JP2001116766A - Inspection board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To contrive the coexistence of the shortness of a current path between the outer lead of a semiconductor device and the wiring of an inspection board and the absorption of the irregularity of the height of the outer lead of the semiconductor device. SOLUTION: A plurality of pieces of wiring 11 are formed on the surface of a wiring board 10 having elasticity. An opening 10a is formed on an area opposed to the semiconductor device A in the wiring board 10, and a plurality of breaks 12 are passed between the pieces of the wiring 11 from the opening 10a to be radially formed.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an inspection substrate for inspecting electrical characteristics of a semiconductor device having a plurality of external leads, and more particularly to an inspection substrate for inspecting electrical characteristics of a semiconductor device operating at a high frequency.

[0002]

2. Description of the Related Art In order to respond to the development of communication technology and the development of highly computerized new media, the use of high-frequency signals in fields such as satellite broadcasting, mobile phones, and non-contact communication in transportation systems. Is remarkable. Therefore, in order to improve the reliability of a semiconductor device operating in a high frequency band of about 6 GHz or more, there is a strong demand for quality assurance of the semiconductor device.

For this reason, an electric signal is input from an external inspection device to the semiconductor device via a first external lead provided on the semiconductor device, and an external signal is input from the semiconductor device via a second external lead. It is necessary to accurately evaluate the electrical characteristics of the semiconductor device using an external inspection device by outputting an electric signal to the inspection device.

Therefore, an inspection board having a plurality of wirings for electrically connecting each external lead of the semiconductor device and each terminal of the external inspection device is required.

In this case, in order to accurately evaluate the electrical characteristics of the semiconductor device, it is necessary to securely connect each external lead of the semiconductor device to each wiring of the inspection substrate. A function for absorbing variations in the height of the lead in the semiconductor device is required.

Further, in order to stably measure the electrical characteristics of a semiconductor device operating in a high frequency band without being affected by generation of noise and attenuation of a measurement signal, the semiconductor device is formed on an inspection substrate. It is necessary to make the length of the wiring, that is, the current path as short as possible.

Therefore, an inspection board as described below has been proposed.

FIG. 6 shows a cross-sectional structure of an inspection board according to a first conventional example. On a wiring board 100, a plurality of sockets 101 for housing a semiconductor device A are arranged side by side. Each socket 101 is provided so as to penetrate a socket main body 102 fixed to the wiring board 100, a storage section 103 provided at an upper portion of the socket main body 102, and a lower portion of the socket main body 103, and is stored in the storage section 103. The plurality of elastic test pins 104 connected to the external leads B of the semiconductor device A, and the semiconductor device A housed in the housing 103 is pressed against the socket body 102 to make the external leads B into the test pins 104. Pressing member 105 to be brought into contact
The inspection pin 104 is electrically connected to the wiring 106 provided on the wiring board 100.

According to the first embodiment, the variation in the height of the external lead B of the semiconductor device A can be absorbed by the elastic deformation of the inspection pin 104. The amount by which the pressing member 105 presses the semiconductor device A depends on the pressing member 105.
Is determined by a position where the lower surface of the socket contacts the upper surface of the socket body 102.

FIG. 7 shows a cross-sectional structure of an inspection board according to a second conventional example.
A (Pressure Contact Rubber) sheet 112 is placed, and a large number of conductive particles 113 for electrically connecting the external leads B of the semiconductor device A and the wiring of the wiring board 110 are placed inside the PCR sheet 112. Embedded continuously in the sheet thickness direction.

According to the second conventional example, the variation in the height of the external leads B of the semiconductor device A can be absorbed by the elastic deformation of the PCR sheet 112. In addition, PCR sheet 1
The current path is shortened by setting the thickness of T.12 to 0.5 mm or less.

[0012]

However, in the first conventional example, an inspection pin is interposed between the semiconductor device and the wiring board, and in the second conventional example, between the semiconductor device and the wiring board. Since the PCR sheet is interposed, there is a problem that impedance characteristics cannot be accurately measured when inspecting electrical characteristics of a semiconductor device operating in a high frequency band. That is, since the inspection pin or the PCR sheet is interposed between the semiconductor device and the wiring board, there is a limit in shortening the path length of the electric signal. There is a problem that the impedance characteristics cannot be measured accurately due to the capacitance generated between the test pins or the conductive particles.

