JP2001127233A - Resin-sealed semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To support a semiconductor chip stably by supporting a die pad at four spots, in place of ordinary one-point supporting. SOLUTION: Since supporting spots for semiconductor chip 35 are four in number, and approach the end parts of the semiconductor chip 35. By forming four chip-supporting parts 34 of approximately the same height by press working using a lead frame as original material, so as to protrude from the exposed fundamental part 33 of a die pad 32, and supporting the semiconductor chip 35 by the supporting parts 34, a mounted posture of the semiconductor chip 35 is stabilizes, and a possibility of generation of inconvenience in a manufacturing process is diminished. Besides, the semiconductor chip 35 can be thinned, and consequently it becomes possible to thin a semiconductor device, since rigidity which is required by the semiconductor chip 35 becomes smaller by the increase of the supporting points.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin-encapsulated semiconductor device using a lead frame, and more particularly to a heat-dissipation-type resin-encapsulated semiconductor device in which the back side of a die pad is exposed.

[0002]

2. Description of the Related Art First, the structure of a conventional resin-encapsulated semiconductor device will be described with reference to FIGS. Note that the drawings used in the description are not necessarily the same size as the actual ones, but are partially exaggerated in the height direction for easy understanding. This is the same for the drawings used in the description of the embodiments of the invention described later.

FIGS. 22 and 23 are a front sectional view and a bottom view, respectively, of a conventional resin-encapsulated semiconductor device. FIG. 22 shows a cross section taken along the line AA1 in FIG. FIG. 22, FIG.
In 3, it is assumed that 11 indicates the entire resin-sealed semiconductor device. Reference numeral 12 denotes a die pad at the center, which comprises a basic portion 13 and a chip supporting portion 14 which are exposed. Reference numeral 15 denotes a semiconductor chip, and 16 denotes a die bonding agent for fixing the semiconductor chip 15 to the chip supporting portion 14. Reference numeral 17 denotes a terminal (lead) provided so as to surround the die pad 12. Reference numeral 18 denotes an electrode pad (not shown) of the semiconductor chip 15 and the terminal 17.
Is a wire that connects 19 is a sealing resin for protecting the whole. This semiconductor device 11 has a heat dissipation type QFN.
(Quad Flat Non-leaded pac
Kage) type, the bottom surface of the die pad 12 is exposed, only the upper side of the terminal 17 becomes a resin sealing portion, and there is no outer lead portion extending laterally from the side surface of the resin sealing type semiconductor device main body. The lower surface of 17 is a mounting surface on a printed wiring board as an external terminal.

Next, a lead frame constituting a conventional resin-encapsulated semiconductor device will be described with reference to FIG.
FIG. 24 is a perspective view of a basic unit of a conventional lead frame.

In FIG. 24, it is assumed that reference numeral 20 indicates the entire lead frame. Reference numeral 21 denotes a die pad support which is bent at two places and supports the die pad 12 in four directions.
Is a dam bar that serves as a resin stopper in the sealing process, and 23 is a slit that reduces the influence of heat in the manufacturing process.

The details of the die pad 12 will be described. The chip supporting portion 14 is formed using the lead frame 20 as an original material so as to protrude in the height direction.
Since there is a height difference between the chip support portion 14 and the basic portion 13, in the state of the completed semiconductor device 11, the cantilever support portion of the semiconductor chip 15 which is separated from the chip support portion 14 and the basic portion. The sealing resin 19 intervenes between the portion 13. As a result, the semiconductor chip 15 has a well-balanced structure in which the top and bottom of the semiconductor chip 15 are covered with the sealing resin 19. Further, the boundary between the basic portion 13 and the sealing resin 19 may be a moisture infiltration path, but the path to the semiconductor chip 15 is smaller than that when the semiconductor chip 15 is directly mounted on a flat die pad. The length is increased by projecting the chip supporting portion 14 in the height direction, and the structure is highly reliable.

The manufacturing process of the resin-encapsulated semiconductor device 11 includes a die bonding process in which a die bonding agent 16 is applied to the chip supporting portion 14, the semiconductor chip 15 is pressed and arranged thereon, and then fixed. A wire bonding step of connecting an electrode pad (not shown) to the terminal 17 with a metal wire 18, and setting the lead frame 20 to a mold having an outer shape of the semiconductor device 11 and melting the sealing resin 19. It includes a sealing step of pouring and then curing, and a product processing step of cutting a portion to be the resin-sealed semiconductor device 11 from the entire lead frame 20.

[0008]

However, in such a conventional structure, even if the semiconductor chip becomes large, the semiconductor chip is supported only at the center of the die pad. The balance of the pressing force tends to be lost, and even if the semiconductor chip is slightly inclined, if the semiconductor chip is large, the amount of inclination at the end becomes large. As a first problem due to this, there is a problem that uniform bonding cannot be performed due to a difference in bond height at the time of wire bonding, a resin flow is not smooth at the time of sealing, and a large cantilevered support length increases wire bonding. Since a moment is applied, there is a problem that a thin semiconductor chip is damaged.

In the conventional configuration, the chip supporting portion is formed by processing the lead frame as a raw material. For this reason, as a second problem, there is a problem in that the support position and the support height of the semiconductor chip are limited due to the processing limit, and the structure is not always optimal.

Further, in the conventional configuration, there is only one supporting portion for the semiconductor chip. Therefore, as a third problem,
Even if an attempt is made to mount a plurality of semiconductor chips, there is a problem that a plurality of semiconductor chips cannot be mounted because there is only one support portion.

The present invention solves the above-mentioned conventional problems. First, a semiconductor chip is stably supported at a plurality of positions on a die pad to eliminate the possibility of inconvenience in a manufacturing process. A first object is to reduce the thickness of a semiconductor device by reducing the thickness of the semiconductor device. In addition, by supporting the semiconductor chip with another member integrally fixed to the die pad, it is necessary to improve the structure of the semiconductor chip.
The purpose of. Further, a third object is to enable mounting of a plurality of semiconductor chips by providing a plurality of support portions of the semiconductor chip, and to perform mounting with higher density.

