JP2001127322A - Lead wire soldering apparatus for solar cell - Google Patents
Lead wire soldering apparatus for solar cellInfo
- Publication number
- JP2001127322A JP2001127322A JP30553399A JP30553399A JP2001127322A JP 2001127322 A JP2001127322 A JP 2001127322A JP 30553399 A JP30553399 A JP 30553399A JP 30553399 A JP30553399 A JP 30553399A JP 2001127322 A JP2001127322 A JP 2001127322A
- Authority
- JP
- Japan
- Prior art keywords
- lead wire
- solar cell
- soldering
- lead
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 title claims abstract description 153
- 238000005476 soldering Methods 0.000 title claims abstract description 54
- 229910000679 solder Inorganic materials 0.000 claims abstract description 64
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims abstract description 30
- 229910052742 iron Inorganic materials 0.000 claims abstract description 15
- 239000000463 material Substances 0.000 claims abstract description 4
- 238000003825 pressing Methods 0.000 claims description 11
- 238000006243 chemical reaction Methods 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 6
- 238000000576 coating method Methods 0.000 description 6
- 239000004677 Nylon Substances 0.000 description 5
- 239000004809 Teflon Substances 0.000 description 5
- 229920006362 Teflon® Polymers 0.000 description 5
- 229920001778 nylon Polymers 0.000 description 5
- 239000000758 substrate Substances 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 3
- 230000008602 contraction Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- NJFMNPFATSYWHB-UHFFFAOYSA-N ac1l9hgr Chemical compound [Fe].[Fe] NJFMNPFATSYWHB-UHFFFAOYSA-N 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 235000000396 iron Nutrition 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 230000037303 wrinkles Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/05—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1876—Particular processes or apparatus for batch treatment of the devices
- H01L31/188—Apparatus specially adapted for automatic interconnection of solar cells in a module
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Sustainable Development (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Sustainable Energy (AREA)
- Manufacturing & Machinery (AREA)
- Photovoltaic Devices (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】この発明は、太陽電池パネル
の正負の電極にリード線を接続して出力を取出すための
太陽電池用リード線半田付け装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a lead wire soldering device for a solar cell for connecting a lead wire to positive and negative electrodes of a solar cell panel to obtain an output.
【０００２】[0002]
【従来の技術】太陽エネルギーを直接電気エネルギーに
変換する太陽電池モジュールは、ガラス基板等の絶縁基
板上に、透明電極層、半導体光電変換層及び裏面電極層
が順次形成された積層体を備えている。この積層体は、
レーザスクライブ等によって複数の光電変換セルに分離
されるとともに、各光電変換セルは電気的に直列または
並列に接続されている。2. Description of the Related Art A solar cell module for directly converting solar energy into electric energy includes a laminate in which a transparent electrode layer, a semiconductor photoelectric conversion layer, and a back electrode layer are sequentially formed on an insulating substrate such as a glass substrate. I have. This laminate is
The cells are separated into a plurality of photoelectric conversion cells by a laser scribe or the like, and the respective photoelectric conversion cells are electrically connected in series or in parallel.
【０００３】また、例えば，特開平９‐３２６４９７号
公報、特開平９‐１３５０３５号公報及び特開平９‐８
３００１号公報等に示すように，太陽電池モジュールの
両端にはリード線取付け領域が設けられ、このリード線
取付け領域には正負の電極として半田バンプが形成さ
れ、この半田バンプにリード線を接続することにより、
太陽電池モジュールの出力を取出すようにしている。そ
して、リード線は太陽電池モジュールの裏面に取付けら
れる端子ボックスに接続される。Further, for example, Japanese Patent Application Laid-Open Nos. 9-326497, 9-135035 and 9-8
As shown in Japanese Patent Application Laid-Open No. 3001 and the like, lead wire attachment regions are provided at both ends of the solar cell module, and solder bumps are formed as positive and negative electrodes in the lead wire attachment regions, and lead wires are connected to the solder bumps. By doing
The output of the solar cell module is taken out. Then, the lead wire is connected to a terminal box attached to the back surface of the solar cell module.
【０００４】また、リード線取付け領域に半田バンプを
形成する超音波半田付け装置としては，例えば、特許第
２６９１６８５号公報、特開平９−２９５１３３号公報
で知られており、半田こてに超音波振動を付与して効率
的に、しかも確実に半田付けされるように構成されてい
る。As an ultrasonic soldering apparatus for forming a solder bump in a lead wire mounting area, for example, Japanese Patent Application Laid-Open No. 2691685 and Japanese Patent Application Laid-Open No. 9-295133 disclose an ultrasonic soldering apparatus. The vibration is applied so that the solder is efficiently and reliably soldered.