In the second conventional example, since the PCR sheet is made of rubber, the PCR sheet expands or contracts due to a temperature change, or the PCR sheet receives mechanical stress from the conductive particles. In some cases, the position of the conductive particles may shift. For this reason, the position of the conductive particles of the PCR sheet is shifted with respect to the position of the external lead of the semiconductor device or the position of the wiring of the wiring board, and thus there is a problem that the electrical continuity between the external lead and the wiring is impaired.

Therefore, in order to shorten the path length of the electric signal and to ensure the electrical conduction between the external lead and the wiring, it is also considered to solder the external lead to the wiring.

However, when the external leads are soldered to the wiring, a step of melting the solder portion after the completion of the inspection is inevitable, so that a new problem occurs that the time required for the inspection process is increased and the cost is increased. Therefore, it is difficult to employ a method of soldering external leads to wiring.

In view of the above-mentioned problems, the present invention achieves both the reduction of the current path between the external lead of the semiconductor device and the wiring of the inspection substrate and the absorption of the variation in the height of the external lead of the semiconductor device. It is an object of the present invention to realize the inspection without increasing the time and cost of the inspection process.

[0017]

In order to achieve the above object, a first inspection substrate according to the present invention is directed to an inspection substrate for inspecting electrical characteristics of a semiconductor device having a plurality of external leads. A wiring board on which a plurality of wirings in contact with each of the plurality of external leads are formed, and a displacement means provided on the wiring board and displacing the plurality of wirings independently of each other in a direction perpendicular to the substrate surface. I have.

According to the first inspection board, since the wiring board is provided with the wiring that comes into contact with the external lead of the semiconductor device, the external lead and the wiring can come into direct contact with each other. The path length can be reduced to the limit.

Further, since the wiring board is provided with a displacement means for displacing a plurality of wirings independently of each other in a direction perpendicular to the substrate surface, the wiring which is in contact with the relatively high external lead is relatively small. Since the displacement is large in the direction perpendicular to the substrate surface as compared with the wiring contacting with the low external lead, variations in the height of the external lead can be absorbed.

In the first inspection board, the displacement means comprises:
It is preferable that the cut is formed between the wirings on the wiring board. With this configuration, the plurality of wirings can be reliably displaced independently of each other in a direction perpendicular to the substrate surface.

In the first inspection substrate, the displacement means includes:
The cutout is preferably formed in a region between the wirings on the back surface of the wiring board. This way,
The plurality of wirings can be reliably displaced independently of each other in a direction perpendicular to the substrate surface.

A second inspection substrate according to the present invention is intended for an inspection substrate for inspecting electrical characteristics of a semiconductor device having a plurality of external leads, and has a contact portion which comes into contact with each of the plurality of external leads. The semiconductor device includes a wiring board on which a plurality of wirings are formed, and a concave / convex portion provided at each contact portion of the plurality of wirings.

According to the second inspection board, the contact portion of the wiring with the external lead is provided with an uneven portion, so that the area of the portion of the wiring that contacts the external lead is reduced. And the contact pressure increases. For this reason, the amount of displacement of the wiring and the amount of displacement of the external lead increase, so that variations in the height of the external lead can be absorbed.

[0024] In the second inspection substrate, the concavo-convex portion is preferably formed by a large number of conductive particles fixed to each contact portion of the plurality of wirings. This way,
An uneven portion can be easily and reliably provided at a contact portion of the wiring with an external lead.

In the second inspection substrate, it is preferable that the uneven portion is formed by subjecting each contact portion of the plurality of wirings to grinding, polishing, or plating. With this configuration, it is possible to easily and reliably provide the uneven portion at the contact portion of the wiring with the external lead.

In the second inspection substrate, it is preferable that a plating layer is formed on the surface of the uneven portion. In this case, since the surface strength of the uneven portion is increased, the durability of the wiring is improved, and the life of the inspection substrate is extended.

A third inspection board according to the present invention is intended for an inspection board for inspecting electrical characteristics of a semiconductor device having a plurality of external leads, and has a rigid fixed base and a surface provided on the fixed base. A plurality of wirings formed on the surface of a flexible member provided on the surface of the elastic member or the fixed base via an elastic body, and in contact with each of the plurality of external leads.

According to the third inspection board, the wiring is provided on the surface of the elastic member provided on the surface of the fixed base or on the surface of the flexible member provided on the surface of the fixed base via an elastic body. Since the wiring that contacts the relatively high external lead is greatly displaced in the direction perpendicular to the substrate surface as compared with the wiring that contacts the relatively low external lead, the variation in the height of the external lead can be absorbed. .

