JP2010171254A - Electronic device package structure, and electronic circuit module using the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic device package structure downsizable and incorporated in an actuator of a motor, an injector or the like that particularly easily generates large electrical noise, and to provide an electronic circuit module using the same. <P>SOLUTION: A base board 1 including an electronic circuit part 21A with electronic components 10, 11 each comprising a semiconductor element and the like mounted thereon is formed of a dielectric material; and a dielectric lamination part with a sheet-like dielectric material 2 and a conductor 4 laminated therein is arranged in a bushel-like form in an outer peripheral part of the base board 1 to surround the electronic circuit part 21A to remove or cut off noise emitted to the outside from the electronic circuit part 21A and/or intruding into the electronic circuit part 21A from the outside. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to an electronic device package structure in which an electronic component made of a semiconductor element or the like is mounted on the surface of a base substrate, and an electronic circuit module using the electronic device package structure, and is used particularly in a high noise environment such as an automobile. The present invention relates to a suitable electronic circuit module.

  In a circuit module for mounting an electronic circuit (electronic component), in the conventional technique, electronic components such as a semiconductor element and a capacitor and a resistor for preventing (reducing) noise are directly mounted on a circuit board. Alternatively, after mounting electronic components such as a semiconductor element, a noise removing capacitor, and a resistor on an interposer substrate, they are packaged by sealing with a resin or the like, and the package is mounted on a circuit substrate (see Patent Documents 1 and 2 below) reference).

JP 2001-168266 A JP 2002-184894 A

  However, in the prior art, capacitors that prevent the influence of electrical noise due to electromagnetic waves of electronic circuits (electronic components) are individually installed, so it is difficult to reduce the size of the circuit module itself, and in particular, motors and injectors ( It has been difficult to incorporate an electronic circuit into an actuator such as a fuel injection valve.

  The present invention has been made in view of the above circumstances, and an object of the present invention is to be able to reduce the size, and in particular, to be incorporated in an actuator such as a motor or an injector that easily generates a large electric noise. It is an object to provide an electronic device package structure and an electronic circuit module using the electronic device package structure.

  In order to achieve the above object, one of the electronic device package structures according to the present invention basically includes a base substrate having an electronic circuit part on which an electronic component made of a semiconductor element or the like is mounted, and is formed of a dielectric. A dielectric in which a sheet-like dielectric and a conductor are laminated on the outer periphery of the base substrate in order to remove or block noise that enters the electronic circuit part from the outside and / or from the outside to the electronic circuit part. The laminated portion is provided in a bowl shape so as to surround the electronic circuit portion.

  According to another aspect of the electronic device package structure of the present invention, a base substrate having an electronic circuit portion on which an electronic component made of a semiconductor element or the like is mounted is formed of a dielectric, and the periphery of the electronic circuit portion in the base substrate In addition, a plurality of dielectric laminated portions in which sheet-like dielectrics and conductors are laminated are provided in a predetermined manner, and adjacent to at least one dielectric laminated portion of the plurality of dielectric laminated portions. In addition, a dielectric laminate part composed of a dielectric having a characteristic different from that of the dielectric constituting the dielectric laminate part is arranged.

  In this case, the plurality of dielectrics having different characteristics preferably have different capacities or dielectric constants.

  The plurality of dielectrics having different characteristics are preferably obtained by firing powders of the same material, and the characteristics are made different depending on the particle size.

  In a further preferred aspect, the plurality of dielectrics having different characteristics are formed of green particles of powders having the same material but different particle sizes, and having the same characteristics by punching them into a predetermined size shape. They are arranged in a staggered manner so as not to be adjacent to each other, and are laminated together after being laminated with the same characteristics.

  The dielectric material is preferably barium titanate.

  In another preferred aspect, the dielectric laminated portion is formed by alternately laminating dielectrics and conductors having the same characteristics, and n and n + 2 layers of the conductor are arranged between them, where n is an integer. Are connected by a conductor filled in a via hole provided in the dielectric.

