JPH08213424A - Semiconductor device - Google Patents

Abstract

PURPOSE: To realize a semiconductor device which is erected and formed in a module by using a TAB semiconductor device. CONSTITUTION: A slit 16 is provided at the mounting part of the outer lead 15 of a TAB(tape automated bonding) semiconductor device by using the TAB semiconductor device, an outer lead 15 crossing the slit 16 is bent, and the bent part is connected to a printed board.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device. More specifically, the present invention relates to a semiconductor device in which a resin-sealed IC package can be mounted upright and modularized using a TAB tape.

[0002]

2. Description of the Related Art A conventional TAB semiconductor device is shown in FIG.
In this TAB semiconductor device, as shown in the figure, a semiconductor element 3 is face-bonded to an inner lead 2 provided on a support ring 1 made of a TAB tape by a bump 4 provided on the surface thereof, and then the semiconductor element is formed. Three
The inner lead 2 is sealed with resin 5, and the outer lead 6 connected to the inner lead 2 is bent and formed into a predetermined shape.

[0003]

In recent years, there has been a demand for large capacity semiconductor memory devices. Therefore, it is possible to use a plurality of single semiconductor devices. However, the mounting area becomes large only by using a plurality of the conventional semiconductor devices and arranging them in a plane. Therefore, it is necessary to make the semiconductor device upright and downsize.

The present invention is intended to realize a semiconductor device which can be made upright and modularized by using the TAB semiconductor device.

[0005]

In the semiconductor device of the present invention, a TAB semiconductor device is used, and a slit 16 is provided in a mounting portion of the outer lead 15 of the TAB semiconductor device.
The outer lead 15 crossing the slit 16 is bent, and the bent portion is used as a connecting portion to the printed board. In addition to that, a connection portion to the printed board in which the outer lead 15 is bent is provided only on one side of the semiconductor element 10. Also,
The shape of the bent portion of the outer lead is U-shaped. In addition, the tip of the lead bent portion is attached to the base film 10 with an adhesive layer interposed between the semiconductor element 1
It is characterized by being fixed to the back of 0.

On the side surface of the mounting surface of the semiconductor element 10, a columnar spacer 18 made of an insulating material and having a substantially semicircular cross section is horizontally fixed by an adhesive layer, and is fixed to the side surface of the spacer 18. Along the outer lead 15 of the slit
It is characterized by bending. Further, a reinforcing plate 20 having an L-shaped cross section made of an insulating material is adhesively fixed via an adhesive layer 19 from the side surface to the rear surface of the semiconductor element 10 in the lead connection direction, and the outer lead 15 of the slit portion is formed along the reinforcing plate 20. It is characterized by bending.

Further, the base film 10 is arranged between the inner lead 14 and the edge portion of the semiconductor element 10 so as to cover the edge portion, and is fixed to the semiconductor element 10 via an adhesive layer. And In addition, when the inner lead 14 is pulled out toward the center of the semiconductor element 10, the base film 12 is arranged on the inner periphery of the bump 11 and fixed to the semiconductor element 10 via an adhesive layer.

Further, the dummy lead 13a is drawn out from the bump 11a provided on the side of the mounting side of the semiconductor element 10 and extended to the mounting surface to form an adhesive portion to the printed board. . In addition, the base film 12b is left in the bonding portion of the dummy lead 13a to the printed board. In addition, the base film 12a is fixed to the side of the mounting side of the semiconductor element 10 via an adhesive layer, and a dummy lead 13a for holding the mounting strength is provided on the surface of the base film 12a.