【０００５】これらは、太陽電池モジュールの両端のリ
ード線取付け領域に、超音波半田付け法によってスポッ
ト径が２ｍｍ程度の半田バンプを２０ｍｍ間隔程度で、
列状に形成したのち、前記半田バンプの列上に半田メッ
キされた銅箔等のリード線を沿わせ、リード線の上方か
ら半田こてによって半田バンプに対してリード線を加熱
しながら押圧して半田付けしている。In these methods, solder bumps having a spot diameter of about 2 mm are provided at intervals of about 20 mm in the lead wire attachment areas at both ends of the solar cell module by ultrasonic soldering.
After being formed in a row, a lead wire such as a copper foil plated with solder is placed on the row of the solder bumps, and the lead wire is pressed against the solder bump by heating with a soldering iron from above the lead wire. Soldered.
【０００６】ところで、従来、太陽電池モジュールの両
端のリード線取付け領域にリード線を取付けるには，リ
ード線取付け領域に予備半田として半田バンプを形成し
たのち、この半田バンプの列上に半田メッキされた銅箔
等のリード線を沿わせ、リード線を半田バンプに対して
半田付けする作業は手作業によって行われている。Conventionally, in order to attach a lead wire to a lead wire attaching region at both ends of a solar cell module, a solder bump is formed as a preliminary solder in the lead wire attaching region, and then solder plating is performed on a row of the solder bumps. The work of soldering the lead wires to the solder bumps along the lead wires made of copper foil or the like is performed manually.
【０００７】すなわち、半田バンプの列上にリード線を
沿わせ、リード線の上面から半田こてを押し当てて半田
付けする際に、リード線がずれたり、皺が発生すること
がある。そこで、リード線の端部に重りを吊り下げ、リ
ード線にテンションを付与しながら半田付けを行ってい
る。[0007] That is, when a lead wire is placed on a row of solder bumps and a soldering iron is pressed against the upper surface of the lead wire to perform soldering, the lead wire may be displaced or wrinkled. Therefore, a weight is suspended from the end of the lead wire, and soldering is performed while applying tension to the lead wire.
【０００８】[0008]
【発明が解決しようとする課題】しかしながら、半田バ
ンプに対してリード線を手作業によって半田付けする作
業は非能率的であり、大量生産には多くの工数を要し、
コストアップの原因となる。また、リード線に重りによ
ってテンションを付与して半田付けを行うと、半田付け
された半田バンプ相互間のリード線が張設された状態と
なり、太陽電池モジュールを建造物の屋根等に設置した
とき、リード線の熱収縮によってリード線が半田バンプ
から外れたり破損する虞がある。However, the work of manually soldering the lead wires to the solder bumps is inefficient, and mass production requires many man-hours.
It causes cost increase. Also, when soldering is performed by applying tension to the lead wires by weight, the lead wires between the soldered solder bumps are stretched, and when the solar cell module is installed on the roof of a building or the like. In addition, there is a possibility that the lead wire may come off from the solder bump or be damaged due to thermal contraction of the lead wire.
【０００９】また，リード線を半田バンプの列上に連続
的に供給して自動半田付け装置によって自動的に半田付
けすることが試みられているが，リード線は，前述した
ように，半田メッキされた銅箔等で形成されているた
め，リード線を案内する案内面との摩擦によって半田が
案内面に付着して詰まったり，リード線に皺が発生した
り，破断することがあり，リード線を円滑に供給できな
いという問題がある。Also, attempts have been made to automatically supply a lead wire to a row of solder bumps and to automatically perform soldering by an automatic soldering apparatus. Because of the friction with the guide surface that guides the lead wire, the solder may adhere to the guide surface and become clogged, wrinkles may occur on the lead wire, or the lead wire may break. There is a problem that wires cannot be supplied smoothly.
【００１０】この発明は，前記事情に着目してなされた
もので，その目的とするところは，太陽電池のリード線
取付け領域に対してリード線を円滑に供給でき，半田バ
ンプに対するリード線の接続が自動的に行え、作業能率
の向上を図ることができる太陽電池用リード線半田付け
装置を提供することにある。SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and has as its object to supply a lead wire smoothly to a lead wire mounting region of a solar cell and to connect the lead wire to a solder bump. It is an object of the present invention to provide a solar cell lead wire soldering apparatus capable of automatically performing the above-mentioned steps and improving the working efficiency.
【００１１】[0011]
【課題を解決するための手段】この発明は、前記目的を
達成するために、請求項１は、太陽電池のリード線取付
け領域にリード線を取付ける太陽電池用リード線半田付
け装置において、前記リード線取付け領域に列状に半田
バンプが形成された太陽電池を載置する載置部と，前記
太陽電池の半田バンプ列上にリード線を連続的に案内す
るとともに、少なくとも案内面が摩擦係数の小さい材料
によって形成されたリード線供給部と，前記リード線を
前記半田バンプに押し付け、前記リード線を半田バンプ
に接続するリード線半田こてとを具備したことを特徴と
する。According to the present invention, there is provided a solar cell lead wire soldering apparatus for mounting a lead wire in a lead wire mounting area of a solar cell. A mounting portion for mounting a solar cell having solder bumps formed in a row in a wire attachment region; and a guide for continuously guiding a lead wire on the solder bump array of the solar cell, and at least the guide surface has a coefficient of friction. A lead wire supply unit made of a small material, and a lead wire soldering iron for pressing the lead wire against the solder bump and connecting the lead wire to the solder bump are provided.