[0012]

In order to achieve the first object, a resin-encapsulated semiconductor device according to the present invention comprises a die pad supporting a semiconductor chip and a terminal having a tip disposed around the die pad. And a member that electrically connects the semiconductor chip and the terminal, and a sealing resin that exposes a bottom surface of the die pad and seals an outer periphery of the semiconductor chip. The die pad has a basic portion exposed to the outside of the sealing resin, and a plurality of support portions formed integrally with the basic portion and having substantially the same height as the basic portion, and The semiconductor device is a resin-sealed semiconductor device in which the semiconductor chip is supported by the support portion.

As a result, the posture of the semiconductor chip is stabilized, so that there is no possibility that inconvenience occurs in the manufacturing process. Further, since the number of support points increases, the semiconductor chip may be thinned, and the thickness of the semiconductor device can be reduced.

According to a second aspect of the present invention, there is provided a resin-encapsulated semiconductor device, comprising: a die pad supporting a semiconductor chip; a terminal having a tip disposed around the die pad; A resin-encapsulated semiconductor device comprising: a member electrically connected to the terminal; and a sealing resin that exposes a bottom surface of the die pad and seals an outer periphery of the semiconductor chip. A resin-sealed semiconductor device in which a bottom surface is exposed to the outside of the sealing resin, an auxiliary member having a supporting portion is separately provided, and the semiconductor chip is supported by the supporting portion.

Thus, since the supporting position and the supporting height of the semiconductor chip can be freely set, a well-balanced structure can be realized, and the shape retention, that is, the reliability, against the temperature and humidity changes can be improved.

As a first means for achieving the third object, a resin-encapsulated semiconductor device according to the present invention comprises a die pad supporting a semiconductor chip, and a terminal having a tip disposed around the die pad. A resin-sealed semiconductor device comprising: a member that electrically connects the semiconductor chip and the terminal; and a sealing resin that exposes a bottom surface of the die pad and seals an outer periphery of the semiconductor chip. The die pad has a basic portion exposed to the outside of the sealing resin, and is formed integrally with the basic portion, has a plurality of support portions having different heights from the basic portion, and has a planar overlap with each other. A resin-encapsulated semiconductor device in which a plurality of semiconductor chips are supported by the plurality of support portions in a non-existent state.

Thus, since a plurality of semiconductor chips can be mounted side by side on the semiconductor device, a plurality of functions can be integrated into one package to reduce the mounting area and weight.

As a second means for achieving the third object, a resin-encapsulated semiconductor device according to the present invention comprises a die pad supporting a semiconductor chip, and a terminal having a tip disposed around the die pad. A resin-sealed semiconductor device comprising: a member that electrically connects the semiconductor chip and the terminal; and a sealing resin that exposes a bottom surface of the die pad and seals an outer periphery of the semiconductor chip. The die pad has a bottom surface exposed to the outside of the sealing resin, and has an auxiliary member having two or more support portions separately,
A resin-encapsulated semiconductor device in which a plurality of semiconductor chips are supported by the plurality of support portions in a state where they do not overlap with each other in a plane.

Thus, since a plurality of semiconductor chips can be mounted side by side on a semiconductor device while freely supporting a semiconductor chip at a supporting position and supporting height, a one-package of a plurality of functions can be realized with a well-balanced structure, and the mounting area can be increased. The weight can also be reduced.

As a third means for achieving the third object, a resin-encapsulated semiconductor device according to the present invention comprises a die pad supporting a semiconductor chip, and a terminal having a tip disposed around the die pad. A resin-sealed semiconductor device comprising: a member that electrically connects the semiconductor chip and the terminal; and a sealing resin that exposes a bottom surface of the die pad and seals an outer periphery of the semiconductor chip. The die pad has a basic portion exposed to the outside of the sealing resin, and a plurality of support portions formed integrally with the basic portion and having different heights from the basic portion and two or more heights. Further, a resin-encapsulated semiconductor device in which a plurality of semiconductor chips are supported by the plurality of support portions in a state of being overlapped with each other in a plane.

Thus, a plurality of semiconductor chips can be mounted on the semiconductor device so as to have a two-dimensional overlap, so that a plurality of functions can be packaged at a high density to reduce a mounting area and weight.

As a fourth means for achieving the third object, the resin-encapsulated semiconductor device of the present invention comprises a die pad supporting a semiconductor chip, and a terminal having a tip disposed around the die pad. A resin-sealed semiconductor device comprising: a member that electrically connects the semiconductor chip and the terminal; and a sealing resin that exposes a bottom surface of the die pad and seals an outer periphery of the semiconductor chip. The die pad has a bottom surface exposed to the outside of the sealing resin, and has another auxiliary member having two or more support portions having different heights from each other, and the plurality of die pads overlap each other in a planar manner. This is a resin-encapsulated semiconductor device in which a plurality of semiconductor chips are supported by a support.

With this arrangement, the semiconductor device can be mounted at a position where the semiconductor chip can be freely supported and the height at which the semiconductor chip can be mounted, so that the plurality of semiconductor chips can be mounted on the semiconductor device so as to have a two-dimensional overlap. A single package can be realized, and the mounting area and weight can be reduced.

[0024]

DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of a resin-sealed semiconductor device according to the present invention will be described below with reference to the drawings.

First, a first embodiment for the first object of the present invention will be described. The configuration of the resin-encapsulated semiconductor device will be described with reference to FIGS.

FIGS. 1 and 2 are a front sectional view and a bottom view, respectively, of a resin-sealed semiconductor device according to the first embodiment for the first purpose. FIG. 1 shows a cross section taken along a line B-B1 in FIG. In the bottom view cited in the description of the present invention, the configuration partially seen through is indicated by a broken line.

In the figure, reference numeral 31 denotes the entire resin-sealed semiconductor device. Reference numeral 32 denotes a die pad at the center, which comprises a basic portion 33 and four integrally formed chip support portions 34 having substantially the same height. 35 is a semiconductor chip, 3
Reference numeral 6 denotes a die bonding agent for fixing the semiconductor chip 35 to the chip supporting portion 34. Reference numeral 37 denotes a terminal provided so as to surround the die pad 32, and reference numeral 38 denotes a wire for connecting an electrode pad (not shown) of the semiconductor chip 35 to the terminal 37 (lead). 39 is a sealing resin for protecting the whole.

