JP2001094139A - Wiring board for mounting x-ray detecting element - Google Patents
Wiring board for mounting x-ray detecting elementInfo
- Publication number
- JP2001094139A JP2001094139A JP27041299A JP27041299A JP2001094139A JP 2001094139 A JP2001094139 A JP 2001094139A JP 27041299 A JP27041299 A JP 27041299A JP 27041299 A JP27041299 A JP 27041299A JP 2001094139 A JP2001094139 A JP 2001094139A
- Authority
- JP
- Japan
- Prior art keywords
- ray
- mounting
- detecting element
- ray detecting
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
Landscapes
- Measurement Of Radiation (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Light Receiving Elements (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、Ｘ線画像を検出す
るＸ線検出素子を搭載するためのＸ線検出素子搭載用配
線基板に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wiring board for mounting an X-ray detecting element for mounting an X-ray detecting element for detecting an X-ray image.
【０００２】[0002]
【従来の技術】例えば歯科用のＸ線カメラには、外部か
ら照射されたＸ線を画像情報に変換するためのＸ線検出
素子としてフォトダイオードセンサ素子が使用されてい
る。2. Description of the Related Art For example, in a dental X-ray camera, a photodiode sensor element is used as an X-ray detecting element for converting X-rays radiated from the outside into image information.
【０００３】フォトダイオードセンサ素子は、その上面
に多数のフォトダイオードが配列形成されており、これ
らのフォトダイオードにＸ線が照射されることにより、
各フォトダイオードの電圧電流特性が変化し、この変化
を画像情報として取り出すものである。[0003] The photodiode sensor element has a large number of photodiodes arranged and formed on the upper surface thereof. When these photodiodes are irradiated with X-rays,
The voltage-current characteristics of each photodiode change, and this change is extracted as image information.
【０００４】従来より、このようなＸ線検出素子は、こ
れを搭載するためのＸ線検出素子搭載用配線基板に搭載
されて使用されている。そして、Ｘ線検出素子搭載用配
線基板は、例えば図２に断面図で示すように、その上面
中央部にＸ線検出素子14を搭載するための搭載部11ａを
有するセラミック基体11と、このセラミック基体11の搭
載部11ａ周辺から下面にかけて導出する複数のメタライ
ズ配線導体12とから構成されていた。Conventionally, such an X-ray detecting element has been used by being mounted on an X-ray detecting element mounting wiring board for mounting the X-ray detecting element. The wiring substrate for mounting the X-ray detecting element is, for example, as shown in a sectional view of FIG. 2, a ceramic base 11 having a mounting portion 11a for mounting the X-ray detecting element 14 at the center of the upper surface thereof, And a plurality of metallized wiring conductors 12 extending from the periphery of the mounting portion 11a of the base 11 to the lower surface.
【０００５】これによれば、セラミック基体11の搭載部
11ａにＸ線検出素子14を接着固定するとともに、Ｘ線検
出素子14の各電極をメタライズ配線導体12にボンディン
グワイヤ15を介して電気的に接続し、しかる後、メタラ
イズ配線導体12でセラミック基体11の下面に導出した部
位に外部の電気回路に接続される外部接続用ケーブル16
を接続するとともに、これらを図示しない樹脂製の密閉
容器内に密閉することにより、Ｘ線カメラの撮像部とな
り、この撮像部のＸ線検出素子14側を被写体に対向させ
るとともに、この被写体を透してＸ線をＸ線検出素子14
の上面に照射することによって被写体のＸ線映像が得ら
れることとなる。According to this, the mounting portion of the ceramic base 11
An X-ray detecting element 14 is bonded and fixed to 11a, and each electrode of the X-ray detecting element 14 is electrically connected to a metallized wiring conductor 12 via a bonding wire 15. External connection cable 16 that is connected to an external electric circuit
By connecting them to each other and sealing them in a hermetically sealed resin container (not shown), an imaging unit of an X-ray camera is obtained. The X-ray detection element 14 side of the imaging unit is opposed to the subject, and the subject is transparent. X-ray to X-ray detector 14
By irradiating the upper surface of the object, an X-ray image of the subject can be obtained.
