JP2001111180A - Assembled type board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an assembled type board from which factors for blocking cost reduction caused by regulation on the external dimensions of the board can be eliminated. SOLUTION: A frame part is sectioned internally by perforations H and arranged with a plurality of unit boards 1, 2, 3 to produce an assembled type board. The perforation H has a joint between the frame part and the unit boards 1, 2, 3 and has no joint between the unit boards 1, 2, 3.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] The present invention relates to a collective substrate.

[0002]

2. Description of the Related Art FIG. 4 shows an example of a conventional collective board (also referred to as a multi-work board). As shown in FIG. 4, a plurality of unit substrates (also referred to as product substrates) A, B, C, D, E and F are arranged inside a frame portion on the collective substrate, and each of the unit substrates A to F Are disposed so as to surround the periphery of the substrate, and perforations H are interposed between the disposal substrate G and the unit substrates A to F.

[0003] The perforation H is composed of a discarded substrate G and unit substrates A to
F is connected at a plurality of locations by connecting portions i. Therefore, by cutting off the joint portion i of the perforation H, it becomes possible to separate each of the unit substrates A to F and handle them independently. Discard substrate G is perforated H
Is deleted after deleting the connecting portion i.

[0004]

In the above-mentioned conventional collective board, the unit boards A to F are connected by the discard board G or the perforation H, so that the distance between the unit boards A to F is the minimum required. Dimensions are required, and the external dimensions of the collective board are restricted. Further, when the unit substrates A to F are connected to each other at the perforations, it is necessary to use a dividing jig and then split the unit substrates. SUMMARY OF THE INVENTION It is an object of the present invention to provide a collective substrate that can eliminate the hindrance to cost reduction resulting from the restriction on the outer dimensions of the substrate.

[0005]

According to a first aspect of the present invention, there is provided a collective board which is divided into perforations in a frame portion and has a plurality of unit substrates arranged therein. And a perforation between the unit substrates has a joint,
The perforation between the unit substrates does not have a joint. A collective substrate according to a second aspect of the present invention for solving the above-mentioned problems is characterized in that, in the first aspect, perforations between the unit substrates are arranged in substantially the same direction as the warp direction of the collective substrate. According to a third aspect of the present invention, which solves the above-mentioned problems, the aggregate substrate according to the first or second aspect, wherein the substrate material is mainly composed of glass epoxy and has a thickness of 0.8 mm. The distance to the free end of the unit substrate is set to 20 mm or less. The collective substrate according to claim 4 of the present invention that solves the above-mentioned problems,
In claim 1 to claim 3, when the unit substrates are arranged adjacent to each other via the perforation, they are arranged adjacent to each other in a substantially similar shape portion or a similar shape portion.

[0006]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described in detail with reference to embodiments shown in the drawings. One embodiment of the present invention is shown in FIG. As shown in FIG. 1, a plurality of unit substrates 1, 2, 3 are partitioned by perforations H in the collective substrate.
In addition, a disposal substrate 4 is disposed. While the discarded substrate 4 is interposed between the unit substrate 2 and the unit substrate 3,
The discarded substrate 4 is directly adjacent between the unit substrate 1 and the unit substrate 2 and between the unit substrate 1 and the unit substrate 3 without intervening. Therefore, the distance between the unit substrates 1, 2, or 1, 3 can be minimized, the arrangement can be performed efficiently, and the external dimensions of the collective substrate can be reduced.

The perforations H between the unit substrates 2 and 3 and the discard substrate 4 are connected at a plurality of joints (indicated by ○ in the figure), whereas the unit substrates 1 and In the area a of the perforation H between the area 2 and the area b of the perforation H between the unit substrate 1 and the unit substrate 3, there is no connecting portion. Therefore, only by deleting the joint portion i of the perforation H between each of the unit substrates 1, 2, 3 and the disposal substrate 4,
Since it is possible to separate each of the unit substrates 1 to 3 and it is not necessary to cut off the connecting portion i between each of the unit substrates 1 to 3, it is possible to minimize the possibility of accidentally damaging the unit substrates 1 to 3. Can be.