[0029]

DESCRIPTION OF THE PREFERRED EMBODIMENTS (First Embodiment) Hereinafter, an inspection substrate according to a first embodiment of the present invention will be described with reference to FIG.
This will be described with reference to (a) and (b).

As shown in FIG. 1A, a plurality of wirings 11 made of a conductive material such as copper are formed on the surface of a wiring substrate 10 having a resin as a main component and having elasticity. Is an external lead B of the semiconductor device A.
Is electrically connected to

As a feature of the first embodiment, an opening 10a is formed in a region (central region) of the wiring substrate 10 facing the semiconductor device A, and the wirings 11 are connected to each other through the opening 10a. A plurality of cuts 12 are formed radially outwardly through the gap, and the cuts 12 constitute a displacement means for displacing the plurality of wirings 11 independently of each other in a direction perpendicular to the substrate surface. I have.

The method of forming the cut 12 is to form a groove in a predetermined portion of the wiring board 10 mechanically using a router or the like, or to irradiate a predetermined portion of the wiring board 10 with a laser beam to form a groove by melting. And the like.
When the cut 12 is formed by the laser beam, C
When an O ₂ laser or a YAG laser is used, a thin groove can be formed, which is advantageous when the pitch of the wiring 11 is small. Incidentally, in FIG.
2 is wavy, but may be linear.

FIG. 1B shows a contact state between the inspection substrate and the semiconductor device A when inspecting the electrical characteristics of the semiconductor device A using the inspection substrate according to the first embodiment. The area of the wiring board 10 that contacts the external leads B of the semiconductor device A is elastically deformed downward (back side). In this case, the external lead B on the right side in FIG.
Is higher than the height of the left external lead B. That is, the lower end of the right external lead B is
Is located below the lower end of the. For this reason, the area of the wiring board 10 that is in contact with the external lead B on the right side is greatly elastically deformed as compared with the area that is in contact with the external lead B on the left side, thereby absorbing the variation in the height of the external lead B. be able to. In this case, since the contact pressure between the contact portion of the wiring 11 and the external lead B and the external lead B is determined by the elastic modulus of the material forming the wiring 11, the contact pressure between each wiring 11 and each external lead B is determined. Is equal in all the wirings 11 of the semiconductor device A. For this reason, the contact resistance between the wiring 11 and the external lead B becomes equal, and the mechanical stress applied to the wiring 11 becomes equal, so that the life of the wiring 11 and, consequently, the inspection substrate becomes longer.

Further, since the wiring board 10 has elasticity, when the wiring board 10 is released from contact with the external leads B, the elastically deformed area of the wiring board 10 returns to the initial position. The inspection substrate according to the embodiment is a semiconductor device A
Can be repeatedly used for inspection.

(Second Embodiment) Hereinafter, an inspection substrate according to a second embodiment of the present invention will be described with reference to FIGS. 2 (a) and 2 (b). Incidentally, FIG.
2A shows a cross-sectional structure taken along line IIb-IIb.

As shown in FIGS. 2A and 2B, a wiring 21 made of a conductive material such as copper is formed on the surface of a wiring substrate 20 having a resin as a main component and having elasticity.
An inner end of the wiring 21 is connected to an external lead B of the semiconductor device A.
Is electrically connected to

As a feature of the second embodiment, a plurality of rectangular regions located at the center and a plurality of radially extending outwards passing between the rectangular regions and portions where the wirings 11 are formed. A notch 22 formed by cutting the back surface of the wiring board 20 is formed over the band-like region of the wiring board 20. The notch 22 allows the plurality of wirings 21 to be perpendicular to the board surface independently of each other. Displacement means for displacing in any direction.

As a method of forming the notch 22, there is a method of mechanically removing a predetermined portion on the back surface of the wiring board 10 using a router or the like.

When the electrical characteristics of the semiconductor device A are inspected by using the inspection substrate according to the second embodiment, as in the first embodiment, the semiconductor device A comes into contact with a relatively high external lead B on the wiring board 10. Since the region is elastically deformed to a greater extent than the region in contact with the relatively low external lead B, it is possible to absorb variations in the height of the external lead B. Also,
Since the wiring board 20 has elasticity, the external leads B
When the semiconductor device A is released from contact with the semiconductor device A, it returns to its original shape, and can be used repeatedly for testing the semiconductor device A.

(Third Embodiment) Hereinafter, an inspection substrate according to a third embodiment of the present invention will be described with reference to FIG.

The feature of the third embodiment is that the wiring board 3
Semiconductor device A on the surface of wiring 31 formed on
An uneven portion is formed at a contact portion with the external lead B. Examples of the method of forming the uneven portion include a method of mechanically grinding or polishing the surface of the wiring 31 or a method of plating the surface of the wiring 31 with rhodium or the like.