Further, in addition to the outer lead 15 provided on the mounting side of the semiconductor element 10, an independently bent lead 13a for holding the mounting strength is provided. In addition, the base film 12 fixed to the back surface of the semiconductor element 10 is provided with leads 13b for holding the mounting strength. Further, two semiconductor elements 10a and 10b are arranged in a single TAB semiconductor device, and the connecting directions of the respective semiconductor elements 10a and 10b are set to be the centers of each other, and a slit 16 is provided at the center portion thereof, and an outer portion of the slit portion is provided. The lead 15 is bent 180 ° so that the two semiconductor elements 10a and 10b are back-to-back, and the semiconductor elements are bonded and fixed by an adhesive layer 21. Further, a spacer for maintaining the strength of the lead is provided between the side surface of the semiconductor element 10 and the outer lead 15 of the slit portion. By adopting this configuration, T
By using the AB semiconductor device, a semiconductor device that can be made upright and modularized can be obtained.

[0010]

According to the present invention, the TAB semiconductor device, which can make the thickness of the semiconductor device thinner than that of the wire-bonded product, is used. Mounting is possible, and a TAB semiconductor device having a plurality of semiconductor elements is bent at the outer lead portions and the semiconductor elements are adhered back to back, whereby modularization is possible.

[0011]

FIG. 1 is a diagram showing a first embodiment of the present invention.
(A) is a development view, (b) is an assembly sectional view taken along line bb of (a). In addition, the present embodiment includes claims 1 to 4 and 7.
Corresponds to ~ 8. In FIG. 1A, 10 is a semiconductor element (LSI), 11 is a bump provided on the semiconductor element, 12 is a base film, 13 is a lead formed on the base film, and the lead is an inner lead. 14 and an outer lead 15 are connected to each other, and the inner lead 14 is bonded to the bump 11.

The outer leads 15 are all drawn out in the same direction. At this time, the leads 13 extending from the bumps 11 on the side far from the connection side to the printed circuit board.
Is patterned so as not to contact the inner leads 14 on the connection side on the base film 12 installed in the central portion of the semiconductor element for the purpose of preventing edge short-circuit and holding the leads.

Further, a slit 16 is formed in the base film 12 at a mounting portion of the outer lead 15 and in a direction crossing the outer lead 15. The base film 12 that covers the edge portion of the semiconductor element 10 is provided so as to extend outside from the edge portion, and is fixed to the semiconductor element 10 with an adhesive layer. Also, the pad 11 on the upper side
And the base film 1 in the middle between the lower side pad 11
2 is also adhesively fixed to the semiconductor element 10 by an adhesive layer. Further, the surface of the semiconductor element 10 including the bumps 11 and the inner leads 14 is molded with resin 17 as shown in FIG.

In this embodiment, the TA formed as described above is used.
B Outer lead 1 in the slit portion 16 of the semiconductor device
5 is bent in a U shape, and the base film 12 supporting the tips of the outer leads 15 is adhesively fixed to the back surface of the semiconductor element 10 by an adhesive layer.

In this embodiment thus formed, the semiconductor element 10 is mounted vertically by soldering the tips of the bent portions of the outer leads 15 bent in a U shape to the pads of the printed circuit board. be able to. The strength of the U-shaped lead portion is obtained by protruding the base films 12 on both sides of the slit portion 16 from the edge of the semiconductor element 10 as shown in FIG. 1B.

FIG. 2 is a diagram showing a second embodiment of the present invention.
(A) is sectional drawing, (b) is a perspective view of a spacer. This embodiment corresponds to claim 5, and since it is basically the same as the previous embodiment, the description of the same parts will be omitted. The present embodiment is different from the previous embodiment in that a spacer 18 is interposed so as to fill a space formed between the outer lead 15 bent in a U shape and the end face of the semiconductor element 10.

The spacer 18 is made of an insulating material (b).
As shown in the figure, the cross-section is formed into a columnar shape having a substantially semi-circular shape, and the plane portion thereof is bonded and fixed to the end surface of the semiconductor element 10 by the adhesive layer 19.

The present embodiment thus constructed has the same operation and effect as the previous embodiment, and the strength of the spacer 18 can be increased by the spacer 18 in the U-shaped bent outer lead 15. A heat sink material may be used for the spacer 18 to enhance heat dissipation.

