JP3100687U - High brightness light emitting diode - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a high brightness light emitting diode having a particularly excellent heat dissipating effect.
SOLUTION: The support frame 10 includes a light emitting element 17 and a resin body 19, the support frame 10 includes a first lead frame 11 and a second lead frame 14, and the first lead frame 11 and the second lead frame 14 The sealing portion 12 of the first lead frame 11 is a mounting portion 121, which is composed of sealing portions 12 and 15 and exposed portions 13 and 16 that are covered by the resin body 19. The exposed portion 13 is provided with a large-area neck portion 131 extending downward from the mounting portion 121 and a pin-shaped lead portion 133, and the sealing portion 15 of the second lead frame 14 is provided. Has a rectangular shape, a wire 18 connected to the light emitting element 17 is adhered to the upper surface thereof, and a large area neck portion 16 extending downward from the sealing portion 15 to the exposed portion 16. 1 and a pin-shaped lead portion 163 are provided.
[Selection diagram] Fig. 1

Description

  The present invention relates to a high brightness light emitting diode having a particularly excellent heat dissipation effect.

  In recent years, multicolored light emitting diodes have been mostly developed and used for various types. However, the light-emitting element incorporated in the light-emitting diode requires not only saturation but also high luminance, so an excellent light source is required. Further, in order to increase the luminance of the light-emitting diode, the light-emitting capability of the light-emitting element itself is required. Besides, the sealed structure of the light emitting diode is also an important key.

  As shown in FIG. 6, in a general pin type light emitting diode, a light emitting element (51) is bonded onto a lead frame (501) of a support frame (50), and further connected to the lead frame (502) by bonding. After that, the light emitting element (51) and a part of the support frame (50) are sealed with the transparent or translucent resin body (52), and the light emitting element (51) therein is placed in the resin body (52). Since the structure is completely sealed, heat generated from the light emitting element (51) is radiated to the outside from the support frame (50). Therefore, since such a casting type light emitting diode is usually used on a circuit with a low current, the brightness of the light emitting diode cannot be increased to an ideal level.

  Also, as shown in FIG. 7, another pin type light emitting diode different from the above is superior in brightness as compared with the light emitting diode shown in FIG. 6, but the reason is that the heat dissipation effect of the light emitting diode is higher. That's why. That is, since the support frame (60) of the light emitting diode has four leads (61 to 64), it has a larger heat dissipation area than the support frame (50) of the light emitting diode of FIG. The distance between the resin body (66) of the light emitting diode and the periphery of the lead portion (61-64) in the support frame (60) is very short. Thus, when the light emitting element (65) is operated, heat can be smoothly radiated from the support frame (60) to the outside, so that high luminance can be achieved by using a high current light emitting element. .

  However, the pin type light emitting diode has a configuration in which the number of leads is increased by two, a total of four leads are used, and they are soldered on a circuit board. A large space is required, which leads to an increase in cost.

  Recently, in order to satisfy the requirements of the SMT (Surface Mount Technology) method, an adhesive mounting method has been adopted on the surface of the electronic element, and a surface mount type light emitting diode capable of high brightness has been developed.

  As shown in FIG. 8, the surface mount type light emitting diode is similar to the general pin type light emitting diode, but the support frame (70) has six leads (71 to 76). And three of the leads (71 to 73) receive the same potential signal, and the other three leads (74 to 76) receive the other potential signal. Each set of the one-legged lead portions (71, 74), the two-legged lead portions (72, 73), and the lead portions (75, 76) is integrally formed in an L-shape. As can be seen from the above description, since the number of leads is also large in this surface mount type light emitting diode, as in the case of the pin type light emitting diode shown in FIG. 7, a large space for providing a larger circuit board is required. Required.

The present invention
A lead frame (10), at least one light emitting element (17) and a resin body (19),
The lead frame (10) includes first sealing portions (12, 15) covered by a resin body (19) and exposed portions (13, 16) exposed from the resin body (19). 11) and a second lead frame (14),
In the first lead frame (11), the sealing portion (12) serves as a mounting portion (121) for mounting and electrically connecting the light emitting element (17), and the exposed portion (13) serves as the mounting portion (121). ), A large-area neck portion (131) and a lead portion (133) extending downward.
In the second lead frame (14), the sealing portion (15) has a rectangular shape, and a wire (18) for bonding the light emitting element (17) is connected to the upper surface thereof, and the exposed portion (16) is Provided is a high-luminance light-emitting diode comprising a large-area neck portion (161) and a lead portion (163) extending downward from a sealing portion (15).

The present invention is divided into a sealing portion and an exposed portion, the sealing portion is a mounting portion having a large area, a first lead frame provided with a convex piece extending outward to the exposed portion, the sealing portion and A support frame composed of a second lead frame divided into exposed parts and provided with a convex piece extending outward on the exposed part,
A light emitting element adhered to the upper surface of the sealing portion of the first lead frame in the support frame and connected to the upper surface of the sealing portion in the second lead frame by bonding,
A sealing portion of the first lead frame and the second lead frame in the support frame, and a resin body for sealing the light emitting element and the wire,
Since the projections are provided on the outer sides of the exposed portions of the first lead frame and the second lead frame in the support frame, the heat dissipating area of the support frame can be effectively enlarged. Heat generated at the time can be quickly dissipated. Thus, the present invention makes it possible to use a light-emitting element that can handle a high current, so that a low-cost, simple-structure, high-brightness pin-type light-emitting diode can be realized.

  Further, since the light emitting diode of the present invention has a groove in the exposed portion, the contact area with the air is increased and the convection of the air is increased, so that the heat dissipation effect is improved.