According to the third embodiment, since the uneven portion is formed at the contact portion of the wiring 31 with the external lead B, the area of the portion of the wiring 31 that contacts the external lead B is reduced. The contact pressure between the surface of the lead and the external lead B increases. Therefore, the amount of displacement of the wiring 31 and the amount of displacement of the external lead B increase, so that the wiring 31 and the external lead B can be reliably brought into contact even if the height of the external lead B varies.

When nickel or rhodium is plated on the surface of the uneven portion of the wiring 31, the surface strength of the uneven portion is increased and the durability of the wiring 31 is improved, so that the life of the inspection substrate is extended.

(Fourth Embodiment) Hereinafter, an inspection board according to a fourth embodiment of the present invention will be described with reference to FIG.

The feature of the fourth embodiment is that the wiring board 4
Semiconductor device A on the surface of wiring 41 formed on
A bump 42 made of, for example, Au or the like is provided at a contact portion of the semiconductor device A with the external lead B of the semiconductor device A, so that an uneven portion is formed on the surface of the wiring 41. .

According to the fourth embodiment, since the bump 42 is formed on the surface of the wiring 41 that contacts the external lead B, the area of the wiring 41 that contacts the external lead B is reduced. The contact pressure between the surface of the lead and the external lead B increases. For this reason, since the displacement amount of the wiring 41 and the displacement amount of the external lead B increase, the wiring 41 and the external lead B can be surely brought into contact even if the height of the external lead B varies.

When the bumps 42 are formed of a relatively soft metal such as Au, the hardness of the bumps 42 becomes smaller than the hardness of the external leads B and the wirings 41. More variation in the height of the lead B can be absorbed.

Further, as shown in FIG. 4, when the bumps 42 are formed in a two-tiered shape, the amount of deformation of the bumps 42 becomes larger, so that the variation in the height of the external leads B can be further absorbed. .

(Fifth Embodiment) Hereinafter, an inspection substrate according to a fifth embodiment of the present invention will be described with reference to FIG.

The feature of the fifth embodiment is that the wiring board 5
Semiconductor device A on the surface of wiring 51 formed on
A large number of conductive particles 52
Are fixed, and thereby, a concavo-convex portion is formed at a contact portion of the surface of the wiring 51 with the external lead B of the semiconductor device A.

As an example of a method of fixing the conductive particles 52, a method of plating a surface of the surface of the wiring 51 which is in contact with the external lead B can be cited. In this case, the particle size of the conductive particles 52 can be changed by changing the setting of plating conditions such as a plating bath.

According to the fifth embodiment, since a large number of conductive particles 52 are fixed to the surface of the wiring 51 that contacts the external lead B, the area of the part of the wiring 51 that contacts the external lead B is reduced. Therefore, the contact pressure between the surface of the wiring 51 and the external lead B increases. For this reason, the displacement amount of the wiring 51 and the displacement amount of the external lead B increase.
1 and the external lead B can be reliably contacted.

In the third embodiment, an uneven portion is formed on the surface of the wiring 31. In the fourth embodiment, a bump 42 is formed on the surface of the wiring 41. In the fifth embodiment, the wiring 51 is formed. The contact pressure between the surface of the wiring and the external lead B was increased by fixing a large number of conductive particles 51 on the surface of the lead, thereby increasing the displacement of the wiring and the displacement of the external lead B. By an appropriate method such as mechanical or chemical grinding, polishing, or roughening, the contact area of the wiring with the external lead B may be reduced, and the contact pressure between the surface of the wiring and the external lead B may be increased.

(Sixth Embodiment) Hereinafter, an inspection board according to a sixth embodiment of the present invention will be described with reference to FIG.

As a feature of the sixth embodiment, a tape-shaped or sheet-shaped flexible member 62 made of polyimide or Kapton is adhered to the surface of a rigid fixed base 60 via an elastic body 61. The wiring 63 is formed on the surface of the flexible member 62.

According to the sixth embodiment, the flexible member 62
The area of contact with the relatively high external lead B in (1) is more flexed (largely displaced in the direction perpendicular to the substrate surface) than the area of contact with the relatively low external lead B. Can be absorbed.

The contact pressure between the external lead B and the wiring 63 can be adjusted by forming the elastic body 61 from an elastic material having an appropriate elastic coefficient.