As described above, the resin-encapsulated semiconductor device of the present embodiment has a basic portion 33 whose bottom surface is exposed to the outside, and a plurality of integrally formed monoliths having different heights from the basic portion 33. A die pad 32 having a support portion 34, a semiconductor chip 35 supported by a plurality of chip support portions 34 via a die bonding agent 36, a terminal 37 having its tip disposed around the die pad 32, a terminal 37 and a die pad. A wire 38 such as a gold wire that electrically connects the semiconductor chip 35 mounted on the semiconductor chip 32, and a region excluding the bottom surface of the die pad 32, one side surface of the terminal 37 and the bottom surface of the terminal as an outer periphery of the semiconductor chip 35. It is made of a sealing resin 39 which has been sealed.

The resin-encapsulated semiconductor device of the present embodiment has four
Since the two protruding support portions 34 are integrally formed in the surface of the die pad 32, the semiconductor chip 35 can be stably supported, and the sealing resin 39 is also provided on the back surface of the semiconductor chip 35.
The reliability can be maintained because of the structure capable of forming the.

Next, the lead frame will be described with reference to FIG. FIG. 3 is a perspective view of a basic unit of the lead frame in the first embodiment for the first object. In the figure, 40 indicates the entire lead frame. 41
Is a die pad support that is bent at two places and supports the die pad 32 in four directions, 42 is a dam bar that serves as a resin stopper in the sealing process, and 43 is a slit that reduces the influence of heat in the manufacturing process.

The four chip supporting portions 34 provided on the die pad 32 are formed using the lead frame 40 as an original material so as to protrude in the height direction. As a result, the number of support points of the semiconductor chip 35 becomes four, and the support point approaches the end of the semiconductor chip 35. In forming the chip supporting portion 34, a process of stopping punching (half-cut press) may be performed, or a die corresponding to the shape may be prepared and subjected to a press process that conforms to the shape. Good.

Protrusion of the chip supporting portions 34 at a plurality of positions of the die pad 32 as shown in FIG. 3 can also be realized by partially half-etching the die pad. However, in this case, since the support height of the semiconductor chip 35 is reduced, it is necessary to change the dimension of the die pad support 41 in the height direction. Also, the rear surface of the die pad remains the same surface without any irregularities.

Next, a resin-sealed semiconductor device according to a second embodiment for the first object will be described. In addition, since it is the same as that of the first embodiment except for the shape of the die pad,
Only the shape of the die pad will be described. FIG. 4 is a perspective view of the die pad according to the second embodiment for the first purpose. In the figure, reference numeral 46 denotes a die pad, which comprises a basic portion 47 and four chip support portions 48 having substantially the same height. Reference numeral 49 denotes a slit, which is provided on both sides of the chip supporting portion 48 so that the chip supporting portion 48 can be processed. The chip supporting portion 48 is formed by using a lead frame as a raw material so as to protrude in the height direction. For this purpose, the slit 49 is first removed from the lead frame, and then the chip supporting portion 48 may be pressed so as to conform to the prepared die.

Next, a resin-sealed semiconductor device according to a third embodiment for the first object will be described. Here, only the shape of the die pad will be described. FIG. 5 is a perspective view showing a die pad according to the third embodiment for the first purpose. In the figure, reference numeral 51 denotes a die pad, which comprises a basic portion 52 and four chip support portions 53 having substantially the same height. Reference numeral 54 denotes a notch, which is provided on both sides of the chip support 53 so that the chip support 53 can be processed. The chip supporting portion 53 is formed by using a lead frame as an original material so as to protrude in the height direction. To do this,
First, the notch portion 54 is removed from the lead frame, and then the chip support portion 53 may be pressed to conform to the prepared mold. It should be noted that even if the semiconductor chip is supported at a plurality of locations, as shown in FIG.
If the direction of the inclined portion 55 reaching 3 is the direction radiating from the center of the die pad 51, the die pad 51 generated after the sealing step due to the difference in the coefficient of thermal expansion of the constituent materials of the semiconductor device.
Warpage can be reduced because the position of the chip supporting portion 53 can be changed. Further, in the structure shown in FIG.
When the semiconductor chip is supported, the semiconductor chip can be mounted while absorbing a chip warp or the like, and a highly reliable resin-encapsulated semiconductor device can be obtained.

As described above, in the first to third embodiments for the first object, the chip support portions are all four symmetrically. However, the chip support portions need not be symmetrical, and any number of two or more may be used. . However, it is arranged in consideration of the chip support balance and its thermal effect. In addition to the shape shown in the embodiment, the shape of the chip supporting portion can be variously deformed by using a lead frame as a raw material. The point is that a semiconductor chip is supported by a plurality of chip supporting portions of substantially the same height provided on a die pad whose back surface is exposed, using a lead frame as a base material.

A first embodiment for the second object of the present invention will be described. First, the configuration of the resin-sealed semiconductor device of the present embodiment will be described with reference to FIGS.
6 and 7 are a front sectional view and a bottom view, respectively, of the resin-sealed semiconductor device according to the first embodiment for the second purpose. FIG. 6 shows a cross section taken along the line CC of FIG. In the figure, 61 indicates the entire resin-sealed semiconductor device. Reference numeral 62 denotes a die pad having a back surface side exposed at the center, and 63 denotes an auxiliary member integrally fixed to the die pad 62, and has four chip support portions 64. Reference numeral 65 denotes a semiconductor chip, and 66 denotes a die bonding agent for fixing the semiconductor chip 65 to the chip supporting portion 64. Reference numeral 67 denotes a terminal provided to surround the die pad 62, and reference numeral 68 denotes a wire for connecting an electrode pad (not shown) of the semiconductor chip 65 to the terminal 67. 69 is a sealing resin for protecting the whole.