【０００６】なお、このようなＸ線検出素子搭載用配線
基板においては、例えば、セラミック基体11は酸化アル
ミニウム質焼結体から形成されており、メタライズ配線
導体12はタングステンメタライズから形成されていた。In such a wiring board for mounting an X-ray detecting element, for example, the ceramic base 11 is formed of an aluminum oxide sintered body, and the metallized wiring conductor 12 is formed of tungsten metallized.
【０００７】[0007]
【発明が解決しようとする課題】しかしながら、この従
来のＸ線検出素子搭載用配線基板によれば、セラミック
基体11を構成する酸化アルミニウム質焼結体は、Ｘ線を
透過させやすい性質を有していることから、搭載部11ａ
にＸ線検出素子14を搭載するとともに、これらを樹脂製
密閉容器内に密閉してＸ線カメラの撮像部となした後
に、Ｘ線検出素子14の上面に被写体を透してＸ線を照射
すると、撮像部の後方に位置する他の部材等で反射した
Ｘ線がセラミック基体11を透ってＸ線検出素子14に裏面
側から侵入し、これがＸ線検出素子14に被写体と異なる
不要な映像を重畳させてしまい、そのため、この不要な
映像までもが画像情報として変換されてしまい、その結
果、正確かつ鮮明な被写体の画像が得られにくいという
問題点を有していた。However, according to the conventional wiring board for mounting an X-ray detecting element, the aluminum oxide sintered body constituting the ceramic base 11 has a property of easily transmitting X-rays. The mounting part 11a
After mounting the X-ray detecting elements 14 on the X-ray camera and sealing them in a resin-made sealed container to form an imaging unit of an X-ray camera, the upper surface of the X-ray detecting elements 14 is irradiated with X-rays through a subject. Then, X-rays reflected by other members and the like located behind the imaging unit penetrate through the ceramic base 11 and enter the X-ray detection element 14 from the back side, and this is unnecessary for the X-ray detection element 14 to be different from the subject. The video is superimposed, so that even the unnecessary video is converted as image information, and as a result, it is difficult to obtain an accurate and clear image of the subject.
【０００８】本発明はかかる従来の問題点に鑑み案出さ
れたものであり、その目的は、搭載部にＸ線検出素子を
搭載するとともに、これらを例えば樹脂製密閉容器内に
密閉してＸ線カメラの撮像部となした後に、Ｘ線検出素
子の上面に被写体を透してＸ線を照射した際に、撮像部
の後方に位置する他の部材等でＸ線が反射したとして
も、反射したＸ線がＸ線検出素子に裏面側から侵入する
ことがなく、正確かつ鮮明な被写体の画像が得られるＸ
線検出素子搭載用配線基板を提供することにある。The present invention has been devised in view of the conventional problems described above, and has as its object to mount an X-ray detecting element on a mounting portion and seal the X-ray detecting element in, for example, a resin hermetically sealed container. After the imaging unit of the X-ray camera, after irradiating the X-ray through the subject to the upper surface of the X-ray detection element, even if the X-rays are reflected by other members located behind the imaging unit, The reflected X-ray does not enter the X-ray detection element from the back side, and an accurate and clear image of the subject can be obtained.
An object of the present invention is to provide a wiring board for mounting a line detection element.
