TWI731529B - Substrate treating apparatus and substrate transporting method - Google Patents

Abstract

Disclosed are a substrate treating apparatus and a substrate transporting method. A first ID block takes a substrate from a carrier placed on a carrier platform and sends the taken substrate to one of six treatment layers. Moreover, a second ID block returns the substrate, sent from the treatment layer, for example, to a carrier placed on a platform. This allows the first ID block to transport many substrates to the six treatment layers arranged in an upward/downward direction more rapidly. Moreover, this simultaneously allows the second ID block to transport many substrates, having been sent from the six treatment layers arranged in the upward/downward direction, to the carrier more rapidly. As a result, a throughput of a substrate treating apparatus can be enhanced.

Description

Substrate processing device and substrate conveying method

The present invention relates to a substrate processing device for processing a substrate and a method for transporting the substrate. Examples of the substrate include semiconductor substrates, FPD (Flat Panel Display) substrates, photomask substrates, optical disk substrates, magnetic disk substrates, ceramic substrates, and solar cell substrates. Examples of FPD include liquid crystal display devices and organic EL (electroluminescence) display devices.

The conventional substrate processing apparatus has a transfer block and a processing block (for example, refer to Japanese Patent Laid-Open No. 2014-022570). The transfer block is equipped with: a carrier stage, which is used to place a carrier capable of storing multiple substrates; and a substrate transfer manipulator, which transfers the substrate between the carrier placed on the carrier stage and the processing block . The processing block applies, for example, a resist solution to the substrate.

In addition, the substrate processing apparatus includes a storage device (carrier buffer device) (for example, refer to Japanese Patent Laid-Open No. 2011-187796). The storage device is arranged in such a way that it extends to the side of the carrier platform in the horizontal direction. The storage device is provided with a storage rack for storing the carrier and a carrier conveying mechanism.

[The problem to be solved by the invention]

However, in the case of the conventional substrate processing apparatus having such a structure, there are the following problems. That is, the substrate conveying process performed by the transfer block of the substrate processing apparatus includes a conveying process and a moving back process. The conveying process is the process of taking out the substrate from the carrier placed on the carrier table and transporting the taken out substrate to the processing block. In addition, the moving back process is a process of receiving the substrate processed by the processing block from the processing block, and moving the received substrate back to the carrier placed on the carrier stage. As far as the conveying process is concerned, moving back to the process may result in a reduction in throughput. In addition, in terms of the return process, the conveying process may cause a reduction in throughput.

The present invention was completed in view of this situation, and its object is to provide a substrate processing apparatus and a substrate transport method that can increase the throughput. [Technical means to solve the problem]

In order to achieve such an object, the present invention adopts the following configuration. That is, the substrate processing apparatus for processing substrates of the present invention includes the following components: a first transfer block, which is provided with a first carrier mount, and the first carrier mount is used for mounting and accommodating a plurality of The carrier of the substrate; a single processing block, which is connected with the above-mentioned first transfer block, and a plurality of processing layers are arranged in the vertical direction; and a second transfer block, which is connected with the above-mentioned single processing block, and A second carrier placing table for placing the carrier is provided; the first transfer block takes out the substrate from the carrier placed on the first carrier placing table, and transports the taken-out substrate to the above Any one of a plurality of processing layers, each of the plurality of processing layers performs specific processing on the conveyed substrate, and the substrate is transferred to the second transfer block, and the second transfer block will be processed by the above The substrate after the layer processing is moved back to the carrier placed on the second carrier mounting table.

According to the substrate processing apparatus of the present invention, the first transfer block takes out the substrate from the carrier placed on the first carrier stage, and transports the taken-out substrate to any one of the plurality of processing layers. In addition, the second transfer block moves the substrate transported from the processing layer back to the carrier placed on the second carrier stage. Thereby, the first transfer block can more quickly transfer the plurality of substrates to the plurality of processing layers arranged in the vertical direction. In addition, at the same time, the second transfer block can more quickly transfer the plurality of substrates transferred from the plurality of processing layers arranged in the vertical direction to the carrier. As a result, the throughput of the substrate processing apparatus can be increased.

Furthermore, in the substrate processing apparatus, it is preferable that the first transfer block takes out the substrate from the carrier placed on the first carrier stage, and transports the substrate to the plurality of processing layers. The first processing layer. The first processing layer performs specific processing on the conveyed substrates, and transports the substrates to the second transfer block, and the second transfer block transfers the transferred substrates to the plurality of The second processing layer of the two processing layers. The second processing layer performs specific processing on the conveyed substrate and transfers the substrate to the first transfer block, which will be transferred to the first transfer block. The substrate is transported to the third processing layer of the plurality of processing layers, and the third processing layer performs specific processing on the transported substrate, and transports the substrate to the second transfer block, and the second transfer area The block moves the substrate processed by the third processing layer back to the carrier placed on the second carrier mounting table.