As described above, in the resin-encapsulated semiconductor device of the present embodiment, the die pad 62 whose bottom surface is exposed to the outside is provided.
And an auxiliary member 63 having a height different from that of the die pad 62 and fixed to the die pad 62 and having a plurality of chip support portions 64, and a plurality of support portions 64 of the auxiliary member 63 via a die bonding agent 66. A supported semiconductor chip 65, a terminal 67 whose tip is disposed around the die pad 62, a wire 68 such as a gold wire electrically connecting the terminal 67 and the semiconductor chip 65 mounted on the die pad 62, As an outer periphery of the semiconductor chip 65, the semiconductor chip 65 includes a bottom surface of the die pad 62, and a sealing resin 69 sealing a region excluding one side surface and the bottom surface of the terminal.

Next, a lead frame to which the auxiliary member 63 is fixed will be described with reference to FIG. FIG. 8 is a perspective view of a basic unit of the lead frame to which the auxiliary member according to the first embodiment is fixed for the second object. In the figure,
70 indicates the entire lead frame. Reference numeral 71 denotes a die pad support that is bent at two places and supports the die pad 62, 72 denotes a dam bar that serves as a resin stopper in a sealing process, and 73 denotes a slit that reduces the influence of heat.

The auxiliary member 63 integrally fixed to the die pad 62 is formed by etching a circular sheet metal to form four chip support portions 64. Since the base material of the auxiliary member 63 is different from the lead frame 70, there is no restriction on the shape and dimensions. Here, the chip supporting portion 64 is provided so as to protrude from the die pad 62 to support the vicinity of the end of the semiconductor chip 65. The support height can also be freely set, and is set higher here than in the first embodiment for the first purpose. Further, the volume and the shape of the sealing resin 69 in the resin-sealed semiconductor device 61 are greatly changed by the auxiliary member 63. As a method of integrally fixing the auxiliary member 63 to the die pad 62, there are laser welding, solder bonding, adhesion, and the like, but a method having good heat transfer between the members is desirable.

Next, a second embodiment for the second purpose will be described. Since the configuration is the same as that of the first embodiment except for the shape of the auxiliary member, only the die pad portion to which the auxiliary member is fixed will be described. FIG. 9 is a perspective view of the die pad portion to which the auxiliary member according to the second embodiment is fixed for the second purpose. The auxiliary member 75 integrally fixed to the die pad 74 is formed by bending a cross-shaped sheet metal to form four chip support portions 76. here,
The chip supporting portion 76 is provided so as to protrude largely from the die pad 74 so that the end portion of the semiconductor chip can be supported even if it is large.

As described above, in each of the first and second embodiments for the second purpose, the chip support portion is provided at four symmetrical portions, but it may not be symmetrical or may be provided at any number of portions. . Even if the chip supporting portion is provided at one position, the size of the supporting portion can be freely set because the original material is different from the lead frame. Although one auxiliary member is fixed to the die pad, a plurality of auxiliary members may be used. The auxiliary member can be deformed into various shapes formed by various materials and processing methods other than those shown in the embodiments, and the chip supporting position and the chip supporting height can also be variously modified. The point is that the semiconductor chip is supported by an auxiliary member integrally fixed to the die pad whose back side is exposed.

A first embodiment for the third object of the present invention will be described. First, referring to FIGS. 10 and 11,
The configuration of the resin-sealed semiconductor device will be described. FIG.
FIG. 11 is a front sectional view and a bottom view of the resin-sealed semiconductor device according to the first embodiment for the third purpose. FIG. 10 shows a cross section taken along a line DD1 in FIG. In the figure, it is assumed that reference numeral 81 represents the entire resin-sealed semiconductor device. Reference numeral 82 denotes a die pad at the center, which comprises a basic portion 83 and two chip supporting portions 84 and 85. 86
Are the semiconductor chips 87 and 88, respectively,
This is a die bonding agent for fixing to 4,85. 89
Is a terminal provided so as to surround the die pad 82, and 90 is a wire connecting an electrode pad (not shown) of the semiconductor chips 87 and 88 and the terminal 89. Reference numeral 91 denotes a sealing resin for protecting the whole.

As described above, the resin-encapsulated semiconductor device of the present embodiment has a basic portion 83 whose bottom surface is exposed to the outside, and a plurality of integrally formed monoliths having different heights from the basic portion 83. A die pad 82 having chip support portions 84 and 85 of
The die bonding agent 86 is formed by the plurality of chip supporting portions 84 and 85.
A plurality of semiconductor chips 87 and 88 supported via
Terminal 89 having its tip arranged around die pad 82
A wire 90 such as a gold wire for electrically connecting the terminal 89 to each of the semiconductor chips 87 and 88 mounted on the die pad 82; a bottom surface of the die pad 82 as an outer periphery of the semiconductor chips 87 and 88; And a sealing resin 91 that seals a region excluding one side surface and the bottom surface of the terminal.

Next, a lead frame used in the resin-encapsulated semiconductor device of this embodiment will be described with reference to FIG. FIG. 12 is a perspective view showing a basic unit of the lead frame in the first embodiment for the third purpose. 9
2 indicates the entire lead frame. Reference numeral 93 denotes a die pad support that is bent at two places and supports the die pad 82; 94, a dam bar that functions as a resin stopper in a sealing process; and 95, a slit that reduces the influence of heat.

The chip supporting portions 84 and 85 provided on the die pad 82 are formed using the lead frame 92 as a raw material so as to protrude in the height direction. The semiconductor chips 87 and 88 are both supported at their central portions by chip support portions 84 and 85, respectively. Chip support 8
For the formation of 4, 85, the punching may be stopped in the middle, or a die corresponding to the shape may be prepared and the pressing may be performed to conform to the shape.

As described above, in the first embodiment for the third object, the central portion of the semiconductor chip is supported at one place. However, the central portion may not be supported at the central portion, and may be supported according to the size of the semiconductor chip to be mounted. May be supported at a plurality of locations so that the position is stable. Further, although the chip support portions 84 and 85 are provided in a direction parallel to the side of the die pad 82, they may be provided in a diagonal direction, or may be provided in various other ways. In addition, the chip support 8
In addition to the circular shapes shown in the embodiment, the shapes of the materials 4 and 85 can be formed by using a lead frame such as a rectangle or a polygon as a raw material and can be variously modified. Further, although two semiconductor chips are mounted on the resin-encapsulated semiconductor device, the number of chip supporting portions may be increased to three or more. The point is that a plurality of chip supports are provided on a part of a die pad whose back surface is exposed using a lead frame as a base material, and a plurality of semiconductor chips are arranged and mounted on a resin-sealed semiconductor device. The electrical connection between the mounted semiconductor chips by wires may be made as needed.