  On the other hand, an electronic circuit module according to the present invention adopts the electronic device package structure described above, and an electronic component made of a semiconductor element or the like is mounted on the electronic circuit portion of the base substrate, and the dielectric laminate portion. The outermost layer is formed of a conductor, and the outermost layer conductor is connected to the electronic circuit portion and to an electrode terminal portion provided for connection to the outside.

  In a preferred aspect of the electronic circuit module, a part or all of the electronic circuit module is sealed with a cap formed of a conductor.

  The electronic component is preferably bonded to the base substrate with a conductive adhesive.

  The electronic component is preferably connected to a conductor formed on the surface of the substrate by a metal bump.

  In another preferred aspect of the electronic circuit module, the electronic circuit module is configured as a drive circuit for controlling the motor and can be built in the motor.

  In another preferable aspect of the electronic circuit module, the electronic circuit module is configured as a drive circuit for controlling the injector of the vehicle-mounted engine and can be built in the injector.

  In an electronic circuit module employing the electronic device package structure according to the present invention, a base substrate having an electronic circuit portion is formed of a dielectric, and a sheet-like dielectric and a conductor are laminated on the outer periphery of the base substrate. The dielectric laminate portion is provided in a bowl shape so as to surround the electronic circuit portion (preferably a plurality of types of dielectric laminate portions having different characteristics are disposed alternately, for example). Electrical noise is absorbed or removed by the dielectric laminated portion at the entrance of the portion, so that the electronic circuit portion can be stably operated.

  In particular, in actuators such as motors and injectors (fuel injection valves) in automobiles, electromagnetic waves during operation of the actuators become noise and cause electronic circuits (electronic parts) to malfunction, but according to the present invention, noise is an electronic circuit unit. Since it is absorbed by the dielectric laminated portion at the entrance, it can be easily built in the actuator. At the same time, noise emitted to the outside from the electronic circuit section in the module can be removed.

  In addition, it is not necessary to install capacitors individually for each electronic component that makes up the electronic circuit, and by mounting multiple types of semiconductor components, a circuit module that does not require a circuit board can be created, and a significant reduction in size can be achieved. .

  Furthermore, according to the present invention, in order to mount an electronic circuit part (electronic component) in a module (package) formed of a dielectric, a capacitor is individually installed for each electronic component to be mounted as in the past. There is no need to consider the arrangement of the design, and the degree of freedom in design increases.

The side view which shows schematic structure of one Example of the electronic device package structure which concerns on this invention (X-X 'arrow sectional drawing of FIG. 2). FIG. 1 is a plan view showing a schematic configuration of the noise removing capacitor shown in FIG. FIG. 2 is a cross-sectional view taken along arrow Y-Y ′ in FIG. 1. Sectional drawing which shows an example of the electronic circuit module which concerns on this invention. The drive circuit diagram of a motor. Sectional drawing of the motor which incorporated an example of the electronic circuit module which concerns on this invention. FIG. 7 is a detail view of a main part of the motor shown in FIG. 6. The conventional injector drive circuit diagram. The drive circuit diagram of the injector with a built-in driver. Sectional drawing of the injector which incorporated the other example of the electronic circuit module of this invention. FIG. 11 is an external conceptual diagram of a drive circuit module built in the injector shown in FIG. 10. FIG. 11 is a detail view of a main part of the injector shown in FIG. 10.

  Embodiments of the electronic device package structure of the present invention will be described below with reference to the drawings.

  1, 2, and 3 show a schematic configuration of an embodiment of an electronic device package structure according to the present invention. FIG. 1 is a side view thereof (sectional view taken along the line XX ′ in FIG. 2), FIG. Is a plan view thereof, and FIG. 3 is a cross-sectional view taken along arrow YY ′ of FIG.

  1 to 3, the base substrate 1 is made of a dielectric material. On the substrate 1, a conductor 6 serving as a circuit reference potential is formed on the same surface together with electronic circuit wiring (not shown).

  The dielectrics 2 and 3 have different dielectric constants (ε1, ε2), and are laminated so as to overlap with the conductor layers 4 and 5 (referred to as dielectric laminates 2, 3 or dielectric laminates 16). Is).

