示器を点灯させた場合、LEDランプ21から放射さ
れる光の輝度が、発光源すなわちLEDランプ21の直
上方向が一番高く、その周辺方向に向かうにつれて低く
なる、いわゆる指向性の強い光が放射される。そのた
め、発光表示器全体の発光は不均一となり、輝度むらが
発生する。
When the light-emitting display having the above structure is turned on, the brightness of the light emitted from the LED lamp 21 is highest in the direction directly above the light-emitting source, that is, the LED lamp 21, and the periphery thereof. Light with so-called strong directivity is emitted, which becomes lower in the direction. Therefore, the light emission of the entire light emitting display becomes non-uniform, resulting in uneven brightness.

【0005】一方、この発光表示器において、LEDラ
ンプ21と拡散シート29の空間を拡散剤入りの透光性
樹脂を封入すれば均一な発光が可能と考えられるが、L
EDランプ21から拡散シート29までの間での光減衰
が増大するため、輝度が全体として著しく低下するとい
う問題が生じる。本発明はかかる問題点に鑑み、均一な
発光が可能で、充分な輝度が得られるLEDランプ並び
に発光表示器を提供することを目的としている。
On the other hand, in this light emitting display, if the space between the LED lamp 21 and the diffusion sheet 29 is filled with a translucent resin containing a diffusing agent, uniform light emission is possible.
Since the light attenuation between the ED lamp 21 and the diffusion sheet 29 increases, there arises a problem that the brightness as a whole is significantly reduced. The present invention has been made in view of the above problems, and an object thereof is to provide an LED lamp and a light emitting display which can emit light uniformly and have sufficient brightness.

【0006】[0006]

【課題を解決するための手段】本発明は、上記の目的を
達成するために次のような構成をとる。すなわち、請求
項1の発光ダイオードランプは、対向する少なくとも一
組のリード端子と、前記一組のリード端子の一方の先端
部に取り付けられた発光ダイオード素子と、前記発光ダ
イオード素子と他方のリード端子とを接続する金属ワイ
ヤと、発光ダイオード素子を含むリード端子先端部を透
光性樹脂で封止したモールド部から成る発光ダイオード
ランプにおいて、前記モールド部から突出する一組のリ
ード端子が前記発光ダイオード素子の発光方向に折り曲
げられるとともに、その先端部がモールド部の発光面と
略同一面となるように外方に折り曲げられたことを特徴
とするものである。
The present invention has the following constitution in order to achieve the above object. That is, the light emitting diode lamp according to claim 1 has at least one pair of lead terminals facing each other, a light emitting diode element attached to one end of one of the pair of lead terminals, the light emitting diode element and the other lead terminal. In a light-emitting diode lamp comprising a metal wire connecting with a lead wire and a lead terminal including a light-emitting diode element and a mold portion sealed with a translucent resin, a set of lead terminals protruding from the mold portion is the light-emitting diode. The device is characterized in that it is bent in the light emitting direction of the element and is bent outward so that its tip end is substantially flush with the light emitting surface of the mold part.

【0007】請求項2の発光表示器は、表面に配線パタ
ーンが形成されたプリント基板と、前記配線パターンの
所定の位置に固着された発光ダイオードランプと、前記
プリント基板の縁周辺に設けられた反射枠と、前記反射
枠の上面に取り付けられた拡散シートとを有する発光表
示器であって、前記発光ダイオードランプは請求項1記
載の発光ダイオードランプであることを特徴とするもの
である。
According to another aspect of the light emitting display of the present invention, a printed circuit board having a wiring pattern formed on a surface thereof, a light emitting diode lamp fixed to a predetermined position of the wiring pattern, and a periphery of the printed circuit board are provided. A light emitting display having a reflection frame and a diffusion sheet attached to an upper surface of the reflection frame, wherein the light emitting diode lamp is the light emitting diode lamp according to claim 1.