A second embodiment for the third object of the present invention will be described. First, the configuration of the semiconductor device will be described with reference to FIGS. FIGS. 13 and 14 are a front sectional view and a bottom view, respectively, of the semiconductor device according to the second embodiment for the third purpose. FIG. 13 shows E in FIG.
The cross section at -E1 is shown. In the figure, reference numeral 101 denotes the entire resin-sealed semiconductor device. A die pad 102 is located at the center and has a back side exposed, and 103 is an auxiliary member integrally fixed to the die pad 102, and has two chip supporting portions 104 and 105. Reference numeral 106 designates the semiconductor chips 107 and 108 as chip support portions 10 respectively.
Die bonding agent for fixing to 4,105. 1
09 is a terminal provided to surround the die pad 102;
Reference numeral 110 denotes a wire that connects an electrode pad (not shown) of the semiconductor chips 107 and 108 to the terminal 109. 1
11 is a sealing resin for protecting the whole.

As described above, the resin-encapsulated semiconductor device of this embodiment has the die pad 102 whose bottom is exposed to the outside.
And a plurality of chip supporting portions 10 having a height different from that of the die pad 102 and fixed to the die pad 102.
And an auxiliary member 103 having
Semiconductor chips 107, 10 supported by a plurality of chip supporting portions 104, 105 via a die bonding agent 106
8, a terminal 109 having a tip disposed around the die pad 102, a wire 108 such as a gold wire electrically connecting the terminal 109 and the semiconductor chips 107 and 108 mounted on the die pad 102, and a semiconductor chip 107. , 1
08, the bottom surface of the die pad 102 and the terminal 1
09 and a sealing resin 111 which seals a region excluding the side surface and the bottom surface of the terminal.

Next, a lead frame to which an auxiliary member used in the resin-sealed semiconductor device of this embodiment is fixed will be described with reference to FIG. FIG. 15 is a perspective view showing a basic unit of a lead frame to which an auxiliary member is fixed in the second embodiment for the third purpose. In the figure, 112
Denotes the entire lead frame. Reference numeral 113 denotes a die pad support that is bent at two places and supports the die pad 102, 114 denotes a dam bar that serves as a resin stopper in a sealing process, and 115 denotes a slit that reduces the influence of heat.

The auxiliary member 103 integrally fixed to the die pad 102 is formed by bending a rectangular sheet metal to form two chip supporting portions 104 and 105. The semiconductor chips 107 and 108 are both supported at their central portions by chip supporting portions 104 and 105, respectively. Since the base material of the auxiliary member 103 is different from the lead frame 112, there is no restriction on the shape and dimensions. Here, the chip supporting portions 104 and 105 are provided so as to protrude from the die pad 102, and the distance between the centers of the semiconductor chips 107 and 108 is increased. Since the supporting height of the semiconductor chips 107 and 108 can be set freely, the height is set higher than that of the first embodiment for the third purpose. Further, the sealing resin 1 in the semiconductor device 101 is formed by the auxiliary member 103.
The volume of 11 and its shape have changed greatly. As a method of integrally fixing the auxiliary member 103 to the die pad 102, there are laser welding, solder joining, adhesion, and the like, but a method having good heat conductivity between the members is desirable.

As described above, in the second embodiment for the third object, the central portion of the semiconductor chip is supported at one place. However, the central portion may not be located at the central portion, and may be supported depending on the size of the semiconductor chip to be mounted. May be supported at a plurality of locations so that the position is stable. Even if the chip supporting portion is provided at one position, the size of the supporting portion can be freely set because the original material is different from the lead frame. Although one auxiliary member is fixed to the die pad, a plurality of auxiliary members may be used. Further, the chip supporting portion is provided in a direction parallel to the side of the die pad, but may be in a diagonal direction,
Various other methods are also possible. The auxiliary member can be deformed into various shapes formed by various materials and processing methods other than those shown in the embodiments, and the chip supporting position and the chip supporting height can also be variously modified. Further, although two semiconductor chips are mounted on the semiconductor device, three or more semiconductor chips may be provided by increasing the chip supporting portion. The point is that an auxiliary member is integrally fixed to a die pad whose back surface is exposed, and a plurality of semiconductor chips are arranged and mounted on a semiconductor device. The electrical connection between the mounted semiconductor chips by wires may be made as needed.

A third embodiment for the third object of the present invention will be described. First, referring to FIGS. 16 and 17,
The configuration of the resin-sealed semiconductor device will be described. FIG.
FIG. 17 is a front sectional view and a bottom view of a resin-sealed semiconductor device according to the third embodiment for the third purpose. FIG. 16 shows a cross section taken along a line FF1 in FIG. In the figure, it is assumed that 121 represents the entire resin-sealed semiconductor device. Reference numeral 122 denotes a die pad at the center, which is a basic part 123 and two chip supporting parts 124 and 125.
Consists of Reference numeral 126 denotes a die bonding agent for fixing the semiconductor chips 127 and 128 to the chip supporting portions 124 and 125, respectively. 129 is a terminal provided to surround the die pad 122, and 130 is a semiconductor chip 127, 1
These wires connect the electrode pads (not shown) and the terminals 129. 131 is a sealing resin for protecting the whole.

As described above, the resin-encapsulated semiconductor device of the present embodiment has the basic portion 123 whose bottom is exposed to the outside,
The height of the basic portion 123 is different from that of the basic portion 123, and
3 and a die pad 122 having chip support portions 124 and 125 of two or more different heights from the basic portion 123, and die bonding by the chip support portions 124 and 125 so as to overlap each other in a plane. Semiconductor chips 127 and 128 supported via the agent 126, terminals 129 each having a tip disposed around the die pad 122,
A wire 130 such as a gold wire that electrically connects the terminal 129 and the semiconductor chips 127 and 128 mounted on the die pad 122, a bottom surface of the die pad 122 as an outer periphery of the semiconductor chips 127 and 128, and one side surface of the terminal 129. And a sealing resin 131 which seals a region excluding the bottom surface of the terminal.

