JP2001105326A - 化学機械的ポリシングマット修整ディスク及びその製法 - Google Patents
化学機械的ポリシングマット修整ディスク及びその製法Info
- Publication number
- JP2001105326A JP2001105326A JP2000026534A JP2000026534A JP2001105326A JP 2001105326 A JP2001105326 A JP 2001105326A JP 2000026534 A JP2000026534 A JP 2000026534A JP 2000026534 A JP2000026534 A JP 2000026534A JP 2001105326 A JP2001105326 A JP 2001105326A
- Authority
- JP
- Japan
- Prior art keywords
- disk
- abrasive particles
- diamond
- modified
- modified disk
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Polishing Bodies And Polishing Tools (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW088116681A TW412461B (en) | 1999-09-29 | 1999-09-29 | Diamond disk for trimming wafer polishing pad and method for making the same |
TW88116681 | 1999-09-29 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2001105326A true JP2001105326A (ja) | 2001-04-17 |
Family
ID=21642430
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2000026534A Pending JP2001105326A (ja) | 1999-09-29 | 2000-02-03 | 化学機械的ポリシングマット修整ディスク及びその製法 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP2001105326A (zh) |
TW (1) | TW412461B (zh) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20030006793A (ko) * | 2001-07-16 | 2003-01-23 | 프리시젼다이아몬드 주식회사 | 다이아몬드계 치(齒)공구의 제조방법 및 이에 의해 제조된치(齒)공구 |
JP2005288685A (ja) * | 2004-03-10 | 2005-10-20 | Read Co Ltd | 研磨布用ドレッサー及びその製造方法 |
JP2007044863A (ja) * | 2005-08-09 | 2007-02-22 | Princo Corp | ウェハ研磨パッドのコンディショナ及びその製造方法 |
JP2009090382A (ja) * | 2007-10-04 | 2009-04-30 | Nihon Micro Coating Co Ltd | クリーニングテープ及びその製造方法 |
WO2009104224A1 (ja) * | 2008-02-20 | 2009-08-27 | 新日鉄マテリアルズ株式会社 | 研磨布用ドレッサー |
US8092560B2 (en) | 2005-11-09 | 2012-01-10 | Hitachi, Ltd. | Lapping tool and method for manufacturing the same |
CN111230758A (zh) * | 2020-03-05 | 2020-06-05 | 华侨大学 | 一种大粒径金刚石磨具的磨粒表面微去除方法及该大粒径金刚石磨具的制造方法 |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100491077C (zh) * | 2003-05-13 | 2009-05-27 | 中国砂轮企业股份有限公司 | 在制造中能个别调整磨粒的修整盘及其制造方法 |
TWI289093B (en) | 2006-07-26 | 2007-11-01 | Kinik Co | Method of manufacturing diamond disk |
CN101879706B (zh) * | 2009-05-08 | 2012-01-11 | 中国砂轮企业股份有限公司 | 钻石研磨碟及其制造方法 |
CN114770781B (zh) * | 2022-06-22 | 2022-10-14 | 成都泰美克晶体技术有限公司 | 一种sc晶片改弦定位装置及其使用方法 |
-
1999
- 1999-09-29 TW TW088116681A patent/TW412461B/zh not_active IP Right Cessation
-
2000
- 2000-02-03 JP JP2000026534A patent/JP2001105326A/ja active Pending
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20030006793A (ko) * | 2001-07-16 | 2003-01-23 | 프리시젼다이아몬드 주식회사 | 다이아몬드계 치(齒)공구의 제조방법 및 이에 의해 제조된치(齒)공구 |
JP2005288685A (ja) * | 2004-03-10 | 2005-10-20 | Read Co Ltd | 研磨布用ドレッサー及びその製造方法 |
JP2007044863A (ja) * | 2005-08-09 | 2007-02-22 | Princo Corp | ウェハ研磨パッドのコンディショナ及びその製造方法 |
US8092560B2 (en) | 2005-11-09 | 2012-01-10 | Hitachi, Ltd. | Lapping tool and method for manufacturing the same |
JP2009090382A (ja) * | 2007-10-04 | 2009-04-30 | Nihon Micro Coating Co Ltd | クリーニングテープ及びその製造方法 |
WO2009104224A1 (ja) * | 2008-02-20 | 2009-08-27 | 新日鉄マテリアルズ株式会社 | 研磨布用ドレッサー |
JP2009196025A (ja) * | 2008-02-20 | 2009-09-03 | Nippon Steel Materials Co Ltd | 研磨布用ドレッサー |
TWI455794B (zh) * | 2008-02-20 | 2014-10-11 | Nippon Steel Materials Co Ltd | 研磨布用修整輪 |
CN111230758A (zh) * | 2020-03-05 | 2020-06-05 | 华侨大学 | 一种大粒径金刚石磨具的磨粒表面微去除方法及该大粒径金刚石磨具的制造方法 |
CN111230758B (zh) * | 2020-03-05 | 2021-09-21 | 华侨大学 | 大粒径金刚石磨具的磨粒表面微去除方法及其制造方法 |
Also Published As
Publication number | Publication date |
---|---|
TW412461B (en) | 2000-11-21 |
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