JP2001118882A - Semiconductor device and packaging structure of the semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent a semiconductor element mounted by a TAB system from being broken by thermal stress due to contact of the element with a packaging board, when a semiconductor device itself is mounted on the packaging board along with a heat sink. SOLUTION: An elastic insulating resin 7 is provided on the surface region of a semiconductor element 5. Accordingly, even if impact is applied to the surface of the element 5 when a semiconductor device itself is mounted on a packaging board turning the surface of the element 5 to the side of the packaging board, the impact is absorbed by the resin 7, can be relaxed and reliability can be obtained. In particular, in the case where the device itself is mounted on the packaging board turning the surface of the element 5 to the side of the packaging board and a heat sink is provided on the side of the bottom of the device, the device causes deflection, the surface of the element 5 abuts on the packaging board and the impact can be applied to the surface of the element 5, but the impact can be absorbed by the resin 7, relaxed, and reliability can be obtained.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a TA using a tape carrier having a conductor wiring pattern formed on a resin tape.
B (Tape Automated Bonding)
The present invention relates to a semiconductor device and a mounting structure of the semiconductor device which are effective when attaching a heat radiating plate for dissipating heat from an element to a package or a COF (Chip On Film) package.

[0002]

2. Description of the Related Art At present, most of IC parts and semiconductor products have very low product unit prices, and further cost reduction is always required. Under such circumstances, TAB packages and COF packages using a tape carrier such as TAB have few manufacturers of base tapes, and are very expensive products as compared with conventional resin-sealed packages. In addition, along with the miniaturization of products, users of semiconductor devices have requested that a heat sink be attached to a semiconductor element, and it is necessary to customize the package. However, there are many cases where the cost is not justified.

A conventional TAB package with a heat sink is
In order to ship with the AB package and the heat sink attached, a heat sink, a shipping tray, and the like dedicated to the package are required. Therefore, investment by adding and remodeling many facilities was necessary. A large amount of investment is possible if the semiconductor device uses a special and high-priced semiconductor element.
Inexpensive semiconductor devices such as liquid crystal display drivers, which are often used in TAB packages, could not invest much.

FIG. 6 is a sectional view showing a TAB package as a conventional semiconductor device.

As shown in FIG. 6, a conventional TAB package includes a tape carrier 3 having a conductor tape 2 formed on a resin tape 1 and an opening region of the tape carrier 3.
A semiconductor element 5 in which the conductor wiring 2 of the tape carrier 3 and its surface electrode (not shown) are connected via bumps 4
And a protective insulating resin 6 provided on the element surface including a connection portion between the conductor wiring 2 and the surface electrode of the semiconductor element 5.

When a heat radiating plate is provided for the TAB package shown in FIG. 6, the heat radiating plate is bonded to the bottom surface of the semiconductor element 5 and shipped to the user in that state.

[0007]

However, in the conventional semiconductor device, when the semiconductor device itself is mounted on a mounting board together with a heat sink, there is a possibility that the semiconductor element mounted on the TAB by contact with the mounting board may be broken by thermal stress. was there.
In addition, as the package itself (semiconductor device) is required to be downsized due to downsizing of a set product, etc., a structure in which a heat sink is attached to each semiconductor element requires a plurality of the same semiconductor devices such as a driver for a liquid crystal display. When mounted, there is a problem that the space cannot be used effectively.

SUMMARY OF THE INVENTION An object of the present invention is to solve the above-mentioned conventional problems. In a semiconductor device using a tape carrier such as TAB, when mounted on a substrate together with a heat sink, the reliability of the semiconductor device is ensured and the production equipment is modified. It is an object of the present invention to provide a semiconductor device which can reduce the number of semiconductor elements at a very low cost and can simultaneously attach a heat sink to a plurality of semiconductor elements.

[0009]

In order to solve the above-mentioned conventional problems, a semiconductor device according to the present invention has the following configuration.

