JP2002311048A - Guide for probe card, probe card equipped with the same, and method of inspecting electronic circuit device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a probe card, and a method for testing an electronic circuit device using the same which can be used in a test of a wide range of electronic circuit devices, prevents probes from contacting and crossing each other, and is not affected by an electromagnetic wave. SOLUTION: The probe card is provided by structuring so as to include a guide having a substrate with holes of which the number corresponds at least to the number of electrodes of the electronic circuit device.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a probe card guide, a probe card equipped with the probe card, and a method for inspecting an electronic circuit device, and more particularly, to a probe card guide used for a continuity test of electrodes of an electronic circuit device. The present invention relates to a highly reliable probe card having the probe card mounted thereon and a method for inspecting an electronic circuit device using the probe card.

[0002]

2. Description of the Related Art In recent years, electronic circuit devices have been miniaturized and highly integrated, as typified by semiconductor integrated circuits, and electronic circuit device inspection systems for inspecting their electrical characteristics have also been developed. Fine pitch is required. To cope with such a situation, a probe card in which a large number of inspection probes are integrated has been developed.
In the inspection of the above, a probe card in which a vertical needle type probe is integrated moves on a silicon wafer, and each of the chips arranged on the wafer is probed with a terminal (connecting portion) arranged at an end of the chip. Are pressed and brought into contact with each other, and an electric current is selectively passed to the probe according to the contents of the inspection to perform the inspection.

[0003] By the way, at the time of inspection, it is necessary to bring probes into contact with the electrodes of all chips on the wafer. However, the silicon wafer is not completely horizontal, It has undulations of about 10 μm to one hundred and several tens of μm, and the probes are integrated and fixed on the probe card. It was necessary to press. For this reason, in the inspection using the probe card, the pressure at the time of pressing causes the probe to wear the terminals (connection portions) on the chip side or damage the chip itself, and the chip becomes unusable in a short time. In addition, there is a problem that the probe itself is deformed and an accurate continuity test cannot be performed.

In order to address the above problem, for example, Japanese Patent Application Laid-Open No. Hei 4-363671 discloses a probe board in which a probe is made to be an elastic member and is attached diagonally to a substrate to reduce damage during pressing. Japanese Patent Application Laid-Open No. 2000-134341 discloses a probe card in which two U-shaped deformation regions are provided at the upper part of a probe to improve the ability to follow irregularities on the surface of a test object. A probe card in which a deformation area bent in a mold or an arc shape is provided in the probe to reduce the pressure at the time of pressing has been studied, and a tentative solution has been achieved.

On the other hand, the pitch between electrodes is becoming increasingly narrower with the further increase in the integration of electronic circuit devices.
There is a new problem that the probes are brought into contact with each other due to deformation when the probes are pressed, resulting in crosstalk. When using a probe card to inspect the electrical characteristics of an electronic circuit device, which is the device under test, the current applied for the test and the output signal from the device under test oscillate due to external electromagnetic waves. There is also a problem that normal measurement cannot be performed.
Furthermore, since the number and pitch of electrodes are different for each type of electronic circuit device, in the conventional inspection, a probe card having a probe corresponding to the electrode pattern is prepared for each electronic circuit device and the inspection is performed. Also, there remains a problem that an arbitrary device cannot be inspected with one type of probe card.

For this reason, there has been a strong demand for developing a probe card which can be used for testing a wide range of electronic circuit devices, in which probes do not come into contact with each other or crosstalk, and which are not affected by electromagnetic waves.

[0007]

SUMMARY OF THE INVENTION In view of the above-mentioned problems of the prior art, an object of the present invention is to be used for inspection of a wide range of electronic circuit devices. The object of the present invention is to provide a probe card guide which is not affected by the above, a probe card equipped with the guide, and an electronic circuit device inspection method using the same.

[0008]

Means for Solving the Problems The inventors of the present invention have made intensive studies to achieve the above object, and as a result, the use of a guide comprising a substrate having at least the number of holes corresponding to the number of electrodes of an electronic circuit device has made it possible to obtain a desired structure. It has been found that a probe card excellent in versatility and excellent in reliability can be obtained, and the present invention has been completed.

That is, according to the first aspect of the present invention, there is provided a probe card guide comprising a substrate having holes through which probes corresponding to at least the number of electrodes of an electronic circuit device pass.

[0010] According to a second aspect of the present invention, there is provided a probe card including a probe in contact with an electrode of an electronic circuit device, a substrate holding the probe, and a probe card guide of the first aspect. Is done.

According to the third aspect of the present invention, the second aspect
According to the invention, a probe card is provided in which an insulating elastic member is filled between a substrate holding a probe and a guide.

According to a fourth aspect of the present invention, the second aspect
According to the invention, there is provided a probe card, wherein an elastic member having an electromagnetic wave shielding property is filled between a guide holding a probe and a guide.

