JP2001068819A - Judging method of defective printed board and mark used therefor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To efficiently judge whether a printed board is defective or not in a manufacturing process and to quickly feed back data on a defective printed board to a production line, by a method wherein the conduction of a check record mark composed of through-hole patterns provided to the outer layer of the printed board and surface patterns which electrically connect the through- hole patterns is measured. SOLUTION: A check record mark 10 is composed of round lands 1 (1a, 1b, 1c, and 1d) formed of through holes pattern formed in blind holes which partially penetrate an insulating layer 5 including an adhesive layer or through holes penetrating through a waste part of a board, and surface patterns 2a, 2b, and 2c which are provided along a prescribed insulating layer 5 so as to electrically connect the adjacent round lands 1 together. The conduction of the check record mark 10 formed on the outer layer of the waste part of a board is measured. At this time, the surface configuration of a drill hole of a drill pit used when through holes are bored in a wiring layer is also tested.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for detecting defective products in a printed circuit board manufacturing process with a final electric checker. The present invention relates to a method of determining a failure of a printed circuit board which promptly feeds back to a printed circuit board to prevent the printed circuit board determined to be defective from flowing out, and a mark used for this determination.

[0002]

2. Description of the Related Art As a method of detecting a defective product in a manufacturing process of a printed circuit board manufactured by sequentially stacking an insulating layer and a wiring layer, an electric checker inspection for checking that a circuit net of the wiring layer is properly manufactured is performed. Inspection using a microscope or a magnifying glass or a microscope is generally performed. These tests are
Defective products discovered during the manufacturing process are marked on the surface of the worksheet of the printed circuit board in the worksheet with an oil mark or the like to indicate the defect, or a sticker indicating the defect is attached. The sorting method is adopted.

Further, a method has been adopted in which a hole is formed in a product of a corresponding defective board with a drill or the like, and a final electric checker inspection is performed. In the case of a printed circuit board with a complex outer edge shape, the outer shape punching step of performing the outer shape processing by die punching is often included twice or more, but it is brought into the inspection process without performing all the set outer shape punching In addition, an accident that a defective product flows out due to a leak in the appearance inspection is likely to occur.

[0004]

Defective products discovered in the course of the process are marked with a cross mark or the like using an oil-based marker or the like, or a sticker indicating the defect is attached to a defective portion of the printed circuit board surface in the worksheet. It is sorted at the final appearance inspection. However, such a marking is erased by an oil-based marker through various process histories such as a physical polishing process, a treatment with an acidic or alkaline chemical solution, or an organic solvent in a manufacturing process after the marking. Defective products that do not affect the net of the electric circuit due to peeling or peeling off of the seal may pass the electric checker inspection and the appearance inspection, and may be shipped as non-defective products. Further, even when the process proceeds to the final inspection process with the marks and seals of the oily marker remaining, the marks and seals of the oily marker may be overlooked in the appearance inspection, and an accident of shipping as a non-defective product may occur.

[0005] In addition to the above-described marks and seals using an oil-based marker, a method is also used in which a hole is drilled in a substrate having a defective process and the presence or absence of the drill hole is detected in a final electric checker inspection. In this case, defective products are surely selected in the electric checker inspection, but the result of the electric checker inspection is only "frequent occurrence of open defects", so that the inspection efficiency in the electric checker inspection is significantly reduced. In addition, it is difficult to determine in which manufacturing process the defective product has occurred, and it is not possible to provide quick feedback to the manufacturing process.

On the other hand, a so-called “kit board” for finishing a plurality of printed boards into one kit, for example, five
If one of the printed circuit boards in the kit becomes defective during the process and if a hole is made in the kit board with a drill or the like in order to identify the defective product, open defects occur frequently in the final electrical checker inspection. However, it becomes impossible to determine whether the remaining four units are non-defective. The only way to avoid this is to subject each of the five boards in the kit board to an electrical checker inspection.
Work efficiency is significantly reduced.