【００１２】前記構成によれば、リード線供給部のリー
ド線案内面が摩擦係数の小さい，例えばテフロン（登録
商標），ナイロンによって形成されているため，リード
線が円滑に半田バンプ列上に供給でき，リード線にメッ
キされている半田が摩擦によって案内面に付着すること
はなく，半田バンプに対するリード線の接続が自動的に
行える。According to the above configuration, since the lead wire guide surface of the lead wire supply portion is formed of, for example, Teflon (registered trademark) or nylon having a small friction coefficient, the lead wire is smoothly supplied onto the solder bump array. As a result, the solder plated on the lead wire does not adhere to the guide surface due to friction, and the connection of the lead wire to the solder bump can be performed automatically.
【００１３】[0013]
【発明の実施の形態】以下、この発明の実施の形態を図
面に基づいて説明する。Embodiments of the present invention will be described below with reference to the drawings.
【００１４】図１〜図３は太陽電池用のリード線半田付
け装置を示し，図１は側面図，図２は一部を拡大した側
面図，図３は半田付け部を示す側面図，図４は太陽電池
の断面図，図５は太陽電池に半田バンプを形成した状態
の斜視図、図６は太陽電池にリード線を取付けた状態の
斜視図である。1 to 3 show a lead wire soldering apparatus for a solar cell, FIG. 1 is a side view, FIG. 2 is a partially enlarged side view, and FIG. 3 is a side view showing a soldering portion. 4 is a sectional view of the solar cell, FIG. 5 is a perspective view showing a state where solder bumps are formed on the solar cell, and FIG. 6 is a perspective view showing a state where lead wires are attached to the solar cell.
【００１５】まず、太陽電池１について説明すると，図
４に示すように，ガラス基板等の絶縁基板２上に、透明
電極層３、半導体光電変換層４及び裏面電極層５が順次
形成された積層体６を備えている。積層体６は複数の光
電変換セル７に分離されるとともに、各光電変換セル７
は電気的に接続されている。First, the solar cell 1 will be described. As shown in FIG. 4, a laminated structure in which a transparent electrode layer 3, a semiconductor photoelectric conversion layer 4, and a back electrode layer 5 are sequentially formed on an insulating substrate 2 such as a glass substrate. The body 6 is provided. The laminate 6 is separated into a plurality of photoelectric conversion cells 7 and each of the photoelectric conversion cells 7
Are electrically connected.
【００１６】さらに、図５に示すように，太陽電池１の
両端にはリード線取付け領域８が設けられ，このリード
線取付け領域８には所定間隔を存して列状に半田バンプ
１０が形成されている。半田バンプ１０の列上には後述
するリード線半田付け装置によって図６に示すように，
リード線１１が半田バンプ１０に押し付けられ，リード
線１１が半田バンプ１０に接続されるようになってい
る。Further, as shown in FIG. 5, lead wire attachment regions 8 are provided at both ends of the solar cell 1, and solder bumps 10 are formed in a row at predetermined intervals in the lead wire attachment regions 8. Have been. As shown in FIG. 6, a lead wire soldering device to be described later places on the row of the solder bumps 10 as shown in FIG.
The lead wire 11 is pressed against the solder bump 10, and the lead wire 11 is connected to the solder bump 10.
【００１７】次に，図１〜図３に基づいてリード線半田
付け装置について説明する。Next, a lead wire soldering apparatus will be described with reference to FIGS.
【００１８】載置部１２には太陽電池１が固定的に支持
され，太陽電池１の両端のリード線取付け領域８には列
状に半田バンプ１０が形成されている。載置部１２の上
方には矢印Ａ方向に１ピッチずつ間欠移動する可動フレ
ーム１３が設けられ，この可動フレーム１３にはＺ方向
駆動機構（図示しない）を介してリード線半田付け装置
１４が上下動自在に設けられている。The solar cell 1 is fixedly supported on the mounting portion 12, and solder bumps 10 are formed in rows in the lead wire attachment regions 8 at both ends of the solar cell 1. A movable frame 13 that is intermittently moved by one pitch in the direction of arrow A in the direction of arrow A is provided above the mounting portion 12, and a lead wire soldering device 14 is vertically mounted on the movable frame 13 via a Z-direction drive mechanism (not shown). It is provided movably.