【０００９】[0009]
【課題を解決するための手段】本発明のＸ線検出素子搭
載用配線基板は、Ｘ線検出素子の電極を外部に接続する
ためのメタライズ配線導体が形成されたセラミック基体
の上面にＸ線検出素子を搭載するための搭載部を有して
成るＸ線検出素子搭載用基板であって、セラミック基体
の内部および／または表面に、タングステン・モリブデ
ンのうちの少なくとも１種から成り、セラミック基体を
上面視で透視した場合に搭載部と重なり合う複数層のＸ
線遮蔽用メタライズ層を、これらのＸ線遮蔽用メタライ
ズ層の合計の厚みが0.05〜0.5 ｍｍとなるように形成し
て成ることを特徴とするものである。According to the present invention, there is provided a wiring board for mounting an X-ray detecting element, wherein an X-ray detecting element is provided on an upper surface of a ceramic base on which a metallized wiring conductor for connecting an electrode of the X-ray detecting element to the outside is formed. An X-ray detection element mounting substrate having a mounting portion for mounting an element, wherein at least one of tungsten and molybdenum is provided inside and / or on a surface of a ceramic substrate, and the ceramic substrate has an upper surface. Multiple layers of X that overlap the mounting part when seen through
The X-ray shielding metallized layer is formed so that the total thickness of the X-ray shielding metallized layer is 0.05 to 0.5 mm.
【００１０】本発明のＸ線検出素子搭載用配線基板によ
れば、セラミック基体の表面および／または内部に、タ
ングステン・モリブデンのうちの少なくとも１種から成
り、セラミック基体を上面視で透視した場合に前記搭載
部と重なり合う複数層のＸ線遮蔽用メタライズ層を、こ
れらのＸ線遮蔽用メタライズ層の合計の厚みが0.05〜0.
5 ｍｍとなるように形成して成ることから、搭載部にＸ
線検出素子を搭載し、Ｘ線検出素子の上面にＸ線を照射
した場合に、照射されたＸ線が他の部材等で反射してＸ
線検出素子に裏面側から侵入しようとしてしても、その
侵入はＸ線遮蔽用メタライズ層により有効に阻止され
る。According to the wiring board for mounting an X-ray detecting element of the present invention, at least one of tungsten and molybdenum is formed on the surface and / or inside of the ceramic base, and when the ceramic base is seen through from above, A plurality of X-ray shielding metallized layers overlapping with the mounting portion, the total thickness of these X-ray shielding metallized layers is 0.05 to 0.
5 mm, so that the mounting part
When the X-ray detector is mounted and the upper surface of the X-ray detector is irradiated with X-rays, the irradiated X-rays are reflected by other members or the like and X
Even if an attempt is made to enter the line detecting element from the back side, the intrusion is effectively prevented by the X-ray shielding metallized layer.
【００１１】[0011]
【発明の実施の形態】次に、本発明を添付の図面を基に
説明する。Next, the present invention will be described with reference to the accompanying drawings.
【００１２】図１は、本発明のＸ線検出素子搭載用基板
の実施の形態の一例を示す断面図であり、１はセラミッ
ク基体、２はメタライズ配線導体、３ａ・３ｂ・３ｃ・
３ｄはＸ線遮蔽用メタライズ層である。FIG. 1 is a sectional view showing an embodiment of an X-ray detecting element mounting substrate according to the present invention, wherein 1 is a ceramic base, 2 is a metallized wiring conductor, 3a, 3b, 3c.
3d is an X-ray shielding metallized layer.
【００１３】セラミック基体１は、例えば酸化アルミニ
ウム質焼結体から成る略四角平板状であり、その上面中
央部にＸ線検出素子４を搭載するための搭載部１ａを有
しており、この搭載部１ａには例えばフォトダイオード
センサ素子等のＸ線検出素子４が搭載される。The ceramic substrate 1 is in the form of a substantially rectangular flat plate made of, for example, an aluminum oxide sintered body, and has a mounting portion 1a for mounting the X-ray detecting element 4 at the center of its upper surface. An X-ray detection element 4 such as a photodiode sensor element is mounted on the section 1a.