[0007] Further, when an outer shape punching process using a mold is included, especially when two or more outer shape punching processes are included, a substrate that has been subjected to a final inspection process without performing a predetermined outer shape punching process is subjected to the electrical inspection. If there are no defective parts in the circuit, the electric checker passes. Such a substrate will be selected as a punched defective product in a subsequent appearance inspection, but it is difficult to completely prevent such defective products from leaking out by a visual inspection.

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems, and it is possible to reliably and efficiently determine a defective product generated in a process of manufacturing a printed circuit board, and to promptly feed back a result of the determination to a manufacturing process. It is an object of the present invention to provide a method for possible defect determination.

[0009]

According to the present invention, there is provided a method for judging a failure of a printed circuit board which is manufactured by sequentially stacking an insulating layer and a wiring layer, wherein the wiring layer is formed by penetrating the insulating layer. A test recording mark composed of a plurality of through-hole patterns and a surface pattern for selectively conducting these through-hole patterns along the insulating layer is formed by a conductor pattern near the wiring layer, and then each wiring layer is inspected. When inspecting each time, when the inspection result is recorded in the inspection item part set in advance on the inspection recording mark corresponding to the inspection item by disconnection of the pattern, and when inspecting the manufactured printed circuit board, By measuring the continuity of the inspection recording mark on the outer layer of the printed circuit board, a method for determining a defect of the printed circuit board which determines the inspection result on the inner wiring layer of the printed circuit board is provided. That.

That is, when forming each wiring layer, the inspection recording mark is formed by a conductor pattern substantially simultaneously with the formation of the wiring layer, and the inspection recording mark is disconnected so that the inspection recording mark is not easily erased. The result is recorded for each inspection item, and the recording of the inspection result of the wiring layer sealed in the inner layer of the printed circuit board can be determined from the inspection recording mark on the outer layer of the printed circuit board using an electric checker. Inspection results are reliably recorded for each inspection item, so that defective products generated in the course of manufacturing a printed circuit board can be reliably sorted out.

The inspection recording mark is formed substantially simultaneously with the formation of the wiring layer, and the inspection recording mark can be inspected using an electric checker used for the inspection of the wiring layer. Can be significantly reduced. Further, by determining the record of the inspection result sealed in the inner layer of the printed circuit board, it is possible to analyze the tendency of failure in each manufacturing process, and the analysis result can be quickly fed back to the manufacturing process. Further, by incorporating the inspection record mark into the net data of the electric checker inspection, it is possible to reliably prevent the outflow of these defective products in the electric checker inspection.

The disconnection of the pattern of the inspection item part in the present invention functions as an inspection recording "mark" to be added on the inspection recording mark in accordance with the inspection result. To judge the mark marked (member) (net data of electric checker inspection)
If a rule of disconnection as a “mark” is set in advance, a portion corresponding to the item of “defective” may be disconnected, or a portion corresponding to the item of “abnormal” may be disconnected. The wire may be disconnected.

[0013] The disconnection of the pattern at the inspection item portion is performed by the drill hole, so that there is no missing such as a mark or a seal by an oily marker, and the disconnection of the pattern is incorporated in the process of forming the wiring layer, so that quick marking is performed. Becomes possible. Furthermore, the drill hole is formed by the drill bit used when forming each wiring layer, and when measuring the conduction of the inspection record mark on the outer layer of the perforated printed circuit board, the surface shape of the drill hole is observed. Thus, a drill hole in the wiring layer can be determined. Thereby, the processing quality of the drill hole in the wiring layer can be determined, and the result can be fed back to the determination of the defect life of the drill bit, the improvement of the material and shape of the drill bit, and the like.

The inspection items according to the present invention include items relating to the steps of forming a plane wiring pattern on an insulating layer, forming through holes, solder resist, symbol printing, external processing, and surface treatment. The inspection item part is preferably specified by an identification pattern provided near the inspection recording mark in the conductor pattern for forming the wiring layer.