【００１９】リード線半田付け装置１４にはＺ方向駆動
機構によって上下動自在で、鉛直方向に延びる取付けプ
レート１５が設けられ，この取付けプレート１５の上部
にはリード線１１を繰り出すリード線繰出し部１６が設
けられている。このリード線１１は幅が約２ｍｍの帯状
の半田メッキ銅箔であり、取付けプレート１５に回転自
在に支持されたボビン１７に巻回されている。The lead wire soldering device 14 is provided with a vertically extending mounting plate 15 which can be moved up and down by a Z-direction driving mechanism. Above the mounting plate 15, a lead wire feeding portion 16 for feeding out the lead wire 11 is provided. Is provided. The lead wire 11 is a band-shaped solder-plated copper foil having a width of about 2 mm, and is wound around a bobbin 17 rotatably supported by a mounting plate 15.
【００２０】ボビン１７の下方には取付けプレート１５
に沿ってリード線供給部１８が設けられている。リード
線供給部１８は垂直ガイド１９とこの垂直ガイド１９の
下端部から円弧ガイド２０が連続して設けられ，さら
に、円弧ガイド２０から水平ガイド２１が連続して設け
られている。そして、ボビン１７から繰り出されたリー
ド線１１はガイドローラ２１を介して垂直ガイド１９，
円弧ガイド２０、水平ガイド２１の順に挿通され、載置
部１２上の太陽電池１に導かれるようになっている。Below the bobbin 17, a mounting plate 15 is provided.
A lead wire supply unit 18 is provided along. The lead wire supply unit 18 is provided with a vertical guide 19 and an arc guide 20 continuously from the lower end of the vertical guide 19, and further, a horizontal guide 21 is continuously provided from the arc guide 20. The lead wire 11 fed out from the bobbin 17 is guided by a vertical guide 19,
The circular guide 20 and the horizontal guide 21 are inserted in this order, and are guided to the solar cell 1 on the mounting portion 12.
【００２１】垂直ガイド１９にはリード線押えシリンダ
２２が設けられている。また、円弧ガイド２０の湾曲部
２０ａの曲率半径は，Ｒ４０ｍｍ以上，好ましくはＲ６
０ｍｍ以上に設定されている。さらに、水平ガイド２１
には下面、すなわち太陽電池１に向かって開口するガイ
ド溝２３が設けられている。The vertical guide 19 is provided with a lead wire holding cylinder 22. The radius of curvature of the curved portion 20a of the arc guide 20 is R40 mm or more, preferably R6.
It is set to 0 mm or more. Furthermore, the horizontal guide 21
Is provided with a guide groove 23 that opens toward the lower surface, that is, toward the solar cell 1.
【００２２】また、垂直ガイド１９、円弧ガイド２０，
水平ガイド２１は、リード線１１の肉厚より若干広い幅
の隙間によって形成され，その少なくとも内面のリード
線１１と接触する部分は摩擦係数の小さい，例えばテフ
ロンコーティングあるいはナイロンコーティングが施さ
れ，リード線１１が円滑に摺動して案内供給されるよう
になっている。なお、テフロンコーティングあるいはナ
イロンコーティングに限定されるものではなく，垂直ガ
イド１９、円弧ガイド２０，水平ガイド２１自体をテフ
ロンあるいはナイロンによって形成してもよい。The vertical guide 19, the arc guide 20,
The horizontal guide 21 is formed by a gap having a width slightly larger than the thickness of the lead wire 11, and at least a portion of the inner surface that contacts the lead wire 11 is coated with a small friction coefficient, for example, Teflon coating or nylon coating. 11 are smoothly guided and supplied. The vertical guide 19, the arc guide 20, and the horizontal guide 21 themselves may be formed of Teflon or nylon, without being limited to Teflon coating or nylon coating.
【００２３】さらに、水平ガイド２１にはガイド溝２３
に向かって貫通する大径孔２４と、この大径孔２４を挟
んで水平ガイド２１の先端側に長孔２５が、基端側に小
径孔２６が穿設されている。，さらに、前記取付けプレ
ート１５には側板２７が一体に設けられ，この側板２７
には第１のエアシリンダ２８が鉛直方向に取付けられて
いる。第１のエアシリンダ２８の昇降ロッド２９にはブ
ラケット３０を介してリード線用半田こて３１が鉛直方
向に取付けられている。Further, the guide groove 23 is formed in the horizontal guide 21.
, A long hole 25 is formed at the distal end side of the horizontal guide 21, and a small diameter hole 26 is formed at the base end side of the large diameter hole 24. The mounting plate 15 is provided with a side plate 27 integrally therewith.
Has a first air cylinder 28 mounted vertically. A lead wire soldering iron 31 is vertically attached to a lifting rod 29 of the first air cylinder 28 via a bracket 30.