【0008】[0008]

【作用】このLEDランプを表面実装する場合、LED
ランプの発光面がプリント基板に対向するように表面実
装される。このLEDランプのリード端子に駆動電圧が
印加されると、リード端子に取り付けられたLED素子
が発光し、LEDランプの発光面を介して光がプリント
基板に向けて放射される。放射された光は、LEDラン
プの発光面と対向する位置にあるプリント基板の表面で
乱反射され、プリント基板の表面方向に均一に拡散放射
される。その結果、LEDランプから放射される光は、
その輝度が平均化された状態となり、輝度のバラツキの
ない均一な発光状態を得ることができる。
[Function] When this LED lamp is surface-mounted, the LED
The light emitting surface of the lamp is surface-mounted so as to face the printed circuit board. When a drive voltage is applied to the lead terminal of the LED lamp, the LED element attached to the lead terminal emits light, and the light is emitted toward the printed board through the light emitting surface of the LED lamp. The emitted light is diffusely reflected by the surface of the printed circuit board at a position facing the light emitting surface of the LED lamp, and is uniformly diffused and emitted in the surface direction of the printed circuit board. As a result, the light emitted from the LED lamp is
The luminance is in an averaged state, and a uniform light emitting state with no variation in luminance can be obtained.

【0009】[0009]

【実施例】以下、本発明の実施例を、図1、図2を参照
しつつ説明する。図1は、本発明によるLEDランプを
示しており、実装の際には、裏返した状態でプリント基
板上に装着される。このLEDランプ1は、少なくとも
一組のリード端子2,3を備えており、銅,鉄・ニッケ
ル合金,鉄・ニッケル・コバルト合金等の金属から形成
されている。一組のリード端子2,3うちの一方のリー
ド端子2の先端部にはGaP,GaAs,GaAlAs
等からなるLED素子4が取り付けられ、このLED素
子4の上面に形成された電極と他方のリード端子3とは
金属ワイヤ5により電気的に接続されている。LED素
子4および金属ワイヤ5を含むリード端子2,3の先端
部は透明または半透明の透光性樹脂、例えばエポキシ樹
脂で封止した状態で、モールド部6が形成されている。
モールド部6から突出する一組のリード端子2,3は、
LED素子4の発光の方向(矢印Bの方向)に折り曲げ
られるとともに、その突出先端部はモールド部6の発光
面6aと略同一面の外方に向くよう折り曲げられてい
る。
Embodiments of the present invention will be described below with reference to FIGS. FIG. 1 shows an LED lamp according to the present invention, which is mounted upside down on a printed circuit board when mounted. This LED lamp 1 is provided with at least one set of lead terminals 2 and 3, and is made of a metal such as copper, iron / nickel alloy, iron / nickel / cobalt alloy. GaP, GaAs, GaAlAs is attached to the tip of one lead terminal 2 of the pair of lead terminals 2 and 3.
The LED element 4 composed of the like is attached, and the electrode formed on the upper surface of the LED element 4 and the other lead terminal 3 are electrically connected by the metal wire 5. A mold portion 6 is formed in a state in which the tip portions of the lead terminals 2 and 3 including the LED element 4 and the metal wire 5 are sealed with a transparent or semitransparent translucent resin such as an epoxy resin.
The set of lead terminals 2 and 3 protruding from the mold portion 6 are
The LED element 4 is bent in the light emitting direction (the direction of arrow B), and the protruding tip portion is bent so as to face outward on the substantially same surface as the light emitting surface 6a of the mold portion 6.

【0010】上記のような構成のLEDランプ1は、使
用時には発光面6aがプリント基板の表面と対向するよ
うに表面実装される。そして、LEDランプ1の点灯
は、リード端子2,3間へ駆動電圧を印加することによ
り行われる。なお、本実施例では、2本のリード端子を
有するLEDランプを例に採って説明したが、例えば複
数色を発光できる2本以上のリード端子を有する表面実
装型のLEDランプにも適用することができる。
The LED lamp 1 having the above structure is surface-mounted so that the light emitting surface 6a faces the surface of the printed circuit board when in use. The LED lamp 1 is turned on by applying a drive voltage between the lead terminals 2 and 3. In the present embodiment, the LED lamp having two lead terminals has been described as an example. However, the present invention is also applicable to a surface mount LED lamp having two or more lead terminals capable of emitting a plurality of colors. You can

【0011】図2(a)は、本発明のLEDランプ1を
プリント基板7上に装着した他の実施例を示し、LED
ランプ1を複数個用いた発光表示器を示す分解斜視図で
ある。この発光表示器は、表面に配線パターンが形成さ
れたプリント基板7と、この配線パターン上の所定の位
置に半田等でそれぞれ固着された複数のLEDランプ1
と、プリント基板7の縁周辺に設けられた反射効率の高
い樹脂性の反射枠8と、この反射枠の上面に取り付けら
れたLEDランプ1からの光を拡散させるための拡散シ
ート9と、から構成されている。
FIG. 2 (a) shows another embodiment in which the LED lamp 1 of the present invention is mounted on a printed circuit board 7.
3 is an exploded perspective view showing a light emitting display using a plurality of lamps 1. FIG. This light emitting display includes a printed circuit board 7 having a wiring pattern formed on the surface thereof, and a plurality of LED lamps 1 each fixed to a predetermined position on the wiring pattern with solder or the like.
And a resin-made reflective frame 8 having a high reflection efficiency provided around the edge of the printed circuit board 7, and a diffusion sheet 9 mounted on the upper surface of the reflective frame for diffusing light from the LED lamp 1. It is configured.