The printed circuit board according to the present invention includes a kit board in which a plurality of printed boards are developed into one kit, and an inspection record mark corresponds to each of the printed boards developed in the kit board. It is preferable to form it. As a result, the correspondence between the printed circuit board and the inspection record mark is clarified, and a judgment without error can be made. Since each of the inspection recording marks is formed at the same position in the laminating direction of the insulating layer, a through-hole pattern orthogonal to the substrate surface can be formed as the inspection recording mark, and the accuracy of the electric checker inspection can be improved. Judgment can be made.

According to the present invention, an inspection recording mark for recording an inspection result of a printed board manufactured by sequentially stacking an insulating layer and a wiring layer, wherein the inspection recording mark is:
When forming each wiring layer, a plurality of through-hole patterns penetrating through the insulating layer formed by the conductor pattern near the wiring layer, and a surface pattern that selectively conducts these through-hole patterns along the insulating layer. When the inspection item part corresponding to the inspection item of the wiring layer is set on the inspection recording mark, and the inspection result corresponding to the inspection item after the wiring layer is formed is recorded by disconnection of the pattern of the inspection item part. By measuring the continuity of the inspection recording mark on the outer layer of the manufactured printed board, an inspection recording mark on the printed board that can determine the inspection result on the wiring layer on the inner layer of the printed board is provided.

As a specific example of the inspection recording mark, the through hole pattern is formed of an island-shaped conductor pattern formed at a predetermined interval, and the surface pattern is formed of a linear shape connecting adjacent island-shaped patterns. And a conductor pattern of the following.

According to another aspect of the present invention, there is provided a method for inspecting a contour punching process of a printed circuit board formed by sequentially stacking an insulating layer and a wiring layer, wherein a portion to be punched is formed when forming the wiring layer. The present invention provides a method of determining a printed circuit board defect by forming a punching inspection mark conducting through a conductive pattern on an insulating layer, measuring the continuity of the punching inspection mark after completion of the punching step, and determining a punching defect. . In the present invention, the outer shape punching process of the printed board is performed by punching for forming a perforated separation line for separating the product board from the discarded plate portion, forming a screw hole for fixing the product board, or a part of the product board. Punching for supplementarily correcting the contour of the image.

Further, according to the present invention, there is provided an inspection mark for inspecting a contour punching step of a printed circuit board produced by sequentially stacking an insulating layer and a wiring layer. A conductive mark is formed on the insulating layer so as to be conductive through the hole, and after the punching step is completed, the conductiveness of the test mark is measured to provide a punching test mark for determining a punching defect. As a specific example of the punching inspection mark, a mark formed by passing an intermediate portion through a portion to be punched, for example, a mark formed of a U-shaped conductor pattern can be given.

[0020]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Referring to FIGS.
An embodiment of a method for determining a defect of a printed circuit board according to the present invention and a mark used for the defect determination will be described. First Embodiment First, a method of determining an inspection result regarding an inner wiring layer of a printed circuit board and an example of an inspection recording mark used for this failure determination will be described with reference to FIGS.

In this example, as shown in FIG. 1, an inspection record mark 10 of the present invention is provided on a discard plate portion 25 of a kit plate 30 in which two product substrates 20 are developed on one substrate.
It is set corresponding to each product substrate 20. As shown in the enlarged cross-sectional view of FIG. 2, the kit plate 30 has double-sided core substrates 11, 12, and 13 having conductor layers serving as wiring layers disposed on the front and back surfaces (5-1 to 5-6) of the insulating layer 5. Is a printed circuit board of a 6-wiring-layer specification in which is laminated via insulating adhesive layers 15 and 16. The product substrate 20 is manufactured by a manufacturing process such as formation of a planar wiring pattern, formation of through holes, solder resist, symbol printing, external processing, and surface treatment on the double-sided core base material. The first to sixth wiring layers are formed corresponding to the respective insulating layer surfaces 5-1 to 5-6 in the drawing.