【００１４】セラミック基体１は、酸化アルミニウム質
焼結体から成る場合であれば、酸化アルミニウム・酸化
珪素・酸化マグネシウム・酸化カルシウム等の原料粉末
に適当な有機バインダ・溶剤を添加混合して泥漿状とな
すとともに、これをドクターブレード法によりシート状
となして複数枚のセラミックグリーンシートを得て、次
に、これらのセラミックグリーンシートに適当な打ち抜
き加工を施すとともに上下に積層してセラミックグリー
ンシート積層体となし、最後にこのセラミックグリーン
シート積層体を還元雰囲気中にて約1600℃の温度で焼成
することによって製作される。If the ceramic substrate 1 is made of an aluminum oxide-based sintered body, an appropriate organic binder and a solvent are added to a raw material powder such as aluminum oxide, silicon oxide, magnesium oxide, calcium oxide, etc. The ceramic green sheet is formed by forming a sheet by the doctor blade method to obtain a plurality of ceramic green sheets, and then performing an appropriate punching process on the ceramic green sheets and laminating the ceramic green sheets on top and bottom. The ceramic green sheet laminate is finally manufactured by firing this ceramic green sheet laminate at a temperature of about 1600 ° C. in a reducing atmosphere.
【００１５】また、セラミック基板１の搭載部１ａの周
辺から下面にかけては複数のメタライズ配線導体２が形
成されている。A plurality of metallized wiring conductors 2 are formed from the periphery of the mounting portion 1a of the ceramic substrate 1 to the lower surface.
【００１６】メタライズ配線導体２は、Ｘ線検出素子４
の各電極を外部の電気回路に電気的に接続するための導
電路として機能し、その搭載部１ａ周辺部位にはＸ線検
出素子４の各電極がボンディングワイヤ５を介して電気
的に接続され、絶縁基体１の下面に導出した部位には、
外部電気回路との接続に利用される外部接続用ケーブル
６が接続される。The metallized wiring conductor 2 includes an X-ray detecting element 4
Function as a conductive path for electrically connecting each of the electrodes to an external electric circuit, and the electrodes of the X-ray detecting element 4 are electrically connected to the mounting portion 1a via bonding wires 5 around the mounting portion 1a. In the part led out to the lower surface of the insulating base 1,
An external connection cable 6 used for connection to an external electric circuit is connected.
【００１７】メタライズ配線導体２は、タングステンや
モリブデン等の高融点金属粉末メタライズから成り、例
えばタングステンメタライズから成る場合であれば、平
均粒径が１〜５μｍ程度のタングステン粉末に適当な有
機バインダ・溶剤を添加混合して得た金属ペーストをセ
ラミック基体１となるセラミックグリーンシートにスク
リーン印刷法等により印刷塗布し、これをセラミックグ
リーンシートとともに焼成することによって、セラミッ
ク基体１の搭載部１ａ周辺から下面にかけて形成され
る。The metallized wiring conductor 2 is made of a metal powder of a refractory metal such as tungsten or molybdenum. For example, if the metallized wiring conductor 2 is made of a metallized tungsten, an appropriate organic binder / solvent for a tungsten powder having an average particle size of about 1 to 5 μm is used. The metal paste obtained by adding and mixing is printed and coated on a ceramic green sheet to be the ceramic substrate 1 by a screen printing method or the like, and is fired together with the ceramic green sheet, from the periphery of the mounting portion 1a of the ceramic substrate 1 to the lower surface. It is formed.
【００１８】なお、通常であれば、メタライズ配線導体
２の表面には、メタライズ配線導体２の酸化腐食を防止
するとともにメタライズ配線導体２とボンディングワイ
ヤ５および外部接続用ケーブル６との接続を容易で強固
なものとするために、厚みが１〜10μｍ程度のニッケル
めっきおよび厚みが0.1 〜３μｍ程度の金めっきが電解
めっき法や無電解めっき法により順次施されいる。Normally, on the surface of the metallized wiring conductor 2, the metallized wiring conductor 2 is prevented from being oxidized and corroded, and the metallized wiring conductor 2 is easily connected to the bonding wire 5 and the external connection cable 6. In order to make it strong, nickel plating having a thickness of about 1 to 10 μm and gold plating having a thickness of about 0.1 to 3 μm are sequentially applied by an electrolytic plating method or an electroless plating method.
