JP2001091783A - Slit sleeve for optical communication and its manufacturing method - Google Patents

Slit sleeve for optical communication and its manufacturing method

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Publication number
JP2001091783A
JP2001091783A JP26637199A JP26637199A JP2001091783A JP 2001091783 A JP2001091783 A JP 2001091783A JP 26637199 A JP26637199 A JP 26637199A JP 26637199 A JP26637199 A JP 26637199A JP 2001091783 A JP2001091783 A JP 2001091783A
Authority
JP
Japan
Prior art keywords
peripheral surface
inner peripheral
split sleeve
less
optical communication
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP26637199A
Other languages
Japanese (ja)
Inventor
Yoshihiro Kobayashi
善宏 小林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Priority to JP26637199A priority Critical patent/JP2001091783A/en
Publication of JP2001091783A publication Critical patent/JP2001091783A/en
Pending legal-status Critical Current

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Abstract

PROBLEM TO BE SOLVED: To obtain a slit sleeve 10 for optical communication small in a connection loss when an optical fiber connector is composed. SOLUTION: In the slit sleeve 10 for optical communication in which a slit 11 is provided in the longitudinal direction of its cylindrical body, the roundness of the inner peripheral surface 12 is specified to 1 μm or less, moreover the straightness in the longitudinal direction of the inner peripheral surface 12 is specified to 1 μm or less, further the degree of concentricity between the outer peripheral surface 13 and the inner peripheral surface 12 of the slit sleeve 10 is specified to 10 μm or less and moreover the surface roughness of the inner peripheral surface 12 is specified to Rma×0.5 μm or less.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明が属する技術分野】本発明は、光通信等で光ファ
イバの接続に用いる光通信用割スリーブに関するもので
ある。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a split sleeve for optical communication used for connecting optical fibers in optical communication or the like.

【0002】[0002]

【従来の技術】光ファイバ同士を接続する光コネクタの
構造は、図3に示すように光ファイバ40を挿通したフ
ェルール41同士を割スリーブ10の両端から挿入して
突き合わせるようになっており、上記フェルール41、
割スリーブ10の材質として、アルミナやジルコニア等
のセラミックスまたは金属、プラスチックス等が用いら
れている。
2. Description of the Related Art As shown in FIG. 3, the structure of an optical connector for connecting optical fibers is such that ferrules 41 each having an optical fiber 40 inserted therein are inserted from both ends of a split sleeve 10 and abutted. The above ferrule 41,
As the material of the split sleeve 10, ceramics such as alumina and zirconia, metals, plastics and the like are used.

【0003】また、従来の一般的な割スリーブは図2に
示すように円筒体で長手方向にスリット11が設けら
れ、その内周面12はフェルール41の外径よりわずか
に小さく精密研磨されている(特開平2−231545
号公報参照)。この割スリーブ10にフェルール41を
挿入すると、割スリーブ10が弾性変形して若干広がる
ことにより、割スリーブ10の内周面12でフェルール
41を強固に把持することが出来るようになっている。
As shown in FIG. 2, the conventional general split sleeve has a cylindrical body provided with a slit 11 in the longitudinal direction, and an inner peripheral surface 12 of which is slightly smaller than the outer diameter of the ferrule 41 and is precisely polished. (Japanese Unexamined Patent Application Publication No.
Reference). When the ferrule 41 is inserted into the split sleeve 10, the split sleeve 10 is elastically deformed and slightly spreads, so that the ferrule 41 can be firmly gripped by the inner peripheral surface 12 of the split sleeve 10.

【0004】また、この割スリーブ10をセラミックス
で形成する場合は、セラミック原料を押出成形等によっ
て円筒状に成形し、焼成した後、内周面及び外周面を研
削し、加工によりスリット31を形成して製造してい
た。
When the split sleeve 10 is formed of ceramics, a ceramic raw material is formed into a cylindrical shape by extrusion or the like, fired, and then the inner and outer peripheral surfaces are ground to form a slit 31 by processing. Was manufactured.