Each processing layer transports the substrate from the transfer block as the transfer source of the substrate to the transfer block on the opposite side. The substrate placement part used for substrate transport is arranged between the processing layer and the transfer block. When the substrate is moved back to the transfer block as the transfer source of the substrate, it is necessary to install the two kinds of substrate placement parts, the substrate placement part for transport and the substrate placement part for return, in one transport block Near. Therefore, the number of substrates W that can be placed in each of the substrate placement portion for transportation and the substrate placement portion for retraction is also limited. However, by transporting the substrate from the transfer block as the transfer source of the substrate to the transfer block on the opposite side, the number of substrates that can be placed on the substrate placement portion can be secured. In addition, since the two transfer blocks are transferred alternately, the two transfer blocks can roughly equally share the substrate transfer for loading and unloading the substrate into and out of the carrier and the substrate transfer between the layers.

Furthermore, in the substrate processing apparatus, it is preferable that the first transfer block takes out the substrate from the carrier placed on the first carrier stage, and transports the substrate to the plurality of processing layers. The first processing layer. The first processing layer performs specific processing on the conveyed substrates, and transports the substrates to the second transfer block, and the second transfer block transfers the transferred substrates to the plurality of The second processing layer of the two processing layers, the second processing layer performs specific processing on the conveyed substrate, and transports the substrate to the second transfer block, which will be transferred from the second transfer block to the second transfer block. The substrate processed by the processing layer is moved back to the carrier placed on the second carrier placing table.

In the structure of using the first processing layer and the second processing layer to sequentially perform specific processing on the substrate, the two transfer blocks can share the substrate transfer for loading and unloading the substrate on the carrier and the substrate transfer between the layers.

Furthermore, in the substrate processing apparatus, it is preferable that the second transfer block transfers the substrate processed and conveyed by the second processing layer to the third processing layer among the plurality of processing layers. The processing layer performs specific processing on the conveyed substrate, and transports the substrate to the second transfer block, and the second transfer block moves the substrate processed by the third processing layer back to the loading The above-mentioned carriers of the second carrier table.

In a structure that uses the first processing layer, the second processing layer, and the third processing layer to sequentially perform specific processing on the substrate, the two transfer blocks can share the substrate transport and the interlayer for loading and unloading the substrate on the carrier. The substrate transportation.

Furthermore, in the substrate processing apparatus, it is preferable that the second transfer block is further configured to carry in and out the substrate to an external device, and the second transfer block transfers the substrate processed by the first processing layer To the external device, the second transfer block is carried from the external device to the substrate subjected to the specific processing by the external device, and the loaded substrate is transported to the second processing layer of the plurality of processing layers.

In a structure that uses the first processing layer, the second processing layer and an external device to sequentially perform specific processing on the substrates, two transfer blocks can be used to share the substrate transport for loading and unloading the substrate and the substrate between the layers Transport.

Furthermore, in the substrate processing apparatus, it is preferable that the first transfer block takes out the substrate from the carrier placed on the first carrier stage, and transports the substrate to the plurality of processing layers. The first processing layer. The first processing layer performs specific processing on the conveyed substrates and transfers the substrates to the first transfer block, which transfers the transferred substrates to the plurality of The second processing layer of the two processing layers, the second processing layer performs specific processing on the conveyed substrate, and transports the substrate to the second transfer block, which will be transferred from the second transfer block to the second transfer block. The substrate processed by the processing layer is moved back to the carrier placed on the second carrier placing table.

In the structure of using the first processing layer and the second processing layer to sequentially perform specific processing on the substrate, the two transfer blocks can share the substrate transfer for loading and unloading the substrate on the carrier and the substrate transfer between the layers.

Furthermore, in the substrate processing apparatus, it is preferable that the second transfer block transfers the substrate processed and conveyed by the second processing layer to the third processing layer among the plurality of processing layers. The processing layer performs specific processing on the conveyed substrate, and transports the substrate to the second transfer block, and the second transfer block moves the substrate processed by the third processing layer back to the loading The above-mentioned carriers of the second carrier table.

In a structure that uses the first processing layer, the second processing layer, and the third processing layer to sequentially perform specific processing on the substrates, the two transfer blocks can equally share the substrate transfer for loading and unloading the substrates on the carrier. And substrate transfer between layers.

Furthermore, in the substrate processing apparatus, it is preferable that the second transfer block is further configured to carry in and out the substrate to an external device, and the second transfer block transfers the substrate processed by the second processing layer To the external device, the second transfer block is carried from the external device to the substrate subjected to the specific processing by the external device, and the loaded substrate is transported to the third processing layer of the plurality of processing layers.

