JP2001093959A - Substrate rearranging apparatus and substrate treating apparatus having the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a substrate rearranging apparatus and a substrate treating apparatus which changes the array of glass substrates, semiconductor wafers, etc., for liquid crystals to the array in face to face or back to back. SOLUTION: This apparatus lifts substrates W held face to back in cassettes 15, 16 to a second position H2 through push-up members 60, 61, inserts a movable base 23f of a substrate hold means 21 into lower parts of the substrates W, holds and lifts the substrates with a substrate holder 23g to a third position H3, rotates the substrates 180 deg. through the push-up member 60, moves the movable base and push-up members horizontally to position the substrates, lowers the substrate holder, inserts the substrates on the push-up member between the substrates on the substrate holder, thereby mounting the substrates face to face on the push-up member 60, then executes cleaning and drying works, and rearranges the substrates into a face-to-back array by the reverse operation to this operation.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a face surface (mirror surface) of a plurality of substrates (a glass substrate for liquid crystal, a semiconductor wafer, etc.).
The present invention relates to a substrate rearranging device for converting an array having a back surface facing each other and a substrate processing apparatus provided with the device.

[0002]

2. Description of the Related Art Conventionally, a substrate processing apparatus that performs processing on a substrate by immersing a plurality of substrates in a processing tank that stores a processing liquid such as a cleaning liquid or a CVD apparatus that forms a thin film on the surface of the plurality of substrates includes:
A plurality of substrates are aligned so that the face surfaces on which the element patterns are formed or the back surfaces that are the back sides of the face surfaces face each other so that the surfaces are aligned.

[0003] As a substrate rearranging device of a conventional substrate processing apparatus, there is, for example, Japanese Patent Application Laid-Open No. 2-184045. FIG.
FIG. 2 is a side view of the conventional substrate rearranging apparatus. As shown in FIG. 12, the push-up plate 162 of the wafer push-up rotation device 160 pushes up and holds the substrate W accommodated in the carrier 120. The substrates W on the push-up plate 162 are gripped every other by the chuck 148 of the chuck device 140. Then, the chuck 148 is lifted and every other sheet is extracted from between the substrates W. Then, the chuck device 140
Moves on the rail 150 in the Y-axis direction, the chuck 148 also moves in the Y-axis direction, which is the direction in which the substrates W are arranged, and retreats from above the carrier 120.

Next, the substrate W left on the push-up plate 162
The push-up plate 162 is rotated by 180 degrees so that the back surface faces in the direction in which the face surface faces. Then, the chuck device 140 moves in a direction opposite to the above-described moving direction, thereby moving the chuck 148 holding the substrate W above the carrier 120 and then descends. Further, the lifting plate 162 is raised, so that the lifting plate 1
The chuck 14 is inserted into a gap between the plurality of substrates W held on
The substrate W gripped by 8 is inserted. Thereafter, the chuck 148 is opened, and the substrate W held by the chuck 148 is lifted.
The substrate W can be aligned with the face surfaces facing each other or the back surfaces facing each other by holding the substrate W on the second surface.

[0005]

In the conventional substrate rearranging apparatus, when the chuck 148 holds every other substrate W held on the push-up plate 162, or when the chuck 148 holds the substrate W held by the chuck 148, When inserting the plurality of substrates W into the gap between the upper substrates W, the chuck 1
48 is moved so that the chuck 148 is positioned at an appropriate position.

However, if the positioning accuracy is low, the chuck 148 may fail to hold the substrate W,
There is a possibility that the substrate W gripped by 48 and the substrate W held on the push-up plate 162 may be damaged due to contact with the substrate W or the like.

According to the present invention, it is possible to reliably hold a substrate without using a conventional chuck, and to damage the substrates without causing damage to the substrates. It is an object of the present invention to provide a substrate rearranging device capable of converting an array into a facing arrangement and a substrate processing apparatus provided with the device.

[0008]

SUMMARY OF THE INVENTION A substrate rearranging apparatus according to the present invention reverses the direction of a part of a plurality of substrates accommodated in a plurality of cassettes so that the back surfaces of the substrates are opposite to each other or opposite to each other. What is claimed is: 1. A substrate rearranging device for rearranging an array in which surfaces are opposed to each other, the substrate rearranging device includes a lifting mechanism and a substrate holding member that is horizontally movable and holds a substrate at a symmetrical position at a tip portion. Substrate holding means having a horizontal moving mechanism having a movable base, a substrate lifting means for lifting and lowering the first lifting member and the second lifting member, and rotating the first lifting member and the second lifting member, respectively. Substrate lifting means having a possible rotation mechanism, wherein the first lifting member and the second lifting member have received a plurality of substrates contained in the cassette and moved to a predetermined position. Said first lifting member (or the second push-up member) the substrate placed in a state of holding receiving said substrate holding means, the second lifting member (or the first
A plurality of substrates held on the second push-up member, and the substrate holding means moves down above the second push-up member, and then descends to move the substrate between the substrates on the second push-up member. Is inserted and placed.