FIG. 3 is a diagram showing a third embodiment of the present invention.
(A) is sectional drawing, (b) is a perspective view of a reinforcing member. This embodiment corresponds to claim 6 and uses a TAB semiconductor device similar to that of the first embodiment, and has an L-shaped cross-section of an insulating material as shown in FIG. The reinforcing plate 20 formed by the above is adhered by the adhesive layer 19, and the outer lead 15 is provided along the outer surface of the reinforcing plate 20.
Is bent and the base film 12 at the tip thereof is adhesively fixed to the back surface of the reinforcing plate 20 by an adhesive layer. It is preferable to use a material having a good heat dissipation property such as a heat sink material for the reinforcing plate 20.

The present embodiment thus constructed can be mounted upright, and the outer leads 15 are reinforced by the reinforcing plate 20. Although the mounting surface is flat in the figure, the base film is not installed in consideration of the influence of heat during soldering.

FIG. 4 is a diagram showing a fourth embodiment of the present invention.
(A) is a development view, (b) is an assembly sectional view taken along line bb of (a). This embodiment corresponds to claims 9 and 10, and the TAB semiconductor device is based on the TAB semiconductor device of the first embodiment, and further the semiconductor element 10 is used.
Dummy bumps 1 on sides B and C with respect to mounting side A of
1a is provided, the base film 12a is adhesively fixed, the dummy leads 13a are drawn out from the bumps 11a, and are routed 90 ° to the mounting surface, and the slits 16a are provided in the base film supporting the dummy leads 13a. There is. The surface of the semiconductor element 10 including the bumps 11 and the inner leads 14 is molded with resin 17.

In this embodiment, the TAB formed as described above is used.
A semiconductor device is formed by bending an outer lead 15 into a U-shape as shown in FIG. 2B, adhesively fixing the base film 12 at the tip thereof to the back surface of the semiconductor element 10 via an adhesive layer, and connecting the leads 13a on both left and right sides. The lower surface of the base film 12b is bent at 90 ° so as to be flush with the lower surface of the outer lead 15.

In this embodiment thus constructed, the outer leads 15 bent in a U shape can be mounted upright, and the base films 12b at the ends of the dummy leads 13a provided on the left and right of the semiconductor element 10 can be mounted. Mounting strength can be improved by adhesively fixing to the substrate.

5A and 5B are views showing a fifth embodiment of the present invention. FIG. 5A is a development view and FIG. 5B is an assembly sectional view taken along line bb in FIG. 5A. The present embodiment corresponds to claim 11, and the configuration is almost the same as the previous embodiment, except that the left and right dummy bumps of the semiconductor element 10 are removed. Therefore, its function and effect are similar to those of the previous embodiment.

FIG. 6 is a diagram showing a sixth embodiment of the present invention.
(A) is a development view, (b) is an assembly sectional view taken along line bb of (a). This embodiment corresponds to claim 12, and the TAB semiconductor is based on the TAB semiconductor device of the first embodiment, and the original lead is provided in the vicinity of the left and right sides with respect to the mounting side of the semiconductor element 10. Dummy lead 1 separately
3a is provided. This dummy lead 13a
May or may not have bumps 11a,
Further, it has a base film 12b at the tip.

In this embodiment, this TAB semiconductor device is shown in FIG.
As shown in (b), the outer lead 15 is bent in a U shape, the base film 12 at the tip thereof is adhered and fixed to the back surface of the semiconductor element 10 via an adhesive layer, and the dummy lead 13a is bent outward by 90 °. The lower surface of the base film 12b at the tip is made to match the height of the lower surface of the U-shaped outer lead 15.

In this embodiment thus constructed, the mounting strength can be improved by the dummy leads 13a as in the previous embodiment.

FIG. 7 is a diagram showing a seventh embodiment of the present invention.
(A) is a development view, (b) is an assembly sectional view taken along line bb of (a). This embodiment corresponds to claim 13. The TAB semiconductor device is the same as that used in the fourth embodiment described with reference to FIG. Film 1
A dummy lead 13b having 2c is provided.

