JP2001094053A - Semiconductor integrated circuit and liquid crystal display - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a semiconductor integrated circuit for coping with variations in a plurality of ITO wiring patterns using a single chip, and a liquid crystal display device using such semiconductor integrated circuit in a semiconductor chip for driving a liquid crystal which is subjected to COG packaging onto a liquid crystal panel. SOLUTION: A semiconductor chip 3 is provided with a plurality of common driving voltage output terminals COM1-COM18 for outputting a common electrode voltage to the common electrode of a liquid crystal panel, a plurality of segment drive voltage output terminals (SEG1-SEG80) for outputting a segment drive voltage to the segment electrode, and a drive circuit for forming the common drive voltage and segment drive voltage for outputting. In the semiconductor chip 3, the plurality of segment drive terminals and common drive terminals are arranged along one long side of the semiconductor chip, and at the same time, dummy terminals Dummy 1-Dummy 27 that are not connected to the internal circuit and a protective means for protecting the dummy terminals from electrostatic breakdown are provided at a short side.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a technique useful for application to a semiconductor integrated circuit for driving a liquid crystal panel for display, and further relates to a semiconductor chip having such an integrated circuit mounted on a transparent substrate of a panel in a face-down system. The present invention relates to a technique particularly useful for a liquid crystal display device mounted on a film or a film.

[0002]

2. Description of the Related Art In recent years, mobile phones and PDAs (Personal Dig) have been developed.
In portable terminals such as ital Assistant), a liquid crystal display device with low power consumption is used. In such a liquid crystal display device, as shown in FIG. 6, a technology in which a semiconductor chip (liquid crystal driver) 3 mounted with a display drive circuit is mounted on a transparent substrate 62 of a liquid crystal panel 6 by COG (Chip On Glass) has been previously used. There is more.

As shown in FIG. 5, a liquid crystal panel sandwiches liquid crystal between a front transparent substrate 61 on which common electrodes are formed and a rear transparent substrate 62 on which segment electrodes are formed. It is composed. The COG mounting used for the liquid crystal display device is performed by fixing the semiconductor chip 3 face-down to the protruding portion 62A of the transparent substrate 62 on the back side of the pair of transparent substrates 61 and 62. The extension 62A of the transparent substrate 62 includes input / output wiring for supplying a power supply voltage to the semiconductor chip 3 and exchanging various signals, and lead lines for connecting the semiconductor chip 3 to segment electrodes and common electrodes of a liquid crystal panel. ITO (Indium Tin Oxi
de: transparent conductive film) and printed wiring. The segment electrode provided on the other transparent substrate 61 is electrically connected to a lead wire of the transparent substrate 62 on which the chip 3 is mounted via a conductive member (silver ball or the like) provided on the edge side of the panel. Then, a gold bump or the like provided on an electrode pad, which is a terminal of the semiconductor chip 3, is pressed or fused to a wiring terminal portion on the transparent substrate 62, so that the semiconductor chip 3
Is fixed on the transparent substrate 62 and the semiconductor chip 3
And the wiring terminals of the transparent substrate 62 are electrically connected.

In portable electronic devices, since the screen is large and the whole device is desired to be small and lightweight, there is a demand for reducing the area of a portion of the liquid crystal panel that protrudes outside the screen. Further, in a dot matrix type liquid crystal panel, the number of common lines and segment lines arranged on the panel surface is considerably large. Therefore, as shown in FIG. 6, ITO wirings such as the common electrode lead line 71 and the segment electrode lead line 72 provided on the overhang portion 62A of the transparent substrate 62 also become overcrowded.

[0005] A semiconductor chip is generally cut into a rectangular shape, and a pad portion for electrical connection is provided at a portion along each side thereof. In the liquid crystal panel, there are more segments than commons. Therefore, in the conventional LCD driver,
Generally, a segment drive voltage output terminal is provided on one of two long sides of a semiconductor chip, and a common drive voltage output terminal is provided on each of two short sides.

According to such a terminal arrangement, the size of the semiconductor chip is determined by the number of segments and the number of commons, and the length of the overhang portion 62A of the transparent substrate 62 cannot be reduced because the short side is not so short.