【００２４】リード線用半田こて３１は、超音波振動子
３２と、この超音波振動子３２に直結され，内部に電気
ヒータ（図示しない）を有したこて３３とからなり，こ
て３３の先端部は先細に形成されている。超音波を印加
しない場合、超音波振動子もなく、電気ヒータ（図示し
ない）とこて３１，３３のみが存在する。そして、こて
３３は前記水平ガイド２１の大径孔２４に対向し，大径
孔２４を貫通してリード線１１の上面を圧接できるよう
になっている。The lead wire soldering iron 31 comprises an ultrasonic oscillator 32 and a iron iron 33 directly connected to the ultrasonic oscillator 32 and having an electric heater (not shown) therein. Has a tapered end. When no ultrasonic wave is applied, there is no ultrasonic vibrator, and only an electric heater (not shown) and irons 31 and 33 are present. The iron 33 is opposed to the large-diameter hole 24 of the horizontal guide 21, and can penetrate the large-diameter hole 24 to press the upper surface of the lead wire 11.
【００２５】側板２７にはリード線用半田こて３１の軸
線を中心として山形状に傾斜するブラケット３４が設け
られ，このブラケット３４にはリード線用半田こて３１
を挟んで第２のエアシリンダ３５と第３のエアシリンダ
３６が傾斜して設けられている。第２のエアシリンダ３
５の昇降ロッド３７にはピン３８によってリード線押え
部材３９が取付けられている。このリード線押え部材３
９は、略三角形プレートからなり，半田付け後のリード
線１１を長い範囲を押えるためにリード線１１の長さ方
向に沿って長い押え部３９ａを有し、前記水平ガイド２
１の長孔２５を貫通してリード線１１の上面を押えるよ
うになっている。The side plate 27 is provided with a bracket 34 inclined in a mountain shape around the axis of the lead wire soldering iron 31, and this bracket 34 is attached to the lead wire soldering iron 31.
The second air cylinder 35 and the third air cylinder 36 are provided to be inclined with respect to. Second air cylinder 3
A lead wire pressing member 39 is attached to the lifting rod 37 of No. 5 by a pin 38. This lead wire holding member 3
Reference numeral 9 denotes a substantially triangular plate, which has a long pressing portion 39a along the length direction of the lead wire 11 to hold the lead wire 11 after soldering in a long range.
The upper surface of the lead wire 11 is pressed through the one long hole 25.
【００２６】第３のエアシリンダ３６の昇降ロッド４０
にはリード線押えピン４１が取付けられている。このリ
ード線押えピン４１は先端部が先細で，水平ガイド２１
の小径孔２６を貫通して半田付け前のリード線１１を押
えるようになっている。The lifting rod 40 of the third air cylinder 36
A lead wire pressing pin 41 is attached to the. The lead wire holding pin 41 has a tapered tip, and
Through the small-diameter hole 26 to hold the lead wire 11 before soldering.
【００２７】そして、第２のエアシリンダ３５、第１の
エアシリンダ２８、第３のエアシリンダ３６の順に作動
してリード線１１を太陽電池１のリード線取付け領域８
に形成された半田バンプ１０にリード線押え部材３９に
よって長い範囲を押え付けるようになっている。さら
に，リード線半田こて３１によってリード線１１を半田
バンプ１０に圧接し、次にリード線押えピン４１によっ
てリード線１１を半田バンプ１０に押えた状態でリード
線１１を半田バンプ１０に半田付けするようになってい
る。The second air cylinder 35, the first air cylinder 28, and the third air cylinder 36 are operated in this order to connect the lead wire 11 to the lead wire mounting area 8 of the solar cell 1.
A long range is pressed by the lead wire pressing member 39 on the solder bump 10 formed in the above. Further, the lead wire 11 is pressed against the solder bump 10 by the lead wire soldering iron 31, and then the lead wire 11 is soldered to the solder bump 10 while the lead wire 11 is pressed against the solder bump 10 by the lead wire pressing pin 41. It is supposed to.
【００２８】次に，前述のように構成された太陽電池用
リード線半田付け装置の作用について説明する。Next, the operation of the solar cell lead wire soldering apparatus configured as described above will be described.
【００２９】リード線半田付け装置１４の載置部１２に
搬入される太陽電池１は、両端のリード線取付け領域８
に列状に半田バンプ１０が形成されたもので，可動フレ
ーム１３が矢印Ａ方向に１ピッチずつ間欠移動し，この
可動フレーム１３に搭載されたリード線半田付け装置１
４によって載置部１２に載置された太陽電池１の半田バ
ンプ１０にリード線１１が半田付けされる。The solar cell 1 carried into the mounting portion 12 of the lead wire soldering device 14 has lead wire mounting regions 8 at both ends.
The movable frame 13 intermittently moves one pitch at a time in the direction of arrow A, and the lead soldering apparatus 1 mounted on the movable frame 13
4, the lead wire 11 is soldered to the solder bump 10 of the solar cell 1 mounted on the mounting portion 12.
【００３０】まず，リード線半田付け装置１４が太陽電
池１の両端の半田バンプ１０が形成されたリード線取付
け領域８に対向する。このとき、カメラ（図示しない）
によって太陽電池１に付されたアライメントマークを読
み取って位置決めを行う。First, the lead wire soldering device 14 is opposed to the lead wire mounting area 8 where the solder bumps 10 at both ends of the solar cell 1 are formed. At this time, a camera (not shown)
The positioning is performed by reading the alignment mark attached to the solar cell 1.