Further, the movable base of the substrate rearranging apparatus according to the present invention is substantially U-shaped, and a substrate holding member for holding the substrate is mounted at a position symmetrical with respect to the tip of the movable base, A groove is formed between the holding grooves of the substrate holding member so that one substrate can pass between the holding grooves.

Further, in the substrate rearranging apparatus according to the present invention, the first push-up member and the second push-up member have the same configuration, and a groove for holding the substrate of the first push-up member and the second push-up member. Is different from the pitch of the holding grooves of the cassette.

Further, a substrate processing apparatus according to the present invention includes a first substrate rearranging section and a second substrate rearranging section having the substrate rearranging apparatus, and a plurality of substrates mounted on a receiving table. Cassette transport means for transporting the cassette;
Substrate alignment means for aligning the substrates housed in the cassette and positioning them in a regular position, substrate transport means for transporting the substrate, and a plurality of cleaning tanks for cleaning the substrate transported by the substrate transport means, Drying means for drying the substrate cleaned by the cleaning tank; rearranging the substrate before the cleaning processing by the cleaning tank by the first substrate rearranging section into a face-to-face arrangement; The substrate that has been cleaned by the cleaning tank by the substrate rearranging section is rearranged into a face-to-back arrangement.

Further, the substrate rearranging apparatus according to the present invention comprises:
A substrate rearranging apparatus for reversing the direction of a part of a plurality of substrates housed in a plurality of cassettes and rearranging them in an array in which face surfaces of the substrates or back surfaces that are the back sides of the face surfaces face each other, The substrate rearranging device is an elevating mechanism, a substrate holding unit having a horizontal moving mechanism having a movable base mounted with a substrate holding member that can move in the horizontal direction and holds a substrate at a symmetrical position at the distal end, A substrate lifting means for lifting and lowering the first lifting member and the second lifting member; and a substrate lifting rotating means having a rotation mechanism capable of rotating the first lifting member and the second lifting member, respectively. The push-up member and the second push-up member receive the plurality of substrates accommodated in the cassette and move to a predetermined position, and then the substrates placed on the first push-up member and the second push-up member. In a state where the substrate holding unit receives, holds, and retracts, the plurality of substrates held on the first push-up member and the second push-up member are rotated, and the substrate holding unit rotates the first push-up member. And moving down to a position above the second push-up member and lowering the same to insert and place the substrate between the substrates on the first push-up member and the second push-up member.

[0013]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Referring to the drawings, embodiments of a substrate rearranging apparatus and a substrate processing apparatus provided with the apparatus will be described below. Hereinafter, an automatic substrate cleaning apparatus as a substrate processing apparatus including a substrate rearranging apparatus will be described. FIG. 1 is a plan view schematically showing the configuration of an automatic substrate cleaning apparatus as a substrate processing apparatus.

As shown in FIG. 1, an automatic substrate cleaning apparatus 1
Has a substantially rectangular flat surface, and a cassette 15 and a cassette 16 each containing a plurality of substrates W such as wafers are placed on a receiving table (not shown) in the lower left portion. Each of the cassettes 15 and 16 stores 25 substrates W each. The cassettes 15 and 16 are placed and positioned one by one on an upper O / F (Orientation Flat) aligning means 6 by a cassette transporter 2 as a cassette transporting means. The cassette transporter 2 includes a cassette 15
And the cassette 16 is moved while holding the cassettes, respectively, and can be moved up and down and horizontally.

The O / F (Orientation Flat) aligning means 6
Is to align the O / F (Orientation Flat) of the substrates W stored in the cassette 15 and the cassette 16 to perform positioning at a regular position (reference plane). It ’s a board W
That is, the shape of the wafer is not a perfect circle but a side serving as a reference plane is formed. By aligning the reference plane, the pattern plane can be easily matched. In place of the O / F aligning means 6, an invention "notched wafer aligning apparatus" described in Japanese Patent Application Laid-Open No. 10-4133 filed by the applicant can be used. O / F
The alignment means 6 and the notched wafer alignment apparatus are also referred to as substrate alignment d means.

The holding grooves (not shown) for holding the substrates W of the cassettes 15 and 16 are 1P (pitch), that is, 6.35 mm.

O / F (Orientation Flat) alignment means 6
When the O / Fs of the substrates W stored in the cassettes 15 and 16 are aligned, the plurality of substrates W are face-to-back (face-to-back) by the substrate rearranging device 11 described later.
face to fac (face to fac)
e) Rearrange into the array. That is, the opposing face surfaces (mirror surfaces) of the adjacent substrates W face each other.