In addition, in the case of such a semiconductor chip,
The lead wire of the common electrode consisting of ITO wiring printed on the transparent substrate extends outward from one side of the chip,
The layout is such that it is bent in a U-shape and connected to one side of the liquid crystal unit.

The present inventors have studied a technique for reducing the width of a semiconductor chip by arranging a common terminal and a segment terminal on one long side.

In the case of such a semiconductor chip, as shown in FIG. 7, the ITO wiring printed on the transparent substrate 62 has a common electrode lead-out line 81 which extends once under the semiconductor chip 3 to the outside. After that, it is possible to make a layout in which the connection is bypassed in a U-shape and connected to one side of the liquid crystal unit.

However, in the case of COG mounting, the fusion of the metal bumps performed at the pad portion of the chip serves to electrically connect the chip terminals to the ITO wiring terminals of the transparent substrate 62 and also connects the chip to the transparent substrate 62. It also plays the role of fixing. Therefore, even in the above-mentioned chip in which the common terminal is not provided on the left and right short sides, a dummy pad for fixing the chip (pad not connected to the internal circuit) is provided on the left and right short sides, and the pad on the long side is provided. In the same manner as described above, the structure has to be fixed to the dummy electrode on the transparent substrate via the metal bump. However, in this case, the common lead line cannot be laid out as shown in FIG. 7, and as shown in FIG.
The ITO wiring printed on the transparent substrate 62 is connected to one side of the liquid crystal unit in a U-shape after the lead wire 71 of the common electrode extends upward from the long side of the semiconductor chip 3 once. Layout.

[0011]

As described above, in the conventional semiconductor chip for driving a liquid crystal, when the semiconductor chip is mounted on the transparent substrate 62 by COG, the wiring pattern applied to the substrate or the film is a semiconductor chip. Is almost determined by the arrangement of the pads provided on the transparent substrate 62, and furthermore, the shape and size of the overhanging portion of the transparent substrate 62 are almost determined by this wiring pattern, so that it is impossible to meet the demands of a plurality of customers. There was a problem.

An object of the present invention is to provide a semiconductor integrated circuit capable of coping with variations of a plurality of wiring patterns in one semiconductor chip for driving a liquid crystal, and a liquid crystal display device using such a semiconductor integrated circuit. It is in.

It is another object of the present invention to provide a semiconductor integrated circuit and a liquid crystal display device in which the overhanging portion of the liquid crystal panel on which the semiconductor chip is mounted is reduced to thereby reduce the size of the entire panel.

The above and other objects and novel features of the present invention will become apparent from the description of the present specification and the accompanying drawings.

[0015]

The outline of a typical invention among the inventions disclosed in the present application is as follows.

That is, in a semiconductor integrated circuit for driving a liquid crystal having a common drive voltage output terminal for outputting a drive voltage applied to a common electrode and a segment electrode of a liquid crystal panel, and a segment drive voltage output terminal, a long side of a semiconductor chip is provided. While the common drive voltage output terminal and the segment drive voltage output terminal are arranged along the short side of the chip, and dummy terminals not connected to the internal circuit are provided along the short side of the chip, and the dummy terminals are electrostatically damaged. It is configured to provide protection means to protect from.

According to the above-described means, the segment driving voltage output terminal and the common driving voltage output terminal are provided on one long side portion, so that the short side of the chip can be shortened. In addition, a semiconductor chip on which the above-described integrated circuit is mounted is connected to a wiring forming substrate (COG) provided with a lead wire connected to a common electrode or a segment electrode of a liquid crystal panel.
When mounted face-down on a transparent substrate for mounting or a wiring film for COF mounting), even if a dummy terminal comes into contact with the wiring on the substrate surface, electrostatic damage will not occur. Therefore, wiring is also provided on the chip mounting portion on the substrate surface. Accordingly, it is possible to increase the variation of the wiring pattern of the lead wire of the common electrode.
Further, by providing the dummy terminals on the two short sides of the chip, the variation of the wiring pattern can be further increased. Further, the wiring of the chip mounting portion is not limited to the wiring pattern of the common terminal, and may be a wiring pattern connected to a segment terminal or a control terminal. Thus, one semiconductor integrated circuit can cope with many wiring patterns.