【００１９】さらに、セラミック基体１の内部および搭
載部１ａ上面には、セラミック基体１を上面視で透視し
た場合に、搭載部１ａと重なり合う複数層のＸ線遮蔽用
メタライズ層３ａ・３ｂ・３ｃ・３ｄが形成されてい
る。Further, a plurality of X-ray shielding metallization layers 3a, 3b, 3c, which overlap with the mounting portion 1a when the ceramic substrate 1 is seen through from above, are provided on the inside of the ceramic substrate 1 and the upper surface of the mounting portion 1a. 3d is formed.
【００２０】Ｘ線遮蔽用メタライズ層３ａ・３ｂ・３ｃ
・３ｄは、タングステンやモリブデン等の高融点金属粉
末メタライズから成り、搭載部１ａに搭載されるＸ線検
出素子４に不要なＸ線がその裏面側から侵入するのを防
止するバリアとして機能し、タングステン等の原子量の
大きな元素がＸ線の透過を有効に阻止する作用をなす。X-ray shielding metallized layers 3a, 3b, 3c
3d is made of a metallized metal powder of a high melting point such as tungsten or molybdenum, and functions as a barrier for preventing unnecessary X-rays from entering the X-ray detection element 4 mounted on the mounting portion 1a from the back side thereof; An element having a large atomic weight such as tungsten acts to effectively prevent the transmission of X-rays.
【００２１】そして、Ｘ線遮蔽用メタライズ層３ａ・３
ｂ・３ｃ・３ｄがＸ線の透過を有効に阻止することか
ら、搭載部１ａにＸ線検出素子４を搭載するとともに、
これらを例えば樹脂製の密閉容器内に密閉してＸ線カメ
ラの撮像部となした後、Ｘ線検出素子４の上面に被写体
を透してＸ線を照射した際に、撮像部の後方に位置する
他の部材等で反射したＸ線がＸ線検出素子４にその裏面
側から侵入しようとしても、その侵入はＸ線遮蔽板用メ
タライズ層３ａ・３ｂ・３ｃ・３ｄにより有効に阻止さ
れてＸ線検出素子４に被写体以外の不要な映像が映るこ
とはなく、それにより正確かつ鮮明な被写体の画像を得
ることが可能となる。The X-ray shielding metallization layers 3a and 3
Since b, 3c, and 3d effectively block transmission of X-rays, the X-ray detection element 4 is mounted on the mounting portion 1a,
After these are sealed in a sealed container made of, for example, a resin to form an imaging unit of an X-ray camera, when the upper surface of the X-ray detecting element 4 is irradiated with X-rays through a subject, the imaging unit is positioned behind the imaging unit. Even if the X-rays reflected by other members or the like are trying to enter the X-ray detecting element 4 from the back side, the intrusion is effectively prevented by the X-ray shielding plate metallization layers 3a, 3b, 3c, 3d. Unnecessary images other than the subject do not appear on the X-ray detection element 4, thereby enabling accurate and clear images of the subject to be obtained.
【００２２】なお、各Ｘ線遮蔽用メタライズ層３ａ・３
ｂ・３ｃ・３ｄは、それぞれの厚みが10〜50μｍ程度で
あり、合計の厚みが0.05〜0.5 ｍｍとなっている。The X-ray shielding metallized layers 3a, 3a
Each of b, 3c and 3d has a thickness of about 10 to 50 μm and a total thickness of 0.05 to 0.5 mm.
