JPS6484291A - Display device - Google Patents

Display device

Info

Publication number
JPS6484291A
JPS6484291A JP24295387A JP24295387A JPS6484291A JP S6484291 A JPS6484291 A JP S6484291A JP 24295387 A JP24295387 A JP 24295387A JP 24295387 A JP24295387 A JP 24295387A JP S6484291 A JPS6484291 A JP S6484291A
Authority
JP
Japan
Prior art keywords
resin
light emitting
emitting elements
wires
soft resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP24295387A
Other languages
Japanese (ja)
Inventor
Masaru Jinno
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Priority to JP24295387A priority Critical patent/JPS6484291A/en
Publication of JPS6484291A publication Critical patent/JPS6484291A/en
Pending legal-status Critical Current

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  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

PURPOSE: To improve workability at the time of production and to prevent the failure of light emitting elements, etc., by packing a translucent resin into optical guide lines by injection molding or transfer molding, adhering a soft resin to the light emitting elements and wires and bringing the soft resin into tight contact with the translucent resin. CONSTITUTION: The translucent resin 6 is packed into the optical guide lines 5 by injection molding or transfer molding. The soft resin 11 is adhered to the light emitting elements 8 are the wires 9 to bring the soft resin 11 into contact with the translucent resin 6. Namely, the injection molding or transfer molding is used at the time of packing the translucent resin 6 into the optical guide lines 5 of the case 2, by which the intrusion of air bubbles into the translucent resin is averted. Then, the need for the deformation work during the production stage is eliminated and the workability is improved. The light emitting elements 8 (and the wires 9) are sealed to the other ends of the optical guide lines 5 by the soft resin 11, by which the danger of the failure of the light emitting elements 8 and the wires 9 by application of a stress thereon at the time of the solidification of the soft resin 11 is lessened.
JP24295387A 1987-09-28 1987-09-28 Display device Pending JPS6484291A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP24295387A JPS6484291A (en) 1987-09-28 1987-09-28 Display device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP24295387A JPS6484291A (en) 1987-09-28 1987-09-28 Display device

Publications (1)

Publication Number Publication Date
JPS6484291A true JPS6484291A (en) 1989-03-29

Family

ID=17096682

Family Applications (1)

Application Number Title Priority Date Filing Date
JP24295387A Pending JPS6484291A (en) 1987-09-28 1987-09-28 Display device

Country Status (1)

Country Link
JP (1) JPS6484291A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001134220A (en) * 1999-11-09 2001-05-18 Funai Electric Co Ltd Light emitting diode display device
WO2008032676A1 (en) * 2006-09-11 2008-03-20 Sharp Kabushiki Kaisha Light emitting module
US8384669B2 (en) 2007-11-21 2013-02-26 Fujitsu Component Limited Information processing apparatus, remote system, and computer readable medium

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5853424A (en) * 1981-09-24 1983-03-30 Yoshida Kogyo Kk <Ykk> Method and apparatus for preparation thick resin molded item
JPS5926609U (en) * 1982-08-12 1984-02-18 長田電機工業株式会社 dental treatment instruments

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5853424A (en) * 1981-09-24 1983-03-30 Yoshida Kogyo Kk <Ykk> Method and apparatus for preparation thick resin molded item
JPS5926609U (en) * 1982-08-12 1984-02-18 長田電機工業株式会社 dental treatment instruments

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001134220A (en) * 1999-11-09 2001-05-18 Funai Electric Co Ltd Light emitting diode display device
WO2008032676A1 (en) * 2006-09-11 2008-03-20 Sharp Kabushiki Kaisha Light emitting module
US8384669B2 (en) 2007-11-21 2013-02-26 Fujitsu Component Limited Information processing apparatus, remote system, and computer readable medium

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