Next, a lead frame used in the resin-encapsulated semiconductor device of this embodiment will be described with reference to FIG. FIG. 18 is a perspective view showing a basic unit of the lead frame in the third embodiment for the third purpose. In the drawing, 132 indicates the entire lead frame. 1
Reference numeral 33 denotes a die pad support that is bent at two places and supports the die pad 122, 134 denotes a dam bar that functions as a resin stopper in a sealing process, and 135 denotes a slit that reduces the influence of heat.

The chip supporting portions 124 and 125 provided on the die pad 122 are formed at different heights using the lead frame 132 as a raw material. Semiconductor chip 12
7 and 128 are mounted on the semiconductor device 121 such that their central portions are supported by chip supporting portions 124 and 125, respectively, and have a planar overlap. In this case, since the arrangement of the chip supporting portions 124 and 125 is restricted, the size of the lower chip cannot be so large, and the combination of chip sizes that can be mounted is also small. For the formation of the chip supporting portions 124 and 125, a die corresponding to the shape may be prepared and press working may be performed to conform to the shape, or punching may be stopped halfway. However, there is a limit to the height that can be formed by a process in which the punching is stopped halfway, so that the height difference between the two chip supporting portions cannot be made larger than the thickness of the semiconductor chip only by this process.

As described above, in the third embodiment for the third object, the central portion of the semiconductor chip is supported at one place. However, the central portion may not be supported, and the support may be stable depending on the size of the semiconductor chip. It may be supported at a plurality of places as shown in FIG. Further, the chip supporting portion is provided in a direction parallel to the side of the die pad, but may be provided in a diagonal direction, and various other methods are also possible. In addition to the shape shown in the embodiment, the shape of the chip supporting portion can be variously deformed by using a lead frame as a raw material. Further, although two semiconductor chips are mounted on the semiconductor device, three or more semiconductor chips may be provided by increasing the chip supporting portion. The point is that using the lead frame as the original material, a plurality of chip support parts are provided on a part of the die pad where the back side is exposed, and a plurality of semiconductor chips are mounted on the semiconductor device so that they overlap in a plane. is there. Note that electrical connection between the mounted semiconductor chips by wires is possible as long as the lower semiconductor chip is not completely hidden in a plane from the upper semiconductor chip, and may be performed as needed.

A fourth embodiment for the third object of the present invention will be described. First, referring to FIGS. 19 and 20,
The configuration of the resin-sealed semiconductor device will be described. FIG.
FIG. 20 is a front sectional view and a bottom view of the semiconductor device according to the fourth embodiment for the third purpose. FIG.
Indicates a section taken along a line GG1 in FIG. In the figure, it is assumed that 141 represents the entire resin-sealed semiconductor device.
142 is a die pad in the center, the back side of which is exposed,
An auxiliary member 143 is integrally fixed to the die pad 142, and has two chip supporting portions 144 and 145.
146 is a die bonding agent for fixing the semiconductor chips 147 and 148 to the chip supporting portions 144 and 145, respectively. 149 is a terminal provided so as to surround the die pad 142, and 150 is a wire connecting the electrode pad (not shown) of the semiconductor chips 147 and 148 to the terminal 149. 151 is a sealing resin for protecting the whole.

As described above, in the resin-encapsulated semiconductor device of this embodiment, the die pad 142 whose bottom is exposed to the outside is provided.
And an auxiliary member 143 having a height different from that of the die pad 142 and fixed to the die pad 142 and having a plurality of stepped chip supporting portions 144 and 145, and an auxiliary member 143 having a planar overlap. A semiconductor chip 147, 148 supported by a plurality of chip supports 144, 145 via a die bonding agent 146;
A terminal 149 having its tip disposed around 42 and the semiconductor chip 1 mounted on the terminal 149 and the die pad 142
47, 148, and a wire 150 such as a gold wire electrically connected to the semiconductor chips 147, 148.
It comprises a bottom surface of the die pad 142 and a sealing resin 151 which seals a region excluding one side surface of the terminal 149 and the bottom surface of the terminal.

Next, a lead frame to which the auxiliary member of this embodiment is fixed will be described with reference to FIG. FIG.
FIG. 14 is a perspective view showing a basic unit of a lead frame to which an auxiliary member is fixed in a fourth embodiment for a third purpose. In the drawing, 152 indicates the entire lead frame. 153 is bent at two places and the die pad 14
The die pad support 154 supports the dam 2 and the dam bar 155 serves as a resin stopper in the sealing process. The slit 155 reduces the influence of heat.

The auxiliary member 143 integrally fixed to the die pad 142 is formed by bending a rectangular sheet metal to form two chip support portions 144 and 145. The semiconductor chips 147 and 148 are both supported at their central portions by chip support portions 144 and 145, respectively. Since the base material of the auxiliary member 143 is different from the lead frame 152, there is no restriction on the shape and dimensions. Here, the chip supporting portion 145 is provided so as to protrude from the die pad, and is mounted on the semiconductor device 141 such that the semiconductor chips 147 and 148 have a planar overlap. In this case, since there is no restriction on the arrangement of the chip support portions 144 and 145, the size of the lower chip can be increased, and there are many combinations of chip sizes that can be mounted. Since the supporting height of the semiconductor chips 147 and 148 can be freely set, the height is set higher than that of the third embodiment for the third purpose. Auxiliary member 1
43 is integrally fixed to the die pad 142.
Although there are laser welding, solder joining, adhesion, and the like, those having good heat conductivity between members are desirable.