That is, a semiconductor device according to the present invention includes a tape carrier having conductive wiring formed on a resin tape, a semiconductor element having conductive wiring of the tape carrier and its surface electrode connected via bumps, A semiconductor device comprising: a protective insulating resin provided on a surface of a semiconductor element including a connection portion between a conductor wiring and a surface electrode of the semiconductor element; and an elastic insulating resin provided on the insulating resin.

Further, the insulating resin is an epoxy resin,
The elastic insulating resin is a semiconductor device that is an elastomer insulating resin.

The insulating resin is an epoxy resin,
The elastic insulating resin is a semiconductor device that is a sheet-shaped elastomer insulating resin.

The semiconductor device according to the present invention also provides a tape carrier in which conductor wiring is formed on a resin tape, a semiconductor element in which the conductor wiring of the tape carrier and its surface electrode are connected via bumps, A semiconductor device comprising a protective elastic insulating resin provided on a surface of a semiconductor element including a connection portion between a wiring and a surface electrode of the semiconductor element.

The elastic insulating resin is a semiconductor device which is an elastomer insulating resin.

The elastic insulating resin is a semiconductor device which is a sheet-like elastomer insulating resin.

The semiconductor device according to the present invention also provides a tape carrier in which conductor wiring is formed on a resin tape, a semiconductor element in which the conductor wiring of the tape carrier and its surface electrode are connected via bumps, It comprises an insulating resin for protection provided on the surface of the semiconductor element including a connection portion between the wiring and the surface electrode of the semiconductor element, and an elastic insulating resin provided via the resin tape on the insulating resin. It is a semiconductor device.

[0017] A mounting structure of a semiconductor device according to the present invention comprises: a tape carrier having conductor wiring formed on a resin tape; a semiconductor element in which the conductor wiring of the tape carrier and its surface electrode are connected via bumps; For a semiconductor device comprising an insulating resin for protection provided on the surface of a semiconductor element including a connection portion between the conductor wiring and a surface electrode of the semiconductor element, and an elastic insulating resin provided on the insulating resin. A mounting structure of a semiconductor device mounted on a mounting board by providing a heat radiating member, wherein a heat radiating member is provided via an adhesive layer on a bottom surface of the semiconductor element of the semiconductor device, and the upper surface of the semiconductor device and The semiconductor device in which the elastic insulating resin provided on the semiconductor device is closely attached to the gap between the mounting board and the heat dissipation member is fixed to the mounting board by a holding member. It is a mounting structure of.

As described above, since the elastic insulating resin is provided on the surface region of the semiconductor element, when the semiconductor device itself is mounted with the surface of the semiconductor element facing the mounting substrate, distortion due to thermal stress or the like causes Even when the surface of the semiconductor element and the mounting substrate are in contact with each other via the insulating resin and an impact is applied to the surface of the semiconductor element, the impact can be absorbed and reduced by the elastic insulating resin, and reliability can be obtained.

Further, since the semiconductor device itself is provided with the elastic insulating resin in consideration of the formation of the heat radiating plate and the fixation to the mounting substrate, the semiconductor device can be mounted on the substrate with high reliability.

That is, in the semiconductor device of the present invention, the heat sink is not directly attached to the package, but the material is changed or added so that the heat sink can be easily attached. This can be handled by making small changes to existing equipment. Also,
There is an advantage that the shape of the provided heat sink can be freely changed on the user side (customer).

[0021]

DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the semiconductor device of the present invention and its mounting structure will be described below with reference to the drawings.

First, an embodiment of the semiconductor device of the present invention will be described. FIG. 1 is a sectional view showing the semiconductor device of the present embodiment.

As shown in FIG. 1, the semiconductor device according to the present embodiment is a TAB type semiconductor device, in which a tape carrier 3 having a conductor wiring 2 formed on a resin tape 1 and an opening of the tape carrier 3 are provided. A semiconductor element 5 in which each conductor wiring 2 and its surface electrode are connected via bumps 4
A protective insulating resin 6 provided on the surface of the semiconductor element 5 including a connection portion between the conductor wiring 2 and the surface electrode of the semiconductor element 5, and an elastic insulating resin 7 provided on the insulating resin 6. And a semiconductor device comprising:

In the semiconductor device of this embodiment, the insulating resin 6 is an epoxy resin, and the elastic insulating resin 7 is an elastomer resin having a higher elastic modulus than the epoxy resin.
Second-layer elastic insulating resin 7 formed on insulating resin 6
Has a thickness of 200 [μm] to 400 [μm], and preferably 300 [μm]. This elastomer resin can be formed by a potting method. In the semiconductor device of the present embodiment, in particular, for the purpose of providing a heat sink to the semiconductor device, it is effective to implement on the user side only by providing an elastic insulating resin on the second layer before the product is shipped.