【００２３】Ｘ線遮蔽用メタライズ層３ａ・３ｂ・３ｃ
・３ｄは、その合計の厚みが0.05ｍｍ未満ではＸ線の透
過を十分に阻止することができなくなる傾向にある。他
方、0.5 ｍｍを超えると、本発明のＸ線検出素子搭載用
配線基板が不要に厚いものとなり、本発明のＸ線検出素
子搭載用配線基板を使用したＸ線カメラの撮像部の小型
化が困難なものとなってしまう傾向にある。したがっ
て、Ｘ線遮蔽用メタライズ層３ａ・３ｂ・３ｃ・３ｄの
厚みは、0.05〜0.5 ｍｍの範囲が好ましい。X-ray shielding metallized layers 3a, 3b, 3c
3d tends to be unable to sufficiently prevent transmission of X-rays when the total thickness is less than 0.05 mm. On the other hand, when the thickness exceeds 0.5 mm, the wiring board for mounting the X-ray detection element of the present invention becomes unnecessarily thick, and the imaging unit of the X-ray camera using the wiring board for mounting the X-ray detection element of the present invention becomes smaller. It tends to be difficult. Therefore, the thickness of the X-ray shielding metallized layers 3a, 3b, 3c, 3d is preferably in the range of 0.05 to 0.5 mm.
【００２４】Ｘ線遮蔽用メタライズ層３ａ・３ｂ・３ｃ
・３ｄは、メタライズ配線導体２と同様に、例えばタン
グステンメタライズから成る場合であれば、平均粒径が
１〜５μｍ程度のタングステン粉末に適当な有機バイン
ダ・溶剤を添加混合して得た金属ペーストをセラミック
基体１となるセラミックグリーンシートにスクリーン印
刷法等により印刷塗布し、これをセラミックグリーンシ
ートとともに焼成することによって、セラミック基体１
の内部および搭載部１ａ上面に形成される。X-ray shielding metallized layers 3a, 3b, 3c
3d is a metal paste obtained by adding a suitable organic binder / solvent to tungsten powder having an average particle size of about 1 to 5 μm and mixing the same if the metallization wiring conductor 2 is made of, for example, tungsten metallization. The ceramic green sheet serving as the ceramic base 1 is printed and applied by a screen printing method or the like, and is baked together with the ceramic green sheet.
And on the upper surface of the mounting portion 1a.
【００２５】なお、通常であれば、セラミック基体１の
表面に形成されたＸ線遮蔽用メタライズ層３ａの上面に
は、Ｘ線遮蔽用メタライズ層３ａの酸化腐食を防止する
ために、厚みが１〜10μｍ程度のニッケルめっきおよび
厚みが0.1 〜３μｍ程度の金めっきが電解めっき法や無
電解めっき法により順次施されている。Normally, on the upper surface of the X-ray shielding metallized layer 3a formed on the surface of the ceramic substrate 1, a thickness of 1 mm is formed in order to prevent oxidation corrosion of the X-ray shielding metallized layer 3a. Nickel plating with a thickness of about 10 μm and gold plating with a thickness of about 0.1 to 3 μm are sequentially applied by an electrolytic plating method or an electroless plating method.
【００２６】かくして、本発明のＸ線検出素子搭載用配
線基板によれば、セラミック基体１の搭載部１ａにＸ線
検出素子４を接着固定するとともに、Ｘ線検出素子４の
各電極をメタライズ配線導体２にボンディングワイヤ５
を介して電気的に接続し、しかる後、メタライズ配線導
体２でセラミック基体１の下面に導出した部位に外部接
続用ケーブル６を接続するとともに、これらを樹脂製の
密封容器で密封することにより、例えば歯科用のＸ線カ
メラの撮像部となる。Thus, according to the wiring board for mounting an X-ray detecting element of the present invention, the X-ray detecting element 4 is bonded and fixed to the mounting portion 1a of the ceramic base 1, and each electrode of the X-ray detecting element 4 is metallized wiring. Bonding wire 5 to conductor 2
Then, the external connection cable 6 is connected to a portion led out to the lower surface of the ceramic base 1 by the metallized wiring conductor 2, and these are sealed with a resin-made sealed container. For example, it is an imaging unit of a dental X-ray camera.
【００２７】なお、本発明は上述の実施の形態の一例に
限定されるものではなく、本発明の要旨を逸脱しない範
囲であれば種々の変更は可能であることはいうまでもな
い。The present invention is not limited to the above-described embodiment, and it goes without saying that various changes can be made without departing from the scope of the present invention.