When the dummy terminal is electrically connected to a common lead or the like, a voltage such as a common voltage is applied to the dummy terminal. Although the electrode pads are electrostatically damaged, the above-mentioned means does not hinder the connection between the dummy terminals and the lead wires because the dummy terminals are provided with protection means for preventing electrostatic damage.

More preferably, a power supply terminal for receiving a power supply voltage of the semiconductor integrated circuit from the outside is arranged at the short side portion. In general, the wiring for supplying the power supply voltage needs to be thick to reduce the wiring resistance and the like, and the bypass via the dummy terminal as described above is not practical. Therefore, by providing a power supply voltage terminal on the short side of the chip from the beginning, the wiring for supplying the power supply voltage becomes a wiring pattern drawn from the left and right sides of the chip, and a wiring forming member for supplying the power supply voltage from the outside. Can be configured to have a small area. That is, when the power supply terminal is provided on the long side portion, it is necessary to provide a connection space protruding outside the long side portion of the semiconductor chip on the wiring forming board for connection with the cable, but on the short side portion. Since the outside is relatively vacant due to the space for forming the common lead line, it is not necessary to provide a new space for the power supply wiring.

The protection means comprises, for example, a PN junction formed on a semiconductor chip, and includes a first constant voltage terminal and a second constant voltage terminal.
Can be constituted by diodes connected in the reverse direction to the constant voltage terminals.

[0021]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is an overall configuration diagram showing an embodiment of a portable telephone 1 mounted with a semiconductor chip suitable for applying the present invention.

The portable telephone 1 includes, but is not limited to, a microphone 4, a speaker 5, a liquid crystal display 6, an antenna 7, a voice interface 21, a high frequency interface 22, a memory 23, a liquid crystal controller driver 31 including a liquid crystal drive circuit, a voice, and the like. DSP (Digital Signal Processor) 2 that performs signal processing on signals and transmission / reception signals
6. ASIC that provides users with custom functions (appl
ication specific integrated circuits) 27, and a microcomputer 28 for controlling the entire apparatus including display control. DSP2 above
6, the ASIC 27 and the microcomputer 28
The baseband unit 25 performs decoding and demodulation of signals to be transmitted and received.

In FIG. 1, reference numerals 2 and 3 denote one semiconductor chip, respectively, and the liquid crystal controller driver 31 is mounted on one semiconductor chip 3 as a CMOS LSI by a known semiconductor integrated circuit manufacturing technique. It is integrated in.

FIG. 2 shows a configuration example of the liquid crystal controller driver 31.

2, reference numeral 243 denotes a system interface for receiving control signals and data signals from the microcomputer 28 shown in FIG. 1; 244, an instruction register for setting internal control information and the like;
An instruction decoder 245 decodes a set value of the instruction register 244 and outputs a control signal to each operation block. A display data RAM 247 stores a character code of a character to be displayed on a screen.
46, an address counter for reading display data from the display data RAM 247 in accordance with the driving position of the liquid crystal panel; 249, a character generator ROM for developing a dot matrix character font pattern from the character code read from the display data RAM 247;
Reference numeral 248 denotes a character generator RAM that stores a user-defined character font pattern and is developed in the same manner as the ROM 249. Reference numeral 250 denotes a cursor blink control circuit for displaying (inverted) a cursor on a screen. Reference numeral 251 denotes a predetermined segment. A segment blink control circuit 252 for performing a predetermined blink display in a display mode for performing display is a character generator RAM 24.
8; a character generator ROM 249; and a character synthesizing circuit for synthesizing dot data of the display pattern output from the cursor blink control circuit 250. 253, a parallel-conversion circuit for converting the read plural-bit dot data into serial data; Reference numeral 254 denotes a segment shift register which shifts the converted dot data and accumulates data for one line of the display panel;
Is a latch circuit that holds the shifted one line of display data, and 256 is a segment driver that forms and outputs a drive voltage waveform applied to the segment electrode of the display panel based on the held one line of data. Is a common shift register that sequentially selects the common electrodes of the display panel, and 258 is a common driver that forms and outputs a drive voltage waveform applied to the common electrodes.