The inspection recording mark 10 is an inspection recording mark for recording the inspection result using the above-described manufacturing process as an inspection item, and is shown in an enlarged sectional view of FIG. 2 and an enlarged plan view of FIG. As described above, at the same time as or before and after the manufacturing process of the product substrate 20, the double-sided core substrate 11 serving as the back surface of the product substrate 20, the internal double-sided core substrate 12, and the double-sided core substrate 13 serving as the front surface are sequentially laminated. Formed.

The inspection recording mark 10 is made of an adhesive layer 15, 1
A plurality of round lands 1 (1 a, 1 b, 1 c, 1 d) comprising through-hole patterns formed partially in the insulating layer 5 including the through holes, that is, blind holes or through-holes penetrating the front and back of the discard plate portion 25. And a surface pattern 2 (2a, 2b, 2c) for making adjacent round lands 1 conductive along a predetermined insulating layer 5. The inspection record mark 10 is formed by etching or the like using the same conductor pattern as that for forming the circuit of the product substrate 20. Note that FIG.
The broken line portion indicates the formation site of each surface pattern 2.

A strip-shaped identification pattern 3 having a predetermined width is formed outside the inspection recording mark 10. The identification pattern 3 has a sharp end 3a having a sharp shape at one end in order to identify each of the round land 1 and the surface pattern 2.
Having. With the sharp end 3a or instead of providing the sharp end 3a, other identification patterns, for example, alphabets "A", "B", "C",
“D” may be sequentially formed by a conductor pattern.

The round lands 1 (1a, 1b, 1c, 1d) and the identification patterns 3 are discarded having the same plane as the plane from the insulating layer surface 5-1 to 5-6 on which the wiring layer of the product substrate 20 is formed. It is formed at the same position on the insulating layer 5 that is formed on a plane from the insulating layer surface 5-1 to 5-6 of the plate portion 25 and completely overlaps in the laminating direction. In the surface pattern 2 (2a, 2b, 2c), the surface pattern 2a is the round lands 1a and 1b, and the surface pattern 2b is the round lands 1b and 1b.
c is set so that the surface pattern 2c connects the round lands 1c and 1d, respectively, and the insulating layer 5 changes the portion where the round lands 1 are connected. In this example, the set portion of the surface pattern 2 is a portion indicated by oblique lines shown in FIG.

That is, the first layer formed on the insulating layer surface 5-1 is set to the round land 1 only (FIG. 4A), and the second layer formed on the insulating layer surface 5-2 is the round land 1 And the setting of the surface pattern 2a [FIG. 4 (b)]. The third layer formed on the insulating layer surface 5-3 is the setting of the round land 1 and the surface pattern 2b [FIG. 4 (c)]. The fourth layer formed on the fourth layer 4 has only the round land 1 (FIG. 4D), and the insulating layer surface 5
The fifth layer formed in -5 is the round land 1 and the surface pattern 2
The setting of c (FIG. 4E) is such that the sixth layer formed on the insulating layer surface 5-6 is the setting of only the round land 1 (FIG. 4F). Note that the outer layer pattern of the inspection recording mark 10,
That is, the first and sixth layers are preferably formed and handled so as not to be covered with a solder resist or the like.

Next, a procedure for recording an inspection result for each inspection item on the inspection recording mark 10 in the course of the manufacturing process will be described. Note that, in this example, the printed circuit board of the final finished product has the round lands 1a to 1b, 1b
1c to 1d are all electrically conductive (1a to 1d are also conductive). When a defect occurs in the manufacturing process of the product substrate 20, an inspection result is recorded in an inspection item portion of the inspection recording mark 10 corresponding to each wiring layer. The inspection item part is a part that is set on the inspection recording mark 10 corresponding to the inspection item of each wiring layer and can be disconnected by a drill hole according to the inspection result.