Further, according to the fifth aspect of the present invention, the second aspect
In the invention, a probe card is provided, wherein the probe surface is insulated and coated at least between a substrate holding the probe and a guide.

According to the sixth aspect of the present invention, the fifth aspect is provided.
According to the invention, there is further provided a probe card, wherein an elastic member having an electromagnetic wave shielding property is filled between a guide holding a probe and a guide.

According to a seventh aspect of the present invention, there is provided an electronic circuit device inspection method using the probe card according to any one of the second to sixth aspects.

[0016]

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, the present invention will be described in detail.

The probe card guide of the present invention is characterized by comprising a substrate having at least holes corresponding to the number of electrodes of an electronic circuit device. Here, the guide refers to an insulating substrate having many holes through which the probe passes. The hole through which the probe passes may be set so that the tip of the probe is in contact with the position of the electrode of the electronic circuit device to be inspected, and is perpendicular to the substrate so as to match the position of the electrode of the electronic circuit device. A hole may be formed in the substrate, or a hole may be formed in the substrate obliquely so that the probe contacts the electrode obliquely. A known substrate can be used as the insulating substrate. Hereinafter, a plurality of embodiments of the present invention will be exemplified. However, the present invention is not limited thereto without departing from the spirit of the present invention.

FIG. 1 is a conceptual diagram of inspecting an electronic circuit device on a wafer using a probe card 1 having a vertical probe 2. FIG. 2 shows the probe card 1
FIG. 2 is an enlarged perspective view of an inspection unit and an electronic circuit device as an object to be inspected. As is apparent from FIG. 2, the probe 2 of the probe card 1 needs to have the same pitch as the electrode 9 of the electronic circuit device 8 in order to make the probe contact the electrode.

A probe card according to the present invention has a probe that contacts an electrode of an electronic circuit device of a device under test, a substrate holding the probe, and at least holes corresponding to the number of electrodes of the electronic circuit device that is the device under test. A guide made of a substrate.

The present invention is characterized in that a guide is used. The guide may or may not be fixed to a probe card for inspection, but is preferably fixed in a removable manner. . The position of the guide is adjusted and fixed so that the tip of the probe passed through the guide contacts the electrode of the electronic circuit device. By using a guide, the number of holes, the fixed position, etc. of the guide can be adjusted, so that the number of electrodes, the pitch, the arrangement position of the electrodes, etc. can be adjusted to the electronic circuit devices of the device under test. There is no need to make a card. That is, when the number of probes of the probe card is larger than the number of electrodes of the electronic circuit device to be inspected, the probe is deformed in different directions through the guide, and only the probes that should be brought into contact with the electrodes of the electronic circuit device are selectively applied to the electrodes. By contacting, it is possible to prevent the extra probe from contacting and mixing with the device electrode, and if there is a gap between the arrangement position of the electrode of the electronic circuit device and the arrangement position of the probe of the probe card. However, since the tip of the probe and the electrode can be aligned through the guide, the versatility of the probe card is significantly improved.

Here, a probe card guide and a probe card according to one embodiment of the present invention are shown in FIGS. 3 and 4, respectively. The guide 10 has a hole 1 having a diameter substantially equal to the diameter of the probe in the substrate 12 so that the probe can pass therethrough.
1 is vertically formed, a hole corresponding to the probe pitch (a hole having the same arrangement as the arrangement of the probe tip), a hole formed outside the probe at a pitch wider than the probe pitch, and a probe It has holes drilled at a smaller pitch than the pitch. Probe 2 in the hole outside this guide
The pitch can be adjusted by increasing the distance between the probes by moving the
The present invention can also be used for inspection of an electronic circuit device 14 having an electrode arrangement with a wider pitch than the original probe pitch.

FIGS. 5 and 6 show a probe card guide and a probe card according to another embodiment of the present invention. A hole 17 is formed in the guide 16 in a diagonally outward direction downward from the substrate 18, and the position of the hole on the upper surface of the substrate coincides with the arrangement of the probe 2. The probe is bent obliquely by passing the probe 2 through the hole 17 of the guide, and the pitch thereof matches the electrode 21 of the electronic circuit device 20 which is the device to be inspected. In this case, the probe can be bent only by pushing the probe into the guide, and the pitch of the probe can be adjusted by moving the guide up and down. In addition, since the probe tip is obliquely contacted with the electrode by bending the probe obliquely, the contact area with the electrode at the time of pressing is increased, reliable contact can be performed, and damage to the electrode is reduced.

FIGS. 7 and 8 show a probe card guide and a probe card according to another embodiment of the present invention. A hole 23 is formed in the guide 22 obliquely inward toward the lower side of the substrate 24, and the position of the hole on the upper surface of the substrate matches the arrangement of the probe 2. By passing the probe 2 through the hole of the guide, the probe is bent obliquely, and its pitch matches the electrode 27 of the electronic circuit device 26 which is the test object.