【0005】[0005]

【発明が解決しようとする課題】ところが従来の割スリ
ーブ10では、光ファイバ40を挿通した一対のフェル
ール41同士を割スリーブ10の両端から挿入して当接
させた時に、割スリーブ10の個々の接続損失にバラツ
キが生じ、フェルール41の真円度、真直度、同心度、
内周面粗さ、外径寸法、内径寸法等の各部単体の寸法精
度をいくら良くしても安定した光学特性を得ることが困
難であるという問題があった。
However, in the conventional split sleeve 10, when a pair of ferrules 41 into which the optical fiber 40 is inserted are inserted from both ends of the split sleeve 10 and brought into contact with each other, the individual split sleeve 10 The connection loss varies, and the roundness, straightness, concentricity,
There is a problem that it is difficult to obtain stable optical characteristics even if the dimensional accuracy of each part alone such as the inner peripheral surface roughness, the outer diameter dimension, and the inner diameter dimension is improved.

【0006】[0006]

【課題を解決するための手段】上記に鑑みて本発明は、
円筒体の長手方向にスリットを設けた光通信用割スリー
ブにおいて、内周面の真円度を1μm以下、かつ内周面
の長手方向の真直度を1μm以下としたことを特徴とす
る。
In view of the above, the present invention provides
In the optical communication split sleeve provided with a slit in the longitudinal direction of the cylindrical body, the roundness of the inner peripheral surface is 1 μm or less, and the straightness of the inner peripheral surface in the longitudinal direction is 1 μm or less.

【0007】即ち、特に真円度と真直度を上記範囲内と
することで、上記問題を解決できることを見いだした。
That is, it has been found that the above problem can be solved particularly by setting the roundness and straightness within the above ranges.

【0008】又、上記割スリーブにおいて、外周面と内
周面との同心度を10μm以下、かつ内周面の表面粗さ
をRmax0.5μm以下とした。
In the split sleeve, the concentricity between the outer peripheral surface and the inner peripheral surface is 10 μm or less, and the surface roughness of the inner peripheral surface is Rmax 0.5 μm or less.

【0009】さらに、本発明は、上記割スリーブの内周
面の加工方法として、ホーニング加工で荒研磨をした
後、ピン研磨で最終仕上げ加工を施すことを特徴とした
ものである。
Further, the present invention is characterized in that, as a method for processing the inner peripheral surface of the split sleeve, after rough polishing by honing processing, final finishing processing is performed by pin polishing.

【0010】[0010]

【発明の実施の形態】以下本発明の実施形態を図を用い
て説明する。
Embodiments of the present invention will be described below with reference to the drawings.

【0011】図1は、本発明の実施形態による割スリー
ブ10を示す断面図である。割スリーブ10はアルミナ
やジルコニア等のセラミックス、リン青銅、又はプラス
チックス等の材料からなり、円筒体で長手方向にスリッ
ト11が設けられ、その内周面12は挿入するフェルー
ルの外径よりも僅かに小さな内径となるような円形に精
密研磨されている。
FIG. 1 is a sectional view showing a split sleeve 10 according to an embodiment of the present invention. The split sleeve 10 is made of a material such as ceramics such as alumina or zirconia, phosphor bronze, or plastics, is provided with a slit 11 in a longitudinal direction in a cylindrical body, and its inner peripheral surface 12 is slightly smaller than the outer diameter of the ferrule to be inserted. It is precisely polished into a circle with a small inside diameter.

【0012】本発明の割スリーブ10は、図3に示すよ
うに両側から光ファイバ40を挿通したフェルール41
を挿入して当接させることにより、光ファイバ40同士
を結合する光コネクタとすることが出来る。
As shown in FIG. 3, the split sleeve 10 of the present invention has a ferrule 41 into which an optical fiber 40 is inserted from both sides.
By inserting and abutting each other, an optical connector for coupling the optical fibers 40 to each other can be obtained.

【0013】各部分の寸法精度は、内周面12の真円度
を1μm以下、内周面12の長手方向の真直度を1μm
以下、外周面13と内周面12との同芯度を10μm以
下で、かつ内周面12の表面粗さをRmaxを0.5μm
以下としてある。
The dimensional accuracy of each part is such that the roundness of the inner peripheral surface 12 is 1 μm or less and the straightness of the inner peripheral surface 12 in the longitudinal direction is 1 μm.
Hereinafter, the concentricity between the outer peripheral surface 13 and the inner peripheral surface 12 is 10 μm or less, and the surface roughness Rmax of the inner peripheral surface 12 is 0.5 μm.
It is as follows.

