JP2001102713A - Pin-erecting type printed circuit board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a pin-erecting type printed circuit board which is constituted, in such a way that the solder used at erecting of a pin does not obstruct work performed to other portions by devising the shape and dimension of the pin or changing the shape of the through-hole into which the pin is inserted. SOLUTION: In a pin-erecting type printed circuit board, which is constituted by planting a required pin 3 in a through-hole section 2 made through a printed circuit board 1 and soldering the pin 3 in the hole section 2, the insertion length of the pin 3 is made shorter than the depth of the hole section 2 and the pin 3 is formed in a multilayered shape such that the diameter of the pin 3 becomes smaller, the farther it is into the interior of the hole section 2.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a pin-type printed circuit board, and more particularly to improving the shape and dimensions of pins used or changing the shape of through holes into which pins are inserted. Accordingly, the present invention relates to a pin stand type printed circuit board in which the solder used for the pin stand operation is prevented from obstructing other parts.

[0002]

2. Description of the Related Art FIG. 7 is a schematic illustration of a conventional pin-type printed circuit board. First, FIG.
In the through-hole 2 provided at an appropriate position of the printed circuit board 1, a flat-headed pin 3 with a flange 5 is inserted so as to be substantially flush with the surface of the printed circuit board 1, and a suitable solder 4 It is fixed. FIG. 7B shows a state in which the pins 3 are inserted at appropriate locations around the printed circuit board 1 on which the required components 6 are provided. In the conventional example shown in FIG. 7, a flat head pin 3 with a flange 5 is inserted into a through hole 2 provided at an appropriate position on a printed circuit board 1, and then the pin 3 is set on the side where the pin 3 stands (solder). By performing a solder dip operation on the (surface side), required soldering is performed.

[0003] However, the above-mentioned conventional example has some disadvantages as described below. That is, (1) when performing the required soldering by performing the solder dip operation, the swelling of the solder 4 occurs on the side where the pins 3 do not stand (the component surface side). (2) When a required cream solder is printed by using a corresponding metal mask (not shown) due to the swelling of the solder 4, the space between the metal mask and the printed circuit board 1 is increased. Gap becomes excessive. (3) As described above, since the gap between the metal mask and the printed circuit board is excessively large, the amount of the cream solder used for the printing process is increased, or the cream solder is Bleeding may occur. (4) When soldering by reflow processing after mounting required components, the occurrence of an undesired short-circuit phenomenon increases (this is particularly noticeable when a QFP is provided near the pin 3). Is).
Also, during this reflow process, the solder for soldering the pins 3 (so-called 9: 1 solder) melts and swells. (5) For this reason, after the predetermined soldering operation is completed, it is necessary to make various corrections such as repairing the short-circuit generating portion.

[0004]

As described above, in the above-mentioned prior art, when the required soldering is performed by a solder dip operation, the side of the printed circuit board 1 where the pins 3 are not standing (the component surface). Side), the swelling of the solder 4 occurs; due to the swelling of the solder 4, the gap between the corresponding metal mask (not shown) and the printed circuit board 1 becomes excessively large, resulting in a printing process. The amount of cream solder increases, or
Undesirable short-circuit phenomenon increases when soldering is performed by reflow processing after mounting required parts, and the peripheral portion may be blurred. For this reason, after a predetermined soldering operation is completed, It is necessary to make various corrections, such as reworking the short-circuiting portion; and so on.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and is devised by devising the shape and dimensions of a pin to be used or changing the shape of a through hole into which the pin is inserted. It is another object of the present invention to provide a pinned type printed circuit board in which solder used in the pinning operation does not interfere with other parts.

[0006]

SUMMARY OF THE INVENTION The present invention relates to a pin stand type printed circuit board in which required pins are implanted and soldered in through holes provided in the printed circuit board. A pinned type printed circuit board, wherein the length is made smaller than the depth of the through-hole portion, and the shape is a multilayer shape whose diameter becomes smaller as the depth of the through-hole portion becomes smaller. .

Since the pin stand type printed circuit board according to the present invention has such a configuration, the solder used for pin setting work on the printed circuit board does not hinder other parts. There are advantages.

