JP2001081591A - Starting sheet automatic stripping method and device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method and a device for automatically striping a starting sheet firmly adhered to a base sheet without any manual work. SOLUTION: In a stage in which a starting sheet of an electrodeposition metal is peeled from a base sheet, a part of an insulating protector fitted to the end part of the base sheet is detached, the base sheet is fixed to a fixed position, thereafter, at the position of the detached part in the insulating protector, a chisel is inserted into the space between the base sheet and the starting sheet, the end edge part of the starting sheet is separated from the base sheet to make an opened state, thereafter, plural vacuum adsorption pads 51 are applied on the starting sheet, and the vacuum adsorption pads 51 are moved in the peeling direction of the starting sheet, by which the starting sheet is peeled from the base sheet.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a technique for automatically peeling an electrodeposited metal, that is, a seed plate from a mother plate as a cathode plate in electrolytic refining and electrowinning of a metal.

[0002]

2. Description of the Related Art Conventionally, various types of seed plate peeling machines of this type have been developed and put into practical use. However, when the seed plate adheres firmly to the mother plate, the seed plate peeling machine is removed. Since it is difficult to peel off with a removing machine, a method of peeling off one by one manually has been adopted.

For example, in the nickel refining process, the electrowinning method using a chloride bath has remarkably large electrodeposition stress as compared with copper electrolysis or the like, so that the seed plate precipitated during electrolysis is not peeled off from the mother plate. The surface of the mother plate is intentionally made rough to mechanically increase the adhesive force.

[0004]

As a method of peeling the seed plate in such a state, a boundary (edge) of the seed plate deposited is used.
Inserting a wedge-shaped tool (chisel blade) between the seed plate and the base plate by hand from one end of the plate, raising the seed plate, holding both ends of the seed plate with both hands, and peeling the seed plate from the base plate However, according to such work, the work efficiency is poor, the burden on the worker is large, and there is a problem in terms of safety.

Further, since the liquid level in the electrolytic cell is constantly changing, the thickness of the upper part of the deposited seed plate is extremely thin.
Furthermore, since irregular edges are formed, it is difficult to peel off, and it is very difficult to insert a tool (chisel blade) from a thin portion at the top.

Accordingly, it is an object of the present invention to provide a method and apparatus for automatically peeling off a seed plate firmly attached to a mother plate without manual intervention.

[0007]

SUMMARY OF THE INVENTION In view of the above-mentioned object, the present invention provides a method of making a part of an insulating protector movable, and removing the movable insulating protector from a mother plate, thereby obtaining an edge portion of a seed plate. Is exposed from the surface of the motherboard, a chisel blade is inserted between the exposed motherboard and the motherboard, and the edge of the motherboard is separated from the motherboard to form a mouth open state. Apply the vacuum suction pad, move the suction pad in the direction of peeling of the seed plate, and proceed with the peeling position of the seed plate sequentially from the mouth opening side and peel it off step by step, so that even in a strong electrodeposition state, The seed plate can be peeled off mechanically.

[0008] More specifically, in the method for automatically peeling a seed plate of the present invention, in the step of peeling an electrodeposited metal seed plate from a mother plate, a part of an insulating protector attached to an end of the mother plate is removed. After removing and fixing the mother plate in place, insert a chis blade between the mother plate and the seed plate at the position of the removed insulation protector, and separate the edge of the seed plate from the mother plate. Then, the seed plate is peeled off from the mother plate by applying a plurality of vacuum suction pads to the seed plate and moving the vacuum suction pad in the peeling direction of the seed plate.

Further, the method for automatically peeling off a seed plate according to the present invention comprises:
In the process of peeling the seed plate from the mother plate with the vacuum suction pad,
Two stages, primary peeling in which the vacuum suction pad is moved in the direction of peeling the seed plate with respect to the mother plate, and secondary peeling by tilting the vacuum suction pad in the peeling direction with the lower part of the mother plate as a fulcrum. This prevents the mother plate from rising during peeling.

Further, in the first peeling, the movement of the vacuum suction pad in the peeling direction close to the opening position of the seed plate precedes the movement of the other vacuum suction pad in the peeling direction, and the peeling of the seed plate is opened. Proceed sequentially from the position.