【0014】ここで、内周面12の真円度を1μm以下
としたのは、内周面12の真円度が1μmを越えると割
スリーブ10の内周面12のフェルールを把持する部分
が一定にならず、逆に内周面12の真円度が限りなく0
に近づくほど内周面12の全体でフェルール41を把持
する事になり、接続損失を低減することが出来るためで
ある。
Here, the reason why the roundness of the inner peripheral surface 12 is set to 1 μm or less is that when the roundness of the inner peripheral surface 12 exceeds 1 μm, a portion of the split sleeve 10 that grips the ferrule of the inner peripheral surface 12 is formed. It is not constant, and conversely the roundness of the inner peripheral surface 12 is infinite
This is because the ferrule 41 is gripped on the entire inner peripheral surface 12 as the distance from the inner peripheral surface 12 increases, and the connection loss can be reduced.

【0015】又、内周面12の長手方向の真直度を1μ
m以下としたのは、内周面12の真直度が1μmを越え
ると割スリーブ10の両側からフェルール41を突き合
わせたときに、フェルール端面の中心位置にある光ファ
イバ40同士の中心ずれが生じ、逆に内周面12の長手
方向の真直度を限りなく0に近づけるほど両側のフェル
ール41が一直線上で割スリーブ10の内周面12で固
定される事になり、接続損失を低減することが出来るた
めである。
The straightness of the inner peripheral surface 12 in the longitudinal direction is 1 μm.
When the straightness of the inner peripheral surface 12 exceeds 1 μm, when the ferrules 41 are butted from both sides of the split sleeve 10, the center deviation of the optical fibers 40 at the center position of the ferrule end surface occurs, Conversely, as the straightness in the longitudinal direction of the inner peripheral surface 12 approaches zero as much as possible, the ferrules 41 on both sides are fixed on the inner peripheral surface 12 of the split sleeve 10 in a straight line, and the connection loss can be reduced. Because we can.

【0016】次に、外周面13と内周面12との同心度
を10μmとしたのは、外周面13と内周面12との同
心度が10μmを越えると割スリーブ10の肉厚tが不
均一となり、フェルール41の外周面を均一に把持出来
なくなり、逆に外周面13と内周面12との同心度を限
りなく0に近づけるほど割スリーブ10の内周面12は
周方向に均一にフェルール41を把持する事になり、接
続損失を低減することが出来るためである。
Next, the concentricity between the outer peripheral surface 13 and the inner peripheral surface 12 is set to 10 μm because the concentricity between the outer peripheral surface 13 and the inner peripheral surface 12 exceeds 10 μm. As a result, the outer peripheral surface of the ferrule 41 cannot be evenly gripped. Conversely, as the concentricity between the outer peripheral surface 13 and the inner peripheral surface 12 approaches zero as much as possible, the inner peripheral surface 12 of the split sleeve 10 becomes uniform in the circumferential direction. This is because the ferrule 41 is gripped in a short time, and the connection loss can be reduced.

【0017】最後に、内周面12の表面粗さをRmax
0.5μm以下としたのは、内周面12の表面粗さがR
max0.5μmを越えると面の凹凸によって割スリーブ
10の内周面12のフェルールを把持する部分が一定に
ならず、逆に内周面12の表面粗さが限りなく0に近づ
くほど内周面12の全体でフェルール41を把持する事
になり、接続損失を低減することが出来るためである。
Finally, the surface roughness of the inner peripheral surface 12 is calculated as Rmax
The reason why the thickness is set to 0.5 μm or less is that the surface roughness of the inner peripheral surface 12 is R
If the thickness exceeds max 0.5 μm, the portion of the inner peripheral surface 12 of the split sleeve 10 that grips the ferrule is not constant due to the unevenness of the surface, and conversely, as the surface roughness of the inner peripheral surface 12 approaches zero as much as possible, the inner peripheral surface This is because the ferrule 41 is gripped by the entirety of the joint 12, and the connection loss can be reduced.