【００２８】例えば、上述の実施の形態の一例では、セ
ラミック基体１の内部および表面に４層のＸ線遮蔽用メ
タライズ層３ａ・３ｂ・３ｃ・３ｄを設けていたが、Ｘ
線遮蔽用メタライズ層は、セラミック基体１の内部およ
び表面に４層設けるのに限らず、セラミック基体１の内
部および／または表面に２〜３層あるいは５層以上設け
てもよい。For example, in one example of the above-described embodiment, four X-ray shielding metallized layers 3a, 3b, 3c and 3d are provided inside and on the surface of the ceramic base 1.
The metallization layer for line shielding is not limited to four layers provided inside and / or on the surface of the ceramic substrate 1, but may be provided two to three layers or five or more layers inside and / or on the surface of the ceramic substrate 1.
【００２９】さらに、本発明のＸ線検出素子搭載用配線
基板は、歯科用のＸ線カメラの他に、例えば宇宙観測用
のＸ線カメラ等、他の用途のＸ線カメラに用いてもよ
い。Further, the wiring board for mounting an X-ray detecting element according to the present invention may be used not only for dental X-ray cameras but also for other purposes such as space observation X-ray cameras. .
【００３０】[0030]
【発明の効果】本発明のＸ線検出素子搭載用配線基板に
よれば、セラミック基体の表面および／または内部にタ
ングステン・モリブデンのうちの少なくとも１種から成
り、セラミック基体を上面視で透視した場合に前記搭載
部と重なり合う複数層のＸ線遮蔽用メタライズ層を、こ
れらのＸ線遮蔽用メタライズ層の合計の厚みが0.05〜0.
5 ｍｍとなるように形成して成ることから、搭載部にＸ
線検出素子を搭載するとともに、これらを例えば樹脂製
密閉容器内に密閉してＸ線カメラの撮像部となした後
に、Ｘ線検出素子の上面に被写体を透してＸ線を照射し
た際に、撮像部の後方にある他の部材等でＸ線が反射し
たとしても、反射したＸ線はＸ線遮蔽用メタライズ層に
より有効に遮蔽されてＸ線検出素子に裏面側から侵入す
ることはなく、その結果、搭載されたＸ線検出素子によ
って正確かつ鮮明な被写体の画像を得ることが可能とな
る。According to the wiring board for mounting an X-ray detecting element of the present invention, when the ceramic base is made of at least one of tungsten and molybdenum on the surface and / or inside thereof, and the ceramic base is seen through from above. A plurality of X-ray shielding metallized layers overlapping the mounting portion, the total thickness of these X-ray shielding metallized layers is 0.05 to 0.
5 mm, so that the mounting part
After mounting the X-ray detection elements and sealing them in, for example, a resin-made airtight container to form an imaging unit of an X-ray camera, when X-rays are irradiated through the subject to the upper surface of the X-ray detection element, Even if X-rays are reflected by another member or the like behind the imaging unit, the reflected X-rays are effectively shielded by the X-ray shielding metallization layer and do not enter the X-ray detection element from the back side. As a result, an accurate and clear image of the subject can be obtained by the mounted X-ray detection element.
【図１】本発明のＸ線検出素子搭載用配線基板の実施の
形態の一例を示す断面図である。FIG. 1 is a cross-sectional view illustrating an example of an embodiment of a wiring board for mounting an X-ray detection element according to the present invention.
【図２】従来のＸ線検出素子搭載用配線基板を示す断面
図である。FIG. 2 is a cross-sectional view showing a conventional wiring board for mounting an X-ray detection element.