As described above, in the fourth embodiment for the third object, the central portion of the semiconductor chip is supported at one place. However, the central portion may not be supported, and the support may be stable depending on the size of the semiconductor chip. It may be supported at a plurality of places as shown in FIG. Even if the chip supporting portion is provided at one position, the size of the supporting portion can be freely set because the original material is different from the lead frame. Further, the chip supporting portion is provided in a direction parallel to the side of the die pad, but may be provided in a diagonal direction, and various other methods are also possible. Although one auxiliary member is fixed to the die pad, a plurality of auxiliary members may be used. The auxiliary member can be deformed into various shapes formed by various materials and processing methods other than those shown in the embodiments, and the chip supporting position and the chip supporting height can also be variously modified. Further, although two semiconductor chips are mounted on the semiconductor device, three or more semiconductor chips may be provided by increasing the chip supporting portion. The point is that the auxiliary member is integrally fixed to the die pad whose back side is exposed, and a plurality of semiconductor chips are mounted on the semiconductor device so as to overlap in a plane. Note that electrical connection between the mounted semiconductor chips by wires is possible as long as the lower semiconductor chip is not completely hidden in a plane from the upper semiconductor chip, and may be performed as needed.

Although the description has been given of the QFN type, the present invention is applicable to all types of resin-sealed semiconductor devices using a lead frame.

[0063]

As described above, according to the resin-encapsulated semiconductor device which attains the first object of the present invention, the basic portion exposed to the outside and a plurality of supports having substantially the same height as the basic portion are provided. Since the semiconductor chip can be supported according to its area by having a die pad having a part and a semiconductor chip supported by a plurality of support parts, the mounting posture of the semiconductor chip is stabilized, and the inconvenience in the manufacturing process is reduced. Elimination of the possibility of occurrence. In addition, since the rigidity required for the semiconductor chip is reduced by increasing the number of support points, the semiconductor chip may be thinned, and the semiconductor device may be thinned. At this time, the support point of the semiconductor chip can be brought close to the end of the semiconductor chip, and stable support is possible. In addition, the boundary path from the exposed portion of the die pad to the semiconductor chip, which is a feature of the structure, is formed. The long and reliable feature is maintained.

According to the resin-encapsulated semiconductor device which achieves the second object of the present invention, a die pad exposed to the outside, an auxiliary member fixed to the die pad and having a support portion, and a support member supported by the support portion The semiconductor chip can be supported according to the area of the semiconductor chip, and the supporting position and the supporting height of the semiconductor chip can be freely set. The shape retention, that is, the reliability is improved with respect to the humidity change. At this time, the most stable support can be performed with the support point of the semiconductor chip as the end of the semiconductor chip, and the size range of the semiconductor chip that can be mounted on the same size semiconductor device while supporting the end is wide.

According to the first resin-sealed semiconductor device which achieves the third object of the present invention, the basic portion exposed to the outside and the plurality of support portions having different heights from the basic portion are provided. By having a die pad and a plurality of semiconductor chips supported by the plurality of support portions so that they do not overlap each other in a plane, a plurality of semiconductor chips can be mounted side by side on a semiconductor device, so that a plurality of functions can be implemented. By packaging, the mounting area and the weight on the printed wiring board can be reduced. That is, space saving can be realized as compared with mounting a plurality of semiconductor chips on different semiconductor devices.

According to the second resin-encapsulated semiconductor device which achieves the third object of the present invention, it has a die pad exposed to the outside and a total of two or more support portions fixed to the die pad. A semiconductor device having at least one auxiliary member and a plurality of semiconductor chips supported by the supporting portion so that they do not overlap each other in a plane, allows a semiconductor chip to be freely supported at a supporting position and a supporting height. Since a plurality of semiconductor chips can be mounted side by side, a single package of a plurality of functions can be realized with a well-balanced structure, and the mounting area and weight can be reduced. At this time, there is no restriction on the arrangement of the support portions of the semiconductor chips, and there are many combinations of semiconductor chip sizes that can be mounted side by side on semiconductor devices of the same size, and the effect is large.

According to the third resin-encapsulated semiconductor device which achieves the third object of the present invention, the basic portion exposed to the outside and the support portion having two or more different heights from the basic portion are provided. Having a die pad and a plurality of semiconductor chips supported by the plurality of support portions so as to have a planar overlap, a plurality of semiconductor chips can be mounted on the semiconductor device so as to have a planar overlap. Therefore, a plurality of functions can be integrated into one package at high density to reduce the mounting area and weight. That is, space saving can be realized as compared with mounting a plurality of semiconductor chips side by side.

Further, the fourth object for achieving the third object of the present invention is as follows.
According to the resin-encapsulated semiconductor device described above, the die pad exposed to the outside, the one or more auxiliary members fixed to the die pad and having two or more types of support portions in total, have a planar overlap. By having a plurality of semiconductor chips supported by the support portion as described above, a plurality of semiconductor chips can be mounted on the semiconductor device so as to have a two-dimensional overlap on a semiconductor device while freely supporting a semiconductor chip at a supporting position and supporting height. Therefore, a high-density one-package of a plurality of functions can be realized with a well-balanced structure, and the mounting area and weight can be reduced. At this time, there is no restriction on the arrangement of the supporting portions of the semiconductor chips, and there are many combinations of semiconductor chip sizes that can be mounted so that semiconductor devices of the same size are overlapped in a plane, and the effect is large.

[Brief description of the drawings]

FIG. 1 is a sectional view showing a resin-encapsulated semiconductor device according to a first embodiment of the present invention for a first object;

FIG. 2 is a bottom view showing the resin-encapsulated semiconductor device according to the first embodiment for the first object of the present invention;

FIG. 3 is a perspective view showing a lead frame according to the first embodiment for the first object of the present invention;

FIG. 4 is a perspective view showing a die pad of a lead frame according to a second embodiment for the first object of the present invention;

FIG. 5 is a perspective view showing a die pad of a lead frame according to a third embodiment for the first object of the present invention;

FIG. 6 is a sectional view showing a resin-encapsulated semiconductor device according to the first embodiment for the second object of the present invention;

FIG. 7 is a bottom view showing the resin-encapsulated semiconductor device according to the first embodiment for the second object of the present invention;

FIG. 8 is a perspective view showing a lead frame to which an auxiliary member is fixed according to the first embodiment for the second object of the present invention;

FIG. 9 is a perspective view showing a die pad of a lead frame to which an auxiliary member is fixed in a second embodiment for the second object of the present invention.