The seed plate automatic peeling apparatus of the present invention is based on the above-mentioned automatic seed plate peeling method. In the step of peeling the electrodeposited metal seed plate from the mother plate, it is attached to an end of the mother plate. Insulation protector removal device for removing a part of the insulation protector that has been removed, and the edge of the seed plate inserted between the mother plate and the seed plate fixed in place at the position of the removed insulation protector And a seed plate stripping device having a plurality of vacuum suction pads for adsorbing the seed plate and moving the seed plate in the stripping direction by adsorbing the seed plate and opening the seed plate in a mouth-open state apart from the mother plate.

[0012] A part of the above-mentioned insulating protector is rotatably supported by a pin with respect to the mother plate. The insulating protector removing device includes a detachable pusher for pushing an upper part of the detachable insulating protector in a detaching direction, and It consists of an openable and closable removal hook that pulls the lower part of the insulation protector in the removal direction.

[0013] A seed plate peeling device is a tilting arm that supports a plurality of vacuum suction pads and is tiltable by a lower fulcrum pin, an auxiliary arm that is tiltable about a lower fulcrum shaft, and this auxiliary arm. And a arm driving cylinder for reciprocatingly rotating the tilting arm and the auxiliary arm in the tilting direction.

Further, other seed plate automatic peeling devices include an insulation protector removing device, a seed plate peeling device,
It is composed of an insulation protector holder for moving the detached insulation protector in the closing direction, and an insulation protector insertion device including means for driving the insulation protector holder in the closing direction.

[0015]

FIG. 1 shows a mother plate 1. The mother plate 1 is connected to the beam 2 at an upper portion, and includes an electrically insulating insulating protector 3 at left, right, and lower edge portions. A part of the insulation protector 3, for example, one upper part,
The detachable insulating protector 4 is separated from other insulating protectors 3. The detachable insulating protector 4 is rotatably supported by the upper pin 5.

In the electrolysis process, a metal is electrodeposited on the base plate 1 as an electrode plate, and seed plates 6 indicated by hatching are formed on both surfaces of the base plate 1. In this electrolysis process, the insulation protector 3,
Seed plate 6 is not formed in the portion where 4 exists. Therefore, by pressing the upper part of the detachable insulating protector 4 in the direction of the arrow and pulling the lower part in the direction of the arrow, the insulating protector 4 is detached from the mother plate 1, whereby the edge of the seed plate 6 At the position where the insulation protector 4 is removed,
It is exposed from the surface of the mother plate 1 and is in a state where it is easily peeled off by the chis blade 41 described later.

Next, FIG. 2 shows a seed plate automatic peeling device 7.
3 to FIG. 22 and FIG.
Indicates each part of the seed plate automatic peeling device 7.

In FIGS. 2, 3 and 4, the mother plate 1
Are fed into the motherboard carrying-in stock conveyor 8 by a ceiling crane (not shown) as a set of about 50 sheets at a pitch of about 55 mm. A large number of the loaded motherboards 1 are sent to the vicinity of a lifting device 10 at the end position of the motherboard loading stock conveyor 8 by the movement of the motherboard loading stock conveyor 8 by the driving device 9.

The lifting device 10 transfers one mother plate 1 by rotating an L-shaped lever 12 by a hydraulic cylinder 11 and raising a lifting slider 14 along an inclined slide bar 13. It is lifted to a position where it can be delivered by the device 15.

The transfer device 15 is driven by a transfer hook 18 at the tip of a pair of rotary arms 17 which are rotated by a drive device 16.
At a position rotated by approximately 135 degrees, and passes the received motherboard 1 to the two horizontal feeding hooks 20 of the horizontal feeding conveyor 19.

FIGS. 2, 5 and 6 show the traverse conveyor 19. The traverse conveyor 19 is constituted by a trolley conveyor,
It is provided from the delivery position to the discharge position of the mother plate 1 and is driven by the driving device 21 to
The base plate 1 hung by 0 is moved at a predetermined pitch in a direction parallel to the plane.