In a structure that uses the first processing layer, the second processing layer, the third processing layer and an external device to sequentially perform specific processing on the substrate, the two transfer blocks can share the substrate for loading and unloading the substrate on the carrier. Transfer and transfer of substrates between layers.

Furthermore, in the substrate processing apparatus, it is preferable that the first transfer block takes out the substrate from the carrier placed on the first carrier stage, and transports the substrate to the plurality of processing layers. The first processing layer. The first processing layer performs specific processing on the conveyed substrates and transfers the substrates to the first transfer block, which transfers the transferred substrates to the plurality of The second processing layer of the two processing layers. The second processing layer performs specific processing on the conveyed substrate and transfers the substrate to the first transfer block, which will be transferred to the first transfer block. The substrate is transported to the third processing layer of the plurality of processing layers, and the third processing layer performs specific processing on the transported substrate, and transports the substrate to the second transfer block, and the second transfer area The block moves the substrate processed by the third processing layer back to the carrier placed on the second carrier mounting table.

In a structure that uses the first processing layer, the second processing layer, and the third processing layer to sequentially perform specific processing on the substrate, the two transfer blocks can share the substrate transport and the interlayer for loading and unloading the substrate on the carrier. The substrate transportation.

Furthermore, in the substrate processing apparatus, it is preferable that the second transfer block is further configured to carry in and out the substrate to and from an external device, and the second transfer block is self-mounted on the second carrier stage The carrier takes out the substrate, and transports the substrate to the first processing layer of the plurality of processing layers. The first processing layer performs specific processing on the conveyed substrate, and the substrate is transported to the second transfer Carrier block, the second carrier block carries out the substrate processed by the first processing layer to the external device, and the second carrier block carries the substrate processed by the external device specified by the external device from the external device , And transport the loaded substrate to the second processing layer among the plurality of processing layers. The second processing layer performs specific processing on the conveyed substrate, and transports the substrate to the first transfer block, The first transfer block moves the substrate processed by the second processing layer back to the carrier placed on the first carrier mounting table.

In a structure that uses the first processing layer, the second processing layer and an external device to sequentially perform specific processing on the substrates, two transfer blocks can be used to share the substrate transport for loading and unloading the substrate and the substrate between the layers Transport.

Furthermore, in the substrate processing apparatus, it is preferable that the second transfer block is further configured to carry in and out the substrate to and from an external device, and the second transfer block is self-mounted on the second carrier stage The carrier takes out the substrate, and transports the substrate to the first processing layer of the plurality of processing layers, and the first processing layer performs specific processing on the conveyed substrate, and the substrate is transported to the first transfer The carrier block, the first carrier block transfers the transferred substrate to the second process layer among the plurality of process layers, and the second process layer performs specific processing on the transferred substrate and transports the substrate To the second transfer block, the second transfer block transfers the substrate processed by the second processing layer to the external device, and the second transfer block transfers from the external device to the external device to specify The processed substrates are transported to the third processing layer of the plurality of processing layers. The third processing layer performs specific processing on the substrates that are transported, and transports the substrates to the first processing layer. A transfer block, the first transfer block moves the substrate processed by the third processing layer back to the carrier placed on the first carrier stage.

In a structure that uses the first processing layer, the second processing layer, the third processing layer and an external device to sequentially perform specific processing on the substrate, since the two transfer blocks are transferred alternately, the two transfer blocks can It is used to load and remove substrates from the carrier and transfer the substrates between layers. In addition, the number of substrates that can be placed on the substrate placement portion can be secured by transporting the substrate from the transporting block as the transport source of the substrate to the transporting block on the opposite side.

Furthermore, it is preferable that the substrate processing apparatus further includes a carrier conveying mechanism that conveys the carrier between the first carrier placing table and the second carrier placing table. For example, when all the substrates are taken out from the carrier placed on the first carrier stage, the carrier transport mechanism moves the substrates back to the carrier, so that the substrate can be placed on the first carrier stage. The vehicle is transported to the second vehicle mounting table.

Furthermore, in the substrate processing apparatus, it is preferable that the carrier transport mechanism is mounted on the single processing block. Previously, the carrier conveying mechanism was arranged in a horizontal direction relative to the conveying block. According to the present invention, the carrier conveying mechanism is arranged on the first processing block and the second processing block. Therefore, it is possible to reduce the installation area of the previous carrier conveying mechanism arranged in the horizontal direction with respect to the transfer block. That is, the area occupied by the substrate processing apparatus can be reduced.

In addition, the substrate transport method of the substrate processing apparatus of the present invention includes the following steps: the substrate processing apparatus includes: a first transfer block, which is provided with a first carrier mount, and the first carrier mount is used to mount the A carrier for accommodating a plurality of substrates; and a single processing block, which is connected to the above-mentioned first transfer block, and a plurality of processing layers are arranged in the vertical direction. The above process refers to: taking out the substrate from the carrier placed on the first carrier stage by the first transfer block, and transporting the taken out substrate to any one of the plurality of processing layers By each of the above-mentioned plurality of processing layers, specific processing is performed on the transferred substrate, and the substrate is transported to the second transfer block connected with the above-mentioned single processing block; and by the above-mentioned second The transfer block moves the substrate processed by the processing layer back to the carrier placed on the second carrier set in the second transfer block.