Reference numeral 241 denotes a clock signal generating circuit for generating a system clock; 242, a timing generating circuit for dividing the system clock to supply a clock signal to the shift registers 254, 257 and the segment driver 256; booster circuit for generating a liquid crystal driving voltage V _LCD based on the power supply voltage Vcc, 260
Is a power supply circuit that generates and outputs five voltages for driving liquid crystal to seven voltage supply lines 266, and 267 is any one of the drive voltages V1 to V5 supplied from the power supply circuit 260 for performing gradation display on the display panel. Select segment driver 2
And a liquid crystal drive voltage selection circuit to be supplied to the common driver 258.

The power supply circuit 260 includes a ladder resistor VR,
Voltages V1 to V5 generated by resistance division of R0, R.
Is converted to low output impedance by using
Voltage-follower type operational amplifiers 261 to 265 for supplying two stable liquid crystal bias voltages V1 to V5 are provided. In addition, the system power supply voltage Vcc and GN
D and seven bias voltages including D are supplied through the seven voltage supply lines 266.

FIG. 3 shows a liquid crystal controller driver 31.
2 shows an example of the arrangement of electrode pads of a semiconductor chip 3 on which is formed.

Although the semiconductor chip 3 is not particularly limited,
As shown in the figure, the electrodes are cut into a vertically long rectangular shape, and electrode pads P1, P2,... Serving as external connection terminals are formed on each side near the edge. In the figure, the electrode pads are all shown in a square around the chip 31.

The external connection terminals of the semiconductor chip 3 include:
Common drive voltage output terminals COM1 to COM18 for outputting a common drive voltage applied to the common electrode of the liquid crystal panel,
A segment drive voltage output terminal SEG1 that outputs a segment drive voltage applied to a segment electrode of the liquid crystal panel
SEG80, power supply terminals Vcc..., GND... (Second constant voltage terminal) to which a power supply voltage and a ground potential are applied, and a liquid crystal bias voltage input terminal V _LCD (first constant power supply terminal) to which a bias voltage for driving a liquid crystal is inputted. A drive voltage output terminal V _LOUT for outputting a drive voltage boosted from the power supply voltage Vcc in the liquid crystal controller driver 31, and a drive voltage output terminal V1 _OUT for outputting five types of bias voltages for gradation display of the liquid crystal panel. V5 _OUT , and other clock terminals OSC1 and OSC for inputting a clock and connecting an external resistor when a system clock signal is input from the outside or a system clock signal is generated by an internal oscillation circuit.
C2, connection terminals R1 to R3, C1 for connecting adjustment resistors and capacitors when generating a clock signal internally
, C1-, C2 +, C2-, data input terminals D to which data from the microcomputer 28 is input.
B0 / ID, DB1 to DB3, serial transfer data input terminal SDA, control signal input terminals RS / CS to which control signals such as a register selection signal, a chip selection signal, a write control signal, and a serial data transfer strobe signal are input.
E / SCL, reset signal input terminal RESET, test signal input terminal TEST, mode selection terminals IM1 and IM2 for switching the interface mode with microcomputer 28 between a clock synchronous serial interface and a 4-bit bus interface corresponding to a 68 series processor. Etc. are provided. In the case where two terminal symbols are shown for one terminal, when the 4-bit bus is selected in the interface mode selection, the terminal with the symbol shown after the slash (/) is selected, and the serial transfer is performed. Is selected, the terminal of the symbol shown before the slash (/) is selected.

In this embodiment, among the external connection terminals, the common drive voltage output terminals COM1 to COM18 and the segment drive voltage output terminals SEG1 to SEG80 are provided on one long side of the semiconductor chip 3 (the right side in FIG. 3). It is provided along. Further, dummy terminals Dummy1 and Dummy9 to Dummy27 which are not connected to the internal circuit inside the chip are provided on the short side on the left side (upper side in FIG. 3) over the entire side. Dummy terminals Dummy2 to Dummy are located on the right (lower side in FIG. 3) short side.
8 and power supply terminals Vcc, GND, and a liquid crystal drive voltage input terminal V _LCD . The other (Fig. 2
On the long side of the data input terminal DB0 / ID,
DB1 to DB3, SDA, control signal input terminal RS / C
S, E / SCL, reset signal input terminal RESET, test signal input terminal TEST, mode selection signals IM1, I
M2, clock-related terminals OSC1, OSC2, R1
R3, C1 +, C1-, C2 +, C2-, power terminals Vcc, GND, voltage output terminals V _LOUT , V1 _{OUT to} V5 _{OUT, and the} like are provided. Power supply terminals VCC..., GND... Are provided on both the long side and the short side of the printed circuit board 50, and are configured to be supplied to any one of them.