【0012】そして、プリント基板7に駆動電圧が印加
されると、各LEDランプ1の発光面を介して光が放射
されるが、まずその光はプリント基板の表面で乱反射さ
れるとともに、一部は反射枠8で反射されて、側方に漏
れることなくプリント基板の表面方向(矢印Cの方向)
に平均化された状態で拡散放射される。その結果、発光
表示器全体の発光は輝度のばらつきのない状態となる
(図2(b))。
When a drive voltage is applied to the printed circuit board 7, light is emitted through the light emitting surface of each LED lamp 1. First, the light is diffusely reflected on the surface of the printed circuit board and partly. Is reflected by the reflection frame 8 and does not leak to the side surface direction of the printed circuit board (direction of arrow C)
It is diffused and emitted in an averaged state. As a result, the light emission of the entire light emitting display is in a state where there is no variation in brightness (FIG. 2B).

【0013】ここで、用いられるプリント基板7は、通
常のガラスエポキシ樹脂系基板であっても、セラミック
の基板でも良いが、反射効率の観点から言えば白色系樹
脂(例えば、BT(ヒ゛スマレイミト゛ トリアシ゛ン)レジン)を材質
とするプリント基板を用いることが好ましい。また、比
較的光を透過しやすいガラスエポキシ樹脂系基板であっ
ても、LEDランプ1の発光面と対向する位置にあるプ
リント基板7の表面に白色系の光反射塗料10(斜線部
分)を塗布することにより、反射効率の向上を図ること
ができる。
The printed circuit board 7 used here may be either a normal glass epoxy resin type substrate or a ceramic substrate, but from the viewpoint of reflection efficiency, a white type resin (eg BT (Vesemaleimide Triazine) is used. It is preferable to use a printed circuit board made of resin). In addition, even if the glass epoxy resin-based substrate relatively easily transmits light, a white light-reflecting paint 10 (hatched portion) is applied to the surface of the printed board 7 at a position facing the light emitting surface of the LED lamp 1. By doing so, the reflection efficiency can be improved.

【0014】さらに、プリント基板7の表面に凹凸をつ
けることにより、乱反射が起こり易くなり、より平均化
された状態で拡散放射させることができる。次に、反射
枠8は、プリント基板7の縁周辺に設けられており、反
射効率の高い、例えば、PBT樹脂によって形成されて
おり、プリント基板7で反射された光を側方向に漏らす
ことなく、プリント基板の表面方向に反射させている。
Further, by providing unevenness on the surface of the printed circuit board 7, diffuse reflection is likely to occur and diffused radiation can be performed in a more averaged state. Next, the reflection frame 8 is provided around the edge of the printed board 7 and is made of, for example, PBT resin having high reflection efficiency, and does not leak the light reflected by the printed board 7 in the lateral direction. , Is reflected in the surface direction of the printed circuit board.

【0015】さらに、反射枠8の上面に取り付けられた
拡散シート9は、表面処理がなされた、例えば、ポリエ
ステルの製のシートで、プリント基板7や反射枠8で反
射された光をプリント基板の表面方向へ均一に拡散させ
ている。
Further, the diffusion sheet 9 attached to the upper surface of the reflective frame 8 is a surface-treated sheet made of, for example, polyester, and the light reflected by the printed circuit board 7 and the reflective frame 8 is applied to the printed circuit board. It is uniformly diffused in the surface direction.

【0016】[0016]

【発明の効果】以上説明したように、本発明によるLE
Dランプによれば、LEDランプの発光面とプリント基
板が対向するように表面実装されるので、駆動電圧を印
加しLED素子を発光させた場合、その光はプリント基
板で乱反射した光のみがプリント基板の表面方向に拡散
放射されるので輝度のばらつきの少ない均一な発光状態
を得ることができる。
As described above, the LE according to the present invention is used.
According to the D lamp, since the light emitting surface of the LED lamp and the printed circuit board are surface-mounted so that when a driving voltage is applied to cause the LED element to emit light, only the light diffusely reflected by the printed circuit board is printed. Since it is diffused and radiated in the surface direction of the substrate, it is possible to obtain a uniform light emitting state with little variation in brightness.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明のLEDランプの実施例を示す斜視図。FIG. 1 is a perspective view showing an embodiment of an LED lamp of the present invention.