At the position where the base plate 1 is lifted / transferred, the base plate 1 suspended by the horizontal conveyor 19
It faces the insulation protector removal device 22. The insulation protector removal device 22 is shown in FIGS. 5, 6, 7, 8, and 9.

First, the insulation protector removal device 22
As shown in FIGS. 5 and 6, the removal stopper 23 is protruded into the transport path of the motherboard 1 by a cylinder or the like, and the removal stopper 23 is applied to the front end of the motherboard 1 in the forward direction in the transport direction. And as shown in FIG.
7, the slide base 26 is moved in the direction of the transport path, and the mother plate holder 28 is brought into contact with the mother plate 1 by the cylinder 29. By being sandwiched, the mother plate 1 is fixed in a position where the insulating protector 4 is removed.

Thereafter, the insulation protector removal device 2
2, as shown in FIGS. 7, 8 and 9, the slide plate 32 integrated with the guide shaft 39 is brought closer to the base plate 1 by operating the cylinder 33, and the cylinder 35 on the slide plate 32 is operated. The lower portion of the detachable insulating protector 4 is hooked by a pair of detaching hooks 34. Note that the pair of removal hooks 34 is
8 linked to open and close.

In this state, the cylinder 33 rotates the detachable insulating protector 4 in the detaching direction by retracting the detaching hook 34. At the same time, the cylinder 37 on the slide plate 32 pushes the upper part of the detachable insulating protector 4 by the detachment pusher 36 to assist the detachment of the detachable insulating protector 4 by rotation.

As a result, the detachable insulating protector 4 is rotated about the pin 5 as a fulcrum, and is brought up. As a result of this removal step, the edge of the seed plate 6 is exposed from the surface of the mother plate 1 and is ready to be peeled off by the chis blade 41 at this position.

With the insulating protector 4 removed, the mother plate 1 is fed by one pitch by the horizontal feed conveyor 19, and in addition to FIG. 2, as shown in FIGS. Sent to In this feeding process, the mother plate 1 passes between a pair of left and right chis blades 41 in the feeding direction and a pair of front and rear stripping clamps 42 in the feeding direction and hits the mother plate stopper 45 and stops. In addition, the base plate stopper 45
Are driven by the cylinder 46 and protrude into the passage of the mother plate 1. Thereafter, the cylinder 43 fixes the mother plate 1 by closing the pair of stripping clamps 42, and the moving means such as a cylinder (not shown) moves the beam presser 47 onto the beam 2 to make contact therewith. This prevents the mother plate 1 from rising (upward).

Thereafter, the chis blade pushing cylinder 49
Moves the pair of chis blades 41 toward the mother plate 1 while keeping the pair of chis blades 41 open. In this process, the chis blade opening / closing cylinder 50
Closes the end of the mother plate 1 at the position of the removed insulating protector 4 by closing the pair of chis blades 41. Thereafter, the chis blade 41 is moved forward by the chis blade pushing cylinder 49 so that the chis blade 41 in the closed state is advanced between the surface of the base plate 1 and the edge of the seed plate 6, that is, the adhesion edge to the base plate 1. The seed plate 6 is peeled from the mother plate 1 by the wedge action of the wedge-shaped chis blade 41 at the position of the detached insulating protector 4, and the end edge of the seed plate 6 is opened.

In the process of inserting the chis blade 41, the chis blade opening / closing cylinder 50 increases the opening amount of the seed plate 6 by gradually opening the pair of chis blades 41. When the seed plate 6 is set in a state in which the seed plate 6 is easily peeled off by this opening, the chis blade pushing cylinder 49 causes the chis blade 41 to retreat. Even if the chis blade 41 is retracted from between the base plate 1 and the seed plate 6, the seed plate 6 maintains the mouth open state due to bending deformation of the material itself.