【００３１】カメラとアライメントマークではなく、太
陽電池を位置決めバーに押し当てることによって、太陽
電池の位置決めをする場合には、カメラは取り付けてお
らず、図示しない位置決めバーが取り付けられ、固定さ
れた位置決めバーを基準とし、可動する位置決めバーに
て太陽電池の基準面を固定された位置決めバーに押し当
てることにより位置決めする。When positioning the solar cell by pressing the solar cell against the positioning bar instead of the camera and the alignment mark, the camera is not mounted, but a positioning bar (not shown) is mounted, and the fixed positioning is performed. Based on the bar, the positioning is performed by pressing the reference surface of the solar cell against the fixed positioning bar with a movable positioning bar.
【００３２】次に，Ｚ方向駆動機構によってリード線半
田付け装置１４が下降すると，取付けプレート１５に取
り付けられた水平ガイド２１が半田バンプ１０を有する
リード線取付け領域８に接近する。Next, when the lead wire soldering device 14 is lowered by the Z-direction drive mechanism, the horizontal guide 21 mounted on the mounting plate 15 approaches the lead wire mounting area 8 having the solder bumps 10.
【００３３】次に，リード線１１はボビン１７から繰り
出され，垂直ガイド１９、円弧ガイド２０及び水平ガイ
ド２１の順にガイドされ，さらにガイド溝２３によって
太陽電池１の半田バンプ１０を有するリード線取付け領
域８に導かれている。このとき、垂直ガイド１９、円弧
ガイド２０，水平ガイド２１の内面は摩擦係数の小さ
い，例えばテフロンコーティングあるいはナイロンコー
ティングが施されているため、リード線１１が円滑に摺
動して案内供給され、リード線１１とガイド１９，２
０，２１の摩擦によりリード線１１の表面の半田が溶
け、ガイド１９，２０，２１内に溜まり、リード線１１
がつまったり、傷付いたりすることはない。また、Ｒ４
０以上、好ましくはＲ６０以上の円弧ガイド２０を用い
ることで、リード線１１のテンションによる円弧ガイド
２０の部分への力は分散され、方向変換部は更に良好と
なる。Next, the lead wire 11 is fed out of the bobbin 17 and guided in the order of the vertical guide 19, the arc guide 20 and the horizontal guide 21. Further, the guide groove 23 is used for the lead wire mounting area having the solder bump 10 of the solar cell 1. 8 At this time, since the inner surfaces of the vertical guide 19, the arc guide 20, and the horizontal guide 21 are coated with a small friction coefficient, for example, Teflon coating or nylon coating, the lead wire 11 is smoothly slid and guided and supplied. Line 11 and guide 19,2
The solder on the surface of the lead wire 11 is melted by the friction of the lead wire 11 and accumulated in the guides 19, 20, and 21, and the lead wire 11
It does not get stuck or hurt. Also, R4
By using the arc guide 20 of 0 or more, preferably R60 or more, the force on the portion of the arc guide 20 due to the tension of the lead wire 11 is dispersed, and the direction changing portion is further improved.
【００３４】次に，第２のエアシリンダ３５の昇降ロッ
ド３７が下降し、リード線１１を半田バンプ１０にリー
ド線押え部材３９によって押え付ける。次に，第１のエ
アシリンダ２８の昇降ロッド２９が下降してリード線半
田こて３１によってリード線１１を半田バンプ１０に圧
接する。次に、第３のエアシリンダ３６の昇降ロッド４
０が下降してリード線１１をリード線取付け領域８に押
し付ける。Next, the lifting rod 37 of the second air cylinder 35 is lowered, and the lead wire 11 is pressed against the solder bump 10 by the lead wire pressing member 39. Next, the lifting rod 29 of the first air cylinder 28 descends to press the lead wire 11 against the solder bump 10 by the lead wire soldering iron 31. Next, the lifting rod 4 of the third air cylinder 36
0 descends and presses the lead wire 11 against the lead wire attachment area 8.
【００３５】この状態で，リード線半田こて３１の超音
波振動子３２が超音波振動すると，てこ３３を介してリ
ード線１１と半田バンプ１０との圧接部に超音波振動が
場合によって付与され，しかもリード線半田こて３１に
内蔵された電気ヒータの加熱によってリード線１１の半
田及び半田バンプ１０が溶融してリード線１１が半田バ
ンプ１０に半田付けされる。In this state, when the ultrasonic vibrator 32 of the lead wire soldering iron 31 ultrasonically vibrates, the ultrasonic vibration is applied to the pressure contact portion between the lead wire 11 and the solder bump 10 via the lever 33 in some cases. In addition, the solder of the lead wire 11 and the solder bump 10 are melted by the heating of the electric heater incorporated in the lead wire soldering iron 31, and the lead wire 11 is soldered to the solder bump 10.