According to the substrate transport method of the present invention, the first transfer block takes out the substrate from the carrier placed on the first carrier stage, and transports the taken out substrate to any one of the plurality of processing layers. In addition, the second transfer block moves the substrate transported from the processing layer back to the carrier placed on the second carrier stage. Thereby, the first transfer block can more quickly transfer the plurality of substrates to the plurality of processing layers arranged in the vertical direction. In addition, at the same time, the second transfer block can more quickly transfer the plurality of substrates transferred from the plurality of processing layers arranged in the vertical direction to the carrier. As a result, the throughput of the substrate processing apparatus can be increased. [Effects of Invention]

According to the substrate processing apparatus and the substrate transport method of the present invention, the throughput can be improved.

[Example 1]

Hereinafter, Embodiment 1 of the present invention will be described with reference to the drawings. In the following description, the surface of the substrate on which various patterns such as circuit patterns are formed is referred to as the front surface, and the surface on the opposite side is referred to as the back surface. In addition, the surface of the substrate facing downward is referred to as the lower surface, and the surface of the substrate facing upward is referred to as the upper surface.

FIG. 1 is a longitudinal cross-sectional view of the substrate processing apparatus 1 of the first embodiment. FIG. 2 is a cross-sectional view of the substrate processing apparatus 1. FIG. 3 is a right side view of the substrate processing apparatus 1. FIG. 4 is a diagram showing a part of the left side of the substrate processing apparatus 1.

Refer to Figure 1 and Figure 2. The substrate processing apparatus 1 includes a first transfer block (hereinafter referred to as the “first ID block” as appropriate) 2, a single processing block 3, and a second transfer block (hereinafter referred to as the “second ID block” as appropriate ") 4, and carrier buffer device 8. The first ID block 2, the processing block 3, and the second ID block 4 are linearly arranged in a row.

(The composition of Block 2 of the first transfer) The first ID block 2 includes two opening mechanisms 9 and 10 (refer to FIGS. 2 and 6) and two substrate transport mechanisms (manipulators) TM1 and TM2. The two opening mechanisms (vehicle placing parts) 9 and 10 provided in the first ID block 2 are respectively used for placing the vehicle C.

The carrier C can accommodate multiple (for example, 25) substrates W in a horizontal posture. The carrier C uses, for example, FOUP (FOUP: Front Open Unified Pod), but it can also be a container other than FOUP (for example, SMIF (Standard Mechanical Inter Face) box). The carrier C includes, for example, a carrier body and a cover formed with an opening for inserting and removing the substrate W, and the cover is used to cover the opening of the carrier body.

Each opening mechanism 9, 10 is provided with: a mounting table 13 for mounting the carrier C; an opening 14 for passing the substrate W; a baffle member (not shown) that opens and closes the opening 14, and Loading and unloading the cover of the carrier body; and a baffle member driving mechanism (not shown), which drives the baffle member. The shutter member drive mechanism includes an electric motor. Furthermore, after removing the cover from the carrier body, the baffle member moves in a downward direction or moves in a horizontal direction (Y direction) along the opening 14 for example.

The placing table 13 is set on the top platform of the processing block 3. As shown in FIG. 1, the mounting table 13 is arranged at a higher position than the processing block 3, that is, above the processing block 3. The mounting table 13 may also be installed on the processing block 3, that is, it may be connected to the upper surface of the processing block 3. In addition, the mounting table 13 corresponds to the first carrier mounting table of the present invention.

Each of the two substrate transport mechanisms TM1 and TM2 includes two hands 21, an advancing and retreating drive section 23, and an up-and-down rotation drive section 25. The two hands 21 each hold the substrate W. In addition, each of the two hands 21 is movably attached to the forward/backward driving unit 23. The advancing and retreating driving part 23 can allow both the two hands 21 to enter the carrier C at the same time. In addition, the advancing and retreating drive unit 23 can individually advance and retreat the two hands 21. Therefore, the advancing and retreating driving unit 23 can allow one of the two hands 21 to enter the carrier C.

The up-and-down rotation driving part 25 raises and lowers and rotates the two hands 21 by raising and lowering the forward and backward driving part 23 and rotates it. That is, the up-and-down rotation drive unit 25 can move the forward and backward drive unit 23 in the vertical direction (Z direction) and can rotate the forward and backward drive unit 23 around the vertical axis AX1. Each of the forward/backward driving unit 23 and the up-and-down rotation driving unit 25 includes an electric motor. Furthermore, the two substrate conveying mechanisms TM1 and TM2 are respectively fixed to the bottom of the first ID block 2 in such a way that they cannot move in the horizontal direction (especially the Y direction).