  Further, the conductor layers 4, 5 and 6 are provided inside the dielectric layer 2 as shown in FIG. 3, and are alternately connected to each other by via holes 7 filled with a conductor. Further, as shown in FIG. 3, the conductor layer 4 is connected to a conductor 8 disposed on a side surface of the package (module) for connection to the outside.

  Next, a process for manufacturing a package structure including the dielectric laminates 2 and 3 will be described.

  First, the substrate 1 as a dielectric is in a green sheet shape and the conductor 6 is formed by printing. As the material of the substrate 1, titanium oxide or barium titanate frequently used for capacitors is selected according to a required dielectric constant. The dielectric layer 3 is made of a material having a dielectric constant ε1 obtained by punching out a portion corresponding to the dielectric layer 2 and is formed in a green sheet state like the substrate 1. The dielectric layer 2 (ε2) is punched out in a shape leaving the hatched portion in FIG. 2 opposite to the dielectric layer 3, and the conductor 5 or the conductor 4 is printed in the green sheet state similarly to the substrate 1 and the dielectric layer 3. In addition, a via hole 7 filled with a conductor is provided in a layer of the dielectric 2 that needs to be connected by a via hole.

  Next, each of these layers is laminated. That is, the substrate 1 is laminated with the dielectric 3 and dielectric 2 layers on the lowermost layer, and the layer with the conductor 4 formed on the surface is laminated on the last (uppermost layer). Bake at high temperature. Thereafter, the conductor 8 is applied on the side surface so as to be electrically connected to the conductor 4, and the conductor 8 is fired again at a temperature of about 900 ° C.

  As a result, a bowl-shaped electronic device package structure including a substrate 1 having an electronic circuit portion on which electronic components 10 and 11 made of semiconductor elements or the like are mounted, and a dielectric laminate portion 16 provided on the outer periphery of the substrate 1. (Electronic circuit module) can be obtained.

  Here, the dielectric constants desired for the dielectric layer 3 and the dielectric layer 2 are different. That is, the dielectric layer 2 forming the capacitor has a high dielectric constant (ε2) performance (characteristic), and the dielectric layer 3 has a low dielectric constant (ε1) performance (characteristic) to reduce circuit crosstalk. ) Is desired. However, as described above, since the green sheet is fired as described above, there is a problem of cracking after firing if the behavior in the firing temperature process during firing, typically shrinkage characteristics, is not achieved. In the present invention, in order to solve this, the dielectric layer 3 and the dielectric layer 2 are formed of the same material (material), for example, barium titanate, and the particle size in the powdery state when the green sheet is formed is changed. It was. Barium titanate is characterized by a large change in dielectric constant (1 to 10 times) depending on the particle size. By doing so, it was possible to form layers having different dielectric constants with uniform sintering characteristics during firing.

  According to the present embodiment, it is possible to provide an extremely small electronic device package (module) having a capacitor formed of a dielectric laminated portion on the outer peripheral portion of the substrate 1 and capable of forming an electronic circuit therein.

  FIG. 4 shows an electronic circuit module (motor drive circuit module) 21 in which the electronic device package structure as described above is adopted. In the electronic circuit module 21 of this example, basically, a base substrate 1 having an electronic circuit portion 21A on which electronic components 10 and 11 made of a semiconductor element or the like are mounted is formed of a dielectric, and on the surface of the substrate 1 A dielectric laminated portion in which the dielectrics 2, 3 and the conductors 4 are arranged in a predetermined manner is provided around the electronic circuit portion 21A.

  The module 21 is mounted with a drive circuit (motor driver) that controls the motor shown in FIG.

  The electronic component 11 shown in FIG. 4 is the transistors T1 to T4 (17 to 20) shown in FIG. 5, and the electronic component 10 is the driver IC shown in FIG. A dielectric laminated portion 16 formed of the dielectric layer 2 (ε2) and the conductor layer 5 or the like indicates a capacitor.

  The electronic component 11 (transistors T <b> 1 to T <b> 4) is fixed to the reference voltage conductor 6 of the substrate 1 with a conductive adhesive 12. A wire 14 is electrically connected from the surface electrode (not shown) to the electrode 8 connected to the conductor layer 4 by wire bonding and connected to the outside.