【0018】従って、割スリーブ10の各部分の寸法精
度で、内周面12の真円度を1μm以下、内周面12の
長手方向の真直度を1μm以下、外周面13と内周面1
2との同芯度を10μm以下、かつ内周面12の表面粗
さをRmax0.5μm以下としたことにより、光学特性
として最も重要な接続損失値において優れた効果を奏す
ることが出来る。
Accordingly, with the dimensional accuracy of each part of the split sleeve 10, the roundness of the inner peripheral surface 12 is 1 μm or less, the straightness of the inner peripheral surface 12 in the longitudinal direction is 1 μm or less, and the outer peripheral surface 13 and the inner peripheral surface 1
By setting the concentricity with No. 2 to 10 μm or less and the surface roughness of the inner peripheral surface 12 to Rmax 0.5 μm or less, an excellent effect can be obtained in connection loss, which is the most important optical characteristic.

【0019】ここで各寸法の測定方法について説明す
る。
Here, a method of measuring each dimension will be described.

【0020】真円度は真円度測定器を用い、触針を割ス
リーブ10の内周面12に接触させながら、割スリーブ
10を回転し該触針の振れを測定する方法を用いる。真
直度は接触式形状測定器を用い、割スリーブ10の内周
面12に触針を接触させて、長手方向に移動させながら
該触針の振れを測定する方法を用いる。同心度は同心度
測定器を用い、V溝上で割スリーブ10を回転させ、画
像を拡大した画面上で内周面12のずれを測定する方法
を用いる。内径面12の表面粗さは接触式形状測定器を
用い、割スリーブ10の内周面12に触針を接触させ
て、長手方向に移動させながら該触針の振れを測定する
方法を用いる。
The roundness is measured by using a roundness measuring device and rotating the split sleeve 10 while the stylus is in contact with the inner peripheral surface 12 of the split sleeve 10 to measure the deflection of the stylus. The straightness is measured by using a contact-type shape measuring instrument, by bringing a stylus into contact with the inner peripheral surface 12 of the split sleeve 10, and measuring the deflection of the stylus while moving the stylus in the longitudinal direction. The concentricity is measured by using a concentricity measuring device, rotating the split sleeve 10 on the V-groove, and measuring the displacement of the inner peripheral surface 12 on the enlarged image. The surface roughness of the inner diameter surface 12 is measured by using a contact-type shape measuring instrument, by bringing a stylus into contact with the inner peripheral surface 12 of the split sleeve 10 and measuring the deflection of the stylus while moving the stylus in the longitudinal direction.

【0021】次に、本発明の割スリーブ10の製造方法
について説明する。
Next, a method for manufacturing the split sleeve 10 of the present invention will be described.

【0022】ジルコニアを主成分とし、イットリア、ア
ルミナ、チタニア、カルシア等を含有する原料を押出成
形、プレス成形、もしくは射出成形により予め円筒状に
形成しておき、焼成工程で焼き固める。次に外周面13
を円筒研削盤を用いてダイヤモンド砥石で研削し、内周
面12をダイヤモンド砥石を用いたホーニングおよびダ
イヤモンド砥粒を用いたピン研磨等で所定の内径寸法に
なるように研磨加工を行う。最後にスリット11を平面
研削盤を用いてダイヤモンド砥石で研削する。
A raw material containing zirconia as a main component and containing yttria, alumina, titania, calcia and the like is formed into a cylindrical shape in advance by extrusion molding, press molding, or injection molding, and is baked and hardened in a firing step. Next, the outer peripheral surface 13
Is ground with a diamond grindstone using a cylindrical grinder, and the inner peripheral surface 12 is polished by honing using a diamond grindstone and pin polishing using diamond abrasive grains so as to have a predetermined inner diameter. Finally, the slit 11 is ground with a diamond grindstone using a surface grinder.

【0023】上記内周面12の研磨加工についてはホー
ニング加工とピン研磨加工の両方を行うことを特徴と
し、これによって初めて上述した寸法精度を得ることが
出来る。以下、その詳細を図4を用いて説明する。
The polishing of the inner peripheral surface 12 is characterized in that both the honing and the pin polishing are performed, whereby the dimensional accuracy described above can be obtained for the first time. Hereinafter, the details will be described with reference to FIG.