Further, by using a sheet-like elastomer resin for the elastic insulating resin 7, the second-layer resin can be formed easily and at low cost, which is efficient.

In the semiconductor device of this embodiment, since the elastic insulating resin 7 is provided in the surface region of the semiconductor element 5, when the semiconductor device itself is mounted with the surface of the semiconductor element 5 facing the mounting substrate side, the heat is not applied. The semiconductor element 5 is distorted by stress or the like.
Even if a shock is applied to the surface of the semiconductor element when the surface of the semiconductor element comes into contact with the mounting substrate, the shock can be absorbed and mitigated by the elastic insulating resin 7, and reliability can be obtained. In particular, when the semiconductor device itself is mounted with the surface of the semiconductor element 5 facing the mounting substrate side, a heat sink is provided on the bottom surface side of the semiconductor device, and the heat sink and the mounting substrate are fixed with a fixing jig, Even if the semiconductor device itself is firmly fixed and there is no escape for thermal stress, the semiconductor device bends, the surface of the semiconductor element 5 comes into contact with the mounting substrate, and even if an impact is applied to the surface of the semiconductor element 5 The impact can be absorbed and reduced by the elastic insulating resin 7, and reliability can be obtained.

The semiconductor device of this embodiment may have a structure in which the insulating resin 6 on the surface of the semiconductor element 5 is not provided and the surface of the semiconductor element 5 is covered with a single layer of elastic insulating resin 7.
That is, as shown in FIG. 2, the tape carrier 3 having the conductor wiring 2 formed on the resin tape 1 and the conductor wiring 2 and its surface electrode are connected via the bump 4 at the opening of the tape carrier 3. And a protective elastic insulating resin 7 provided on the surface of the semiconductor element 5 including the connection portion between the conductor wiring 2 and the surface electrode of the semiconductor element 5.

Also in this structure, the semiconductor device itself is mounted with the surface of the semiconductor element 5 facing the mounting substrate side, a heat sink is provided on the bottom surface side of the semiconductor device, and a jig for fixing the heat sink and the mounting substrate is provided. In this case, the semiconductor device itself is firmly fixed, there is no escape for thermal stress, the semiconductor device bends, and the surface of the semiconductor element 5 and the mounting substrate come into contact with each other. Can be absorbed and mitigated by one layer of the elastic insulating resin 7, and reliability can be obtained.

Next, another embodiment of the semiconductor device of the present invention will be described. FIG. 3 is a sectional view showing the semiconductor device of the present embodiment, which is a COF type semiconductor device.

The semiconductor device of this embodiment has a tape carrier 3 in which conductor wiring 2 is formed on a resin tape 1 having no opening, and each conductor wiring 2 of the tape carrier 3 and its surface electrode are bumped. 4, a protective insulating resin 6 provided on the surface of the semiconductor element 5 including a connection portion between the conductor wiring 2 and the surface electrode of the semiconductor element 5, and the insulating resin. 6 is a semiconductor device comprising an elastic insulating resin 7 provided on a resin tape 1 via a resin tape 1.

In the semiconductor device of this embodiment, the insulating resin 6 is an epoxy resin, and the elastic insulating resin 7 is an elastomer resin having a higher elastic modulus than the epoxy resin.
The thickness of the resin is the same as described above.

The semiconductor device of the present embodiment is obtained by applying the elastic insulating resin 7 to the COF type semiconductor device. When the semiconductor device is mounted on a mounting board or mounted together with a heat sink. In this case, even if the semiconductor device itself bends or the semiconductor device comes into contact with the mounting substrate and an impact is applied to the semiconductor device, the impact can be absorbed and reduced by the elastic insulating resin 7 to obtain reliability. Can be.