【００３６】最先端の半田バンプ１０に対してリード線
１１の一端部が半田付けされると、第１、第２及び第３
のエアシリンダ２８，３５，３６の順に作動して昇降ロ
ッド２９，３７，４０が上昇し，同時に可動フレーム１
３が矢印Ａ方向に１ピッチ移動して次の半田バンプ１０
に対するリード線１１の半田付けを行い，前記作用を繰
り返すことにより，太陽電池１の一端側から他端側に向
かって列状の半田バンプ１０に対するリード線１１の接
続が行われる。When one end of the lead wire 11 is soldered to the most advanced solder bump 10, the first, second, and third
The air cylinders 28, 35, 36 are operated in this order to raise and lower the rods 29, 37, 40, and at the same time, move the movable frame 1
3 moves one pitch in the direction of arrow A to move to the next solder bump 10.
By repeating the above-described operation, the lead wires 11 are connected to the solder bumps 10 in a row from one end of the solar cell 1 to the other end.
【００３７】このとき、リード線１１の半田付け後の部
分は、リード線１１の長手方向に沿うプレート状のリー
ド線押え部材３９によって長い範囲を押え付けることが
でき，半田付け前の部分はリード線押えピン４１によっ
て押え付けられ，その間のリード線１１が半田バンプ１
０に半田付けされるため，リード線１１に余分なテンシ
ョンが加わることはなく，半田付け後のリード線１１の
熱収縮によってリード線１１が半田バンプ１０から外れ
ることはない。At this time, a portion of the lead wire 11 after soldering can be pressed over a long range by a plate-like lead wire pressing member 39 along the longitudinal direction of the lead wire 11, and the portion before soldering is a lead. The wire 11 is pressed by the wire holding pin 41 and the lead wire 11 therebetween is connected to the solder bump 1.
Since the lead wire 11 is soldered to the solder bump 10, no extra tension is applied to the lead wire 11, and the lead wire 11 does not come off from the solder bump 10 due to thermal contraction of the lead wire 11 after soldering.
【００３８】このようにしてリード線取付け領域８の全
長に亘ってリード線１１の半田付けが完了すると、所定
の長さのところでリード線１１を切断する。リード線１
１が切断されると，太陽電池１は搬出され，載置部１２
には次の太陽電池１が搬入される。従って，太陽電池１
の半田バンプ１０に対するリード線１１の取付けが全自
動的に行える。When the soldering of the lead wire 11 is completed over the entire length of the lead wire mounting area 8 in this way, the lead wire 11 is cut at a predetermined length. Lead wire 1
When the solar cell 1 is cut off, the solar cell 1 is carried out, and
, The next solar cell 1 is carried in. Therefore, solar cell 1
Attachment of the lead wire 11 to the solder bump 10 can be performed automatically.
【００３９】[0039]
【発明の効果】以上説明したように、請求項１の発明に
よれば、太陽電池のリード線取付け領域に対してリード
線の案内部の表面に摩擦係数が少ない材料を使用するこ
とにより、案内部の内部にリード線の半田が付着し、リ
ード線が詰まったり、破損したりすることがなくなり、
リード線を円滑に供給でき，リード線取付け領域に形成
された半田バンプに対するリード線の接続が自動的に行
え、作業能率の向上を図ることができる。As described above, according to the first aspect of the present invention, the guide is formed by using a material having a low coefficient of friction on the surface of the lead wire guide portion with respect to the lead wire mounting region of the solar cell. The solder of the lead wire will not adhere to the inside of the part, and the lead wire will not be clogged or damaged,
The lead wires can be supplied smoothly, the lead wires can be automatically connected to the solder bumps formed in the lead wire attachment area, and the work efficiency can be improved.
【図１】この発明の第１の実施形態を示す太陽電池用リ
ード線半田付け装置の側面図。FIG. 1 is a side view of a solar cell lead wire soldering apparatus according to a first embodiment of the present invention.
【図２】同実施形態のリード線半田付け装置の一部を拡
大した側面図。FIG. 2 is an enlarged side view of a part of the lead wire soldering apparatus of the embodiment.
【図３】同実施形態のリード線半田付け部を拡大した側
面図。FIG. 3 is an enlarged side view of a lead wire soldering portion of the embodiment.
【図４】同実施形態の太陽電池の断面図。FIG. 4 is a sectional view of the solar cell of the embodiment.