FIG. 4 shows a dummy terminal Dummy provided on the semiconductor chip 3 of the embodiment and its protection diode D.
1 shows a configuration diagram of D2. FIG. 1A is an equivalent circuit diagram thereof, and FIG. 1B is a sectional view of a semiconductor chip.

As shown in FIG. 6 (a), the power supply terminal to the dummy terminal Dummy1~Dummy27 are each liquid crystal driving voltage terminal (first constant voltage terminal) V _LCD and the ground potential (0V) is applied to ( 2nd constant voltage terminal) GN
The protection diodes D1 and D2 are connected in the reverse direction so that a reverse bias voltage is normally applied between the protection diodes D and D.

The electrode pad of the dummy terminal Dummyn is
In FIG. 4B, the first formed in a relatively large area
This is a portion composed of the layer aluminum electrode 38g and the second layer aluminum electrode 39, on which a metal bump 40 for crimp connection is formed.

The protection diodes D1 and D2 are formed of a known CM.
The structure is configurable by the OS integrated circuit manufacturing technology. That is, the protection diode D1 connected to the liquid crystal drive voltage terminal V _LCD side is, for example, n-type on the p-type semiconductor 30.
A p-type diffusion region 33 formed substantially at the center of the n-type well region 31 and an n-type diffusion region formed so as to surround the periphery thereof.
And a mold diffusion region 34. The first-layer aluminum electrode 38b formed to be connected to the p-type diffusion region 33 is connected to the first-layer aluminum electrode 38g of the pad portion of the dummy terminal Dummyn, while being connected to the n-type diffusion region 34. the first layer aluminum electrode 38a formed so as constructed by electrically connecting the liquid crystal driving voltage output terminal V _LCD.

The other protection diode D2 includes, for example, an n-type diffusion region 36 formed on the p-type semiconductor 30 and a p-type diffusion region 37 formed so as to surround the periphery thereof. Then, the first layer aluminum electrode 38e formed to be connected to the n-type diffusion region 38 is connected to the dummy terminal Du.
The p-type diffusion region 37 is electrically connected to the ground potential of the substrate 30 while being connected to the first layer aluminum electrode 38g of the pad portion of mmyn.

The above-mentioned protection diodes D1, D2...
Are dummy terminals Dummy 10 to D
The dummy terminals Dummy10 to Dummy27 are arranged so as to be arranged in a direction intersecting the column of the ummy27.
The ummy 27 can be formed without increasing the interval.

FIG. 5 is a perspective view showing a schematic structure in which a semiconductor chip 3 is mounted on a liquid crystal panel.

The liquid crystal display (liquid crystal panel) 6 includes a transparent substrate 61 having a large display screen disposed on the front side and an ITO.
A rear transparent substrate 62 having an overhang 62A on which the semiconductor chip 3 is wired and mounted, and a pair of transparent substrates 61 and 6
A liquid crystal sandwiched between 2 and sealed inside a sealing material 63;
In addition, it is configured to include a reflection plate provided on the back side of the transparent substrate 62, a polarizing film provided inside each of the transparent substrates 61 and 62, and the like.

On the inner surface of the front transparent substrate 61, ITO
A plurality of common electrodes made of wiring are formed in a stripe shape in the horizontal direction. In the rear transparent substrate 62, a plurality of segment electrodes made of ITO wiring are formed in a stripe shape in a vertical direction at a portion where the liquid crystal is sandwiched, and a protruding portion 62A is provided with a semiconductor chip from the common electrode and the segment electrode. Leader lines such as ITO leading to 3 are formed. Further, between the pair of transparent substrates 61 and 62, for example, a conductive member 73 for electrically connecting a common electrode on the transparent substrate 61 side and a lead wire on the transparent substrate 62 side on the side of the display unit. 6) is provided.