【0024】図4(a)はホーニング加工を示す概念図
であるが、先端部をテーパ形状に形成したホーン30の
テーパ部にダイヤモンド砥石31を貼り付け、該ホーン
30を回転させ、固定冶具32に固定された割スリーブ
10の内径に該ホーン30のダイヤモンド砥石31を接
触させ、該ホーン30の荷重を割スリーブ10の内径に
かける。
FIG. 4 (a) is a conceptual diagram showing honing processing. A diamond grindstone 31 is attached to a tapered portion of a horn 30 having a tapered tip, and the horn 30 is rotated to fix a fixing jig 32. The diamond grindstone 31 of the horn 30 is brought into contact with the inner diameter of the split sleeve 10 fixed to the horn 30, and the load of the horn 30 is applied to the inner diameter of the split sleeve 10.

【0025】ところで、このホーニング加工しか施さな
かった割スリーブ10は内周面12の真直度が悪く、接
続損失も悪くなる。内周面12の真直度が悪くなる理由
は、ホーン30、固定冶具32ともに剛性が高く、割ス
リーブ10の内径中心とホーン30の中心の同心度が0
とはならないために、そのずれが割スリーブ10の内周
面12の長手方向のうねりに影響を与えているからであ
る。
By the way, in the split sleeve 10 subjected to only the honing, the straightness of the inner peripheral surface 12 is poor, and the connection loss is also poor. The reason why the straightness of the inner peripheral surface 12 is deteriorated is that both the horn 30 and the fixing jig 32 have high rigidity, and the concentricity between the inner diameter center of the split sleeve 10 and the center of the horn 30 is zero.
This is because the displacement does not affect the longitudinal undulation of the inner peripheral surface 12 of the split sleeve 10.

【0026】図4(b)はピン研磨を示す概念図である
が、先端部をテーパ形状に形成したピン20に油性スラ
リーに混合したダイヤモンド砥粒21を塗布し、該ピン
20を回転させ、固定冶具22に固定された割スリーブ
10の内周面12に該ピン20のテーパ面を接触させ、
割スリーブ10に該ピン20のテーパ面方向に荷重をか
ける。
FIG. 4 (b) is a conceptual diagram showing the polishing of a pin. Diamond abrasive grains 21 mixed with an oily slurry are applied to a pin 20 having a tapered tip, and the pin 20 is rotated. The tapered surface of the pin 20 is brought into contact with the inner peripheral surface 12 of the split sleeve 10 fixed to the fixing jig 22,
A load is applied to the split sleeve 10 in the direction of the tapered surface of the pin 20.

【0027】このピン研磨しか施さなかった割スリーブ
10は内周面12の真円度が悪く、接続損失の平均値も
悪い。内周面12の真円度が悪くなる理由は、割スリー
ブ10に荷重をかけるときにピンに対して完全な平行な
荷重にならないために偏心した分が割スリーブの内周面
12の真円度に影響を与えているからである。
The split sleeve 10 polished only by the pin has poor roundness of the inner peripheral surface 12 and poor average connection loss. The reason why the roundness of the inner peripheral surface 12 is deteriorated is that when a load is applied to the split sleeve 10, the load is not completely parallel to the pin, so that the eccentricity is equal to the roundness of the inner peripheral surface 12 of the split sleeve. It is affecting the degree.

【0028】これに対し、本発明の内周面の加工方法で
は、内周面12をまず図4(a)に示すホーニング加工
で荒研磨した後、図4(b)に示すピン研磨で最終仕上
げ加工を行なうことによって、内周面の真円度、内周面
の円筒度共に1μm以下となり、接続損失を顕著に小さ
く出来るのである。
On the other hand, in the inner peripheral surface processing method of the present invention, the inner peripheral surface 12 is first roughly polished by honing shown in FIG. By performing the finishing, both the roundness of the inner peripheral surface and the cylindricity of the inner peripheral surface become 1 μm or less, and the connection loss can be significantly reduced.