【図５】同実施形態の太陽電池に半田バンプを形成した
状態の斜視図。FIG. 5 is an exemplary perspective view showing a state where solder bumps are formed on the solar cell according to the embodiment;
【図６】同実施形態の太陽電池にリード線を取付けた状
態の斜視図。FIG. 6 is an exemplary perspective view showing a state where lead wires are attached to the solar cell according to the embodiment;
１…太陽電池 ８…リード線取付け領域 １０…半田バンプ １１…リード線 １２…載置部 １４…リード線半田付け装置 １８…リード線供給部 ３１…リード線半田こて DESCRIPTION OF SYMBOLS 1 ... Solar cell 8 ... Lead wire mounting area 10 ... Solder bump 11 ... Lead wire 12 ... Mounting part 14 ... Lead wire soldering apparatus 18 ... Lead wire supply part 31 ... Lead wire soldering iron
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.7 識別記号 ＦＩ テーマコート゛(参考） Ｈ０１Ｌ 31/04 Ｍ ──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. 7 Identification symbol FI Theme coat ゛ (Reference) H01L 31/04 M
Claims (1)
線を取付ける太陽電池用リード線半田付け装置におい
て、 前記リード線取付け領域に列状に半田バンプが形成され
た太陽電池を載置する載置部と，前記太陽電池の半田バ
ンプ列上にリード線を連続的に案内するとともに、少な
くとも案内面が摩擦係数の小さい材料によって形成され
たリード線供給部と，前記リード線を前記半田バンプに
押し付け、前記リード線を半田バンプに接続するリード
線半田こてと、 を具備したことを特徴とする太陽電池用リード線半田付
け装置。1. A solar cell lead wire soldering apparatus for mounting a lead wire in a lead wire mounting area of a solar cell, wherein a solar cell having solder bumps formed in rows in the lead wire mounting area is mounted. Part, a lead wire supply part whose guide surface is formed of a material having a small coefficient of friction at least while guiding a lead wire continuously on a row of solder bumps of the solar cell, and pressing the lead wire against the solder bump. And a lead wire soldering iron for connecting the lead wire to a solder bump.
Priority Applications (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30553399A JP4504485B2 (en) | 1999-10-27 | 1999-10-27 | Solar cell lead wire soldering equipment |
| EP10172652.9A EP2259338B1 (en) | 1999-09-29 | 2000-03-16 | Method of and apparatus for automatically presoldering the solar battery and soldering a lead wire to the solar battery |
| DE60045182T DE60045182D1 (en) | 1999-09-29 | 2000-03-16 | Method and device for the automatic soldering of a connection wire to a solar cell battery |
| EP00105317A EP1089347B1 (en) | 1999-09-29 | 2000-03-16 | Method and apparatus for automatically soldering a lead wire to a solar battery |
| AT00105317T ATE487238T1 (en) | 1999-09-29 | 2000-03-16 | METHOD AND DEVICE FOR AUTOMATICALLY SOLDERING A CONNECTION WIRE TO A SOLAR CELL BATTERY |
| AU22378/00A AU767276B2 (en) | 1999-09-29 | 2000-03-16 | Method and apparatus for automatically soldering a lead wire to a solar battery |
| US09/532,195 US6357649B1 (en) | 1999-09-29 | 2000-03-22 | Method and apparatus for automatically soldering a lead wire to a solar battery |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30553399A JP4504485B2 (en) | 1999-10-27 | 1999-10-27 | Solar cell lead wire soldering equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2001127322A true JP2001127322A (en) | 2001-05-11 |
| JP4504485B2 JP4504485B2 (en) | 2010-07-14 |
Family
ID=17946309
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP30553399A Expired - Lifetime JP4504485B2 (en) | 1999-09-29 | 1999-10-27 | Solar cell lead wire soldering equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4504485B2 (en) |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005223885A (en) * | 2004-01-07 | 2005-08-18 | Miyota Kk | Quartz oscillator manufacturing method and fluxless soldering device |
| JP2006066570A (en) * | 2004-08-26 | 2006-03-09 | Eco & Engineering Co Ltd | Connection method of solar cell element |
| WO2009049573A1 (en) * | 2007-10-19 | 2009-04-23 | Solarwatt Ag | Connecting device and method for interconnecting solar cells |
| KR100934384B1 (en) | 2009-05-18 | 2009-12-30 | 지.티.에스 (주) | Apparatus soldering ribbon for a solar cell module |
| JP2010142838A (en) * | 2008-12-18 | 2010-07-01 | Kuroda Techno Co Ltd | Soldering device for lead wire for solar cell |
| JP2010162577A (en) * | 2009-01-16 | 2010-07-29 | Kuroda Techno Co Ltd | Heating iron and apparatus for soldering lead wire for solar cell |
| WO2011052479A1 (en) * | 2009-10-30 | 2011-05-05 | 三洋電機株式会社 | Photoelectric conversion module |
| JP2011238926A (en) * | 2010-05-05 | 2011-11-24 | Schott Solar Ag | Method and device for introducing solder onto workpiece |
| JP2012016744A (en) * | 2010-07-09 | 2012-01-26 | Honda Motor Co Ltd | Soldering device and method |
| JP2012143805A (en) * | 2011-01-14 | 2012-08-02 | Eco & Engineering Co Ltd | Heating head, and connection devices for solar cell and solar cell string using the heating head |
| JP2018137354A (en) * | 2017-02-22 | 2018-08-30 | 三菱ケミカル株式会社 | Manufacturing method of solar cell module and solar cell module manufacturing apparatus |
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