The substrate lifting / rotating means 31 of the substrate rearranging device 11 is arranged such that the plurality of substrates W are rearranged into a face-to-face arrangement, and is thus referred to as a wafer transporting means (or also referred to as a substrate transporting means). The wafer transfer device 3 as a substrate W
(The cassette 15 and the cassette 16 are emptied.) Are transported in the direction A shown by the arrow in FIG. 1 to perform a predetermined cleaning operation in each of the cleaning tanks 4, 4, and 4, which are processing tanks. A predetermined drying operation is performed by a spin dryer (S / D) 5 as a means. The wafer transfer device 3 is capable of performing a vertical operation and a horizontal operation similarly to the cassette transfer device 2 described above. As shown in FIG. 1, the substrate rearranging device 11 on the inlet side is indicated by a first substrate rearranging unit 11A, and the substrate rearranging device 11 on the outlet side is indicated by a second substrate rearranging unit 11B.

The empty cassette 15 and the cassette 16 on the substrate pushing-up rotating means 31 of the substrate sorting apparatus 11
Are transported in the direction of arrow B shown in FIG. 1 by the cassette transporter 2 and then transported in the direction of arrow A shown in FIG. 1 by transport means (not shown) such as a belt conveyor. The sheet is transported from the position P1 to the empty cassette standby position P2 on the exit side.

Next, empty cassettes 15 and 16
Is transferred to and placed on the cassette receiving table 7 by the cassette transporter 2 on the exit side (OUT). Next, the empty cassettes 15 and 16 received by the cassette transporter 2 from the cassette receiving table 7 are transferred to the substrate pushing-up rotating means 31 of the substrate reordering device 11. The automatic substrate cleaning apparatus according to the present invention has a configuration in which the empty cassette 15 and the cassette 16 are temporarily transferred to the cassette receiving table 7. Good.

The empty cassettes 15 and 16 on the substrate pushing-up rotating means 31 are transported by the wafer transporting machine 3 performing the cleaning operation, and the cleaning operations by the cleaning tanks 4, 4, 4 and the spin dryer 5 are performed. The stored substrate W is stored.

The substrate rearranging apparatus 11 including the substrate lifting / rotating means 31 performs a reverse operation to convert a plurality of substrates W rearranged into a face-to-face arrangement into a face-to-face arrangement, as described later. Two back (face
to back) array.

FIG. 2 is a front view of the substrate reordering apparatus, and FIG. 3 is a view including a partial cross section of the substrate holding means.

As shown in FIG. 2, the substrate rearranging device 11 includes a substrate holding means 21 fixed in a gantry 12.
And a substrate pushing-up rotating means 31.

The substrate holding means 21 is, as shown in FIG.
The gantry 31 is attached and fixed, and includes a lifting mechanism 22 and a horizontal moving mechanism 23 that can move in a direction perpendicular to the lifting mechanism 22, that is, in the X direction shown in FIG. 3.

As shown in FIG. 2 and FIG.
Are coupled to a pulse motor 22a as a driving means and an output shaft of the pulse motor 22a by coupling or the like (not shown).
A ball screw 22b (shown in FIG. 3) attached via a nut, a nut (not shown) screwed and connected to the ball screw 22b, and a ball screw 22b on both sides of the ball screw 22b in parallel along the longitudinal direction. consisting disposed track rail and the sliding table linear guide 22c (22c ₁ and 22c ₂₎
When, the linear guide 22c (22c ₁ and 22c ₂₎ to be mounted and fixed a movable frame 22 d (it is shown by two-dot chain line)
Consists of

As shown in FIG. 3, when the output shaft of the pulse motor 22a of the elevating mechanism 22 rotates, the ball screw 22b also rotates integrally, and the nut screwed and connected via the ball of the ball screw 22b is an arrow. It moves in any of the Z directions (in the case shown in FIG. 3 of this embodiment, it moves upward). And a movable frame 2 connected to the nut.
2d is guided by the linear guides 22c (22c ₁ and 22c ₂ ) and moves in the direction of arrow Z to move the horizontal moving mechanism 23 in FIG.
Is moved up to the position shown by the two-dot chain line shown in FIG.

Next, the horizontal moving mechanism 23 will be described.

As shown in FIGS. 2 to 5, the horizontal moving mechanism 23 includes a base 23a (shown in FIG. 4) fixed to the upper end of the movable frame 22d in a cantilever manner, and the base 23a.
Mounting and fixing member 2 having a substantially L-shaped cross section which is mounted and fixed to one side of
3b, a pulse motor 23c as driving means disposed on the mounting and fixing member 23b, and a pulse motor 23c.
c, a ball screw 23d attached to the output shaft via a coupling or the like (not shown), a nut (not shown) screwed to the ball screw 23d, and a longitudinal direction of the ball screw 23d. substantially U a linear guide 23e ₁ and 23e ₂ formed of a slidable slide block to the track rail and the track rail disposed in parallel, which is attached and fixed to the linear guide 23e ₁ and 23e ₂ along And a movable base 23f (shown in FIG. 5).