Next, the mounting structure of the semiconductor device of the present invention will be described.

FIG. 4 is a sectional view showing a mounting structure of the semiconductor device of the present embodiment, and shows a structure in which a heat radiation member is provided on the semiconductor device shown in FIG. 1 and mounted on a mounting board.

As shown in FIG. 4, the mounting structure of the semiconductor device according to the present embodiment includes a tape carrier 3 in which conductor wiring 2 is formed on a resin tape 1, and a conductor wiring 2 in an opening of the tape carrier 3. Element 5 whose surface electrode is connected via bumps 4 and a protective insulating resin provided on the surface of semiconductor element 5 including the connection portion between conductor wiring 2 and the surface electrode of semiconductor element 5. A heat sink 8 is provided as a heat radiating member for a semiconductor device comprising an elastic insulating resin 7 provided on the insulating resin 6 and a mounting board 9.
A mounting structure of a semiconductor device mounted thereon, wherein a heat sink 8 is provided on a bottom surface of a semiconductor element 5 of the semiconductor device via an adhesive layer 10, and a gap between an upper surface of the semiconductor device and a mounting substrate 9 is provided. This is a semiconductor device mounting structure in which an elastic insulating resin 7 provided in the device is closely interposed and a heat radiating plate 8 is fixed to a mounting substrate 9 by a fixing jig 11.

In the mounting structure of the semiconductor device of this embodiment,
When the semiconductor device itself is mounted with the surface of the semiconductor element 5 facing the mounting substrate side, a heat sink 8 is provided on the bottom surface side of the semiconductor device, and the heat sink 8 and the mounting substrate 9 are fixed by a fixing jig 11. In addition, the semiconductor device itself is firmly fixed, there is no escape of thermal stress, the semiconductor device bends, and the surface of the semiconductor element 5 and the mounting substrate 9 come into contact via the insulating resin 6, Even if a shock is applied to the surface of the element 5, the shock is absorbed by the elastic insulating resin 7 interposed therebetween.
It is a structure that can be relaxed and reliability can be obtained.

In this embodiment, the TAB shown in FIG.
Although the mounting structure of the semiconductor device of the system is shown, it can be similarly applied to the semiconductor device of the embodiment shown in FIGS. 2 and 3 other than the semiconductor device shown in FIG.

Usually, a low cost TAB method or CO
It is up to the user to provide a heat sink on the F-type semiconductor device and mount it on the user side. As shown in this embodiment, it is assumed that the heat sink is formed on the semiconductor device itself and fixed to the mounting board. Since the resin 7 is provided, the semiconductor device can be mounted on the substrate with high reliability.

Further, instead of a structure in which a heat radiating plate is provided for each semiconductor device, a heat radiating plate can be provided as a post-process and mounted on a substrate, and as shown in a plan view of FIG. By mounting a plurality of semiconductor devices 12 on a substrate and then providing a single radiating plate 13 in contact with the plurality of semiconductor devices 12, a low cost and space-saving mounting area can be realized. It is.

[0040]

As described above, in the semiconductor device of the present invention, the elastic insulating resin is provided in the surface region of the semiconductor element. Therefore, when the semiconductor device itself is mounted with the surface of the semiconductor element facing the mounting substrate, the heat is not generated. Even if the surface of the semiconductor element and the mounting substrate come into contact with each other via the insulating resin due to stress or the like and an impact is applied to the surface of the semiconductor element, the impact can be absorbed and moderated by the elastic insulating resin, and reliability can be improved. Can be obtained. In addition, since the semiconductor device itself is provided with the elastic insulating resin in consideration of the formation of the heat sink and the fixation to the mounting substrate, the semiconductor device can be mounted on the substrate with high reliability.

Further, instead of directly attaching the heat sink to the package, the material is changed or added so that the heat sink can be easily attached to the semiconductor device (package).
Has almost no change in appearance and can be accommodated by small changes to existing equipment. Further, there is an advantage that the shape of the provided heat radiating plate can be freely changed on the user side (customer).