FIGS. 9 and 10 show a probe card guide and a probe card according to another embodiment of the present invention. In the guide 28, vertical holes 29 and obliquely outward holes 29 ′ are formed alternately downward in the substrate 30, and the positions of the holes on the upper surface of the substrate coincide with the arrangement of the probes 2. By passing the probe 2 through the hole in the guide, every other probe is bent obliquely outward,
Only the probe that passes vertically has the same pitch as the electrode 33 of the electronic circuit device 32 that is the test object. This can prevent crosstalk due to adjacent probes coming into contact with the same electrode when the probe pitch is narrow.

Further, another embodiment according to the probe card of the present invention will be exemplified. The present embodiment is characterized in that an insulating elastic member is filled between the guide holding substrate and the guide. By using an insulating elastic member, even when the probe pitch is narrow, it is possible to prevent the probes from contacting each other due to deformation at the time of pressing the probe, and to prevent crosstalk. Bending and damage of the probe due to deformation can be suppressed.

As the insulating elastic member, known materials can be used. For example, silicone rubber, fluorine-based rubber, fluorine-based TPE, styrene-based rubber, olefin-based rubber, acrylic rubber, acrylonitrile-butadiene copolymer (NBR) ), Resins such as elastic epoxy resins and polyesters can be used. These may be used alone or in combination of two or more kinds. Further, those obtained by blending various fillers, antioxidants and the like may be used.

Here, FIG. 11 shows a cross-sectional view of the inspection section of the probe card according to the above embodiment. Probe 38
Are embedded in the insulating substrate 35 and fixed by soldering,
The end is connected to the electrode 39 by the wiring 40 through the insulating substrate 34. An elastic member 36 is filled between the guide 37 and the insulating substrate 35 to which the probe is fixed. Thereby, the force applied to the probe when the probe is pressed against the electronic circuit device of the device under test can be absorbed by the deformation of the entire elastic member, and the probes can be prevented from coming into contact with each other or cross-linked.

Another embodiment according to the probe card of the present invention will be described. The present embodiment is characterized in that an elastic member having electromagnetic shielding properties is filled between a substrate holding a probe and a guide. Thereby, the influence of the external electromagnetic wave is cut off, and the transmission of the current applied for the inspection and the output signal from the object to be measured can be prevented.

As the elastic member having electromagnetic shielding properties, known elastic members can be used. For example, an elastic member in which a conductive filler is uniformly dispersed in an elastic body, or a conductive filler is localized near a surface layer of an elastic body. You can use what you let. As the elastic body, any of the aforementioned elastic bodies can be used. As the conductive filler, iron, ferrite, magnetite, copper,
Examples include silver, gold, nickel, or alloys thereof, metal-plated resin particles, carbon powder, conductive fibers such as carbon fibers and metal fibers, and one or more of these may be used in combination.

Here, FIG. 12 is a sectional view of the inspection section of the probe card according to the above embodiment. A space between the insulating substrate 35 to which the probe is fixed and the guide 37 is filled with an elastic member 41 having electromagnetic shielding properties. Thereby, the influence of the external electromagnetic wave is cut off, and the transmission of the current applied for the inspection and the output signal from the object to be measured can be prevented.

Another embodiment of the probe card according to the present invention will be described. The present embodiment is characterized in that at least the probe surface between the substrate holding the probe and the guide is insulated. Accordingly, even when the pitch of the probes is narrow, it is possible to prevent the probes from being contacted or mixed with each other due to the deformation of the probes due to the pressing during the inspection.

FIG. 13 is a cross-sectional view of the inspection section of the probe card according to the above embodiment. A probe surface between the insulating substrate 35 and the guide 37 through which the probe passes, and a part of the probe surface under the guide 37 are insulated. Accordingly, even when the pitch of the probes is narrow, it is possible to prevent the probes from being contacted or mixed with each other due to the deformation of the probes due to the pressing during the inspection.

Further, another embodiment according to the probe card of the present invention will be exemplified. In the present embodiment, at least the probe surface between the substrate holding the probe and the guide is insulated and coated, and the elastic member having electromagnetic shielding properties is filled between the substrate holding the probe and the guide. It is characterized by being. This eliminates the influence of external electromagnetic waves at the time of inspection, and reduces the pressure applied to the probe by pressing at the time of inspection with the electromagnetic wave shielding member. In addition, instead of the above-described configuration, a sheet is provided in which an adhesive layer is provided on both sides of an elastic body or a conductive thin film in which a conductive filler is dispersed, and the sheet is adhered to a guide to form a hole through which a probe passes. A configuration in which the probe is bonded to a substrate holding the probe may be employed.