Since the movable base 23f is substantially U-shaped, as shown in FIG.
The O / F aligning means 6 and the cassette receiving table 7 can be arranged therebetween, thereby saving space.

As shown in FIG. 5, the movable base
23f is a substrate such as a wafer at a symmetrical position at the tip.
A substrate holding member 23g for holding W is mounted. This
23g of holding groove of substrate holding member 23g₁, 23g_TwoIs a comb
23g of the holding groove ₁, 23g_TwoIs 1P
H) (= 6.35 mm).

[0032] The substrate holding member 23g, as shown in FIG. 6, the holding groove 23g ₁ and the holding groove 23g ₁ for holding a substrate W
A groove 23gs for allowing one substrate to pass therethrough is formed at a position of 1 / 2P (pitch).

As shown in FIG. 3, the horizontal moving mechanism 23
When the output shaft rotates by driving the pulse motor 23c as a driving means, the ball screw 23d attached to the output shaft rotates. Due to the rotation of the ball screw 23d, a nut (not shown) is connected to the linear guide 23e ₁ via the ball.
And it is guided by the 23e ₂ to be linear. Then, the linear guide 23e ₁ and the movable base 23f mounted to 23e ₂ can be moved in the direction of arrow X shown in FIG. As described later, the holding groove 23 of the substrate holding member 23g attached to the tip of the movable base 23f.
g ₁ and 23g ₂ hold the substrate W placed in the cassette 16 (shown in FIG. 2) placed on the push-up member 61 shown in FIG.

Next, the substrate lifting and rotating means 31 will be described.

As shown in FIGS. 2 and 7, the substrate pushing-up rotating means 31 is provided on the gantry 12. The substrate lifting / rotating means 31 includes a substrate lifting / lowering means 32 and a rotation mechanism 51.

The substrate lifting / lowering means 32 includes a pulse motor 32a as a driving means and an output shaft 32 of the pulse motor 32a.
a pulley 32b ₁ which is rotatably mounted fixed to a _1, a pulley 32b ₂ which is rotatably mounted fixed to the frame 12 a above the pulley 32b _1, wound ₂ wound pulleys 32a ₁ and the pulley 32b Belt 32c.

A push-up base 34 of a push-up mechanism 33 is attached to a belt 32c of the substrate lifting / lowering means 32 via a mounting bracket 35. Therefore, the push-up base 34 is
With the movement of the belt 32c, the belt 32c can reciprocate in the Z direction indicated by the arrow. The push-up base 34 is attached to a slide table 37 slidable on one track rail 36 disposed on the gantry 12 in parallel with the belt 32c, and guided by the slide table 37. The belt 32c
A stable linear guide motion can be performed along with the movement of.

As shown in FIG. 7, the push-up base 34 is a linear guide 38a (38a ₁ ~38a ₄₎ is provided comprising a track rail and the sliding table described above, the linear guide 38a (38a ₁ ~ the sliding block of each of 38a _4), table 39a (39a ₁ ~39a ₄₎ is attached and fixed. Then, between the table 39a ₁ and table 39a _3, and the table 39a ₂ and the table 39
Between the a _4, the support arm 40 and support arm 41 is mounted. Therefore, the table 39a (39a
_{1 to} 39a ₄ ) and the support arm 40 and the support arm 41 can be expanded and contracted in the arrow X direction. However, the state shown in FIG. 7 shows the expanded state.

The expansion and contraction closing means 43 for expanding and contracting the support arms 40 and 41 is shown in FIG.
As shown in the figure, a pulse motor 44 as a driving means mounted and fixed to the gantry 12, a rectangular and thin connecting plate 45 mounted on an output shaft of the pulse motor 44, and one end at both ends of the connecting plate 45 And a substantially U-shaped drive plate 46 and a drive plate 47 which are combined with each other. The other ends of the driving plates 46 and 47 are slidably connected to the supporting arms 40 and 41, respectively. Therefore,
As shown in FIG. 8, when the pulse motor 44 is driven and the connecting plate 45 connected to the output shaft rotates clockwise as shown by the arrow, the driving plates 46 and 47 are in the state shown in FIG. The support arm 40 and the support arm 41 can be changed from the expanded state shown in FIG. 7 to the contracted state. Conversely, when the pulse motor 44 is rotated in the reverse direction, the operation described above is performed in an opposite manner to the state shown in FIG. In the present embodiment, the use of the connecting plate 45, the driving plate 46, and the driving plate 47 as described above enables a motion such as a sine wave to be exhibited. Since the substrate W can be moved quickly, adverse effects due to vibrations on the substrate W and the like can be reduced.