In the semiconductor device mounting structure of the present invention,
When a heat sink is provided on the bottom side of the semiconductor device and the heat sink and the mounting board are fixed with a fixing jig, the semiconductor device itself is firmly fixed, and there is no place for thermal stress to escape. Deflection occurs, and the surface of the semiconductor element and the mounting board come into contact with each other via the insulating resin, and even if a shock is applied to the surface of the semiconductor element, the shock can be absorbed and mitigated by the elastic insulating resin that intervenes. Is a structure that can be obtained.

[Brief description of the drawings]

FIG. 1 is a sectional view showing a semiconductor device according to an embodiment of the present invention;

FIG. 2 is a sectional view showing a semiconductor device according to one embodiment of the present invention;

FIG. 3 is a sectional view showing a semiconductor device according to one embodiment of the present invention;

FIG. 4 is a sectional view showing a mounting structure of a semiconductor device according to an embodiment of the present invention;

FIG. 5 is a plan view showing a mounting state of the semiconductor device according to the embodiment of the present invention;

FIG. 6 is a sectional view showing a conventional semiconductor device.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Resin tape 2 Conductor wiring 3 Tape carrier 4 Bump 5 Semiconductor element 6 Insulating resin 7 Elastic insulating resin 8 Heat sink 9 Mounting board 10 Adhesive layer 11 Stopper 12 Semiconductor device 13 Heat sink

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 4M109 AA01 AA02 BA05 CA04 DB15 EA01 EE02 5F036 AA01 BB01 BC05 BE01 BE09 5F044 KK03 NN01 RR17 RR18

Claims (8)

[Claims] A tape carrier having conductor wiring formed on a resin tape; a semiconductor element having conductor wiring of the tape carrier and a surface electrode connected via bumps;
A protective insulating resin provided on the surface of a semiconductor element including a connection portion between the conductor wiring and a surface electrode of the semiconductor element, and an elastic insulating resin provided on the insulating resin, Semiconductor device. 2. The semiconductor device according to claim 1, wherein the insulating resin is an epoxy resin, and the elastic insulating resin is an elastomer insulating resin. 3. The semiconductor device according to claim 1, wherein the insulating resin is an epoxy resin, and the elastic insulating resin is a sheet-like elastomer insulating resin. 4. A tape carrier having conductor wiring formed on a resin tape, a semiconductor element in which the conductor wiring of the tape carrier and its surface electrode are connected via bumps,
A semiconductor device comprising a protective elastic insulating resin provided on a surface of a semiconductor element including a connection portion between the conductor wiring and a surface electrode of the semiconductor element. 5. The semiconductor device according to claim 4, wherein the elastic insulating resin is an elastomer insulating resin. 6. The semiconductor device according to claim 4, wherein the elastic insulating resin is a sheet-like elastomer insulating resin. 7. A tape carrier in which conductor wiring is formed on a resin tape, a semiconductor element in which the conductor wiring of the tape carrier and its surface electrode are connected via bumps,
A protective insulating resin provided on the surface of the semiconductor element including a connection portion between the conductor wiring and a surface electrode of the semiconductor element; and an elastic insulating resin provided via the resin tape on the insulating resin. A semiconductor device comprising: 8. A tape carrier having conductor wiring formed on a resin tape, a semiconductor element in which the conductor wiring of the tape carrier and its surface electrode are connected via bumps,
For a semiconductor device comprising an insulating resin for protection provided on the surface of a semiconductor element including a connection portion between the conductor wiring and a surface electrode of the semiconductor element, and an elastic insulating resin provided on the insulating resin. A mounting structure of a semiconductor device mounted on a mounting board by providing a heat radiating member, wherein a heat radiating member is provided via an adhesive layer on a bottom surface of the semiconductor element of the semiconductor device, and the upper surface of the semiconductor device and The semiconductor device mounting structure, wherein the elastic insulating resin provided on the semiconductor device is closely interposed in a gap with the mounting substrate, and the heat radiation member is fixed to the mounting substrate by a holding member. .