Between the first ID block 2 and the following six processing layers 3A to 3F, six substrate placement portions PS1A to PS6A are provided. The six substrate placing sections PS1A to PS6A and the following substrate placing sections such as the six substrate placing sections PS1B to PS6B are configured to be capable of placing one or more substrates W. The first substrate transport mechanism TM1 can transport the substrate W between the carrier C placed on the opening mechanism 9 and the six substrate placement portions PS1A to PS6A. The second substrate transport mechanism TM2 can transport the substrate W between the carrier C placed on the opening mechanism 10 and the six substrate placement portions PS1A to PS6A. Furthermore, the first substrate transport mechanism TM1 cannot take out and store the substrate W on the carrier C placed on the opening mechanism 10. In addition, the second substrate transport mechanism TM2 cannot take out and store the substrate W on the carrier C placed on the opening mechanism 9.

(The composition of processing block 3) The processing block 3 is connected to the first ID block 2 and the second ID block 4. That is, the processing block 3 is arranged between the two ID blocks 2 and 4. The processing block 3 performs coating processing on the substrate W.

The processing block 3 includes six processing layers 3A to 3F. The six processing layers 3A to 3F are arranged so as to be stacked in the vertical direction (Z direction). The six processing layers 3A to 3F each include a third substrate transport mechanism TM3, a transport space 27, a liquid processing section 28, and a heat treatment section 29. The six processing layers 3A to 3F have the same configuration.

The third substrate transport mechanism TM3 is for transporting the substrate W in each of the processing layers 3A to 3F. The third substrate transport mechanism TM3 includes two hands 31, an advance and retreat drive section 32, a rotation drive section 33, a first movement mechanism 34, and a second movement mechanism 35.

The two hands 31 hold the substrate W, respectively. The two hands 31 are respectively movably attached to the forward/backward driving unit 32. The advancing and retreating drive unit 32 advances and retreats the two hands 31 individually. The rotation driving part 33 rotates the forward and backward driving part 32 about the vertical axis AX2. In this way, the orientation of the two hands 31 can be changed. The first moving mechanism 34 moves the rotation driving unit 33 in the front and rear direction (X direction) in FIG. 1. Thereby, the advancing and retreating driving unit 32 can be moved in the X direction. The second moving mechanism 35 moves the first moving mechanism 34 in the vertical direction (Z direction). Thereby, the advancing and retreating driving unit 32 can be moved in the Z direction.

In addition, each of the forward and backward drive unit 32, the rotation drive unit 33, the first moving mechanism 34, and the second moving mechanism 35 includes an electric motor.

As shown in FIG. 2, the third substrate transport mechanism TM3 is installed in the transport space 27. The transport space 27 is configured to extend linearly in the horizontal direction (X direction). The liquid treatment unit 28 and the heat treatment unit 29 are arranged so as to sandwich the conveyance space 27.

FIG. 3 is a right side view showing the arrangement of the liquid treatment part 28 of the treatment block 3. Each of the six treatment layers 3A to 3F includes four liquid treatment parts 28. The four liquid treatment parts 28 are arranged in 4 rows in the horizontal direction and 4 rows×1 layer in the vertical direction. The two liquid processing sections 28 on the side of the first ID block 2 among the four liquid processing sections 28 are the coating unit BARC. In addition, the two liquid processing units 28 on the side of the second ID block 4 are the coating unit RESIST. The coating unit BARC forms an anti-reflection film on the substrate W. The coating unit RESIST forms a resist film such as a photoresistance resist on the substrate W.

As shown in FIG. 2, the liquid processing unit 28 includes a holding and rotating unit 37, a nozzle 38, and a nozzle moving mechanism 39. The holding and rotating part 37 holds the lower surface of the substrate W by, for example, vacuum suction, and rotates the held substrate W around the vertical axis (Z direction). The rotating system is performed by, for example, an electric motor. The nozzle 38 supplies a coating liquid (for example, a liquid for forming an anti-reflection film or a photoresist liquid) to the substrate W. The nozzle moving mechanism 39 moves the nozzle 38 to an arbitrary position. The nozzle moving mechanism 39 includes, for example, an electric motor.

FIG. 4 is a diagram showing a part of the left side of the arrangement of the heat treatment part 29 of the treatment block 3. Each of the treatment layers 3A to 3F includes a plurality of heat treatment parts 29. The heat treatment section 29 performs heat treatment, and includes a flat plate 41 on which the substrate W is placed (see FIG. 2). The heating of the flat plate 41 is performed by, for example, a heater, and the cooling of the flat plate 41 is performed by, for example, a water-cooled mechanism.