An example of the inspection item and the inspection item part of the inspection recording mark 10 corresponding to the inspection item is shown below. Defective circuit forming process of first and sixth layers: round land 1c Defective circuit forming process of second layer: central portion of surface pattern 2a Defective circuit forming process of third and fourth layers: surface pattern 2b 5th layer circuit forming process defect: center portion of surface pattern 2c defective through hole drilling process: round land 1b Solder resist or symbol printing defect: round land 1c external processing, surface treatment and other defects : Maru Land 1d

The drill hole used for the disconnection is formed by a drill bit having a diameter slightly larger than the diameter of each round land 1. The above-described inspection item and the inspection item part of the inspection record mark 10 are determined according to the rule of their allocation.
If promised between the inspectors in each manufacturing process, the final electrical checker inspectors and those involved in the manufacturing process,
It may be set arbitrarily. Further, in response to the increase in the number of inspection items, the number of inspection item portions can be increased by setting the inspection item portion to a portion near both ends from the center of the surface pattern 2 or increasing the number of the round lands 1 and the surface pattern 2. In this example, the inspection recording mark 10 having four round lands 1 on a printed circuit board of a 6-layer blind via hole specification is used.
Is set, but the round lands 1 and the surface patterns 2 to be set can be increased or decreased according to the increase or decrease in the number of layers.

In the final electric checker inspection step, the outer layer pattern of the inspection recording mark 10 is inspected simultaneously with the inspection of the circuit net of the wiring layer on the printed circuit board of the final product. In this inspection step, when an open defect is detected via the outer layer pattern of the inspection recording mark 10, it is possible to immediately detect which step is defective from the checker net address indicating the open position.

An example of the specification of the inspection recording mark 10 is shown below. Outer dimension of identification pattern 3: 11.5 x 3.0 mm Diameter of round land 1: φ0.75 mm Line width of surface pattern 2: 0.15 mm Hole diameter of through hole 4: φ0.35 mm Pitch of round land 1: 2.5 mm

Next, a method of using the inspection recording mark 10 to determine the processing quality of the through hole formed in the wiring layer will be described. In this example, when measuring the continuity of the inspection record mark 10 formed in the outer layer of the discard plate portion 25, the surface shape of the drill hole formed by the drill bit used in forming the through hole in the wiring layer is also added. inspect. First, an inspection part for inspecting a drill hole to be checked is set near the inspection record mark 10. The inspection site may be within the identification pattern 3. In addition, the inspection site corresponding to the position of the through hole to be checked may be allocated to the round land 1.

Next, after drilling the inside of the product substrate 20 based on a program for drilling a through hole with an NC drill, the drill bit immediately before being replaced with a new drill bit is used in the vicinity of the inspection record mark 10. The inspection site to be drilled. As a result, the through hole formed in the inspection site becomes a hole drilled in the state where the drill bit is cut at the worst. By using this hole as a sample and observing the cross section or the like, the hole in the product substrate 20 is formed. Processing quality can be analyzed.

Embodiment 2 Based on FIGS. 5 and 6, a failure to judge whether or not a predetermined punching process has been properly performed on a printed circuit board on which a die is punched twice or more when performing an outer shape process. An example of a judgment method and a punching inspection mark used for this defect judgment will be described. FIG. 5 is an enlarged plan view showing a state of the punching inspection mark before the inspection, and FIG. 6 is an enlarged plan view showing a state of the punching inspection mark after the inspection.

In this example, the kit plate 90 is provided with a slit 8 (8a, 8a) for punching which is formed in an intermittent and rectangular shape.
b, 8c,...), a product substrate 80 and a discarded plate portion 85 partitioned inside and outside through the slit 8
Is a separation line for separating the product substrate 80 and the waste plate portion 85. In addition, the slit 8 is limited to a slit portion 8b formed at each corner portion when performing the external punching due to design restrictions of a slit forming die that satisfies conditions such as appropriate external punching at the time of punching. However, it is assumed that a program is set so as to be punched in the second die punching step.