In this embodiment, this TAB semiconductor device is shown in FIG.
As shown in (b), the outer lead 15 is bent in a U shape, and the base film 12 at the tip thereof is attached to the semiconductor element 10.
And the dummy leads 13b extending from the adhered base film 12 are bent 90 ° outward, and the dummy leads 13a extending from both left and right sides of the semiconductor element 10 are also outwardly fixed. The base films 12b and 12c are bent by 90 ° so that the lower surfaces of the base films 12b and 12c are flush with the lower surface of the outer lead 15.

In this embodiment thus constructed, the base film 12 at the ends of the dummy leads 13a and 13b is provided on the left and right of the portion where the outer lead 15 is bent and formed in a U shape.
Since b and 12c are projected, the mounting strength can be further improved.

8A and 8B are views showing an eighth embodiment of the present invention, FIG. 8A is a development view, and FIG. 8B is an assembly sectional view taken along line bb in FIG. 8A. This embodiment corresponds to claim 14. As the TAB semiconductor device used, two TAB semiconductor devices shown in FIG. 1A in the first embodiment are used, and as shown in FIG. The outer leads 15 are connected so as to face each other. For example, the bumps A and A ′ or B and B ′ of the one semiconductor element 10a and the other semiconductor element 10b are connected to each other.

In this embodiment, the outer lead 15 of this TAB semiconductor device is bent in a U shape, and one semiconductor element 10a and the other semiconductor element 10b are back-to-back and adhesively fixed by an adhesive layer 21. is there.

In this embodiment having such a structure, two TAB semiconductor devices are combined to enable upright mounting,
A semiconductor device can be miniaturized. In the present embodiment and the first, fourth, fifth and sixth embodiments, when the base film 12 slit 16 is provided, the base film 12 is slightly projected from the edge of the semiconductor element. This prevents the edge of the lead 15 from being short-circuited and also helps improve the strength of the outer lead bent in a U shape. Further, in the fourth to sixth embodiments, a spacer may be provided between the side surface of the semiconductor element and the outer lead 15 of the slit 16 to improve the mounting strength.

[0034]

According to the present invention, a semiconductor device having almost the same size as a semiconductor element can be obtained without significantly modifying the conventional TAB structure, and the upright mounting which is difficult with the conventional TAB semiconductor device can be achieved. It is possible to provide a new high-density mounting method using a plurality of small and thin semiconductor devices.

[Brief description of drawings]

1A and 1B are views showing a first embodiment of the present invention, in which FIG. 1A is a development view, and FIG. 1B is an assembly sectional view taken along line bb in FIG.

2A and 2B are views showing a second embodiment of the present invention, in which FIG. 2A is an assembled sectional view and FIG. 2B is a perspective view of a spacer.

3A and 3B are views showing a third embodiment of the present invention, in which FIG. 3A is an assembled sectional view and FIG. 3B is a perspective view of a reinforcing plate.

4A and 4B are views showing a fourth embodiment of the present invention, in which FIG. 4A is an exploded view and FIG. 4B is an assembled sectional view taken along line bb in FIG. 4A.

5A and 5B are views showing a fifth embodiment of the present invention, wherein FIG. 5A is a development view and FIG. 5B is an assembly sectional view taken along line bb in FIG. 5A.

6A and 6B are views showing a sixth embodiment of the present invention, in which FIG. 6A is a development view and FIG. 6B is an assembly sectional view taken along line bb in FIG. 6A.

7A and 7B are views showing a seventh embodiment of the present invention, FIG. 7A is a development view, and FIG. 7B is an assembly sectional view taken along line bb of FIG. 7A.

8A and 8B are views showing an eighth embodiment of the present invention, in which FIG. 8A is a development view and FIG. 8B is an assembly sectional view taken along line bb in FIG. 8A.

FIG. 9 is a diagram showing a conventional semiconductor device.