Among the six treatment layers 3A to 3F, the heat treatment portion 29 is configured to be able to be arranged in 5 rows×3 layers. In FIG. 4, each of the six treatment layers 3A to 3F includes 14 heat treatment parts 29. That is, each of the six processing layers 3A to 3F includes three adhesion strengthening processing parts PAHP, two cooling parts CP, and nine heating and cooling parts PHP. Furthermore, for example, in the processing block 3, the number and types of processing units other than the liquid processing unit 28 and the heat treatment unit 29 can be appropriately changed. For example, the processing unit may also be an edge exposure part EEW for exposing the peripheral part of the substrate W.

The adhesion strengthening treatment part PAHP improves the adhesion between the substrate W and the anti-reflection film by applying an adhesion strengthening agent such as hexamethyldisilazane (HMDS) on the substrate W and heating it. The adhesion strengthening treatment part PAHP also has a function of cooling the substrate W after heating. The cooling part CP cools the substrate W. The heating and cooling part PHP performs heating treatment and cooling treatment in sequence.

(The composition of block 4 of the second transfer) The second ID block 4 is connected to the processing block 3. The second ID block 4 includes two opening mechanisms 45 and 46 (refer to FIG. 6) and two substrate transport mechanisms TM4 and TM5. The two opening mechanisms 45 and 46 provided in the second ID block 4 are respectively equipped with a carrier C capable of accommodating a plurality of substrates W.

Each opening mechanism 45, 46 is provided with the same as the opening mechanism 9: a mounting table 47 for mounting the carrier C; an opening 48 for passing the substrate W; a baffle member (not shown) that opens The part 48 is opened and closed and the cover part of the carrier body is attached and detached; and the baffle member driving mechanism, which drives the baffle member. The shutter member drive mechanism includes an electric motor. Furthermore, after removing the cover from the carrier body, the baffle member moves in a downward direction or moves in a horizontal direction (Y direction) along the opening 48, for example.

The placing table 47 is set on the top platform of the processing block 3. In FIG. 1, the mounting table 47 is set at a position higher than the processing block 3, that is, above the processing block 3. The mounting table 47 can also be installed on the coating block 3, that is, connected to the processing block 3. In addition, the mounting table 47 corresponds to the second carrier mounting table of the present invention.

Each of the substrate transport mechanisms TM4 and TM5 includes two hands 21, an advance and retreat drive section 23, and an up-and-down rotation drive section 25. Each substrate transport mechanism TM4, TM5 is configured to be the same as the substrate transport mechanism TM1 (TM2).

Between the six processing layers 3A to 3F and the second ID block 4, six substrate placement portions PS1B to PS6B are provided. The fourth substrate transport mechanism TM4 can transport the substrate W between the carrier C placed on the opening mechanism 45 and the six substrate placement portions PS1B to PS6B. The fifth substrate transport mechanism TM5 can transport the substrate W between the carrier C placed on the opening mechanism 46 and the six substrate placement portions PS1B to PS6B. Furthermore, the fourth substrate transport mechanism TM4 cannot take out and store the substrate W with respect to the carrier C placed on the opening mechanism 46. In addition, the fifth substrate transport mechanism TM5 cannot take out and store the substrate W with respect to the carrier C placed on the opening mechanism 45.

(Vehicle buffer device 8) The substrate processing apparatus 1 includes, for example, a carrier buffer device 8 on the first ID block 2, the processing block 3, and the second ID block 4, or above it. The carrier buffer device 8 includes a carrier transport mechanism 51 and a carrier storage rack 53 (refer to FIG. 6).

Refer to Figure 5. FIG. 5 is a diagram showing the carrier conveying mechanism 51. The carrier transport mechanism 51 includes two multi-joint arms 61 and 62. A holding portion 63 is provided at one end of the first multi-joint arm 61, and a holding portion 64 is provided at one end of the second multi-joint arm 62. In addition, the other end of the first articulated arm 61 is supported by the pillar-shaped lift drive portion 65 so as to be movable in the up-and-down direction, and the other end of the second articulated arm 62 is supported by the up-and-down direction to be movable. Lifting driving section 65.

The two holding parts 63 and 64 are respectively configured to hold a protrusion provided on the upper surface of the carrier C, for example. Each of the two holding parts 63 and 64 is equipped with an electric motor.

Each of the two multi-joint arms 61 and 62 is equipped with one or two or more electric motors. The first multi-joint arm 61 is configured to enable the first holding portion 63 to rotate 360 degrees around the vertical axis AX3. The second multi-joint arm 62 is configured the same as the first multi-joint arm 61. For example, the first articulated arm 61 may be responsible for the transportation of the carrier C on the upper side of Fig. 6 (the opening mechanism 10, 46 side), and the second articulated arm 62 may be responsible for the lower side of Fig. 6 (the opening mechanism 9, 45 side). ) The transportation of vehicle C.