  Further, in the present invention, the exposed portions of the first lead frame and the second lead frame in the support frame are further extended downward and bent to form an L-shaped lead portion, whereby a surface-mounted light emitting diode can be obtained. .

  Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

  FIG. 1 is a perspective view of a high brightness light emitting diode according to the present invention, FIG. 2 is a side view of FIG. 1, and FIG. 3 is a side view showing a second embodiment of the high brightness light emitting diode according to the present invention. FIG. 4 is a perspective view showing a third embodiment of the high brightness light emitting diode according to the present invention, and FIG. 5 is a side view of FIG.

  As shown in FIG. 1, the high brightness light emitting diode of the present invention has a support frame (10) including at least one light emitting element (17) and a resin body (19), and the support frame (10) is a first lead. The first lead frame (11) and the second lead frame (14) include a frame (11) and a second lead frame (14). It is composed of exposed portions (13, 16) that are not covered by the resin body (19).

  The sealing portion (12) of the first lead frame (11) is a mounting portion (121), and a light emitting element (17) is adhered to an upper surface of the mounting portion (121) to be electrically connected. The exposed portion (13) is provided with a large-area neck portion (131) extending downward from the mounting portion (121) and a pin-shaped lead portion (133), and the convex portion extending horizontally outward to the neck portion (131). A piece (132) is provided.

  The sealing portion (15) of the second lead frame (14) has a rectangular shape, and a wire (18) connected to the light emitting element (17) is adhered to the upper surface thereof, and is attached to the exposed portion (16). A large-area neck portion (161) extending downward from the sealing portion (15) and a pin-shaped lead portion (163) are provided, and a convex piece (162) extending horizontally outward is provided on the neck portion (161). Can be

  The length of the projections (132, 162) is set according to the magnitude of the current of the light emitting element (17). That is, if the current is large, the protruding pieces (132, 162) may be lengthened by that amount to increase the contact area with air.

  As shown in FIG. 2, after the light emitting element (17) bonded to the upper surface of the mounting portion (121) is connected to the second lead frame (14) by the wire (18), a transparent or translucent resin is formed. The sealing portions (12, 15) of the first and second lead frames (11, 14), the light emitting element (17), and the wires (18) are sealed by the body (19), and the first and second lead frames (11, 14) are sealed. The neck portions (131, 161) and the lead portions (133, 163) of the (11, 14) are exposed to the outside of the resin body (19).

  As shown in FIG. 3, the light emitting diode according to the second embodiment of the present invention is similar to that shown in FIG. 2, except that at least one light emitting diode is provided on the surface of the neck portion (131) of the first lead frame (11). Unlike the groove (134), the groove (134) increases the area of contact with air and the convection of air in the neck (131), thereby increasing the heat dissipation effect.

  As shown in FIG. 4 and FIG. 5, the light emitting diode according to the third embodiment of the present invention is a surface mount type light emitting diode, and the supporting frame (20), the light emitting device (27) and the resin are similar to the above embodiment. The exposed portions (23, 26) of the first and second lead frames (21, 24) of the support frame (20) are spot-welded to a circuit board (not shown). The L-shaped neck portions (231, 261) are provided with convex pieces (232, 262) extending outward at the vertical portions thereof, and have grooves (not shown) on the surface. It is formed.

FIG. 3 is a perspective view of the high brightness light emitting diode according to the present invention. FIG. 2 is a side view of FIG. 1. FIG. 4 is a side view showing a second embodiment of the high brightness light emitting diode according to the present invention. FIG. 4 is a perspective view showing a third embodiment of the high brightness light emitting diode according to the present invention. FIG. 5 is a side view of FIG. 4. It is a perspective view of the conventional light emitting diode. It is a perspective view of the conventional pin type light emitting diode. It is a perspective view of the conventional surface mount type light emitting diode.

Explanation of reference numerals

Reference Signs List 10 support frame 11 first lead frame 12 sealing portion 121 mounting portion 13 exposed portion 131 neck portion 132 convex piece 133 lead portion 134 groove portion 14 second lead frame 15 sealing portion 16 exposed portion 161 neck portion 162 convex piece 163 lead Part 17 light emitting element 18 wire 19 resin body 20 support frame 21 first lead frame 22 sealing part 221 mounting part 23 exposed part 231 L-shaped neck part 232 convex piece 24 second lead frame 25 sealing part 26 exposed part 261 L Shaped neck part 262 Convex piece 27 Light emitting element 28 Wire 29 Resin body 50 Support frame 501, 502 Lead frame 51 Light emitting element 52 Resin body 60 Support frame 61 to 64 Lead part 65 Light emitting element 66 Resin body 70 Support frame 71 to 76 Lead part 77 Light emitting element 78 Resin body

Claims (3)

A lead frame, at least one light emitting element and a resin body,
The lead frame includes a first lead frame and a second lead frame each including a sealing portion covered with a resin body and an exposed portion exposed from the resin body,
In the first lead frame, the sealing portion is a mounting portion for mounting and electrically connecting the light emitting element, and the exposed portion includes a large-area neck portion and a lead portion extending downward from the mounting portion,
In the second lead frame, the sealing portion has a rectangular shape, and a wire for bonding a light emitting element is connected to an upper surface thereof, and the exposed portion has a large-area neck portion and a lead portion extending downward from the sealing portion. A high-brightness light-emitting diode comprising:   The high brightness light emitting diode according to claim 1, wherein the neck of the first lead frame and the neck of the second lead frame are L-shaped necks each having a large area. The first lead frame and the neck portion of the exposed portion of the second lead frame are provided with convex pieces extending horizontally outward, respectively.
3. The high brightness light emitting diode according to claim 1, wherein at least one groove is formed on a surface of a neck of the first lead frame.

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