[Explanation of symbols]

 10, 10a, 10b ... Semiconductor element 11 ... Bump 12, 12a, 12b, 12c ... Base film 13 ... Lead 13a, 13b ... Dummy lead 14 ... Inner lead 15 ... Outer lead 16, 16a ... Slit 17 ... Resin 18 ... Spacer 19 , 21 ... Adhesive layer 20 ... Reinforcing plate

Claims (15)

[Claims] 1. A TAB (Tape Automated Bonding) semiconductor device is used, a slit (16) is provided in a mounting portion of the outer lead (15) of the TAB semiconductor device, and the outer lead crosses the slit (16). A semiconductor device characterized in that (15) is bent and the bent portion is used as a connecting portion to a printed circuit board. 2. A semiconductor device, characterized in that a connecting portion to the printed circuit board in which the outer lead (15) is bent is provided only on one side of the semiconductor element (10). 3. The semiconductor device according to claim 1, wherein the outer lead bent portion has a U-shape. 4. A semiconductor element (10) having a tip portion of the lead bent portion on a base film (10) with an adhesive layer interposed therebetween.
The semiconductor device according to claim 1, wherein the semiconductor device is fixed to the back surface of the. 5. A strength-maintaining spacer (18) made of an insulating material and having a substantially semicircular cross section is horizontally fixed to the side surface of the mounting surface of the semiconductor element (10) with an adhesive layer (19), 2. The semiconductor device according to claim 1, wherein the outer lead (15) of the slit portion is bent along the side surface of the spacer (18). 6. A reinforcing plate (20) made of an insulating material and having an L-shaped cross section is adhesively fixed through an adhesive layer (19) from a side surface to a rear surface of the semiconductor element (10) in a lead connection direction, and the reinforcing plate ( 2. The semiconductor device according to claim 1, wherein the outer lead (15) of the slit portion is bent along the line 20). 7. A base film (10) is arranged between the inner lead (14) and an edge portion of the semiconductor element (10) so as to cover the edge portion, and the semiconductor element (via a bonding layer). 10. The semiconductor device according to claim 1, which is fixed to 10). 8. When the inner lead (14) is pulled out toward the center of the semiconductor element (10), the base film (12) is arranged on the inner periphery of the bump (11) and the semiconductor element (12) is interposed via an adhesive layer. 10. The semiconductor device according to claim 1, which is fixed to 10). 9. A dummy lead (1) is formed from a bump (11a) provided on a side portion of a mounting side of the semiconductor element (10).
3. The semiconductor device according to claim 1, wherein 3a) is pulled out and extended to the mounting surface to form an adhesive portion to the printed circuit board. 10. The semiconductor device according to claim 9, wherein a base film (12b) is left in a bonding portion of the dummy lead (13a) to the printed circuit board. 11. A base film (12a) is fixed to a side portion of a mounting side of the semiconductor element (10) via an adhesive layer, and a dummy lead (13) for maintaining mounting strength is provided on the surface thereof.
The semiconductor device according to claim 1, wherein a) is provided. 12. A lead (13a) which is independently bent and is provided separately from the outer lead (15) provided on the mounting side of the semiconductor element (10). Item 1. The semiconductor device according to item 1. 13. The semiconductor device according to claim 3, wherein the base film (12) fixed to the back surface of the semiconductor element (10) is provided with leads (13b) for holding mounting strength. 14. A single TAB semiconductor device is provided with two semiconductor elements (10a, 10b), and the connecting directions of the respective semiconductor elements (10a, 10b) are mutually centered, and a slit (16) is formed at the center thereof. ) Is provided, and the outer lead (15) of the slit portion is provided with the two semiconductor elements (10a, 10a,
Bend 180 ° so that 10b) are back to back,
The semiconductor device according to claim 1, wherein the semiconductor elements are bonded and fixed to each other with an adhesive layer (21). 15. A spacer for maintaining strength of a lead is provided between a side surface of the semiconductor element (10) and an outer lead (15) of a slit portion, according to any one of claims 9 to 12. Item semiconductor device.