The lift drive unit 65 is configured to be able to lift the two multi-joint arms 61 and 62 individually. The lift drive unit 65 includes an electric motor. The raising/lowering drive unit 65 may be provided with, for example, a belt and a plurality of pulleys for one articulated arm.

The front-rear drive unit 67 includes a support portion 67A that supports the up-and-down drive unit 65, a longitudinal portion 67B that extends longitudinally in the front-rear direction (X direction), and an electric motor (not shown). For example, the longitudinal portion 67B may be a rail (rail), and the support portion 67A may be a trolley. In this case, it may be configured to move the trolley (support section 67A) along the rail (longitudinal section 67B) by an electric motor.

In addition, for example, an electric motor, a plurality of pulleys, belts, and guide rails may be built in the longitudinal section 67B, and the support section 67A may be fixed to the belt. In this case, an electric motor can also be used to rotate the pulleys to move the belts on the plurality of pulleys, and the supporting portion 67A can move along the guide rail.

Refer to Figure 6. The carrier storage rack 53 includes an input port 71, an output port 72, an unprocessed substrate carrier rack 73, an empty carrier rack 74, and a processed substrate carrier rack 75. The input port 71 is used to receive the carrier C containing the unprocessed substrate W from the external transport mechanism OHT (Overhead Hoist Transport). The external transport mechanism OHT transports the carrier C in the factory. The so-called unprocessed means that the processing performed by the processing block 3 has not been performed. As shown in FIGS. 1 and 6, the input port 71 is set on the ID block 2, that is, on the top platform of the ID block 2. Above the ID block 2, a track 77 of the external transport mechanism OHT is provided. The external transport mechanism OHT transports the carrier C to any one of the two input ports 71.

In addition, in FIG. 6, the unprocessed substrate carrier rack 73 and the processed substrate carrier rack 75 are arranged in the longitudinal direction of the substrate processing apparatus 1 along the longitudinal portion 67B. The unprocessed substrate carrier 73 mounts a carrier C that is placed in the input port 71 and accommodates an unprocessed substrate W that cannot be transported to any of the two placing tables 13. The empty carrier rack 74 mounts the carrier C whose substrate W has been completely taken out from the mounting table 13 and cannot be transported to any of the two mounting tables 47. The empty carrier rack 74 is set on the second ID block 4, that is, on the top platform of the second ID block 4. The processed substrate carrier rack 75 mounts a carrier C that stores the processed substrate W and cannot be transported to any of the two output ports 72. The so-called processed means that it has been processed by the processing block 3.

The output port 72 is used to deliver the carrier C containing the processed substrate W to the rack of the external transport mechanism OHT. As shown in FIGS. 1 and 6, the output port 72 is arranged on the ID block 2, that is, on the top platform of the ID block 2. The carrier conveying mechanism 51 can freely move the carrier C between the respective mounting tables 13, 47 and the respective racks 71-75.

Moreover, as shown in Figures 1 and 6, the mounting table 13 and the opening 14 (opening mechanisms 9, 10) are provided on the side of the processing block 3, and the mounting table 47 and the opening 48 (opening mechanisms 45, 46) are provided on the processing block 3 side. Block 3 side. That is, the mounting table 13 and the mounting table 47 are provided so as to face each other. Thereby, the mounting table 13 and the mounting table 47 are installed toward the carrier conveying mechanism 51, so the carrier conveying mechanism 51 can easily convey the carrier C. As shown in FIG. Also, for example, when a mounting table is provided on the opposite side of the processing block 3 (refer to arrow AR2 in FIG. 6) across the first ID block 2 as before, the mounting table 13 protrudes. However, since the mounting table 13 and the mounting table 47 are provided so as to face each other, the mounting table 13 can be suppressed from protruding. Therefore, the area occupied by the substrate processing apparatus 1 can be reduced.

Furthermore, the carrier conveying mechanism 51 has two sets of multi-joint arms and holding parts, but it may also have one set or more than three sets of multi-joint arms and holding parts. In addition, the raising/lowering drive unit 65 may be configured to rotate and drive about a vertical axis with respect to the support portion 67A. In addition, the track 77 may pass through a position other than the position above the first ID block 2. In this case, an input port 71 and an output port 72 are provided at a position above the track passing device 1. The number and types of the vehicle storage racks 53 can be changed appropriately.

Furthermore, as shown in FIG. 2, the substrate processing apparatus 1 includes one or a plurality of control units 79 and operation units 80. The control unit 79 includes, for example, a central processing unit (CPU). The control unit 79 controls each configuration of the substrate processing apparatus 1. The operation unit 80 includes a display unit (for example, a liquid crystal display), a memory unit, and an input unit. The memory unit includes, for example, at least one of a ROM (Read-Only Memory), a RAM (Random-Access Memory), and a hard disk. The input unit has at least one of a keyboard, a mouse, a touch panel, and various buttons. Various conditions of substrate processing and operation programs required for the control of the substrate processing apparatus 1 are stored in the memory portion.