１・・・・・・セラミック基体 １ａ・・・・・・搭載部 ２・・・・・・メタライズ配線導体 ３ａ〜３ｄ・・・・Ｘ線遮蔽用メタライズ層 ４・・・・・・Ｘ線検出素子 DESCRIPTION OF SYMBOLS 1 ... Ceramic base 1a ... Mounting part 2 ... Metallized wiring conductor 3a-3d ... X-ray shielding metallized layer 4 ... X-ray Detection element
Claims (1)
めのメタライズ配線導体が形成されたセラミック基体の
上面に前記Ｘ線検出素子を搭載するための搭載部を有し
て成るＸ線検出素子搭載用配線基板であって、前記セラ
ミック基体の内部および／または表面に、タングステン
・モリブデンのうちの少なくとも１種から成り、前記セ
ラミック基体を上面視で透視した場合に前記搭載部と重
なり合う複数層のＸ線遮蔽用メタライズ層を、これらの
Ｘ線遮蔽用メタライズ層の合計の厚みが0.05〜0.5 ｍｍ
となるように形成して成ることを特徴とするＸ線検出素
子搭載用配線基板。1. An X-ray detector comprising a mounting portion for mounting said X-ray detecting element on an upper surface of a ceramic base on which a metallized wiring conductor for connecting an electrode of the X-ray detecting element to the outside is formed. A wiring board for mounting an element, wherein at least one of tungsten and molybdenum is formed on the inside and / or the surface of the ceramic base, and the plurality of layers overlap the mounting portion when the ceramic base is seen through in a top view. X-ray shielding metallized layer, the total thickness of these X-ray shielding metallized layer is 0.05 to 0.5 mm
A wiring board for mounting an X-ray detection element, wherein the wiring board is formed so as to be:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27041299A JP4160702B2 (en) | 1999-09-24 | 1999-09-24 | Wiring board for mounting X-ray detection elements |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27041299A JP4160702B2 (en) | 1999-09-24 | 1999-09-24 | Wiring board for mounting X-ray detection elements |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2001094139A true JP2001094139A (en) | 2001-04-06 |
| JP4160702B2 JP4160702B2 (en) | 2008-10-08 |
Family
ID=17485912
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP27041299A Expired - Fee Related JP4160702B2 (en) | 1999-09-24 | 1999-09-24 | Wiring board for mounting X-ray detection elements |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4160702B2 (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006202791A (en) * | 2005-01-18 | 2006-08-03 | Hitachi Medical Corp | Ic package and x-ray ct apparatus employing it |
| JP2009076726A (en) * | 2007-09-21 | 2009-04-09 | Kyocera Corp | Wiring board for mounting x-ray detecting element, and x-ray detecting device |
| JP2009074964A (en) * | 2007-09-21 | 2009-04-09 | Kyocera Corp | Wiring board for mounting x-ray detecting element and x-ray detector |
| JP2010066109A (en) * | 2008-09-10 | 2010-03-25 | Canon Inc | Radiation machine |
| JP2010171254A (en) * | 2009-01-23 | 2010-08-05 | Hitachi Automotive Systems Ltd | Electronic device package structure, and electronic circuit module using the same |
-
1999
- 1999-09-24 JP JP27041299A patent/JP4160702B2/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006202791A (en) * | 2005-01-18 | 2006-08-03 | Hitachi Medical Corp | Ic package and x-ray ct apparatus employing it |
| JP4509806B2 (en) * | 2005-01-18 | 2010-07-21 | 株式会社日立メディコ | IC package and X-ray CT apparatus using the same |
| JP2009076726A (en) * | 2007-09-21 | 2009-04-09 | Kyocera Corp | Wiring board for mounting x-ray detecting element, and x-ray detecting device |
| JP2009074964A (en) * | 2007-09-21 | 2009-04-09 | Kyocera Corp | Wiring board for mounting x-ray detecting element and x-ray detector |
| JP2010066109A (en) * | 2008-09-10 | 2010-03-25 | Canon Inc | Radiation machine |
| JP2010171254A (en) * | 2009-01-23 | 2010-08-05 | Hitachi Automotive Systems Ltd | Electronic device package structure, and electronic circuit module using the same |
Also Published As
| Publication number | Publication date |
|---|---|
| JP4160702B2 (en) | 2008-10-08 |
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