As shown in FIG. 5, in this embodiment, the semiconductor chip 3 on which the liquid crystal controller driver 31 is mounted is COG mounted on the overhang 62A of the transparent substrate 62. And a liquid crystal display unit (liquid crystal module:
LCM). The common electrode and the segment electrode of the liquid crystal display 6 are electrically connected to the semiconductor chip 3 via the ITO wiring provided on the transparent substrate 62. The connection between the semiconductor chip 3 and the microcomputer 28 and the like provided on the printed board 2 is made via the ITO wiring on the transparent substrate 62 and the printed wiring cable 50 and the like.

FIGS. 6 to 8 are plan views of first to third examples of wiring patterns of a display panel on which the semiconductor chip 3 is mounted.

The wiring pattern shown in FIG. 6 is for a case where the area of the transparent substrate 62 can be made relatively large. In this wiring pattern, the lead wires 71 connected to the common electrodes COM extend from the long side of the semiconductor chip 3 to the outside of the chip, the left side of the display screen is bent in a U-shape, and the liquid crystal screen is detoured. It is formed so as to be connected to the horizontal conductive member 73. Lead wire 7 of segment electrode SEG ...
Are extended from the segment drive voltage output terminals SEG1 to SEG80 on the long side of the chip to the outside of the chip and are appropriately expanded and connected to the segment electrodes SEG.
Leader lines 74,... To which a control signal, a data signal, a power supply, etc. are applied extend outward from the other chip long side as it is. Note that the lead wires 75 to which the power supply or the like is applied are formed wider to reduce the resistance.

In this embodiment, the dummy terminals Dummy ...
Are fixed to the electrically floating dummy electrodes formed at corresponding positions on the substrate 62 via bumps.

The wiring pattern shown in FIG. 7 is a wiring pattern in which the area of the transparent substrate 62 on which the lead lines are provided is relatively small.

In this wiring pattern, the common electrode C
Leading lines leading to OM are L-shaped leading lines arranged in a range overlapping with the semiconductor chip 3 and a conductive member extending outward from the short side of the chip and bypassing the left side of the display screen. And a U-shaped lead line 81 connected to the reference numeral 73. In this embodiment, the pitch of the lead wires 82 is set to the dummy terminals Dummy10 to Dumm on the short side of the chip.
The dummy terminals Dummy10 to Dummy27 are fixed to the ends of the corresponding lead wires 82 via metal bumps. Thereby, the fixing force of the chip to the substrate is increased.

On the other hand, the lead wires 83 of the segment electrodes SEG extend from the segment drive voltage output terminals SEG1 to SEG80 on the long side of the chip to the outside of the chip, are appropriately expanded, and are connected to the segment electrodes SEG. .

Leader lines 85... 86 for inputting and outputting control signals and data signals extend from the long side of the printed circuit board 50 to the area overlapping with the semiconductor chip 3, and extend to the dummy terminal Dummy 3 on the right short side. To Dummy7 and the dummy terminals Dummy3 to Dummy7.
A lead line 86 extends outward from the short side of the chip via my7, is bent toward the printed circuit board 50, and reaches the end of the transparent substrate 62.

A lead line 87 to which power or the like is input is connected to power terminals VCC..., G provided on the right short side of the semiconductor chip 3.
By using ND... And the driving voltage terminal V _LCD , the chip 3 is provided so as to extend outward from the right short side of the chip 3, bend toward the printed circuit board 50, and reach the end of the transparent substrate 62. .

By providing the wiring pattern in which the lead wires 82, 85,... Are provided in the range overlapping with the semiconductor chip 3 as described above, the area of the protruding portion of the transparent substrate 62 can be reduced, and the wiring (control Cables, power lines, etc.) on one side to facilitate connection to the cable.

The wiring pattern shown in FIG. 8 is a wiring pattern in which the lead lines of the common electrode of the liquid crystal section are drawn from the left and right.

In this wiring pattern, first, two-way lead lines 93 and 94 provided in a range overlapping with the chip 3 are formed by:
Common drive voltage output terminals COM1 to C of semiconductor chip 3
One part of the OM18 is a dummy terminal Dummy on the left short side.
10 through Dummy21, and the remaining part passes under the dummy terminals Dummy3 through Dummy7 on the right-hand short side and is connected to U-shaped lead lines 91 and 92 on both sides of the display unit. The common drive voltage output terminals COM1 to COM18 of the semiconductor chip 3 and the common electrodes COM of the transparent substrate 61 are electrically connected via a conductive member 73.