Further, in the sixth embodiment, the wiring 63 is provided on the flexible member 62 provided on the surface of the fixed base 60 via the elastic body 61.
The wiring 63 may be provided directly on the elastic body 61 provided on the surface.

[0059]

According to the first to third inspection substrates, the substrate is provided with the wiring which directly contacts the external leads of the semiconductor device, and the path length of the electric signal can be reduced to the limit. Since the resistance and reactance of the inspection pin or the conductive particle and the capacitance between the adjacent inspection pin or the conductive particle do not occur as in the related art, the impedance characteristic can be accurately measured.

Further, the first or third inspection board can be displaced in a direction perpendicular to the board surface in accordance with a change in the height of the external lead with which the wiring comes into contact. Since the amount of displacement of the wiring and the amount of displacement of the external lead in the substrate for use are larger than before, the wiring and the external lead can be reliably brought into contact even if the height of the external lead varies.

Therefore, according to the first to third inspection substrates, the current path between the external lead of the semiconductor device and the wiring of the inspection substrate can be shortened, and the variation in the height of the external lead of the semiconductor device can be reduced. The compatibility with the absorption can be realized without increasing the time and cost of the inspection process.

[Brief description of the drawings]

FIG. 1A is a plan view of an inspection substrate according to a first embodiment of the present invention, and FIG. 1B is an electrical characteristic of a semiconductor device using the inspection substrate according to the first embodiment. FIG. 5 is a cross-sectional view showing a method of performing the inspection of FIG.

FIG. 2 (a) is a plan view of an inspection substrate according to a second embodiment of the present invention, and FIG. 2 (b) is IIb-II in FIG.
It is sectional drawing in a b line.

FIG. 3 is a cross-sectional view of an inspection substrate according to a third embodiment of the present invention.

FIG. 4 is a cross-sectional view of an inspection substrate according to a fourth embodiment of the present invention.

FIG. 5 is a cross-sectional view of an inspection substrate according to a fifth embodiment of the present invention.

FIG. 6 is a cross-sectional view of an inspection substrate according to a sixth embodiment of the present invention.

FIG. 7 is a sectional view of an inspection substrate according to a first conventional example.

FIG. 8 is a sectional view of an inspection substrate according to a second conventional example.

[Explanation of symbols]

 A Semiconductor device B External lead 10 Wiring board 10a Opening 11 Wiring 12 Break 20 Wiring board 21 Wiring 22 Notch 30 Wiring board 31 Wiring 40 Wiring board 41 Wiring 42 Bump 50 Wiring board 51 Wiring 52 Conductive particles 60 Fixing table 61 Elastic body 62 Flexible member 63 Wiring

 ────────────────────────────────────────────────── ─── Continuing from the front page (72) Inventor Kenro Jinmori 1-1, Komachi, Takatsuki-shi, Osaka Matsushita Electronics Co., Ltd. F-term (reference) 2G011 AA01 AA12 AA21 AB08 AC14 AC32 AE02 AF07

Claims (8)

[Claims] 1. An inspection board for inspecting electrical characteristics of a semiconductor device having a plurality of external leads, wherein: a wiring board on which a plurality of wirings contacting each of the plurality of external leads is formed; An inspection substrate, comprising: a displacement means provided on the substrate and displacing the plurality of wirings independently of each other in a direction perpendicular to the substrate surface. 2. The inspection board according to claim 1, wherein the displacement means is a cut formed between the wirings on the wiring board. 3. The inspection board according to claim 1, wherein the displacement means is a notch formed in a region between the wirings on the back surface of the wiring board. 4. An inspection board for inspecting electrical characteristics of a semiconductor device having a plurality of external leads, wherein a wiring board having a plurality of wirings having a contact portion that contacts each of the plurality of external leads is formed. And an uneven portion provided at each contact portion of the plurality of wirings. 5. The inspection substrate according to claim 4, wherein the uneven portion is formed of a large number of conductive particles fixed to each contact portion of the plurality of wirings. 6. The inspection according to claim 4, wherein the uneven portion is formed by performing a grinding process, a polishing process, or a plating process on each contact portion of the plurality of wirings. Substrate. 7. The inspection substrate according to claim 4, wherein a plating layer is formed on a surface of the uneven portion. 8. An inspection board for inspecting electrical characteristics of a semiconductor device having a plurality of external leads, comprising: a fixed base having rigidity; an elastic member provided on a surface of the fixed base; An inspection substrate, comprising: a plurality of wirings formed on a surface of a flexible member provided on the surface via an elastic body, the wiring being in contact with each of the plurality of external leads.