[0008]

BEST MODE FOR CARRYING OUT THE INVENTION

DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is a schematic explanatory diagram relating to a pin stand type printed circuit board according to a reference example. In FIG. 1, a pin 3 with a flange 5 lower than the printed circuit board 1 is inserted into a through hole 2 provided at an appropriate position of the printed circuit board 1, and is fixed by an appropriate solder 4. In the reference example shown in FIG.
Through-hole 2 provided in place on printed circuit board 1
The required soldering is performed by inserting a pin 3 with a flange 5 into the connector and performing a solder dip operation on the side where the pin 3 stands (the solder surface side). Here, as described above, since the height of the pin 3 when viewed from the flange 5 is smaller than the thickness of the printed circuit board 1, an extra escape area for the solder 4 is generated, and The swelling of the solder 4 does not occur on the side of the substrate 1 where the pins 3 do not stand (the component surface side), and the inconvenience as in the conventional example described above does not occur even in the printing process using cream solder.

FIG. 2 is a view showing an example of the shape of various pins used in the above reference example, and includes the shape of a pin that can be used in an embodiment of the present invention. (A) of FIG.
The head 3A of the pin 3 with the flange 5 has a flat head shape, which is the same as that used in FIG. 2 (B) to (G) in FIG. 2 illustrate a two-stage layered structure, a spire-shaped structure, or a weight-shaped or cross-shaped structure in plan view, and any structure as necessary. Can be selected and used. In FIGS. 2B to 2G, 3B to 3G represent pin heads, respectively. Then, for example, the groove-shaped portions 5A shown in FIGS.
Are provided to facilitate the flow of solder for bonding.

FIG. 3 is a schematic explanatory view of a pin-type printed circuit board according to a reference example and an embodiment of the present invention. First, as a reference example, in FIG. 3A, a through hole 2 provided at an appropriate position of a printed circuit board 1 includes:
Pin 3 lower than the printed circuit board 1 with the flange 5
(For example, the one provided with the pin head 3C in FIG. 2C) is inserted and fixed with appropriate solder 4. Also in the case shown in FIG. 3A, after inserting the pin 3 with the flange 5 into the through hole 2 provided at an appropriate place of the printed circuit board 1, the side on which the pin 3 stands The required soldering is performed by performing a solder dip operation on the (solder surface side). Here, since the height of the pin 3 when viewed from the flange 5 (that is, the above-mentioned pin head 3C) is smaller than the thickness of the printed circuit board 1, the height of the pin 3 The swelling of the solder 4 does not occur, and the inconvenience as in the above-mentioned conventional example does not occur during the printing process of the cream solder. Next, in FIG. 3B, which is an embodiment of the present invention, a through hole 2 provided at an appropriate position on the printed circuit board 1 has a pin 3 (for example, ,
(Pin head 3F shown in FIG. 2F)
Are inserted and fixed with appropriate solder 4.
Also in the case shown in FIG. 3B, after inserting the pin 3 with the flange 5 into the through hole 2 provided at an appropriate position on the printed circuit board 1, this pin 3
The required soldering is performed by performing a solder dip operation on the side (the solder surface side) on which the surface stands. Here, since the height of the pin 3 when viewed from the flange 5 (that is, the above-described pin head 3F) is smaller than the thickness of the printed circuit board 1, the height of the pin 3 The swelling of the solder 4 does not occur, and the inconvenience as in the above-mentioned conventional example does not occur during the printing process of the cream solder.

FIG. 4 is another schematic explanatory view of the pinned type printed circuit board according to the reference example and the embodiment of the present invention. In FIG. 4, the pinned printed circuit board 1 includes an upper outer layer pattern 41, a first inner layer pattern 42, a second inner layer pattern 43, and a lower outer layer pattern 4.
4 are stacked in this order. Appropriate through-holes are provided at appropriate places on the printed circuit board 1 to electrically connect the first inner layer pattern 42 and the lower outer layer pattern 44 to form pin-through holes 45. Has been. A via hole 46 having an appropriate shape and size is also formed in order to electrically connect the pin stand-through hole 45 to the upper outer layer pattern 41.