Lead wires 9 from the segment electrodes SEG ...
5 are the same patterns as the wiring patterns in FIG. 7, and the lead lines 74,..., 75,.

As described above, according to the semiconductor chip 3 of this embodiment, it is possible to form a wiring pattern below the chip, so that one chip can support various wiring patterns. Therefore, even when manufacturing liquid crystal display units of various shapes with various wiring patterns,
The circuit layout and electrode arrangement of the semiconductor chip 3 can be handled by changing the wiring pattern using the same chip without changing the design. By reducing the design cost of the semiconductor chip 3, it is possible to reduce the cost of liquid crystal display units of various shapes. Can be manufactured. For example, by applying this liquid crystal display unit to a mobile phone, a variety of small, lightweight mobile phones can be developed at low cost.

Further, the semiconductor chip 3 of the above embodiment is provided with the dummy terminals Dummy1 to Dummy27 on the short side portions, so that the bonding strength between the semiconductor chip 3 and the transparent substrate 62 in the COG mounting is not reduced.

Further, the dummy terminals Dummy1 to Dummy1
Since protection diodes D1 and D2 are connected to Mmy27 to take measures against electrostatic destruction, the lead wire of transparent substrate 62 is formed in a range overlapping chip 3, and dummy terminals Dummy1 to Dummy27 are electrically connected to the lead wire. And the control signal line and the lead line of the power supply line can be formed under the dummy terminal, so that the overhanging portion 62 of the transparent substrate 62 can be formed.
The effect that the area of A can be further reduced is obtained.

Since the power supply terminals Vcc..., GND... Are also provided on the short sides of the semiconductor chip 3, the wiring for supplying the power supply voltage is drawn from the left and right sides of the chip (for example, the wiring pattern in FIG. 7). Is possible,
It is possible to eliminate the space for wiring that was required on the connection cable 50 side from the semiconductor chip 3, and it is possible to further reduce the area of the overhang portion 62 </ b> A of the transparent substrate 62.

Although the invention made by the inventor has been specifically described based on the embodiments, the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the gist of the invention. Needless to say.

For example, the type and number of various control signal input terminals and terminals to which power is applied provided on the liquid crystal driving semiconductor chip 3 are not limited to those of the above embodiment (FIG. 3). It can be appropriately changed according to the function of the semiconductor chip 3.

The wiring patterns of the lead lines connected to the segment electrodes and the common electrodes are shown in FIGS. 6 to 8 as examples, and can be formed in various patterns.

In the embodiment, only the case where the semiconductor chip is mounted on the transparent substrate by COG has been described.
The same effect can be obtained in a B (Chip On Board) mounting or a COF (Chip On Film) mounting, and the like.
The present invention is similarly applicable to a mounting method such as a CP (Tape Carrier Package).

In the above description, the invention made by the present inventor has been mainly described with respect to the liquid crystal display device (liquid crystal display unit) of the portable telephone set, which is the application field of the background, but the present invention is limited thereto. Therefore, the present invention can be effectively used for a portable electronic device equipped with a liquid crystal display device, and is not limited to a portable electronic device but can be widely used for a large liquid crystal panel and the like.

[0064]

The effects obtained by typical ones of the inventions disclosed in the present application will be briefly described as follows.

That is, according to the present invention, with one chip,
There is an effect that an inexpensive semiconductor integrated circuit for driving a liquid crystal which can be applied to various wiring patterns can be realized.

Further, there is an effect that a liquid crystal display unit having a small size and a variety of display units can be manufactured at low cost.

[Brief description of the drawings]

FIG. 1 is a block diagram showing an overall configuration of a mobile phone to which a semiconductor chip of a preferred embodiment according to the present invention is applied.

FIG. 2 is a block diagram illustrating an example of an overall configuration of a liquid crystal controller of the mobile phone according to the embodiment.

FIG. 3 is a plan view showing one embodiment of an arrangement of pad portions of a semiconductor chip suitable for applying the present invention.