The punching inspection mark 70 is a conductor pattern formed on the outer layer of the kit board 90 in order to determine whether or not the slit 8b is properly punched out, as shown in FIG. Then, two round lands 71, 72 are set on the discard plate portion 85, and the slit forming scheduled portions 8 are drawn so that the round lands 71, 72 have both ends in a U-shape.
The round land 71 and the round land 72 are connected across b-1. On the other hand, the net data of the electric checker is edited so that when the connection between the round lands 71 and 72 serving as the connection terminals is open, the net data is determined to be good.

A round land 71 and a round land 72 are applied to the printed circuit board 90 having undergone a predetermined manufacturing process by an electric checker.
Is measured. If the second outer shape punching is properly performed, as shown in FIG. 6, the punching inspection mark 70 is cut by the formed slit 8b and a good product is determined. In the case where the processing has been forgotten, the round lands 71 and 72 are electrically connected by the punching inspection mark 70 left in a perfect form, and the defective product is determined. Therefore, it is possible to reliably detect a punching failure of the portion 8b-1 to be formed by the electric checker without relying on visual observation.

The shape and position of the punching inspection mark 70 are not particularly limited as long as it is conductive through the portion to be punched out. Further, the connection terminals (round lands 71 and 72) with the electric checker may be formed on an outer layer in the product substrate 80, or may be formed on these outer layers so as to extend over the product substrate 80 and the waste plate portion 85. Is also good.

[0039]

According to the present invention, the following effects can be obtained. (1) Defective products generated during the manufacturing process can be reliably detected in the final electric checker inspection process. (2) Since it is possible to immediately detect in which process the defect has occurred from the address net of the electric checker, prompt feedback of the defect content such as a defect of the exposure film can be reflected in the processing process. Therefore, the occurrence of continuous failure can be minimized. (3) Instead of judging by looking at the oil-based marker or the seal mark in the final appearance inspection process, it is possible to sort by an electric checker inspection, thereby preventing an article with a defective mark from being shipped as a non-defective product. You. (4) By setting the inspection record mark on the outside of the product of the printed circuit board, the number of points in the open failure mode at the time of the electric checker inspection is reduced as compared with the conventional marking by punching on the defective board, and The work efficiency of the checker inspection is improved. (5) In a kit board in which a plurality of boards are developed, it becomes easy to specify a defective board. In particular, it is possible to prevent a problem that a defective substrate cannot be identified when a hole is formed in a product substrate as in the related art. (6) The inspection record mark is further used for checking the quality of the through hole in the product, so that there is no need to separately provide a portion for checking the quality of the through hole, and the inspection record mark occupies the printed circuit board. The area can be reduced. Further, the points to be inspected can be concentrated on the inspection record marks, and even when the check operation is to be instructed, the inspection item site can be easily and accurately taught. (7) In the case of a printed circuit board that includes a step of performing outer shape processing by die punching two or more times, even if a missing part occurs in the outer shape punching process, without relying on the appearance inspection with much leakage, it is ensured by the electric checker inspection. Defective products can be sorted out.

[Brief description of the drawings]

FIG. 1 is a plan view illustrating an example of a printed board and an inspection recording mark for inspecting the printed board according to the present invention.

FIG. 2 is an enlarged cross-sectional view illustrating a configuration of the printed circuit board of FIG. 1 and an inspection recording mark.

FIG. 3 is an enlarged plan view of the inspection recording mark of FIG. 1;

FIG. 4 is an enlarged plan view illustrating details of the configuration of the inspection recording mark of FIG. 1;

FIG. 5 is a plan view illustrating an example of a printed board and a punching inspection mark for printed board inspection according to the present invention.