Thereafter, the seed plate stripping device 40 strips the seed plate 6 by sucking the open seed plate 6 by the plurality of vacuum suction pads 51 and separating the seed plate 6 from the mother plate 1. A plurality of, for example, nine vacuum suction pads 51 are
The tilting arm 52 is supported by a support rod 60 and a spring 60 a so as to be able to move forward and backward, and is connected to the tip of a drive link 53 by a lower fulcrum pin 54. Of the three upper vacuum suction pads 51, the chis blade 4
The vacuum suction pad 51 close to 1 is attached to the position retracted from the other vacuum suction pads 51 by adjusting the support rod 60 and the spring 60a and adjusting the mounting position, that is, at a small interval to the tilt arm 52,
A step is formed with the position where the other vacuum suction pad 51 is mounted.

A fulcrum shaft 55 at the center of the drive link 53 rotatably supports an auxiliary arm 56. A peeling cylinder 57 attached to the tip of the auxiliary arm 56 is a part of a piston rod. To the tip of the tilting arm 52. A pair of fulcrum shafts 5 on both sides of the mother plate 1
The gear 5 is interlocked with the fulcrum shaft 55 so as to perform the same movement by meshing with a gear 59 integral therewith.

The tilting arm 52, the drive link 53, the auxiliary arm 56, and the peeling cylinder 57 constitute a four-node link mechanism on the left and right in the feeding direction of the mother plate 1, and the arm driving cylinder 58 controls the mother member. It is possible to tilt (rotate) between a position where the seed plate 6 of the plate 1 is sucked and a position where the peeled seed plate 6 is transferred to the left and right receiving conveyors 61 in the traveling direction.

When the mother plate 1 is fixed at the stripping position in a positioning state, the arm drive cylinder 58 drives the drive link 53 to bring the tilt arm 52 closer to the direction of the mother plate 1 and the vacuum suction pad 51 Is applied to the seed plate 6 on the surface of the mother plate 1 and is sucked by vacuum suction. When the vacuum suction pad 51 hits the surface of the seed plate 6, each spring 60a contracts, thereby absorbing a difference in the suction position of the vacuum suction pad 51. Thereafter, the peeling cylinder 57 moves the tilting arm 52 to the seed plate 6 in the open state.
The tilting arm 52 is moved backward in a direction away from the mother plate 1.

The tilting arm 52 is supported by a fulcrum pin 54 at a lower position, and while rotating or tilting, the amount of movement on the side where the seed plate 6 is opened is increased.
The vacuum suction pad 51 is retracted so that the peeling position is sequentially advanced from the opening side. Therefore, the seed plate 6 is sequentially separated from the opening side while moving the peeling position downward. This is primary peeling.

As described above, when the vacuum suction pad 51 is pressed against the seed plate 6 of the mother plate 1, the spring 60a is contracted to suck the seed plate 6 with the three vacuum suction pads 51 in the upper stage. Then, the vacuum suction pad 51 close to the chis blade 41 is peeled off by pulling the seed plate 6 from the side that opened before the other vacuum suction pads 51 by the mounting step difference, starting from the opening position. Is performed by primary peeling.

Thereafter, the arm driving cylinder 58 is
Further, by driving the drive link 53, the tilting arm 52 and the auxiliary arm 56 are both moved in the peeling direction, and the seed plate 6 is sequentially peeled downward from the upper opening side in the same manner as described above. . This is secondary peeling.

As described above, the seed plate 6 is peeled off by the primary peeling by rotation of only the tilting arm 52 and the tilting arm 52.
In addition, by the secondary peeling by the rotation of the auxiliary arm 56, the peeling is performed while moving the peeling position downward from the mouth opening side while preventing the mother plate 1 from floating during peeling.

When the tilting arm 52 and the auxiliary arm 56 descend below the upper surface of the receiving conveyor 61, the two seed plates 6 held by the vacuum suction pads 51 are moved to the position shown in FIG.
As shown in FIG. 15 and FIG. 15, both ride on one receiving conveyor 61. Therefore, in this state, the vacuum suction operation by the vacuum suction pad 51 is released. The receiving conveyor 61 is driven by the driving device 62 and moves the two seed plates 6 in the direction of the seed plate unloading conveyor 63 together.