FIG. 10 is a sectional view showing a resin-encapsulated semiconductor device according to the first embodiment for the third object of the present invention;

FIG. 11 is a bottom view showing the resin-encapsulated semiconductor device according to the first embodiment for the third object of the present invention;

FIG. 12 is a perspective view showing a lead frame according to the first embodiment for the third object of the present invention;

FIG. 13 is a sectional view showing a resin-encapsulated semiconductor device according to a second embodiment for the third object of the present invention;

FIG. 14 is a bottom view showing the resin-encapsulated semiconductor device according to the second embodiment for the third object of the present invention;

FIG. 15 is a perspective view showing a lead frame to which an auxiliary member is fixed in a second embodiment for the third object of the present invention;

FIG. 16 is a sectional view showing a resin-encapsulated semiconductor device according to a third embodiment for the third object of the present invention;

FIG. 17 is a bottom view showing a resin-sealed semiconductor device according to a third embodiment for the third object of the present invention;

FIG. 18 is a perspective view showing a lead frame according to a third embodiment for the third object of the present invention.

FIG. 19 is a sectional view showing a resin-encapsulated semiconductor device according to a fourth embodiment for the third object of the present invention;

FIG. 20 is a bottom view showing a resin-encapsulated semiconductor device according to a fourth embodiment for the third object of the present invention;

FIG. 21 is a perspective view showing a lead frame to which an auxiliary member is fixed in a fourth embodiment for the third object of the present invention.

FIG. 22 is a sectional view showing a conventional resin-encapsulated semiconductor device.

FIG. 23 is a bottom view showing a conventional resin-encapsulated semiconductor device.

FIG. 24 is a perspective view showing a lead frame of a conventional resin-encapsulated semiconductor device.

[Explanation of symbols]

11, 31, 61, 81, 101, 121, 141 Resin-sealed semiconductor device 12, 32, 46, 51, 62, 74, 82, 102,
122,142 Die pad 13,33,47,83,123 Basic part 14,34,48,53,64,76,84,85,1
04, 105, 124, 125, 144, 145 Chip support 15, 35, 65, 87, 88, 107, 108, 12
7, 128, 147, 148 Semiconductor chip 16, 36, 66, 86, 106, 126, 146 Die bonding agent 17, 37, 67, 89, 109, 129, 149 Terminal 18, 38, 68, 90, 110, 130, 150 wire 19, 39, 69, 91, 111, 131, 151 sealing resin

 ────────────────────────────────────────────────── ─── Continued on the front page F term (reference) 4M109 AA01 BA02 CA21 DB03 FA01 FA04 5F047 AA11 AB00 AB06 5F067 AA01 AA03 AA04 AB04 BE00 BE02 BE06 BE08 CA02 CA03 DA05 DE09 DF16

Claims (6)

[Claims] A die pad supporting a semiconductor chip;
A terminal whose tip is arranged around the die pad,
A resin-encapsulated semiconductor device comprising: a member that electrically connects the semiconductor chip and the terminal; and a sealing resin that exposes a bottom surface of the die pad and seals an outer periphery of the semiconductor chip. The die pad has a basic portion exposed to the outside of the sealing resin, and a plurality of support portions formed integrally with the basic portion and having substantially the same height as the basic portion, wherein the plurality of support portions are provided. A resin-encapsulated semiconductor device, wherein the semiconductor chip is supported by a portion. 2. A die pad supporting a semiconductor chip,
A terminal whose tip is arranged around the die pad,
A resin-encapsulated semiconductor device comprising: a member that electrically connects the semiconductor chip and the terminal; and a sealing resin that exposes a bottom surface of the die pad and seals an outer periphery of the semiconductor chip. A resin-encapsulated semiconductor, wherein a bottom surface of the die pad is exposed to the outside of the sealing resin, an auxiliary member having a support portion is separately provided, and the semiconductor chip is supported by the support portion. apparatus. 3. A die pad supporting a semiconductor chip,
A terminal whose tip is arranged around the die pad,
A resin-encapsulated semiconductor device comprising: a member that electrically connects the semiconductor chip and the terminal; and a sealing resin that exposes a bottom surface of the die pad and seals an outer periphery of the semiconductor chip. The die pad is formed integrally with the basic portion exposed to the outside of the sealing resin and has a plurality of support portions having different heights from the basic portion, and has no planar overlap with each other. A plurality of semiconductor chips are supported by the plurality of support portions in a state. 4. A die pad supporting a semiconductor chip,
A terminal whose tip is arranged around the die pad,
A resin-encapsulated semiconductor device comprising: a member that electrically connects the semiconductor chip and the terminal; and a sealing resin that exposes a bottom surface of the die pad and seals an outer periphery of the semiconductor chip. The die pad has a bottom surface exposed to the outside of the sealing resin, and has an auxiliary member having two or more support portions separately. A resin-encapsulated semiconductor device, wherein a semiconductor chip is supported. 5. A die pad supporting a semiconductor chip,
A terminal whose tip is arranged around the die pad,
A resin-encapsulated semiconductor device comprising: a member that electrically connects the semiconductor chip and the terminal; and a sealing resin that exposes a bottom surface of the die pad and seals an outer periphery of the semiconductor chip. The die pad has a basic portion exposed to the outside of the sealing resin, and is formed integrally with the basic portion, and has a plurality of support portions having different heights from the basic portion and two or more kinds of heights. A plurality of semiconductor chips are supported by the plurality of support portions in a state where the plurality of semiconductor chips overlap each other in a planar manner. 6. A die pad supporting a semiconductor chip,
A terminal whose tip is arranged around the die pad,
A resin-encapsulated semiconductor device comprising: a member that electrically connects the semiconductor chip and the terminal; and a sealing resin that exposes a bottom surface of the die pad and seals an outer periphery of the semiconductor chip. The die pad has a bottom surface exposed to the outside of the sealing resin and has a height different from each other.
A resin-encapsulated semiconductor device, further comprising an auxiliary member having one or more support portions, wherein a plurality of semiconductor chips are supported by the plurality of support portions in a state of being mutually superimposed on a plane.