【0029】本発明の加工方法は、一例であり、セラミ
ックス以外では、平板を精密プレス加工で曲げて成形す
るりん青銅割スリーブ、又は精密射出成形で成形するプ
ラスチックス製割スリーブにおいても、上記寸法精度が
得られるのであればいかなる方法でも、同等の効果を奏
することができる。
The processing method of the present invention is an example. In addition to ceramics, the above-described dimensions can be applied to a phosphor bronze split sleeve formed by bending a flat plate by precision press working or a plastics split sleeve formed by precision injection molding. The same effect can be obtained by any method as long as accuracy can be obtained.

【0030】次に割スリーブ10の内周面12と外周面
13の同心度を10μm以下にする加工方法は、内周面
12に棒状の金属ピンを入れて、該金属ピンの外周面を
基準に割スリーブ10の外周面13外径を削ることによ
り達成される。
Next, in a processing method for setting the concentricity of the inner peripheral surface 12 and the outer peripheral surface 13 of the split sleeve 10 to 10 μm or less, a rod-shaped metal pin is inserted into the inner peripheral surface 12 and the outer peripheral surface of the metal pin is used as a reference. This is achieved by cutting the outer diameter of the outer peripheral surface 13 of the split sleeve 10.

【0031】又、内周面12の表面粗さをRmax0.
5μm以下にする方法は、内周面12の最終加工である
ピン研磨において、ダイヤモンド砥粒21の平均粒径を
1〜2μmとすることにより達成される。
The inner surface 12 has a surface roughness Rmax0.
The method of reducing the diameter to 5 μm or less is achieved by setting the average particle diameter of the diamond abrasive grains 21 to 1 to 2 μm in the pin polishing as the final processing of the inner peripheral surface 12.

【0032】[0032]

【実施例】ここで、以下に示す方法で実験を行った。EXAMPLE Here, an experiment was conducted by the following method.

【0033】本発明実施例として、内周面を図4(a)
に示すホーニング加工で荒研磨をした後、図4(b)に
示すピン研磨で最終仕上げ加工したジルコニア製割スリ
ーブを用意し、比較例として従来のホーニング加工のみ
で最終仕上げしたジルコニア製割スリーブ、及びピン研
磨のみで最終研磨したジルコニア製割スリーブを用意し
た。
As an embodiment of the present invention, the inner peripheral surface is shown in FIG.
After rough polishing by honing shown in FIG. 4, a split sleeve made of zirconia, which is finally finished by pin polishing shown in FIG. 4B, is prepared. As a comparative example, a split sleeve made of zirconia, which is finally finished only by the conventional honing, And a zirconia split sleeve that was finally polished only by pin polishing was prepared.

【0034】3種類の割スリーブは共に内径は2.49
3mm、外径は3.2mm、長さは11.4mmであ
り、各100個作成し、その内周面12の真円度、内周
面12の真直度、内外周面同心度、内周面の表面粗さ及
び接続損失を測定した。内周面の真円度、内周面の真直
度、内外周面同心度、内周面の表面粗さについてはその
最大値を算出し、接続損失はその平均値を算出した。
The inside diameter of each of the three types of split sleeves is 2.49.
3 mm, outer diameter is 3.2 mm, length is 11.4 mm, 100 pieces are prepared for each, and the roundness of the inner circumferential surface 12, the straightness of the inner circumferential surface 12, the concentricity of the inner and outer circumferential surfaces, the inner circumference The surface roughness and connection loss of the surface were measured. The maximum value was calculated for the roundness of the inner peripheral surface, the straightness of the inner peripheral surface, the concentricity of the inner and outer peripheral surfaces, and the surface roughness of the inner peripheral surface, and the average value was calculated for the connection loss.

【0035】なお、測定に使用した光ファイバを挿通し
たフェルールは光ファイバのコア部とフェルールの外周
面の同心度が0に設定してあるものを使用した。
As the ferrule into which the optical fiber used for the measurement was inserted, the ferrule in which the concentricity between the core portion of the optical fiber and the outer peripheral surface of the ferrule was set to 0 was used.