FIG. 5 is another schematic explanatory view of a pin-type printed circuit board according to a reference example and an embodiment of the present invention. First, as a reference example, in FIG.
The upper outer layer pattern 41, the first inner layer pattern 42, the second inner layer pattern 43, and the lower outer layer pattern 44 are laminated inside and outside the pinned printed circuit board 1 in this order. Then, the first inner layer pattern 42 and the lower outer layer pattern 44 provided at appropriate places on the printed circuit board 1 are provided.
Through hole 45 for pin stand which electrically connects the
A pin 3 with a rim is inserted into and is filled with solder 4. In addition, the through hole 45 for this pin stand
Via holes 46 having an appropriate shape and dimensions are also formed to electrically connect the upper outer layer pattern 41 to the upper outer layer pattern 41. Next, in FIG. 5B, which is an embodiment of the present invention, an upper outer layer pattern 41 and a first inner layer pattern 4 are shown.
2. Second inner layer pattern 43 and lower outer layer pattern 44
Are sequentially laminated inside and outside of the pin stand type printed circuit board 1. A pin 3 with a flange is inserted into a through hole 45 provided at an appropriate position on the printed circuit board 1 for pin connection which electrically connects the first inner layer pattern 42 and the lower outer layer pattern 44. And is filled with solder 4. A via hole 46 having an appropriate shape and size is also formed to electrically connect the pin-standing through hole 45 to the upper outer layer pattern 41.

FIG. 6 is another schematic explanatory view of the pinned type printed circuit board according to the reference example and the embodiment of the present invention. First, in FIG. 6A, which is a reference example, an upper outer layer pattern 41, a first inner layer pattern 42, a second inner layer pattern 43, and a lower outer layer pattern 44 are provided on a pin-standing printed circuit board 1 according to the above embodiment. The layers are stacked in this order. An appropriate blind hole is provided at an appropriate position on the printed circuit board 1, and the first inner layer pattern 42 and the lower outer layer pattern 44 are electrically connected to form a first via hole 45A for pinning. Have been to be. A small hole 45C for venting air is formed above the first via hole 45A. Then, the first via hole 45A for pin setting is provided.
A second via hole 45B having an appropriate shape and dimensions is formed to electrically connect the upper outer layer pattern 41 to the upper outer layer pattern 41. Next, FIG. 6B showing an embodiment of the present invention.
In the first, the first
A pin 3 having a flange 5 (having a flat head 3A) is inserted into the via hole 45A, and is filled with the solder 4. At this time, the air remaining in the first via hole 45A is discharged through the small air vent 45C. FIG. 6C subsequent thereto is the same as the case of FIG. 6B except that the head of the pin 3 is a two-stage layered portion 3F.

[0014]

As described in detail above, the pin stand type printed circuit board according to the present invention has the required pins implanted in through holes provided in the printed circuit board and the pins to be soldered. In the vertical printed circuit board, the length of the inserted portion of the pin is made smaller than the depth of the through-hole portion, and the shape of the pin-shaped printed circuit board is formed in a multilayer shape in which the diameter becomes smaller toward the back of the through-hole portion. This is a pin-stand type printed circuit board characterized by the above-mentioned. And because of the configuration with such features,
It is possible to provide an escape area for surplus solder generated at the time of performing a required soldering process, and there is an effect that the solder used at the time of pinning work on the printed circuit board does not hinder other parts.

[Brief description of the drawings]

FIG. 1 is a schematic explanatory view of a pin-stand type printed circuit board according to a reference example.

FIG. 2 is an illustration of various pin shapes used in the above reference example and the embodiment of the present invention.

FIG. 3 is a schematic explanatory view of the pinned type printed circuit board according to the reference example and the embodiment of the present invention.

FIG. 4 is another schematic explanatory view of the pinned type printed circuit board according to the reference example and the embodiment of the present invention.

FIG. 5 is another schematic explanatory view related to the above-described reference example and the pinned type printed circuit board according to the embodiment of the present invention.

FIG. 6 is another schematic explanatory diagram related to the above-mentioned reference example and the pin-up type printed circuit board according to the embodiment of the present invention.

FIG. 7 is a schematic illustration of a conventional pin-type printed circuit board.

[Explanation of symbols]

 1: printed wiring board; 2: through hole; 3: pin; 4: solder;

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Claims (1)

[Claims] 1. A pin stand type printed circuit board in which required pins are implanted and soldered in through holes provided in the printed circuit board, and a length of an inserted portion of the pin is equal to that of the through hole. It is made smaller than the depth,
And a pin-shaped printed circuit board having a multi-layered shape, the diameter of which becomes smaller toward the depth of the through hole.