The seed plate carry-out conveyor 63 is, for example, a roller conveyor, and is driven in a carry-out direction by a driving device 64 and has a plurality of correction rollers 65 driven by a driving device 66 at an upper portion thereof. The seed plate 6 is curved in a part of the cylindrical surface by the force in the stripping direction in the stripping process, but the seed plate carry-out conveyor 63 and the straightening roller 65 are curved.
In the process of passing through the space between the two, it becomes substantially flat, and is fed below the seed plate transfer device 67 shown in FIGS.

In the seed plate transfer device 67, the moving holder 6
The suction pad 69 of No. 8 is moved up and down by the cylinder 70 to lift one seed plate 6 on the seed plate unloading conveyor 63, and subsequently, by the horizontal movement of the moving holder 68 by the moving cylinder 71, the transfer position is changed. The seed plate 6 sucked by the suction pad 69 is stored in the lower seed plate pallet 72 by the lowering of the suction pad 69 by the cylinder 70. In addition, the seed plate pallet 7
2 is a pallet loading conveyor 7 as shown in FIG.
3 and stands by at the position of the turntable 74 in a positioning state.

A predetermined number of seed plates 6 are placed on the seed plate pallet 72.
Are stacked, the turntable 74 rotates the seed plate pallet 72 in a predetermined direction, and then sends out the pallet 72 to the pallet unloading conveyor 77. Pallet unloading conveyor 77
Moves the seed plate pallet 72 into the interior of the elevator 79. Here, the elevator 79 conveys the seed plate pallet 72 to a predetermined place.

On the other hand, the stripped mother plate 1 is fed by one pitch by the horizontal feed conveyor 19 to reach the step of inserting the insulating protector 4, and as shown in FIG. 5 and FIG. 2 and is fixed in the positioning state by the insertion portion stopper 82. Here, the insulation protector insertion device 84 is set to the original state by rotating the insulation protector 4 in the open state.

FIGS. 18, 19 and 20 show the insulation protector insertion device 84. FIG. The cylinder 85 of the insulation protector insertion device 84 drives the slider 87,
The roller-shaped insulation protector retainer 86 is raised. Thereafter, the cylinder 88 moves the insulating protector retainer 86 to a position corresponding to the insulating protector 4 by moving the slider 89 forward. Thereafter, the cylinder 90 is connected to the insulation protector holder 86 by the insulation protector 4.
In the direction approaching the
Is brought into contact with the insulating protector 4.

In this state, the cylinder 85 lowers the insulating protector holder 86 along the end surface of the mother plate 1 to rotate the opened (removed) insulating protector 4 about the pin 5 downward. Then, the original mounting state is set by pressing against the end face of the mother plate 1. after this,
The cylinders 85, 88, and 90 prepare for the next operation by returning the insulating protector retainer 86 to its original position as a means for driving the insulating protector 4.

Next, at the insertion position of the insulating protector 4,
As shown in FIG. 21 and FIG.
Is a receiving hook 9 at the tip of the rotating arm 93 driven by the driving device 92 after releasing the clamped state.
At 4, the beam 2 of the mother plate 1 after the insertion of the insulating protector 4 is hooked and received, and it is rotated and transferred to the descending slider 96 of the descending device 95 which is moving up. Descending slider 96
Is moved down along a slide bar 99 by a lever 98 driven by a hydraulic cylinder 97, thereby transferring the beam 2 of the mother plate 1 to the mother plate unloading stock conveyor 10.
Put on 0.

Each time the motherboard 1 arrives, the drive conveyor 101 feeds the motherboard unloading stock conveyor 100 one pitch at a time in the unloading direction.
Are sequentially held. When the peeling of the seed plate 6 from the 50 base plates 1 is completed, the 5
The zero mother plate 1 is transported to the electrolysis process of the seed plate 6 by an overhead crane (not shown) or the like.

As shown in FIG. 2, a spare receiving device 102, a spare lowering device 103, and a spare motherboard unloading stock conveyor 104 are provided at the end position of the traverse conveyor 19 as necessary. Have been. These spare receiving device 102 and spare lowering device 103
The spare motherboard unloading stock conveyor 104 is similar to the receiving device 91, the lowering device 95, and the motherboard unloading stock conveyor 100, and the motherboard 1 taken out by these components is manually operated by a hand push table. It is suspended on a stock table 106 via 105.