【0036】その結果を表1に示す。この様に従来のホ
ーニング加工のみで最終仕上げまで行った割スリーブは
内周面の真直度が悪く、接続損失の平均値も悪い。又、
従来のピン研磨のみで荒研磨から最終研磨までした割ス
リーブでは内周面の真円度が悪く、接続損失の平均値も
悪い。
Table 1 shows the results. As described above, the split sleeve which has been processed to the final finish only by the conventional honing process has a poor straightness of the inner peripheral surface and a poor average value of connection loss. or,
In the case of the split sleeve which has been performed from rough polishing to final polishing only by conventional pin polishing, the roundness of the inner peripheral surface is poor, and the average value of connection loss is also poor.

【0037】これに対し、本発明では内周面の真円度、
内周面の円筒度共に1μm以下であり、接続損失の平均
値も顕著に小さく良好な値となっている。
On the other hand, in the present invention, the roundness of the inner peripheral surface,
Both the cylindricity of the inner peripheral surface is 1 μm or less, and the average value of the connection loss is remarkably small and a good value.

【0038】[0038]

【表1】 [Table 1]

【0039】次に上記3種類の割スリーブの接続損失の
分布状態を図5に示す。
FIG. 5 shows the distribution of connection loss of the above three types of split sleeves.

【0040】この様に、ホーニング加工のみの割スリー
ブ及びピン研磨加工のみの割スリーブは、接続損失値の
平均値が大きくしかもバラツキが大きいのに対し、本発
明の割スリーブは接続損失の平均値が小さいことと共に
そのバラツキも小さいことが確認できる。
As described above, the split sleeve of only the honing process and the split sleeve of only the pin polishing process have a large splice loss value and a large variation, whereas the split sleeve of the present invention has an average splice loss value. It can be confirmed that the variation is small as well as small.

【0041】従って、円筒体の長手方向にスリットを設
けた光通信用割スリーブの内周面をホーニング加工で荒
研磨をした後、ピン研磨で最終仕上げ加工することによ
り、内周面の真円度及び内周面の真直度共に小さくする
ことができ、光学特性として最も重要な接続損失値に優
れた効果が得られた。
Therefore, after the inner peripheral surface of the optical communication split sleeve provided with a slit in the longitudinal direction of the cylindrical body is roughly polished by honing, and finally finished by pin polishing, the inner peripheral surface is perfectly round. Both the degree and the straightness of the inner peripheral surface can be reduced, and an excellent effect on the connection loss value, which is the most important optical characteristic, can be obtained.

【0042】[0042]

【発明の効果】このように、本発明によれば、円筒体の
長手方向にスリットを設けた光通信用割スリーブにおい
て、内周面の真円度を1μm以下、かつ内周面の長手方
向の真直度を1μm以下としたことによって、接続損失
を小さく、かつそのバラツキも小さくすることが出来
る。
As described above, according to the present invention, in an optical communication split sleeve provided with a slit in the longitudinal direction of a cylindrical body, the roundness of the inner peripheral surface is 1 μm or less, and the longitudinal direction of the inner peripheral surface is reduced. By setting the straightness to 1 μm or less, the connection loss can be reduced and the variation thereof can be reduced.

【0043】また、その内周面の加工方法は、ホーニン
グ加工で荒研磨をした後、ピン研磨で最終仕上げ加工を
施したことによって、上記のような面精度の割スリーブ
を容易に得られる。
Further, the inner peripheral surface can be processed by rough finishing by honing and then by final finishing by pin polishing, whereby the split sleeve having the above surface accuracy can be easily obtained.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の光通信用割スリーブを示す断面図であ
る。
FIG. 1 is a sectional view showing an optical communication split sleeve of the present invention.

【図2】本発明の光通信用割スリーブを示す斜視図であ
る。
FIG. 2 is a perspective view showing an optical communication split sleeve of the present invention.

【図3】光ファイバ同士を接続する一般的な光コネクタ
の構造を示す断面図である。
FIG. 3 is a cross-sectional view showing a structure of a general optical connector for connecting optical fibers to each other.

【図4】(a)はピン研磨を示す概念図、(b)はホー
ニング加工を示す概念図である。
FIG. 4A is a conceptual diagram illustrating pin polishing, and FIG. 4B is a conceptual diagram illustrating honing processing.