FIGS. 4A and 4B show the configuration of a dummy pad and a protection diode provided on a semiconductor chip of the embodiment, wherein FIG. 4A is an equivalent circuit diagram and FIG. 4B is a cross-sectional view of the semiconductor chip.

FIG. 5 is a perspective view showing a schematic structure of a liquid crystal display module on which a semiconductor chip is mounted.

FIG. 6 is a plan view showing a first example of a wiring pattern of a display panel on which the semiconductor chip of the embodiment is mounted.

FIG. 7 is a plan view showing a second example of the wiring pattern of the display panel on which the semiconductor chip of the embodiment is mounted.

FIG. 8 is a plan view showing a third example of the wiring pattern of the display panel on which the semiconductor chip of the embodiment is mounted.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 Cellular phone 3 Semiconductor chip 6 Liquid crystal display (liquid crystal panel) 31 Liquid crystal controller driver 39 Electrode pad 40 Metal bump 50 Wiring film 61 Transparent substrate (front side) 62 Transparent substrate (back side) 71, 81, 91, 92 Common electrode extraction Lines 72, 83, 95 Leader lines of segment electrodes 82, 85, 93, 94 Leader lines connected to dummy terminals COM Common electrode SEG Segment electrodes Dummy1 to Dummy27 Dummy terminals COM1 to COM18 Common terminals SEG1 to SEG80 Segment terminals D1, D2 Protection diode Vcc power supply terminal V _LCD liquid crystal drive voltage GND Ground terminal

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Takayuki Nakachi 3681 Hayano, Mobara-shi, Chiba Hitachi Device Engineering Co., Ltd. (72) Kunihiko Tani 5-2-1, Kamimizuhoncho, Kodaira-shi, Tokyo Stock Company (72) Inventor Takashi Oyama 3681 Hayano, Mobara-shi, Chiba F-term (reference) 2H092 GA40 GA60 NA14 NA25 PA06 5F038 AV06 BE07 BG02 BH04 BH13 CD06 CD10 DF01 DF11 EZ20 5F110 BB01 BB04 DD02 EE03

Claims (6)

[Claims] 1. A plurality of common drive voltage output terminals for outputting a common drive voltage applied to a plurality of common electrodes provided on a liquid crystal panel, and a plurality of segment electrodes provided in a direction crossing the common electrodes. A semiconductor integrated circuit comprising: a plurality of segment drive voltage output terminals for outputting a segment drive voltage to be applied; and a drive circuit for forming and outputting the common drive voltage and the segment drive voltage. All or some of the terminals are arranged along one long side of the semiconductor chip, and one or both of the short sides are connected to a dummy terminal that is not connected to an internal circuit. A semiconductor integrated circuit, comprising: protection means for protecting the semiconductor integrated circuit. 2. The protection means according to claim 1, wherein said protection means comprises a PN junction formed on a semiconductor chip and diodes connected in reverse directions between a first constant voltage terminal and a second constant voltage terminal for driving liquid crystal. The semiconductor integrated circuit according to claim 1, wherein: 3. The semiconductor integrated circuit according to claim 1, wherein a power supply terminal for receiving a power supply voltage supplied from the outside is arranged in said short side portion. 4. The semiconductor device according to claim 1, wherein each of the dummy terminals is an electrode pad provided on a semiconductor chip, and each electrode pad is fixed to a terminal or a wiring on a substrate via a bump. 3. The semiconductor integrated circuit according to any one of 3. 5. The semiconductor chip of a semiconductor integrated circuit according to claim 1, wherein a semiconductor chip of the semiconductor integrated circuit according to claim 1 is arranged at a predetermined position on a wiring forming substrate on which a wiring connected to a common electrode or a segment electrode of a liquid crystal panel is formed. A liquid crystal display device in which each terminal of a semiconductor integrated circuit is electrically connected to wiring on the wiring forming substrate, wherein the wiring forming substrate has the common drive voltage output terminal or the segment drive voltage output terminal. A portion of the wiring connecting the common electrode or the corresponding segment electrode of the liquid crystal panel is formed at a portion overlapping the semiconductor chip, and the dummy terminal is fixed to any of the wirings via a bump. A liquid crystal display device. 6. The liquid crystal display device according to claim 5, wherein a control signal line and a lead line of a power supply line are formed at a portion overlapping with the chip.