The above series of operations is performed by the control device 10 shown in FIG.
Step 7 is performed sequentially under sequence control while confirming the operation of each section.

[0049]

According to the present invention, a part of the insulating protector is movable and can be removed from the motherboard, and when the insulating protector is partially removed, the end of the seed plate is exposed from the surface of the motherboard. , The chis blade can be inserted securely from the exposed part,
In addition, the mouth of the seed plate can be sufficiently opened by the chis blade. Also,
Since the seed plate in the opened state is sucked to the mother plate by the vacuum suction pad, the seed plate can be peeled off from the opening side by the primary peeling, and the seed plate can be completely peeled off by the secondary peeling. During the stripping process, no excessive force is applied to the seed plate, no large distortion or strong bending occurs, and the seed plate can be sequentially peeled, so that the seed plate can be mechanically and efficiently stripped.

According to the seed plate automatic peeling apparatus of the present invention, the strong electrodeposited seed plate, which has been manually performed so far, can be performed automatically and continuously. Can be done by one person alone, and the processing capacity per unit man-hour increases.

[Brief description of the drawings]

FIG. 1 is a front view of a mother plate 1. FIG.

FIG. 2 is an overall plan view of a seed plate automatic peeling device 7;

FIG. 3 is a stock conveyor 8 carrying a mother plate, and a lifting device 1
FIG.

FIG. 4 is a stock conveyor 8 for carrying in a mother plate, and a lifting device 1
FIG. 2 is a plan view of the transfer device 15 and the transfer device 15.

FIG. 5 is a plan view of the traverse conveyor 19;

FIG. 6 is a front view of the horizontal feed conveyor 19.

FIG. 7 is a plan view of the insulation protector removal device 22.

FIG. 8 is a sectional view of the insulation protector removal device 22.

9 is a plan view of the detachment clamp 30. FIG.

10 is a plan view of the seed plate stripping device 40. FIG.

11 is a front view of the seed plate stripping device 40. FIG.

12 is a side view of the seed plate stripping device 40. FIG.

13 is a front view of the mother plate stopper 45. FIG.

FIG. 14: Receiving conveyor 61 and seed plate unloading conveyor 6
3 is a plan view of FIG.

FIG. 15: Receiving conveyor 61 and seed plate unloading conveyor 6
It is a side view of No. 3.

FIG. 16 is a plan view of a seed plate transfer device 67.

17 is a side view of the seed plate transfer device 67. FIG.

FIG. 18 is a partially cutaway plan view of the insulation protector insertion device 84.

FIG. 19 is a side view of the insulation protector insertion device 84.

20 is a rear view of the insulation protector insertion device 84. FIG.

21 is a front view of a receiving device 91, a descending device 95, and a motherboard unloading stock conveyor 100. FIG.

FIG. 22 is a side view of the receiving device 91, the descending device 95, and the motherboard unloading stock conveyor 100.

[Explanation of symbols]

REFERENCE SIGNS LIST 1 mother plate 2 beam 3 insulating protector 4 removable insulating protector 5 pin 6 seed plate 7 seed plate automatic peeling device 8 mother plate loading stock conveyor 9 drive device 10 lifting device 11 hydraulic cylinder 12 lever 13 slide bar 14 lifting slider 15 Delivery device 16 Drive device 17 Rotating arm 18 Delivery hook 19 Lateral feed conveyor 20 Lateral feed hook 21 Drive device 22 Insulation protector removal device 23 Removal stopper 26 Slide base 27 Cylinder 28 Mother plate holder 29 Cylinder 30 Removal clamp 32 Slide plate 33 Cylinder 34 Removal hook 35 Cylinder 36 Removal pusher 37 Cylinder 38 Gear 39 Guide shaft 40 Seed plate stripping device 41 Chis blade 42 Stripping clamp 43 Linder 45 Mother plate stopper 46 Cylinder 47 Beam press 49 Chis blade pushing cylinder 50 Chis blade opening / closing cylinder 51 Vacuum suction pad 52 Tilting arm 53 Drive link 54 Support pin 55 Support shaft 56 Auxiliary arm 57 Stripping cylinder 58 Arm drive cylinder 59 Gear Reference Signs List 60 Support rod 60a Spring 61 Receiving conveyor 62 Drive device 63 Seed plate unloading conveyor 64 Drive device 65 Straightening roller 66 Drive device 67 Seed plate transfer device 68 Moving holder 69 Suction pad 70 Cylinder 71 Moving cylinder 72 Seed plate pallet 73 Pallet carrying conveyor 74 Turntable 77 Pallet unloading conveyor 79 Elevator 80 Beam stopper 82 Insertion part stopper 84 Insulation protector insertion device 85 Cylinder 86 Insulation protector holder 87 Slider 88 Cylinder 89 Slider 90 Cylinder 91 Receiving device 92 Drive device 93 Rotating arm 94 Receiving hook 95 Lowering device 96 Lowering slider 97 Hydraulic cylinder 98 Lever 99 Slide bar 100 Mother plate unloading stock conveyor 101 Driving device 102 Spare receiving device 103 Spare Lowering device 104 Spare mother plate unloading stock conveyor 105 Hand push table 106 Stock table 107 Control device

────────────────────────────────────────────────── ───

[Procedure amendment]

[Submission date] January 19, 2000 (2000.1.1)
9)

[Procedure amendment 1]

[Document name to be amended] Statement

[Correction target item name] 0012

[Correction method] Change

[Correction contents]

A part of the insulating protector is rotatably supported by a pin with respect to the mother plate, and the detaching device for detaching the insulating protector presses the upper part of the detachable insulating protector in a direction opposite to the detaching direction. It consists of a pusher and an openable and closable removal hook for pulling the lower part of the insulation protector in the removal direction.

[Procedure amendment 2]

[Document name to be amended] Statement

[Correction target item name] 0014

[Correction method] Change

[Correction contents]

Furthermore, this seed plate automatic peeling device includes an insulating protector removing device, a seed plate peeling device,
It is composed of an insulation protector holder for moving the detached insulation protector in the closing direction, and an insulation protector insertion device including means for driving the insulation protector holder in the closing direction.

[Procedure amendment 3]

[Document name to be amended] Statement

[Correction target item name] 0026

[Correction method] Change

[Correction contents]

As a result, the detachable insulating protector 4 is rotated about the pin 5 as a fulcrum, and is brought up. As a result of this removal step, the edge of the seed plate 6 is exposed from the surface of the mother plate 1, and can be peeled off by inserting the chis blade 41 at this position.

[Procedure amendment 4]

[Document name to be amended] Statement

[Correction target item name] 0042

[Correction method] Change

[Correction contents]

On the other hand, the stripped mother plate 1 is fed by one pitch by the horizontal feed conveyor 19 to reach the step of inserting the insulating protector 4, and as shown in FIG. 5 and FIG. 2 and is fixed in the positioning state by the insertion portion stopper 82. Here, the insulating protector insertion device 84, by rotating the insulating protector 4 in an open state, inserted into the original state.

[Procedure amendment 5]

[Document name to be amended] Statement

[Correction target item name] 0044

[Correction method] Change

[Correction contents]

In this state, the cylinder 85 lowers the insulating protector holder 86 along the end face of the mother plate 1 to rotate the insulating protector 4 in the opened (removed) state downward about the pin 5. Then, it is pressed against the end face of the mother plate 1 and inserted into the original mounting state. after this,
The cylinders 85, 88, and 90 prepare for the next operation by returning the insulating protector retainer 86 to its original position as a means for driving the insulating protector 4.

[Procedure amendment 6]

[Document name to be amended] Statement

[Correction target item name] 0046

[Correction method] Change

[Correction contents]

The motherboard unloading stock conveyor 100 is sent by the drive unit 101 one pitch at a time in the unloading direction each time the motherboard 1 arrives, and sequentially holds approximately 50 motherboards 1 as one work unit. When the peeling of the seed plates 6 from the approximately 50 mother plates 1 is completed, a set of approximately 50 mother plates 1 of the mother plate unloading stock conveyor 100 is subjected to the electrolytic process of the seed plates 6 by a ceiling crane (not shown) or the like. Conveyed.

[Procedure amendment 7]

[Document name to be amended] Statement

[Correction target item name] Fig. 9

[Correction method] Change

[Correction contents]

FIG. 9 is a plan view of the detachment hook 34 ;

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Kazuyuki Kondo 3-5-3 Nishiharacho, Niihama-city, Ehime Prefecture In the Besshi Works of Sumitomo Metal Mining Co., Ltd. (72) Inventor Fumitoshi Nagai 3 Nishiharacho, Niihama-city, Ehime Prefecture −5-3 Sumitomo Metal Mining Co., Ltd. Besshi Office (72) Inventor Nobumasa Iemori 3-5-3 Nishiharacho, Niihama-shi, Ehime Prefecture Sumitomo Metal Mining Co., Ltd. Besshi Office F-term (reference) 4K058 AA13 BB03 BB04 FA04 FA06 FA08

Claims (7)

[Claims] In a step of peeling an electrodeposited metal seed plate from a mother plate, a part of an insulating protector attached to an end of the mother plate is removed, and the mother plate is fixed to a fixed position and then removed. At the position of some of the insulation protectors, insert a chiss blade between the mother plate and the seed plate to separate the edge of the seed plate from the mother plate to open the mouth, and then apply multiple vacuums to the seed plate. A seed plate automatic stripping method, wherein a seed plate is stripped from a mother plate by applying a suction pad and moving the vacuum suction pad in a stripping direction of the seed plate. 2. In the process of peeling a seed plate from a mother plate by a vacuum suction pad, primary peeling in which the vacuum suction pad is moved relative to the mother plate in a direction of peeling the seed plate, and a fulcrum below the mother plate. Due to tilting of the vacuum suction pad in the stripping direction
2. The method for automatically removing a seed plate according to claim 1, wherein the separation of the mother plate at the time of peeling is prevented by dividing into two steps of the next peeling. 3. In the stage of primary peeling, the movement of the vacuum suction pad in the peeling direction close to the opening position of the seed plate precedes the movement of the other vacuum suction pad in the peeling direction, and the peeling of the seed plate is performed. 3. The method for automatically peeling a seed plate according to claim 1 or 2, wherein the method is sequentially advanced from an opening position. 4. An insulating protector removal device for removing a part of an insulating protector attached to an end of a mother plate in a step of separating a seed plate of electrodeposited metal from the mother plate,
Chis blade and seed plate that are inserted between the mother plate and the seed plate fixed in place at the position of the removed part of the insulating protector and open the edge of the seed plate apart from the mother plate A seed plate stripping device having a plurality of vacuum suction pads for adsorbing on a seed plate and moving the seed plate in a stripping direction. 5. A detachable pusher for rotatably supporting a part of an insulating protector with respect to a mother plate by a pin and pushing an upper part of the detachable insulating protector in a detaching direction. 5. The automatic peeling device for a seed plate according to claim 4, wherein the lower portion is constituted by a detachable hook that can be opened and closed to pull in a detaching direction. 6. A tilting arm that supports a plurality of vacuum suction pads and can tilt with a lower fulcrum pin, an auxiliary arm that can tilt with a lower fulcrum shaft as a center,
A peeling cylinder attached to the auxiliary arm for moving the tilting arm in the direction of stripping the seed plate, and an arm driving cylinder for reciprocatingly rotating the tilting arm and the auxiliary arm in the tilting direction. The seed plate automatic peeling device according to claim 4. 7. An insulating protector removing device for removing a part of an insulating protector attached to an end of a mother plate in a step of separating an electrodeposited metal seed plate from the mother plate.
Chis blade and seed plate that are inserted between the mother plate and the seed plate fixed in place at the position of the removed part of the insulating protector and open the edge of the seed plate apart from the mother plate A seed plate stripping device having a plurality of vacuum suction pads for sucking and moving a seed plate in a stripping direction, and an insulating protector presser for moving the detached insulating protector in a closing direction,
And an insulating protector insertion device comprising means for driving the insulating protector retainer in the closing direction.