FIG. 6 is a plan view illustrating the function of the punching inspection mark in FIG. 5;

[Explanation of symbols]

 Reference Signs List 1 (1a to 1d) Round land (inspection record mark) 2 (2a to 2c) Surface pattern (inspection record mark) 3 Identification pattern 3a Sharp end (identification pattern) 5 Insulating layer 10 Inspection record mark 20 Product substrate 30 Kit board 70 Mark for punching inspection 80 Product board 90 Kit board

Claims (11)

[Claims] 1. A method for determining a defect of a printed circuit board which is manufactured by sequentially stacking an insulating layer and a wiring layer, comprising: forming a plurality of through-hole patterns penetrating the insulating layer when forming the wiring layer; And a surface pattern that selectively conducts along the insulating layer is formed by a conductor pattern near the wiring layer, and then when each wiring layer is inspected for each inspection item, Correspondingly, the inspection result is recorded in the inspection item portion set in advance on the inspection recording mark by disconnection of the pattern, and when inspecting the produced printed circuit board, the inspection recording mark on the outer layer of the printed circuit board is inspected. A method for determining a failure of a printed circuit board, which determines an inspection result on an inner wiring layer of the printed circuit board by measuring conduction of the printed circuit board. 2. The method according to claim 1, wherein the disconnection of the pattern of the inspection item portion is caused by a drill hole. 3. A drill hole is a hole formed by a drill bit used for forming each wiring layer, and is used to measure the continuity of an inspection record mark on an outer layer of a perforated printed circuit board. 3. The method according to claim 2, wherein the processing quality of the drill hole in the wiring layer is determined by observing the surface shape of the drill hole. 4. Inspection items include formation of a plane wiring pattern in an insulating layer, formation of a through hole, solder resist,
Claims include items related to any one of the steps of symbol printing, outer shape processing, and surface treatment, and the inspection item part is clearly indicated by an identification pattern attached near the inspection recording mark with a conductor pattern for forming a wiring layer. Any one of 1 to 3
4. A method for determining a failure of a printed circuit board according to any one of the above. 5. The printed board according to claim 1, wherein the printed board is formed of a kit board in which a plurality of printed boards are developed into one kit, and an inspection record mark is formed corresponding to each of the printed boards developed in the kit board. Item 5. The method for determining a failure of a printed circuit board according to any one of Items 1 to 4. 6. The method according to claim 1, wherein each of the inspection recording marks is formed at the same position in the laminating direction of the insulating layer. 7. An inspection recording mark for recording an inspection result of a printed circuit board formed by sequentially stacking an insulating layer and a wiring layer, wherein the inspection recording mark is used for forming a wiring when forming each wiring layer. It consists of a plurality of through-hole patterns that penetrate through the insulating layer formed of conductor patterns near the layer, and a surface pattern that selectively conducts these through-hole patterns along the insulating layer. When the inspection item portion is set on the inspection record mark and the inspection result corresponding to the inspection item after the wiring layer is formed is recorded by disconnection of the pattern of the inspection item portion, the outer layer of the produced printed circuit board is An inspection recording mark for a printed circuit board that can determine the inspection result for an inner wiring layer of the printed circuit board by measuring the conduction of the inspection recording mark. 8. The through hole pattern comprises an island-shaped conductor pattern formed at a predetermined interval, and the surface pattern comprises a linear conductor pattern connecting adjacent island-shaped patterns. Mark for inspection record of printed circuit board described in 1. 9. A method for inspecting a contour punching step of a printed circuit board formed by sequentially stacking an insulating layer and a wiring layer, the method being used for a punching inspection conducted through a portion to be punched when forming a wiring layer. A defect determination method for a printed circuit board in which a mark is formed in a conductive pattern on an insulating layer, and after the punching step is completed, the continuity of the punching inspection mark is measured to determine a punching defect. 10. An inspection mark for inspecting an outer shape punching step of a printed circuit board manufactured by sequentially stacking an insulating layer and a wiring layer, the conductive mark being formed through a portion to be punched when forming a wiring layer. A punching inspection mark formed of a conductor pattern on an insulating layer and measuring the continuity of the inspection mark after completion of the punching step to determine a punching defect. 11. The punching inspection mark according to claim 10, wherein the inspection mark comprises a U-shaped conductor pattern formed so that an intermediate portion thereof passes through a portion to be punched.