FIG. 14 is a cross-sectional view of the inspection section of the probe card according to the above embodiment. The space between the insulating substrate 35 to which the probe is fixed and the guide 37 is filled with an elastic member 43 having electromagnetic shielding properties. Thereby, the force applied to the probe when the probe is pressed against the electronic circuit device of the device under test can be absorbed by the deformation of the entire elastic member, and the probes can be prevented from coming into contact with each other or cross-linked.

Further, an embodiment relating to an electronic circuit device inspection method according to the present invention will be described. The present embodiment is characterized by using any one of the probe cards of the present invention described above.

[0036]

As described above, according to the present invention, by using a guide comprising a substrate having at least the number of holes corresponding to the number of electrodes of an electronic circuit device, it is possible to inspect a desired wide range of electronic circuit devices. It is possible to provide a probe card and an inspection method which can be used, in which probes do not come into contact with each other and are not mixed, and which are not affected by electromagnetic waves.

[Brief description of the drawings]

FIG. 1 is a conceptual diagram of inspecting an electronic circuit device on a wafer using a probe card having a vertical probe.

FIG. 2 is an enlarged perspective view of an inspection unit and an electronic circuit device of the probe card.

FIG. 3 is a cross-sectional view of a probe card guide according to the first embodiment of the present invention.

FIG. 4 is a conceptual diagram of an inspection using a probe card according to the second embodiment of the present invention.

FIG. 5 is a sectional view of a probe card guide according to the first embodiment of the present invention.

FIG. 6 is a conceptual diagram of an inspection using a probe card according to the second embodiment of the present invention.

FIG. 7 is a sectional view of a probe card guide according to the first embodiment of the present invention.

FIG. 8 is a conceptual diagram of an inspection using a probe card according to the second embodiment of the present invention.

FIG. 9 is a cross-sectional view of the probe card guide according to the first embodiment of the present invention.

FIG. 10 is a conceptual diagram of an inspection using a probe card according to the second embodiment of the present invention.

FIG. 11 is a cross-sectional view of an inspection unit of the probe card according to the third embodiment of the present invention.

FIG. 12 is a sectional view of an inspection unit of the probe card according to the fourth embodiment of the present invention.

FIG. 13 is a sectional view of an inspection unit of the probe card according to the fifth embodiment of the present invention.

FIG. 14 is a sectional view of an inspection unit of the probe card according to the sixth embodiment of the present invention.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 Probe card 2, 38 Probe 3 Inspection base material 4 Connector 5 Inspection device for electronic circuit device 6 Wafer 7 Connector wiring 8, 14, 20, 26, 32 Electronic circuit device to be inspected 9, 15, 21, 27, 33 Electrode 10, 16, 22, 28, 37 Probe card guide 11, 17, 23, 29 Hole 12, 18, 24, 30 Substrate 13, 19, 25, 31 Probe card inspection unit 34, 35 Insulating substrate 36 Elastic member 39 Electrode 40 Wiring 41 Electromagnetic wave shielding member 42 Insulating coat 43 Electromagnetic wave shielding elastic member 44 Wiring board

 ──────────────────────────────────────────────────続 き Continued on the front page (72) Akira Nakasuga, 2-1 Hyakuyama, Shimamoto-cho, Mishima-gun, Osaka Sekisui Chemical Co., Ltd. (72) Minoru Adachi 4--5, Shibukawa-cho, Higashi-Osaka-shi, Osaka No. 28 in Cluster Technology Co., Ltd. Development Center (72) Inventor Shoji Uesugi 4-5-2, Shibukawa-cho, Higashi-Osaka-shi, Osaka F-term in Cluster Technology Co., Ltd. Development Center 2G003 AA07 AB01 AG03 AG12 AG20 AH05 AH07 2G011 AA02 AA15 AB06 AB07 AB08 AC06 AC09 AC14 AC33 AD01 AE03 AF07 4M106 AA01 BA01 CA04 DD03 DD06 DD10 DD30

Claims (7)

[Claims] 1. A probe card guide comprising a substrate having holes through which probes corresponding to at least the number of electrodes of an electronic circuit device pass. 2. A probe card comprising: a probe in contact with an electrode of an electronic circuit device; a substrate holding the probe; and the probe card guide according to claim 1. 3. The probe card according to claim 2, wherein the insulating elastic member is filled between the guide holding substrate and the guide. 4. The probe card according to claim 2, wherein an elastic member having an electromagnetic wave shielding property is filled between the substrate holding the probe and the guide. 5. The probe card according to claim 2, wherein the probe surface is insulated and coated between at least a substrate holding the probe and the guide. 6. The probe card according to claim 5, wherein an elastic member having an electromagnetic wave shielding property is filled between the guide holding substrate and the guide. 7. A method for inspecting an electronic circuit device, comprising using the probe card according to claim 2. Description: