JP2001068523A - Mounting apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To absorb and correct deviations of a substrate holding member from its mounting position by providing a mounting apparatus with means for mounting the substrate holding member at a prescribed position and energizing and rocking means for holding the mounting means at a predetermined position, while supporting the mounting means rockably. SOLUTION: At a transfer section, carrier rotating means transfers a carrier C from a first stage to a second stage 51. The stage 51 is lowered to a position, at which a moving table 67 and a mounting apparatus 68 project from an opening section 60. Then, the first stage is lowered to cause a bottom plate to move away from the carrier C for delivery to the carrier rotating means. Then, the rotating means rotates the carrier C by 90 deg., to change the horizontal position of a wafer W to the vertical position. Next, the stage 51 is transferred, turning the carrier C with the wafer W kept in the same position. During the transfer, the carrier C is mounted on the apparatus 68, projecting from the section 60. There are provided a mounting means 70 for mounting the carrier C at a prescribed position A and a rocking means 71 so as to rockably support the means 70 and energize the means 70 for holding at a predetermined position B.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mounting device for mounting a substrate such as a semiconductor wafer or an LCD glass plate.

[0002]

2. Description of the Related Art For example, in a semiconductor device manufacturing process, a semiconductor wafer (hereinafter, referred to as a "wafer") as a substrate is washed with a predetermined chemical solution or a cleaning solution such as pure water.
2. Description of the Related Art A cleaning apparatus for removing contamination such as particles, organic contaminants, and metal impurities attached to the surface of a wafer is used. Among them, a wet type cleaning apparatus that performs a cleaning process by immersing a wafer in a cleaning tank filled with a cleaning liquid is widely used.

In such a cleaning apparatus, a carrier containing, for example, 25 wafers before cleaning is carried in via a carry-in interface port provided on the upper surface of a carry-in section. In this case, a container and a SMIF pod (Standardized) in which the bottom plate of the container is used as a lid so that the wafer is not contaminated by particles or the like during the transfer.
Mechanincal Interface Po
The wafer is stored together with the carrier in a closed container called d), and is transported to the cleaning device in this state. The loading unit includes a first stage that can be moved up and down by an actuator, for example, and the first stage is moved up and down between the inside of the loading unit and the loading interface port. Then, the loaded SMIF pod is placed on the first stage which has been raised to the loading-side interface port in advance,
Thereafter, the first stage is lowered, and the carrier together with the bottom plate is moved into the loading section while the container remains on the loading-side interface port.

Then, 25 wafers are collectively taken out of the carrier transferred to the loader. Thereafter, the 25 wafers are transported to the cleaning / drying processing section, where they are cleaned and dried in a batch manner. Then, the wafer that has been subjected to a predetermined cleaning process in the cleaning / drying processing unit is transferred to an unloader and held in a carrier prepared in advance. The unloading section also has a first stage that can be raised and lowered similarly to the loading section.
Then, the bottom plate of the SMIF pod is placed on the first stage in advance, and the carrier holding the washed wafer is moved to the first stage.
The wafer is conveyed to the first stage that is lowered and is on standby, and is placed on the bottom plate of the SMIF pod on the first stage. Thereafter, the first stage is raised, and the carrier is stored in a container of the SMIF pod placed in advance at the unloading-side interface port of the unloading unit, and is unloaded out of the cleaning device.

[0005] Here, the batch type cleaning in the cleaning apparatus is performed by using a variety of cleaning liquids by storing wafers in a cleaning tank in a vertical posture. In this batch type cleaning, the cleaning efficiency is improved by forming a rising flow of the cleaning liquid between the wafers arranged in a vertical posture at a predetermined interval and supplying the cleaning liquid evenly to the wafer surface. .

In the SMIF pod, a carrier holding a wafer in a horizontal position is accommodated, and the wafer is transferred in a horizontal position so as to suppress the influence of the transfer in a vertical position. However, as described above, since the wafer is cleaned in a vertical position in the cleaning tank, the position of the wafer when transported in the clean room does not match the position of the wafer when cleaning.

In view of the above, a second stage is provided separately from the first stage in the carry-in section and the carry-out section, and the carrier for rotating and transporting the carrier between the first stage and the second stage is provided. Rotating means is provided. Further, the carrier rotating means is configured to convert the attitude of the wafer into a vertical attitude and a horizontal attitude by rotating the carrier itself by 90 °. Then, in the loading section, the carrier holding the wafer before cleaning in a horizontal position is turned by 90 ° by the carrier turning means to change the position of the wafer from the horizontal position to the vertical position, and then the carrier is turned. It moves and is transported to the second stage. At this time, the carrier is placed at a predetermined position on the second stage.
On the other hand, in the unloading section, the carrier holding the wafer after cleaning by the unloader in a vertical position is transferred to the second stage. Thereafter, the carrier is turned by 90 ° by the carrier turning means to change the attitude of the wafer from a vertical attitude to a horizontal attitude, and thereafter, the carrier is rotated and transported to the first stage. At this time, the carrier is placed on the bottom plate of the SMIF pod on the first stage as described above.

[0008]

However, in the loading section, the carrier is rotated and conveyed to the second stage, so that even if the carrier is to be placed at a predetermined position on the second stage. The carrier moves vertically and horizontally. As a result, the carrier moves from a predetermined position on the second stage, causing a positional shift. This makes it difficult for the lifter that transports the carrier to grip the carrier, making it difficult to transport the carrier from the second stage to the next location, the loader.

Also, in the carry-out section, the carrier is rotated and conveyed to the first stage, so that the carrier is moved in the vertical and horizontal directions as in the carry-in section. At this time, not only does the position shift occur, but also the wafer is jumped from the carrier in the horizontal direction due to the impact due to the position shift because the attitude of the wafer is changed from the vertical attitude to the horizontal attitude. Also, the carrier tilts with the displacement,
There is a risk that the wafer may fall from the carrier and be damaged.
Further, the carrier rotating means is operated by pulse control. However, the carrier rotating means malfunctions due to, for example, noise (radio wave interference from another device or the like). ) Will increase the risk of wafer breakage.

SUMMARY OF THE INVENTION It is therefore an object of the present invention to provide a mounting device capable of absorbing and correcting a displacement of a holding member when mounting the holding member.

[0011]

According to one aspect of the present invention, there is provided an apparatus for mounting a holding member for holding a substrate, wherein the holding member is mounted at a specific position. Mounting means for pivotally supporting the mounting means and supporting the mounting means in a predetermined position. Provide equipment.

According to the loading device of the first aspect, the loading means is not fixed at a predetermined position, but is supported by the swing means so as to be swingable. Accordingly, when a force is applied to move the holding member in the vertical and horizontal directions when the holding member is mounted at a specific position of the mounting means, the holding member is moved horizontally and vertically together with the mounting means, and Is allowed. Thereafter, the mounting means is returned to a predetermined position by rocking by the rocking means while the holding means is mounted on the specific position of the mounting means. The holding means is installed at a predetermined position on the mounting device, for example. Thus, the displacement can be absorbed and corrected by the swinging means. Therefore, it is possible to eliminate the displacement. In addition, since the impact when the holding member is placed can be reduced, it is possible to prevent the substrate from jumping out or the substrate from falling due to the tilting of the holding member, and to prevent the substrate from being damaged.

According to a second aspect of the present invention, the swinging means includes an upward biasing mechanism for biasing the placing means vertically upward and a lateral biasing mechanism for biasing the placing means horizontally. Is preferably provided. According to this configuration, the upward biasing mechanism and the horizontal biasing mechanism can absorb and correct the displacement, and can reduce the shock when the holding member is placed. In this case, one or more of the upward biasing mechanism and the horizontal biasing mechanism can be provided.

According to a third aspect of the present invention, it is preferable that the upward urging mechanism includes a projection which can be brought into contact with the lower surface of the placing means and an elastic body which supports the projection. According to this configuration, the upward urging mechanism can appropriately urge the lower surface of the placing unit. In this case, the protrusion may be directly supported by the elastic body, or the support member supporting the protrusion may be provided with an elastic body to support indirectly.

According to a fourth aspect of the present invention, there may be provided a regulating member for regulating a projecting distance of the projection.
According to this configuration, since the projecting distance of the projection is regulated by the regulating member, the upward urging mechanism does not urge the mounting unit vertically upward unnecessarily.

According to a fifth aspect of the present invention, it is preferable that the lateral biasing mechanism includes a projection which can be brought into contact with a side surface of the placing means and an elastic body which supports the projection. According to this configuration, the lateral urging mechanism can appropriately urge the side surface of the mounting unit. In this case, the protrusion may be directly supported by the elastic body, or the support member supporting the protrusion may be provided with an elastic body to support indirectly.

According to a sixth aspect of the present invention, there may be provided a regulating member for regulating a projection distance of the projection.
According to this configuration, since the protrusion distance of the projection is regulated by the regulating member, the lateral urging mechanism does not urge the mounting means in the horizontal direction more than necessary.

[0018]

Embodiments of the present invention will be described below with reference to the accompanying drawings. The present embodiment relates to a mounting apparatus provided as a component of the cleaning apparatus in a cleaning apparatus configured to carry out wafer loading, cleaning, drying, and unloading in a batch manner. is there. FIG. 1 shows a side view of the cleaning apparatus 1 provided with the mounting devices 68 and 110 according to the present embodiment, and FIG. 2 shows a side view of the cleaning apparatus 1.

The cleaning apparatus 1 includes a SMIF pod 3 (Standardized Machine) containing a carrier C for holding a wafer W before cleaning in a horizontal posture.
(Cal Interface Pod) and a loading / unloading unit 4 for carrying out an operation until the wafer W before cleaning is removed from the carrier C, a cleaning / drying processing unit 5 for performing a predetermined cleaning process on the wafer W, Transfer wafer W to carrier C
And the carry-out section 6 that carries out the operation until the carrier C is carried out together with the SMIF pod 3. In addition, it is also possible to provide a carry-in / out unit that can carry out both carry-in and carry-out of the wafer W by integrating the carry-in unit 4 and the carry-out unit 6.

The carry-in section 4 carries in the SMIF pod 3 via the carry-in side interface port 7 and then, from the SMIF pod 3 through the first stage 37, the carrier C
And the carrier C is rotated by the carrier rotating means 50.
Is rotated by 90 ° to change the attitude of the wafer W from the horizontal attitude to the vertical attitude, is transferred to the second stage 51, and then the carrier C is transferred to the loader 10 by the lifter 9.

The cleaning / drying unit 5 has a front side
A transfer device 11 is provided, and the transfer device 11
The cleaning device 1 is slidable along the longitudinal direction (the X direction in FIGS. 1 and 2). In addition, the transfer device 11 supports the wafer chucks 13a and 13b on a support portion 12 which is configured to be able to move up and down (in the Z direction in FIG. 1). It is possible to collectively hold (for example, 50) wafers W and transfer the wafers W from the loading unit 4 side to the unloading unit 6 side.

In the cleaning / drying processing section 5, a chemical cleaning is performed using a chemical and then a rinsing cleaning is performed using pure water.
So-called one-bath type first chemical / rinse cleaning device 1
4 and a second chemical / rinse cleaning device 15 that performs chemical cleaning using a chemical different from the chemical used in the first chemical / rinse cleaning device 14 and then performs rinsing with pure water.
And a wafer chuck cleaning / drying device 16 for cleaning and drying the wafer chucks 13a and 13b of the transfer device 11.
And the wafer W, for example, isopropyl alcohol (IP
A) A drying device 17 for finally drying using steam is sequentially arranged from the carry-in portion 4 side to the carry-out portion 6 side.

The combination of the above arrangements and the chemical / rinse cleaning apparatus can be arbitrarily combined depending on the type of cleaning for the wafer W. For example, a certain chemical / rinse cleaning device may be reduced, or conversely, another chemical / rinse cleaning device may be added.

The unloading section 6 holds the wafer W after cleaning by the unloader 18 in the carrier C in a vertical position, and holds the carrier C from the unloader 18 by the lifter 19 to the second position.
To the stage 51, and then the carrier rotating means 5
0, the carrier C is rotated by 90 ° to change the attitude of the wafer W from the vertical attitude to the horizontal attitude, and then transported to the first stage 37. Thereafter, the carrier C is stored in the SMIF pod 3 and unloaded. It is configured to be carried out via the side interface port 21.

Next, the mounting device 68 according to the present embodiment is described.
The carrying-in section 4 provided with is described. 3 shows a state in which the loading section 4 is viewed from the front, FIG. 4 shows a state in which the loading section 4 is viewed from a plane, and FIGS. 5 and 6 show a state in which the loading section 4 is viewed from the side. First, as shown in FIG. 7, the SMIF pod 3 for storing the carrier C is composed of a transparent container 30 having an open bottom, and a bottom plate 31 for opening and closing the bottom of the container 30. Therefore, for example, 25
A carrier C, which holds a plurality of wafers W in parallel and holds it in a horizontal position, is placed so as to fit with the positioning members 32, 33 of the bottom plate 31, and a container 30 is placed over the carrier C, thereby sealing the carrier C. In this state, it can be transported to the cleaning device 1.

As shown in FIGS. 3, 5 and 6, a first stage 37 provided below the loading interface port 7 is connected to an elevating shaft 36 of an actuator 35. It can be moved up and down (Z direction in FIGS. 3, 5 and 6). An opening 40 is formed in the loading-side interface port 7. The first stage 37 shown in FIG. 5 shows a state in which the first stage 37 is moved up to the opening 40 by the operation of the actuator 35. When the SMIF pod 3 is loaded into the loading-side interface port 7, the opening 40
The lower surface of the SMIF pod 3 is placed on the peripheral edge of the, and the bottom plate 31 is placed on the first stage 37. Then, as shown in FIG. 6, the first stage 37 is moved down by the operation of the actuator 35 while the container 30 remains at the loading-side interface port 7. As described above, since the carrier C is loaded into the loading section 4 without a chance to come into contact with the external atmosphere, the wafer W can be kept clean.

The carrier rotating means 50 adjacent to the first stage 37 rotates the carrier C mounted on the first stage 37 by 90 ° to change the attitude of the wafer W from a horizontal attitude to a vertical attitude. The carrier is changed to a second stage 51 adjacent to the carrier rotating means 50.
The second stage 51 on which the carrier C is transported is moved up and down along the rail 52 (in the Z direction in FIG. 3).
Attached to.

The carrier rotating means 50 supports an arm head 55 to which four chucks 54 for holding the carrier C are attached, and the arm head 55.
An arm 56 that transports the carrier C gripped by the first table 37 and the second table 51 is provided, and a support portion 57 that rotatably supports the arm 56 is provided. As described above, when lowering the carrier C, as shown in FIG. 3, the arm head 55 and the arm 56 are rotated obliquely to the positions shown by the solid lines 55 and 56 so as not to be obstructed. Hold in posture. Thereafter, when the carrier C is ready to be delivered to the carrier rotating means 50, the arm head 55 and the arm 56 are moved to the two-dot chain line 5 in FIG.
The carrier C is rotated to the positions indicated by 5 'and 56' so that the carrier C can be gripped by the carrier rotating means 50 as shown in FIG.

As shown in FIGS. 3 and 4, openings 60 and 61 are formed in the second stage 51, and these openings 60 and 61 allow a rod 66 of a cylinder 65 to be described later to pass therethrough. Are communicated with each other by a simple passage portion 62. Below the second stage 51, a slide member 64 slidable along a rail 63 is provided, and the above-described cylinder 65 is fixed to the upper surface of the slide member 64. The rod 66 of the cylinder 65 is connected to a moving table 67, on which the mounting device 68 according to the present embodiment is fixed. Therefore, the moving table 67 and the placing device 68 can be moved up and down (in the Z direction in FIG. 3) and in a direction parallel to the arrangement direction of the openings 60 and 61 (in the Y direction in FIGS. 3 and 4). It is movable.

In the loading section 4, the carrier rotating means 50
However, the case where the carrier C is transported from the first stage 37 to the second stage 51 will be described with reference to FIGS. 8 to 12. First, FIG. 8 shows that the carrier rotating means 50 as shown in FIG. It is the state when C was grasped from the side. On the other hand, the second stage 51 is in a state of being lowered to a position where the moving table 67 and the mounting device 68 protrude from the opening 60. Next, as shown in FIG. 9, the first stage 37 is lowered, the bottom plate 31 is separated from the carrier C, and the carrier C is delivered to the carrier rotating means 50.

Next, as shown in FIG. 10, the carrier rotating means 50 rotates the carrier C by 90 ° to change the attitude of the wafer W from a horizontal attitude to a vertical attitude. Next, as shown in FIG.
Numeral 0 indicates that the carrier C is rotated (turned) and transferred to the second stage 51 without changing the attitude of the wafer W.

At this time, as shown in FIG. 12, the carrier C is mounted on a mounting device 68 protruding from the opening 60 of the second stage 51. The mounting device 68 according to the present embodiment includes a mounting means 70 for mounting the carrier C at a specific position (a), the mounting means 70 swingably supported, and the mounting means 70 at a predetermined position b. And a swinging means 71 for urging the holding means.

FIG. 13 is a perspective view of the placing device 68.
FIG. 14 is a sectional view thereof, and FIG. 15 is a plan view thereof. As shown in FIG. 13 and FIG.
Has a mounting stage 72 on which the carrier C is mounted, and a receiving member 73 for receiving the mounting stage 72.
Positioning members 75, 75 are provided on the upper surface of the mounting stage 72 so that the carrier C can be fixed at a specific position A. Also, a recess 7 is provided on the lower surface of the mounting stage 72.
On the other hand, on the upper surface of the receiving member 73, convex portions 78, 7 corresponding to the concave portions 77 are provided.
8, 78 are provided. The receiving stage 73 is received by the receiving member 73 by fitting each of the concave portions 77 and each of the convex portions 78.

The swing means 71 has a base 79. On the upper surface of the base 79, five upward urging mechanisms 80, 80, 80, 80, 80 for urging the receiving member 73 vertically upward are provided. As shown in FIG. 14, each upward biasing mechanism 80 is provided with a hole 81 formed in the lower surface of the receiving member 73.
The cover 82 has a projection 82 which can be brought into contact with the cover 82 and an elastically stretchable cover 83 on the bellows supporting the projection 82. A spring spring 84 is provided inside the cover 83.

On the upper surface of the base 79, there are provided substantially T-shaped regulating members 85, 85,
85 and 85 are fixed. As shown in FIG. 14, the receiving member 73 is formed with spaces 87 into which the upper end 86 of each regulating member 85 can enter.
In the lower part of the frame, there is formed a passage portion 89 for relatively moving up and down and sliding a column 88 supporting an upper end portion 86. Since the width of the passage portion 89 is shorter than the width of the upper end portion 86,
Even if the placing means 70 is urged vertically upward more than necessary by the urging of each upward urging mechanism 80, the lower surface of the upper end portion 86 of the regulating member 85 will hit the bottom surface forming the space 87, and The configuration is such that the placing means 70 is prevented from floating.

On the four sides of the base 79, horizontal urging mechanisms 90, 90, 90, 90 are respectively provided. FIG.
FIG. 15 is a perspective view of the horizontal urging mechanism 90, and FIG.
As shown in FIG. 16 and FIG. 16, in each of the horizontal biasing mechanisms 90, the projections 91, 91 are supported by support members 92, 92.
Is fixed in a horizontal position. Further, the plate body 93 is supported by support members 94, 94. Since the support members 94, 94 penetrate the plate body 93, the plate body 93 is configured to be slidable along the support members 94, 94. Support member 94,
Restriction members 95, 95, which will be described later, are fixed to the tip of the 94. A support member 9 supporting the protrusions 91 via the support members 92, 92 and the plate body 93.
Spring springs 96, 96 are wound around the entirety of the spring 4,94. Further, the support members 94, 94 are fixed in a horizontal posture to a plate body 97 vertically attached to the side surface of the base 79. A guide shaft 100 is fixed to the plate body 93 so that the slide movement of the plate body 93 described above can be performed smoothly. The guide shaft 100 has two bearing members 101,
While being supported by 101, it slides through the plate body 97.

Thus, each of the lateral urging mechanisms 90 urges the swinging means 71 in the horizontal direction by bringing the projections 91 into contact with the respective side surfaces of the passive member 73. In addition, since each of the horizontal urging mechanisms 90 urges the placing unit 70 evenly from all directions, the swinging unit 71 holds the placing unit 70 at the predetermined position B when the carrier C is not placed. It has become. In this case, the plate body 93 is slid by the urging of the spring springs 96, 96, and the protrusion 91 is moved horizontally in the horizontal direction. The sliding movement of the plate body 93 is larger than the diameter of the
Always stop at 5,95. Thereby, the plate body 9
3 is prevented from coming off from the support members 94, 94, and the projecting distance of the projecting portion 91 is regulated so as not to extend more than necessary.

Here, as described above with reference to FIG. 11, a load is applied to the mounting device 68 at the moment when the carrier C is mounted on the mounting device 68. FIG. 17 is a cross-sectional view showing this state, and FIG. 18 is a plan view thereof. That is, a downward load is applied in the A1 direction in FIG. 17, and the cover body 82 of each upward biasing mechanism 80 is contracted and distorted. Further, the mounting means 70 on which the carrier C is mounted at the specific position a is, for example, A2 in FIG.
17 and FIG. 18, and horizontally in the direction of A3 in FIGS. The placing means 70 separates from the right side horizontal urging mechanism 90 in FIGS. 17 and 18 and the lower side horizontal urging mechanism 90 in FIG. The lateral urging mechanism 90 on the left side in FIGS. 17 and 18 is pushed in the direction A3 in the direction A2.

Thereafter, the springs 84, 96, 96
Of the upward biasing mechanism 80 by the restoring force of the
Is urged vertically upward, and the left and upper horizontal urging mechanisms 90 urge the mounting means 70 in the horizontal direction. In this way, as shown in FIGS. 19 and 20, the placing means 70 is returned to the predetermined position B, and the carrier C is set at a predetermined position C on the placing device 70. The determined position c coincides with the specific position a except for the moment when the carrier C is placed.

When the carrier C is placed on the placing device 68, the moving table 67 moves to the opening 61. Thereafter, the moving table 67 is lowered, and the carrier C is placed on the periphery of the opening 61 on the way down. continue,
When the moving table 67 returns to the opening 60 side, the next carrier C is placed on the placing device 68. Thereafter, the carrier C is placed on the periphery of the opening 60 by lowering the moving table 67.

The lifter 9 has a pair of grips 105a, 10
5b, the X direction in FIGS. 2 and 4, and the Y direction in FIGS.
3 and is movable in the Z direction in FIG. When two carriers C are placed on the second table 51, the second table 51 rises as shown in FIG. After that, the lifter 9 moves the second table 51
Is transferred to the loader 10. The loader 10 takes out the wafer W from the carrier C in a vertical position by the hands 106 and 106.

The unloading section 6 is also provided with the mounting device 110 according to the present embodiment. FIG. 21 shows a state in which the unloading section 6 is viewed from the side. As shown in FIG. 21, the mounting device 110 is provided on the first stage 37. In the unloading section 6, the carrier C is stored in the container 30 of the SMIF pod 3 placed on the unloading-side interface port 21, so that the mounting device 110 receives the bottom plate 31 of the SMIF pod 3 in advance. are doing. In addition, among the components provided in the unloading section 6,
Components having the same functions and configurations as the components provided in the carry-in section 4 are denoted by the same reference numerals, and redundant description will be omitted.

In the unloading section 6, the carrier rotating means 50
However, the case where the carrier C is transported from the second stage 51 to the first stage 37 will be described with reference to FIGS. First, after transferring two carriers C holding the cleaned wafer W in the vertical posture to the second stage 51 by the lifter 19, the second stage 51 is lowered as shown in FIG. The carrier rotating means 50 is
The individual chucks 54 are advanced to a position where the carrier C can be gripped, and the carrier C is gripped. Next, as shown in FIG. 23, the second stage 51 is lowered, and the carrier C is delivered to the carrier rotating means 50.
The carrier rotating means 50 pulls the carrier C by slightly retracting the chuck 54. Next, as shown in FIG.
By rotating the carrier C by 90 °, the posture of the wafer W is changed from a vertical posture to a horizontal posture. Then, FIG.
As shown in FIG. 6, the carrier rotating means 50
Is rotated and transported to the first stage 37 which has been lowered in advance.

FIG. 26 is a perspective view showing this state. As shown in FIG. 26, the placing device 110 includes a placing unit 111 and a swinging unit 71.
1 has a dedicated receiving member 112 for receiving the bottom plate 31 of the SIMF pod 3.

Next, the operation and effect of the mounting devices 68 and 110 according to the present embodiment configured as described above will be described based on a predetermined cleaning process of the wafer W in the cleaning device 1 of FIG. First, a transfer robot (not shown) loads the SMIF pod 3 containing the carrier C holding, for example, 25 wafers W which have not been cleaned in a horizontal posture, into the carry-in side interface port 7 of the carry-in section 4. And FIG.
As shown in (1), the first stage 37 is lowered and the SM
The carrier C is taken out of the container 30 of the IF pod 3. Next, as shown in FIGS.
0 receives the carrier C from the first stage 37,
The carrier C is rotated by 90 ° to change the attitude of the wafer W from the horizontal attitude to the vertical attitude, and thereafter, the carrier C is rotated and transported to the second stage 51.

At this time, the carrier C is placed on the placing device 68 protruding from the opening 60 of the second stage 51. Since the carrier C is rotating, the carrier C is placed on the placing device 68. On the other hand, a load is applied. As shown in FIG. 15, according to the placing device 68, the placing means 70 is not fixed at the predetermined position A, but is supported by the swing means 71 so as to be swingable. Accordingly, when the carrier C is placed on the placing means 70 at a specific position A of the placing means 70,
When the force to move the carrier C vertically and horizontally acts,
As shown in FIG. 6 and FIG. 17, the carrier C is horizontally and vertically moved together with the mounting means 70 to allow the carrier C to be displaced. In this case, as shown in FIG. 17, each upward urging mechanism 80 contracts, and as shown in FIG. 18, the upper horizontal urging mechanism 90 moves in the A2 direction, and the left horizontal urging mechanism 90 moves in the A3 direction. Since the carrier C is pushed, the impact when the carrier C is placed can be reduced.

As shown in FIG. 20, thereafter, the mounting means 70 is returned to the predetermined position A by the rocking of the rocking means 71, and the carrier C is set at the predetermined position C on the mounting device 68. . In this case, the projection 8
2 is restricted, so that each upward biasing mechanism 80
Does not urge the mounting means 70 vertically upward more than necessary. Therefore, the mounting means 70 can be prevented from lifting. Further, since the protruding distance of the protruding portion 91 is similarly regulated by the regulating member 95, the horizontal urging mechanism 90 on the upper side and the left side does not urge the mounting means 70 more than necessary in the horizontal direction. Then, the carrier C is moved above the opening 61 by sliding the moving table 67. As described above, since the carrier C is installed at the determined position c on the mounting device 70, when the moving table 67 is lowered, the carrier is moved to the determined position on the opening 61 side on the second stage 51. C can be placed.

Subsequently, the moving table 67 returns to the opening 60 side, and the next carrier C is placed on the placing device 68 by the carrier rotating means 50 as before. Again,
Since the carrier C is placed at a predetermined position C on the mounting device 70, if the moving table 67 is lowered as it is, the carrier C is moved to a predetermined position on the opening 60 side on the second stage 51. Can be placed. As described above, the displacement can be absorbed and corrected by the swinging means 71. Therefore, it is possible to eliminate the displacement of the carrier C. Then, when two carriers C are arranged in the second table 51, the second table 51
Will rise, but since these carriers C are placed at predetermined positions on the second stage 51,
The lifter 9 can transfer the carrier C to the loader 10 smoothly.

The wafer W that has been subjected to the predetermined cleaning process in the cleaning / drying processing section 5 is transferred to the unloader 18 and held in the carrier C in a vertical position, and then transferred to the second stage 51. Next, as shown in FIGS. 22 to 25, the carrier rotating means 50 receives the carrier C from the second stage 51 and rotates the carrier C by 90 ° to change the attitude of the wafer W from the vertical attitude to the horizontal attitude. After that, the carrier C is rotated and conveyed to the first stage 37. The carrier C is stored in the SMIF pod 3 and carried out of the cleaning device 1, and the same operation is performed on the next carrier C placed on the second stage 51 and carried out of the cleaning device 1. You.

Also in this case, similarly to the placing device 68, the placing device 110 can absorb and correct the displacement, and can reduce the impact when the carrier C is placed. In particular, since the wafer W is held in a horizontal posture in the carrier C, the impact on the carrier C
The wafer W can be prevented from dropping out due to the wafer W jumping out or the carrier C being tilted, and the wafer W can be prevented from being damaged.

In addition, the carrier rotating means 50 operated by the pulse control may cause a malfunction (such as a speed of rotating and moving faster than usual) due to noise (radio wave interference from other devices). However, such mounting devices 68 and 110 can sufficiently cope with the problem and reduce the risk of breakage of the wafer W.

Thus, the mounting device 68 of the present embodiment
According to 110, the displacement can be absorbed and corrected, and the impact when the carrier C is placed can be reduced. Therefore, the carrier C can be smoothly transferred to the next place, that is, to the loader 10 via the lifter 9. Further, it is possible to prevent the damage of the wafer W. As a result, the wafer W and the carrier C can be safely and reliably loaded and unloaded.

It should be noted that the present invention is not limited to the above-described embodiment, but can take various forms. For example, in the loading unit 4, the placing device 68 described above is provided on the first stage 31, while the placing device 120 which is simply configured is provided on the moving table 67 as shown in FIGS. 27 and 28. You may do it. Mounting device 12
On the upper surface of the “0”, a concave portion 121 as shown in the figure is formed for mounting the foot of the carrier C. Positioning members 122 and positioning members 12 are provided at each corner of the recess 121.
Spring springs 123 for urging the springs 2 are provided, and a total of two spaces 124 are formed so that the respective springs 123 can be attached. According to this configuration, the loading robot 68 provided on the first stage 31 allows the transfer robot or the worker in the factory to connect the SM to the loading-side interface port 7 of the loading unit 4.
The impact at the time of carrying in the IF pod 3 can be reduced. Further, according to the mounting device 120, the same operation and effect as the mounting device 68 can be obtained.

Although the present invention has been described with reference to a cleaning apparatus for cleaning wafers in a batch system, the present invention is not limited to this, and other apparatuses for performing predetermined processing, such as an apparatus for cleaning wafers in a sheet mode and wafers The present invention can also be applied to an apparatus for applying a predetermined processing liquid thereon. Further, although an example in which a wafer is used as the substrate has been described, the present invention is not limited to this example, and can be applied to, for example, an LCD substrate or another substrate.

[0055]

According to the mounting device according to the first to sixth aspects, it is possible to absorb and correct the displacement and reduce the impact when the holding member is mounted. Therefore, it is possible to smoothly transfer the holding member to the next place and prevent the substrate from being damaged. As a result, the board and the holding member can be safely and reliably carried in and out.

According to the second and third aspects, the upward biasing mechanism can suitably bias the lower surface of the mounting means. According to the fourth aspect, the upward biasing mechanism does not bias the mounting means vertically upward more than necessary.

According to the second and fifth aspects, the lateral biasing mechanism can suitably bias the side surface of the mounting means. According to the sixth aspect, the horizontal urging mechanism does not urge the mounting means in the horizontal direction more than necessary.

[Brief description of the drawings]

FIG. 1 is a side view showing a state of a cleaning device provided with a mounting device according to an embodiment.

FIG. 2 is a plan view showing a state of the cleaning device of FIG. 1;

FIG. 3 is a front view showing a state of a loading unit.

FIG. 4 is a plan view showing a state of a loading section.

FIG. 5 is a side view showing a state of the loading section when the first stage has risen to the opening.

FIG. 6 is a side view showing a state of the loading section when the first stage is lowered so that the carrier can be delivered to the carrier rotating means.

FIG. 7 is a perspective view of a SMIF pod and a carrier.

FIG. 8 is a diagram illustrating a first operation when a carrier is conveyed from a first stage to a second stage by a carrier rotating unit in a loading unit.

FIG. 9 is a second operation explanatory diagram in a case where the carrier is transported from the first stage to the second stage by the carrier rotating means in the loading section.

FIG. 10 is a third operation explanatory diagram in a case where a carrier is conveyed from a first stage to a second stage by a carrier rotating means in a loading section.

FIG. 11 is a fourth operation explanatory diagram in a case where the carrier is transported from the first stage to the second stage by the carrier rotating means in the loading section.

FIG. 12 is a perspective view when a carrier is mounted on a mounting device in a loading unit.

FIG. 13 is a perspective view of a mounting device.

FIG. 14 is a cross-sectional view of the mounting device.

FIG. 15 is a plan view of the mounting device.

FIG. 16 is a perspective view of a lateral biasing mechanism.

FIG. 17 is a cross-sectional view illustrating a state when a carrier is mounted on the mounting device.

FIG. 18 is a plan view showing a state where the carrier is placed on the placing device.

FIG. 19 is a cross-sectional view showing a state after the carrier is mounted on the mounting device.

FIG. 20 is a plan view showing a state after the carrier is placed on the placement device.

FIG. 21 is a side view showing a state of a carry-out unit.

FIG. 22 is a diagram illustrating a first operation in the case where a carrier is conveyed from a second stage to a first stage by a carrier rotating unit in an unloading section.

FIG. 23 is a second operation explanatory diagram in the case where the carrier is conveyed from the second stage to the first stage by the carrier rotating means in the carry-out section.

FIG. 24 is a diagram illustrating a third operation when the carrier is conveyed from the second stage to the first stage by the carrier rotating means in the carrying-out section.

FIG. 25 is a fourth operation explanatory diagram in the case where the carrier is conveyed from the second stage to the first stage by the carrier rotating means in the unloading section.

FIG. 26 is a perspective view when a carrier is mounted on a mounting device in the unloading section.

FIG. 27 is a plan view showing another example of the mounting device.

FIG. 28 is a perspective view showing another example of the mounting device.

[Explanation of symbols]

 Reference Signs List 1 cleaning device 68, 110 mounting device 70 mounting device 71 swinging device 80 upward biasing mechanism 82, 91 projecting portion 84, 96 spring spring 85, 95 regulating member 90 horizontal biasing mechanism a specific position b predetermined position W wafer C carrier

Claims (6)

[Claims] 1. An apparatus for mounting a holding member for holding a substrate, comprising: mounting means for mounting the holding member at a specific position; and supporting the mounting means in a swingable manner; Swing means for urging the holding means to hold it in a predetermined position. 2. The apparatus according to claim 1, wherein the swinging means includes an upward biasing mechanism for biasing the placing means vertically upward and a horizontal biasing mechanism for biasing the placing means horizontally. The mounting device according to claim 1, wherein the mounting device is characterized in that: 3. The upward biasing mechanism according to claim 2, further comprising: a projection which can be brought into contact with a lower surface of the placing means, and an elastic body which supports the projection. Mounting device. 4. The mounting device according to claim 3, further comprising a regulating member that regulates a projecting distance of the projection. 5. The lateral biasing mechanism according to claim 2, further comprising: a protrusion capable of abutting on a side surface of the placing means; and an elastic body supporting the protrusion. Or the mounting device according to 4. 6. The mounting device according to claim 5, further comprising a regulating member that regulates a projecting distance of the projection.