Next, the rotation mechanism 51 will be described.

As shown in FIG. 7, two rotation mechanisms 51 are provided. That is, the support members 52 and 5 provided on the table 39a ₃ and the table 39a ₄
3, a gear 54 and a gear 55 rotatably mounted and fixed to the support member 52 and the support member 53, and a motor as drive means for driving the gear 54 and the gear 55 via a transmission gear 58 and a transmission gear 59, respectively. 56 and a motor 57;
The push-up member 60 and the push-up member 61 are rotatable as the gears 54 and 55 rotate. In addition,
The transmission gear 58, the transmission gear 59, the motor 56, and the motor 57 are mounted on a mounting member (not shown) of the rotation mechanism 51.

As shown in FIG. 7, the push-up member 60 is made of the same member as the push-up member 61.
° rotated, and one side surface is substantially U-shaped. A groove for holding the substrate W is formed on both sides in a comb-like shape (shown by a push-up member 61 in FIG. 7), and a plurality of substrates W can be held by the groove. This groove can normally hold 50 substrates W every 1 / 2P (pitch), but it is also possible to hold more or less substrates W. Note that the lifting member 61 is a first lifting member, the lifting member 6.
0 is referred to as a second lifting member.

The relationship between the pitches of the holding grooves of the substrate rearranging device 11 according to the present invention is as follows. That is, the pitch P of the holding grooves of the cassettes 15 and 16
Is 6.35 mm, the movable base 23 shown in FIGS.
The pitch of the holding groove of the substrate holding member 23g of f is P (=
However, a slit 23gs for allowing the substrate W to pass therethrough is formed at a position of 1 / 2P (pitch). Further, the pitch of the holding grooves of the push-up member 60 and the push-up member 61 is 1 / 2P (= 6.35 mm / 2).

Next, the operation of the substrate rearranging apparatus according to the present invention will be described with reference to the drawings.

As shown in FIG. 2, the cassette 15 and the cassette 16 are automatically placed on the receiving tables 13 and 14 provided on the upper surface of the gantry 12 by the transport means (not shown). I have. At this time, as shown in FIGS. 2, 7, and 9 (particularly (1)), the push-up member 60 and the push-up member 61
Is located at a first position H1 which is a reference position. Then, as shown in FIG.
Holds a plurality of substrates W, and in this case, a plurality of substrates W
25 substrates, a total of 50 substrates, are held therein. The arrangement of the plurality of substrates W in the cassette 15 and the cassette 16 is such that the pattern formation surface (face) and the back surface (back) of the normal wafer face each other.

Then, the cassette 15 and the cassette 1
The bottom of 6 has a sufficient space for the push-up members 60 and 61 to pass therethrough.

As shown in FIG. 7, when the pulse motor 32a is driven, the push-up members 60 and 61 together with the push-up base 34, the support arms 40 and the support arms 41 move in the direction of the arrow Z with the movement of the belt 32c. To rise. Then, as shown in FIG. 9B, the push-up members 60 and 61 pass through the cassettes 15 and 16 to receive a plurality of substrates W from the cassettes and transfer the substrates to the second position H2. Move up.

As shown in FIG. 6, the pitch of the holding grooves for holding the substrates of the cassettes 15 and 16 is P
(= 6.35 mm), and the lifting member 60 and the lifting member 6
The pitch of the holding groove of No. 1 is P / 2 (= 6.35 / 2 mm)
It has become.

Then, as shown in FIG. 9 (3) and FIG. 3, the movable base 23f of the substrate holding means 21 is driven by the driving force of the pulse motor 23c and the one lifting member 6
1 and between the outer peripheral lower edge of the substrate W.

As shown in FIG. 9 (4), the substrate holding means 21 is moved from the second position H2 shown in FIG.
To the position H3. The third position H3 is such that when the substrate W is rotated by the lifting member 60, the substrate W
Is set at a position that does not hit the substrate W held by the substrate holding member 23g.

Substrate holding member 23g of movable base 23f
Receives and holds the substrate W held by the lifting member 61 in the process of ascending to the third position H3. The pitch of the holding grooves of the substrate holding member 23g of the movable base 23f is 1P
(Pitch), but a slit 23gs for passing the substrate W at the position of 1 / 2P (pitch) (shown in FIG. 6)
Are formed.

In the state shown in FIG. 9 (4), the lifting member 60
Rotates the substrate W by 180 °.

Next, as shown in FIG. 9 (5), the movable base 23f holding the substrate W of the substrate holding member 23g.
Protrudes to a position above the lifting member 60. Then, it is shifted by 1 / 2P (pitch) in the direction indicated by the arrow in (5) of FIG. 9 by the expanding / contracting closing means 43 shown in FIG. this is,
Since the substrate W of the push-up member 60 is rotated by 180 ° in (4) of FIG. 9, the substrate W on the substrate holding member 23 g is inserted between the substrates W on the push-up member 60 so as not to collide. This is for performing the position alignment. Further, as shown in FIG. 9 (5), the push-up member 60 and the push-up member 61 are moved by a predetermined distance in the directions of arrows S and S '. This is shown in FIG.
This is because when the substrate W is dried by the spin dryer 5 shown in FIG. Therefore, if a predetermined distance for moving the push-up members 60 and 61 in the directions of the arrows S and S ′ is α, FIG.
The moving amount of the substrate holding member 23g shown in (5) is α + 1
/ 2P (pitch). As shown in FIG. 1, the distance L between the center of the processing tank of the spin dryer 5, that is, a preset reference position such as the center of the rotation axis of the processing tank, and the substrate reordering device 11 is determined by a control means (not shown). It is stored in a memory as storage means.

Then, as shown in FIG. 9 (6), the substrate holding means 21 is lowered to insert the substrate W between the slits 23gs indicated by the two-dot chain line in FIG. I do.

Next, as shown in FIG. 9 (7), the movable base 23f is retracted.

When the face-to-face process in the process steps (1) to (7) in FIG. 9 is completed, the process proceeds to the cleaning operation of the substrate W in the above-described processing bath as shown in FIG.

The automatic substrate cleaning apparatus 1 shown in FIG.
It is controlled by control means (not shown) including a microcomputer and the like. Further, the position of the movable part driven by the pulse motor as the driving means shown in FIGS. 2, 3 and 7 is detected by position detecting means (not shown) including an encoder or the like. .

Further, the substrate reordering device 11 according to the present invention
Is configured to hold the substrate W by the movable base 23f instead of the conventional chuck, so that the substrate W can be reliably held, and the gripping force for gripping the substrate W needs to be adjusted. Therefore, it is possible to prevent damage to the substrate W due to failure to grip the substrate W or the like.

Next, a second embodiment of the substrate rearranging apparatus and the substrate processing apparatus provided with the apparatus according to the present invention will be described. It should be noted that a detailed description of the devices having the same functions and configurations as those of the devices shown in FIGS. 1 to 8 will be omitted, and different points will be described below with reference to FIGS.

FIG. 10 is a view showing a configuration corresponding to FIG. 6, and is a view showing a main part of a configuration of a substrate holding member of a movable base of the horizontal moving mechanism.

As shown in FIG. 10, the pitch of the holding grooves of the substrate holding member 23g of the movable base 23f (shown in FIGS. 4 and 5) for holding the substrates of the cassettes 15 and 16 is 2P (= 6. 35 mm × 2), and the pitch P between the holding grooves of the push-up member 60 and the push-up member 61 is 6.35 mm. Accordingly, the pitch P of the holding grooves of the cassette 15 and the cassette 16 is 6.35 mm, and the movable base 23f
The pitch of the holding groove of the substrate holding member 23g is 2P (=
6.35 mm × 2), provided that a slit 23gs for passing the substrate W is formed at a position of 1P (pitch). The pitch P between the holding grooves of the push-up member 60 and the push-up member 61 is 6.35 mm. The relationship is as described above.

Next, the operation of the substrate sorting apparatus according to the second embodiment will be described with reference to FIG.

As shown in FIG. 11, the cassette 15 and the cassette 16 are automatically placed on the receiving tables 13 and 14 provided on the upper surface of the gantry 12 by the transport means (not shown) (see FIG. 2). See). At this time, as shown in FIGS. 2, 7, and 11 (particularly (1)), the lifting member 60
The push-up member 61 is located at a first position H1 which is a reference position. Then, as shown in FIG.
5 and the cassette 16 hold a plurality of substrates W. In this case, the plurality of substrates W
Five substrates, 25 substrates in the cassette 16, and a total of 50 substrates are held. The arrangement of the plurality of substrates W in the cassette 15 and the cassette 16 is such that the pattern formation surface (face) and the back surface (back) of the normal wafer face each other.

Then, the cassette 15 and the cassette 1
The bottom of 6 has a sufficient space for the push-up members 60 and 61 to pass therethrough.

As shown in FIG. 7, when the pulse motor 32a is driven, the lifting base 3 is moved with the movement of the belt 32c.
4. The push-up member 60 and the push-up member 61 move up in the arrow Z direction together with the support arm 40 and the support arm 41. Then, as shown in FIG. 11 (2), the push-up members 60 and 61 pass through the cassettes 15 and 16 to receive a plurality of substrates W from the cassettes and transfer the substrates to the second position H2. The pulse motor 44 shown in FIG. 7 is driven in the counterclockwise direction, and the driving plates 46 and 47 are operated in the closing and closing directions to move the push-up member 60 and the push-up member 61 in directions approaching each other.

Then, as shown in FIG. 11 (3) and FIG. 3, the movable base 23f of the substrate holding means 21 is driven by the driving force of the pulse motor 23c, and the lifting members 60 and 61 and the substrate W are moved. It enters between the outer peripheral lower edge.

As shown in FIG. 11 (4), the substrate holding means 21 rises from the second position H2 shown in FIG. 11 (2) to a third position H3.

In the ascending position of the third position H3, the half of the substrate W held by the push-up members 60 and 61 is received and held by the substrate holding member 23g of the movable base 23f, and the movable base 23f is moved to the position shown in FIG. Pull in as shown in (5).

The push-up member 60 and the push-up member 61
Is moved in the expanding direction opposite to the contracting and closing direction shown in (2) of FIG. This is to prevent the substrates W from hitting each other when the substrate W is rotated by the lifting member 60 and the lifting member 61 as shown in FIG.

In the state shown in FIG. 11 (6), the lifting member 6
0 and the lifting member 61 slightly raise the substrate W to a position where the substrate W does not contact the cassette 15 and the cassette 16 and 1
Rotate 80 °.

As shown in FIG. 11 (7), after rotating the cassette 15 and the cassette 16 by 180 ° in (6) of FIG. 11, the push-up members 60 and 61 lower the substrate W to lower the substrate W in FIG. (5).

Next, as shown in FIG. 11 (8), the push-up member 60 and the push-up member 61 are moved in a direction approaching each other to obtain the state shown in FIG. 11 (2). The movable base 23 holding the substrate W of the substrate holding member 23g.
f protrudes and moves to above the push-up members 60 and 61. Then, by the expanding / contracting closing means 43 shown in FIG.
Shift by P (pitch). This corresponds to (6) in FIG.
The substrate W of the lifting member 60 and the lifting member 61 is
Since it is rotated by 80 °, the lifting member 60 and the lifting member 6
This is for performing positioning for inserting the substrate W on the substrate holding member 23g so as not to collide between the substrates W on the first substrate W. Further, the lifting member 60 and the lifting member 61
Is moved a predetermined distance in the directions of arrows S and S ′. This is because when the substrate W is dried by the spin dryer 5 shown in FIG. Therefore, if a predetermined distance for moving the push-up members 60 and 61 in the directions of the arrows S and S ′ is α, FIG.
The amount of movement of the substrate holding member 23g shown in (8) of 1 is α +
It will be shifted by 1P (pitch).

Then, as shown in FIG. 11 (9), the substrate holding means 21 is lowered to insert the substrate W between the slits 23gs indicated by the two-dot chain line in FIG. Place on top.

Next, as shown in FIG. 11 (10), the movable base 23f is retracted.

When the face-to-face process by the process steps (1) to (10) in FIG. 11 is completed, the process proceeds to the cleaning process of the substrate W in the above-described processing tank as shown in FIG.

The automatic substrate cleaning apparatus 1 shown in FIG.
It is controlled by control means (not shown) including a microcomputer and the like. Further, the position of the movable part driven by the pulse motor as the driving means shown in FIGS. 2, 3 and 7 is detected by position detecting means (not shown) including an encoder or the like. .

It is needless to say that the present invention can be embodied in various forms without departing from the spirit or main characteristics thereof and is to be interpreted in a limited manner. Further, the present invention includes all changes and modifications belonging to an equivalent range.

[0078]

As described above, according to the present invention,
It is possible to securely hold the substrate without using a conventional chuck, and convert it to an array in which the face surfaces (mirror surfaces) or back surfaces of multiple substrates face each other without damaging the substrates. can do.

[Brief description of the drawings]

FIG. 1 is a plan view schematically showing a configuration of an automatic substrate cleaning apparatus as a substrate processing apparatus.

FIG. 2 is a front view of the substrate sorting apparatus.

FIG. 3 is a view including a partial cross section of the substrate holding means.

FIG. 4 is a side view of the substrate holding unit shown in FIG. 3 and a view showing a state where a movable base of the substrate holding unit holds the substrate.

FIG. 5 is a plan view of the substrate holding means shown in FIG. 3;

FIG. 6 is a diagram illustrating a main part of a configuration of a substrate holding member of a movable base of the horizontal movement mechanism.

FIG. 7 is a diagram showing a configuration of a substrate lifting rotation unit.

FIG. 8 is a view for explaining the operation of the expanding / contracting closing means of the substrate pushing-up rotating means shown in FIG. 7;

FIG. 9 is a diagram for explaining the operation of the substrate sorting apparatus.

FIG. 10 is a diagram illustrating a main part of a configuration of a substrate holding member of a movable base of a horizontal movement mechanism according to a second embodiment.

FIG. 11 is a diagram for explaining the operation of the substrate sorting apparatus.

FIG. 12 is a side view of a conventional substrate rearranging apparatus.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 Automatic substrate cleaning device 2 Cassette transfer device 3 Wafer transfer device 4 Cleaning tank 5 Spin drier 6 O / F aligning means 7 Cassette receiving stand 11 Substrate rearranging device 12 Mounting stand 13, 14 Receiving stand 15, 16 Cassette 21 Substrate holding means 22 Elevating Mechanism 23 Horizontal movement mechanism 23f Movable base 23g Substrate holding member 31 Substrate lifting / rotating means 32 Substrate lifting / lowering means 33 Pushing mechanism 34 Pushing base 35 Mounting bracket 40, 41 Support arm 43 Expanding / contracting closing means 45 Connecting plate 46, 47 Driving plate 51 Rotating mechanisms 52, 53 Support members 54, 55 Gears 60, 61 Push-up members

Claims (5)

[Claims] 1. A substrate rearrangement for reversing the direction of a part of a plurality of substrates accommodated in a plurality of cassettes and rearranging the plurality of substrates into an array in which face surfaces of the substrates or back surfaces which are the back sides of the face surfaces are opposed to each other. An apparatus, wherein the substrate rearranging apparatus includes an elevating mechanism, and a horizontal moving mechanism having a movable base mounted with a substrate holding member that is movable in a horizontal direction and holds a substrate at a symmetrical position of a tip portion in the left-right direction. Substrate holding means, substrate lifting / lowering means for raising / lowering the first lifting member and the second lifting member, and substrate lifting / rotating means having a rotation mechanism capable of rotating the first lifting member and the second lifting member, respectively. The first push-up member and the second push-up member receive the plurality of substrates contained in the cassette, move to a predetermined position, and then move the first push-up member (or the second push-up member). In a state in which the mounted substrate is received and held by the substrate holding means, the plurality of substrates held on the second push-up member (or the first push-up member) are rotated, and the substrate holding means A substrate rearranging apparatus, wherein the substrate is rearranged after being moved to a position above the second push-up member and then lowered and inserted between the substrates on the second push-up member. 2. The movable base has a substantially U-shape, and a substrate holding member for holding the substrate is mounted at a position symmetrical to the left and right of a tip portion of the movable base, and a holding groove of the substrate holding member is provided. 2. The substrate rearranging apparatus according to claim 1, wherein a groove through which one substrate can pass is formed between the holding groove and the holding groove. 3. The first push-up member and the second push-up member have the same configuration, and the pitch of the groove for holding the substrate of the first push-up member and the second push-up member is equal to the pitch of the cassette. 2. The substrate rearranging apparatus according to claim 1, wherein the pitch is different from the pitch of the holding groove. 4. A first substrate rearranging unit and a second substrate rearranging unit having the substrate rearranging device according to claim 1, and a cassette accommodating a plurality of substrates placed on a receiving table. Cassette transporting means, substrate aligning means for aligning the substrates housed in the cassette and positioning them at a regular position, substrate transporting means for transporting the substrates, and cleaning the substrates transported by the substrate transporting means. A plurality of cleaning tanks; and drying means for drying the substrate cleaned by the cleaning tank. The substrate before being cleaned by the cleaning tank by the first substrate rearranging unit is arranged face-to-face. A substrate processing apparatus that rearranges the substrates after being cleaned by the cleaning tank by a second substrate rearranging section into a face-to-back arrangement. 5. A substrate rearrangement for reversing the direction of a part of a plurality of substrates housed in a plurality of cassettes and rearranging the plurality of substrates into an array in which face surfaces of the substrates or back surfaces which are the back sides of the face surfaces are opposed to each other. An apparatus, wherein the substrate rearranging apparatus includes an elevating mechanism, and a horizontal moving mechanism having a movable base mounted with a substrate holding member that is movable in a horizontal direction and holds a substrate at a symmetrical position of a tip portion in the left-right direction. Substrate holding means, substrate lifting / lowering means for raising / lowering the first lifting member and the second lifting member, and substrate lifting / rotating means having a rotation mechanism capable of rotating the first lifting member and the second lifting member, respectively. The first push-up member and the second push-up member receive the plurality of substrates housed in the cassette, move to a predetermined position, and then mount on the first push-up member and the second push-up member. In a state in which the substrate holding means receives, holds, and retracts the plurality of substrates, the plurality of substrates held on the first push-up member and the second push-up member are rotated, and the substrate holding means The method is characterized in that the substrate is moved above the first push-up member and the second push-up member and then lowered to insert and place the substrate between the substrates on the first push-up member and the second push-up member. Substrate rearranging device.