In order to keep the gap between the perforations H constant in the area a and the area b, the unit substrates 1 and 2
Alternatively, it is desirable that the shapes adjacent to each other are substantially similar or similar. The discarded substrate 4 is
It is theoretically possible to omit the case where each of the unit substrates 1 to 3 has a substantially similar shape or a similar shape to each other in all shapes, and it is theoretically possible to arrange only the unit substrates 1 to 3. Such a convenient shape is not considered, and the unit substrates 1 to 3 are arranged with the waste substrate 4 interposed therebetween. The discarded substrate 4 is fixed to a frame portion of a collective substrate (not shown), and is discarded after cutting off the joint portion i of the perforation H.

Here, it is preferable that the interval between the connecting portions i of the perforations is as long as possible in order to facilitate the substrate dividing operation, that is, the number of connecting portions i is smaller. However, in such a case, there is a problem that the collective substrate easily bends (warpage when placed in a furnace increases) and the strength of a mold for forming the substrate is reduced. When the substrate material is glass epoxy and the thickness is 0.8 mm, as shown in FIG.
It is desirable that the distance to the free end of each unit substrate be 20 mm or less.

Further, in order to reduce the warpage of the collective substrate in the furnace, the arrangement of the unit substrates as well as the interval of the connecting portion i is important. That is, since no connecting portion is formed at the perforation between the unit substrates, the direction intersecting the perforation is weak in strength and easily bent. Therefore, it is better to arrange the direction in which the collective substrate warps in the furnace and the perforations between the unit substrates in substantially the same direction, as compared to the case where they are arranged in the direction orthogonal to the opposite direction. It becomes strong in strength and hardly bends.

FIG. 3 shows a specific embodiment of the present invention. In this embodiment, unit substrates A to F having the same size as those of the prior art shown in FIG. 4 are arranged. In this embodiment,
As shown in FIG. 3, the inside of the frame portion is partitioned by perforations H, and unit substrates A to F and a disposal substrate G are arranged.
Here, perforations H between the unit substrates A to F and the discarded substrate G are connected at a plurality of connection portions i.

On the other hand, the unit substrates BF are not completely surrounded by the waste substrate G, and a part thereof is adjacent to the other unit substrates BF via the perforations H. The connecting portion i is not provided at the perforation H. As described above, in the present embodiment, the unit substrates A to F are efficiently arranged so as to reduce the discarded substrate G as much as possible. Therefore, as compared with the conventional technology shown in FIG. Even when F is arranged, it is possible to reduce the area of the collective substrate as a whole (about 20% reduction). Further, each of the unit substrates A to F has a connection portion i of a perforation H on the discarded substrate G.
But are connected to each other at the connecting portion i of the perforation H
, It is possible to reduce the possibility of substrate damage at the time of cutting the joint portion i.

[0013]

As described above in detail with reference to the embodiments, according to the present invention, since the unit substrates are efficiently arranged in the collective substrate, the following effects can be obtained. Since the area of the collective substrate can be reduced, the unit cost of the substrate is reduced. Since the unit substrates are not joined at the joint of the perforation, the reliability after dividing the substrate is improved. Since the unit substrates are not connected at the joint of the perforations, the number of steps required for dividing the substrates is reduced.

[Brief description of the drawings]

FIG. 1 is an explanatory diagram of a collective substrate according to one embodiment of the present invention.

FIG. 2 is an explanatory diagram showing an arrangement of a connecting portion.

FIG. 3 is an explanatory diagram of a specific embodiment of the present invention.

FIG. 4 is an explanatory view of a conventional collective substrate.

[Explanation of symbols]

 1-4 Unit substrate a, b Perforated area without joint A-F Unit substrate G Discard substrate H Perforated i Joint

Claims (4)

[Claims] 1. A collective board which is divided by a perforation inside a frame portion and in which a plurality of unit substrates are arranged, a perforation between the frame portion and the unit substrate has a joint portion, and a perforation between the unit substrates is provided. An aggregate substrate having no connecting portion. 2. The collective substrate according to claim 1, wherein perforations between said unit substrates are arranged in substantially the same direction as a warp direction of the collective substrate. 3. The method according to claim 1, wherein when the substrate material is glass epoxy as a main component and the thickness is 0.8 mm, the distance from the joint portion to the free end of the unit substrate is 20 mm or less. The collective substrate according to claim 2. 4. When the unit substrates are arranged adjacent to each other via the perforation, the unit substrates are arranged adjacent to each other in a substantially similar shape portion or a similar shape portion. A collective substrate as described.