  The electronic component 10 (driver IC) is connected to the electronic circuit forming conductor of the substrate 1 by metal bumps (for example, solder) 13. Furthermore, a cap 9 that is a plastic molded product is provided to prevent dust and moisture entering from the outside. A metal layer 15 is formed inside the cap 9 by plating, and the metal layer 15 is electrically connected to a reference potential (via the conductor layer 8 on the right side of FIG. 4).

  The operation of the circuit shown in FIG. 5 will be described.

  A control circuit centered on the microcomputer outputs a signal for the rotational operation of the motor 22 to the driver IC 10 in accordance with various commands and information signals from the sensors. The driver IC outputs a signal for operating the motor to the transistors T1 to T4 according to the instruction. As a result, for example, when the transistors T1 and T4 are turned on, the motor 22 rotates to the right, and when T2 and T3 are turned on, the rotation is controlled to the left.

  According to this configuration, since the electric noise entering the motor drive circuit (motor driver) can be removed by the capacitor 16 (dielectric layer 2, conductor layer 5), it is possible to provide a motor drive circuit (circuit module) with stable operation. I can do it.

  6 and 7 show a state in which the motor drive circuit (circuit module) 21 as shown in FIG. The motor 22 is a power window of an automobile, a power seat that operates a seat, and a power seat belt that winds up the seat belt. These motors must be installed in the interior of an automobile because of their operating functions. Electrical noise generated from the motor, especially noise emitted from the wiring between the motor and the control circuit, can be used for audio equipment and navigation that has recently become widespread. Reduction is desired because it causes a malfunction of a representative information device.

  In FIG. 6, the motor 22 includes a rotor 26, a magnet (permanent magnet) MG, a commutator 25, a brush 24, a circuit board 23, and the like. As shown in FIG. 7, the circuit board 23 is mounted with a motor drive circuit (circuit module) 21 shown in FIGS. A wiring layer is formed on the circuit board 23 and connected to the outside, the microcomputer, and the power source VB via the connector C portion of FIG. Further, the inside is connected to the M + M− terminal of the commutator 25.

  According to this embodiment, electrical noise (radiated noise) between the motor and the drive circuit (circuit module) 21 which is a control circuit is shielded by the metal of the motor body, and the wiring between the motor and the control circuit 21 is also Therefore, it is possible to provide a motor built-in circuit module that does not emit or emit electrical noise.

  Next, an example in which the electronic device package structure described above is applied to a driver of an injector that is a fuel injection valve of an automobile will be described.

  As shown in FIG. 10, the injector 70 sends fuel pressurized by a fuel pump (not shown) to the injector inlet 33, opens the valve body 34 by the electromagnetic force of the coil 32 energized from the outside, and opens the injection hole. From 35, fuel is injected into the intake port or combustion chamber of the engine.

  As shown in FIG. 8, the electrical connection in the general control of the injector 70 is connected to a transistor T built in an ECU (electric control unit) that receives a lot of command information and sensor information. In this connection, since the connection between the ECU and the injector is a long wiring, electrical noise is radiated from the wiring to the outside, which causes the same problem as the motor.

  In this example, as shown in FIG. 9, a part of the ECU, that is, the circuit 27 for driving the injector is housed in the package as described above and incorporated in the connector portion in the injector shown in FIG.

  The contents will be described with reference to FIGS.

  The electronic circuit module 27 has the circuit shown in FIG. 9 mounted therein, and reference numerals 28, 29, A, B, and C are electrodes provided on the side surfaces of dielectrics having different characteristics.

  In FIG. 12, the electrodes 28 and 29 of the circuit module 27 are connected to the coil terminals 31 and 30 of the injector 70 by contact terminals, respectively. The three electrodes A, B, and C are similarly connected to external terminals by contact terminals A, B, and C (41, 42, and 43).

  By adopting such a configuration, the electric noise is removed by the capacitor 16 disposed in the drive circuit (circuit module) 27, so that it is possible to provide an electronic circuit module having stable circuit operation and no electric noise emission. .