【図2】本発明の発光表示器を分解斜視図(A)及び概
略図(B)
FIG. 2 is an exploded perspective view (A) and a schematic view (B) of the light emitting display device of the present invention.

【図3】従来のLEDランプを示す斜視図。FIG. 3 is a perspective view showing a conventional LED lamp.

【図4】従来の発光表示器を示す概略図。FIG. 4 is a schematic view showing a conventional light emitting display.

【符号の説明】[Explanation of symbols]

1 LEDランプ 2,3 リード端子 4 LED素子 5 金属ワイヤ 6 モールド部 6a 発光面 7 プリント基板 8 反射枠 9 拡散シート 10 反射塗料 1 LED Lamp 2, 3 Lead Terminal 4 LED Element 5 Metal Wire 6 Molded Part 6a Light Emitting Surface 7 Printed Circuit Board 8 Reflective Frame 9 Diffusion Sheet 10 Reflective Paint

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 対向する一組のリード端子と、前記一組
のリード端子の一方の先端部に取り付けられた発光ダイ
オード素子と、前記発光ダイオード素子と他方のリード
端子とを接続する金属ワイヤと、発光ダイオード素子を
含むリード端子先端部を透光性樹脂で封止したモールド
部から成る発光ダイオードランプにおいて、前記モール
ド部から突出する前記一組のリード端子が前記発光ダイ
オード素子の発光方向に折り曲げられるとともに、その
先端部がモールド部の発光面と略同一面となるように外
方に折り曲げられたことを特徴とする発光ダイオードラ
ンプ。
1. A pair of lead terminals facing each other, a light emitting diode element attached to one end of the pair of lead terminals, and a metal wire connecting the light emitting diode element and the other lead terminal. A light emitting diode lamp comprising a mold portion in which a tip portion of a lead terminal including the light emitting diode element is sealed with a translucent resin, wherein the set of lead terminals protruding from the mold portion are bent in a light emitting direction of the light emitting diode element. The light emitting diode lamp is characterized in that it is bent outward so that its tip end is substantially flush with the light emitting surface of the mold part.
【請求項2】 表面に配線パターンが形成されたプリン
ト基板と、前記配線パターンの所定の位置に固着された
発光ダイオードランプと、前記プリント基板の縁周辺に
設けられた反射枠と、前記反射枠の上面に取り付けられ
た拡散シートとを有する発光表示器であって、前記発光
ダイオードランプは請求項1記載の発光ダイオードラン
プであることを特徴とする発光表示器。
2. A printed circuit board having a wiring pattern formed on a surface thereof, a light emitting diode lamp fixed to a predetermined position of the wiring pattern, a reflective frame provided around an edge of the printed circuit board, and the reflective frame. A light emitting display having a diffusion sheet attached to the upper surface of the light emitting diode lamp, wherein the light emitting diode lamp is the light emitting diode lamp according to claim 1.
JP7693794A 1994-04-15 1994-04-15 Light emitting diode lamp and light emitting display using the same Pending JPH07283440A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7693794A JPH07283440A (en) 1994-04-15 1994-04-15 Light emitting diode lamp and light emitting display using the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7693794A JPH07283440A (en) 1994-04-15 1994-04-15 Light emitting diode lamp and light emitting display using the same

Publications (1)

Publication Number Publication Date
JPH07283440A true JPH07283440A (en) 1995-10-27

Family

ID=13619654

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7693794A Pending JPH07283440A (en) 1994-04-15 1994-04-15 Light emitting diode lamp and light emitting display using the same

Country Status (1)

Country Link
JP (1) JPH07283440A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11249599A (en) * 1998-02-26 1999-09-17 Denso:Kk Light emitting display
JP2007194401A (en) * 2006-01-19 2007-08-02 Showa Denko Kk LED package using compound semiconductor light emitting device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11249599A (en) * 1998-02-26 1999-09-17 Denso:Kk Light emitting display
JP2007194401A (en) * 2006-01-19 2007-08-02 Showa Denko Kk LED package using compound semiconductor light emitting device

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