【図5】本発明および比較例の光通信用割スリーブを用
いた光コネクタの接続損失の分布状態を示すグラフであ
る。
FIG. 5 is a graph showing a distribution state of connection loss of an optical connector using the optical communication split sleeve of the present invention and a comparative example.

【符号の説明】[Explanation of symbols]

10:割スリーブ 11:スリット 12:内周面 13:外周面 t:肉厚 20:ピン 21:ダイヤモンド砥粒 22:固定冶具 30:ホーン 31:ダイヤモンド砥石 32:固定冶具 40:光ファイバ 41:フェルール 10: split sleeve 11: slit 12: inner peripheral surface 13: outer peripheral surface t: wall thickness 20: pin 21: diamond abrasive grain 22: fixing jig 30: horn 31: diamond grinding stone 32: fixing jig 40: optical fiber 41: ferrule

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】円筒体の長手方向にスリットを設けた光通
信用割スリーブにおいて、内周面の真円度を1μm以
下、かつ内周面の長手方向の真直度を1μm以下とした
ことを特徴とする光通信用割スリーブ。
1. An optical communication split sleeve provided with a slit in a longitudinal direction of a cylindrical body, wherein an inner peripheral surface has a roundness of 1 μm or less, and an inner peripheral surface has a longitudinal straightness of 1 μm or less. Characteristic split sleeve for optical communication.
【請求項2】外周面と内周面との同心度を10μm以
下、かつ内周面の表面粗さをRmax0.5μm以下とし
たことを特徴とする請求項1記載の光通信用割スリー
ブ。
2. The split sleeve for optical communication according to claim 1, wherein the concentricity between the outer peripheral surface and the inner peripheral surface is 10 μm or less, and the surface roughness of the inner peripheral surface is Rmax 0.5 μm or less.
【請求項3】円筒体の長手方向にスリットを設けた光通
信用割スリーブにおいて、内周面をホーニング加工で荒
研磨をした後、ピン研磨で最終仕上げ加工を施すことを
特徴とする光通信用割スリーブの製造方法。
3. An optical communication split sleeve in which a slit is provided in a longitudinal direction of a cylindrical body, wherein the inner peripheral surface is roughly polished by honing and then subjected to final finishing by pin polishing. Method of manufacturing split sleeve.
JP26637199A 1999-09-20 1999-09-20 Slit sleeve for optical communication and its manufacturing method Pending JP2001091783A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP26637199A JP2001091783A (en) 1999-09-20 1999-09-20 Slit sleeve for optical communication and its manufacturing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP26637199A JP2001091783A (en) 1999-09-20 1999-09-20 Slit sleeve for optical communication and its manufacturing method

Publications (1)

Publication Number Publication Date
JP2001091783A true JP2001091783A (en) 2001-04-06

Family

ID=17430022

Family Applications (1)

Application Number Title Priority Date Filing Date
JP26637199A Pending JP2001091783A (en) 1999-09-20 1999-09-20 Slit sleeve for optical communication and its manufacturing method

Country Status (1)

Country Link
JP (1) JP2001091783A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1961504A2 (en) * 2002-08-16 2008-08-27 Nanoprecision Products, Inc. Process for producing high precision optoelectronic components
WO2013183296A1 (en) 2012-06-07 2013-12-12 アダマンド工業株式会社 Sleeve for optical communication, and method for manufacture for same sleeve for optical communication

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1961504A2 (en) * 2002-08-16 2008-08-27 Nanoprecision Products, Inc. Process for producing high precision optoelectronic components
JP2010244073A (en) * 2002-08-16 2010-10-28 Nanoprecision Products Inc High precision optoelectronic components
WO2013183296A1 (en) 2012-06-07 2013-12-12 アダマンド工業株式会社 Sleeve for optical communication, and method for manufacture for same sleeve for optical communication
EP2860559A4 (en) * 2012-06-07 2016-03-02 Adamant Co Ltd Sleeve for optical communication, and method for manufacture for same sleeve for optical communication
US9477048B2 (en) 2012-06-07 2016-10-25 Adamant Co., Ltd. Sleeve for optical communication and method of manufacturing the sleeve for optical communication

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