1 Substrate (dielectric)
2 Dielectric with dielectric constant ε1 3 Dielectric with dielectric constant ε2 4 Conductor layer 5 Conductor layer 6 Conductor layer 7 Conductor filled via hole 8 Conductor 9 Cap 10 Semiconductor element 11 Semiconductor element 12 Conductive adhesive 13 Metal bump 14 Metal wire 15 Metal film by plating 16 Noise removing capacitor 21 Motor drive circuit (electronic circuit module)
21A electronic circuit (motor drive circuit built in the motor)
22 Motor 23 Circuit board 24 Brush 25 Commutator 26 Rotor 27 Injector drive circuit (electronic circuit module)
28 Electrode 29 Electrode 30 Coil terminal 31 Coil terminal 32 Coil 33 Injector inlet 34 Injection valve 35 Injection hole 36 Connector of injector and drive circuit (external socket)
37 Connector of injector and drive circuit (Injector side socket)
70 injector

Claims (13)

  A base substrate having an electronic circuit part on which an electronic component made of a semiconductor element or the like is mounted is formed of a dielectric, and removes or blocks noise intruding from the electronic circuit part to the outside and / or from the outside to the electronic circuit part. Therefore, an electronic device is characterized in that a dielectric laminated portion formed by laminating a sheet-like dielectric and a conductor is provided on the outer periphery of the base substrate so as to surround the electronic circuit portion. Device package structure.   A base substrate having an electronic circuit portion on which electronic components made of semiconductor elements or the like are mounted is formed of a dielectric, and a sheet-like dielectric and a conductor are laminated around the electronic circuit portion of the base substrate. A plurality of dielectric laminate portions are provided in a predetermined manner, and a dielectric constituting the dielectric laminate portion is adjacent to at least one dielectric laminate portion of the plurality of dielectric laminate portions. An electronic device package structure characterized in that a dielectric laminated portion composed of dielectrics having different characteristics is disposed.   The electronic device package structure according to claim 2, wherein the plurality of dielectrics having different characteristics have different capacities or dielectric constants.   3. The electron according to claim 2, wherein the plurality of dielectrics having different characteristics are obtained by firing powders of the same material, and the characteristics are made different depending on a difference in particle diameter. Device package structure.   The plurality of dielectrics having different properties are formed of green sheets of powders having the same material but different particle sizes so that the same properties are not adjacent to each other by punching them into predetermined dimensions. 3. The electronic device package structure according to claim 2, wherein the electronic device package structure is one that is alternately arranged and that is integrally sintered after being laminated with the same characteristics.   3. The electronic device package structure according to claim 2, wherein the dielectric material is barium titanate.   The dielectric laminate portion is formed by alternately laminating dielectrics and conductors having the same characteristics, and n is an integer, and n layers and n + 2 layers of the conductors are arranged between them. 3. The electronic device package structure according to claim 2, wherein the electronic device package structure is connected by a conductor filled in the provided via hole.   An electronic circuit module employing the electronic device package structure according to any one of claims 1 to 7, wherein an electronic component made of a semiconductor element or the like is mounted on an electronic circuit portion of the base substrate, The outermost layer in the dielectric laminated portion is formed of a conductor, and the outermost layer conductor is connected to the electronic circuit portion and to an electrode terminal portion provided for connection to the outside. Electronic circuit module.   9. The electronic circuit module according to claim 8, wherein a part or all of the electronic circuit module is sealed with a cap formed of a conductor.   The electronic circuit module according to claim 8, wherein the electronic component is bonded to the base substrate with a conductive adhesive.   9. The electronic circuit module according to claim 8, wherein the electronic component is connected to a conductor formed on a surface of the substrate by a metal bump.   9. The electronic circuit module according to claim 8, wherein the electronic circuit module is configured as a drive circuit for controlling the motor and can be built in the motor.   9. The electronic circuit module according to claim 8, wherein the electronic circuit module is configured as a drive circuit that controls an injector of an in-vehicle engine and can be built in the injector.

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