<Operation of Substrate Processing Device 1> Next, the operation of the substrate processing apparatus 1 will be described. Furthermore, a plurality of processing steps performed in the substrate processing apparatus 1 is an example, and the operator selects the necessary steps. Refer to Figure 1. The external transport mechanism OHT transports the carrier C to the input port 71 provided on the first ID block 2. The carrier conveying mechanism 51 conveys the carrier C from the input port 71 to, for example, the mounting table 13 of the opening mechanism 9. The baffle part of the opening mechanism 9 removes the cover part of the carrier C and holds the cover part, and opens the opening part 14 at the same time.

(Step S01) 1st ID block 2 The first ID block 2 takes out the substrate W from the carrier C placed on the mounting table 13 of any of the two opening mechanisms 9, 10, and transports the taken out substrate W to one of the six processing layers 3A to 3F Either. For example, the first substrate transport mechanism TM1 takes out the substrate W from the carrier C placed on the mounting table 13 of the opening mechanism 9. The first substrate transport mechanism TM1 transports the taken-out substrate W to, for example, the substrate placement portion PS1A. In addition, the first substrate transport mechanism TM1 transports the taken-out substrate W to, for example, the processing layers 3A to 3F substantially evenly. Furthermore, the second substrate transport mechanism TM2 takes out the substrate W from the carrier C placed on the mounting table 13 of the opening mechanism 10.

Furthermore, when all the substrates W are taken out from the carrier C, the opening mechanism 9 closes the opening 14 with the shutter while attaching the cover to the carrier C. After that, the carrier conveying mechanism 51 replaces the carrier C that becomes empty after the substrate W is taken out with another carrier C in which the unprocessed substrate W is stored. Then, the empty carrier C is transported to the placing table 47 of the opening mechanism 45, for example. When the empty carrier C cannot be transported to any one of the opening mechanisms 45 and 46, the carrier transport mechanism 51 transports the empty carrier C to the empty carrier rack 74.

(Step S02) Processing block 3 The processing layers 3A to 3F of the processing block 3 apply coating processing to the substrate W that has been transported, and the substrate W that has been coated is transported to the second ID block 4. It will be explained in detail.

For example, in the processing layer 3A of the processing block 3, the third substrate transport mechanism TM3 receives the substrate W from the substrate placement portion PS1A. The third substrate transport mechanism TM3 transports the received substrate W in the order of the adhesion strengthening processing part PAHP, the cooling part CP, and the coating unit BARC shown in FIG. 3 or FIG. 4. Thereafter, the third substrate transport mechanism TM3 transports the substrate W on which the antireflection film is formed by the coating unit BARC in the order of the heating and cooling unit PHP, the cooling unit CP, the coating unit RESIST, and the heating and cooling unit PHP. The third substrate transport mechanism TM3 transports the substrate W on which the resist film has been formed by the coating unit RESIST to the substrate placement portion PS1B. In addition, the processing layers 3B to 3F, similar to the processing layer 3A, apply the coating process to the transferred substrate W. Furthermore, it is also possible to omit the process of using the adhesion strengthening treatment part PAHP.

(Step S03) 2nd ID block 4 The second ID block 4 moves the substrate W processed by any one of the processing layers 3A to 3F back to the carrier C placed on the placing table 47 of any one of the two opening mechanisms 45 and 46. It will be explained in detail. The carrier C of the mounting table 47 is brought into a state in which the opening 48 is opened by the opening mechanism 45. The fourth substrate transport mechanism TM4 receives the substrate W from the substrate placement portion PS1B, and moves the received substrate W back to the carrier C placed on the placement table 47 of the opening mechanism 45. Furthermore, the substrate W is moved back to the carrier C stored before the coating process. That is, the substrate W is moved back to the original carrier C. In addition, when the substrate W is moved back to the carrier C placed on the mounting table 47 of the opening mechanism 46, the fifth substrate transport mechanism TM5 is used.

After all the processed substrates W are stored in the carrier C, the opening mechanism 45 closes the opening 48 while mounting the cover on the carrier C. The carrier transport mechanism 51 transports the carrier C containing the processed substrate W from the placing table 47 of the opening mechanism 45 to the output port 72. After that, the external transport mechanism OHT transports the carrier C from the output port 72 to the next destination.

The effect of this embodiment is explained. FIG. 7 is a diagram for explaining the operation of the conventional substrate processing apparatus. FIG. 8 is a diagram for explaining the operation when the processing block 3 has a single processing layer. In FIG. 7, the substrate conveying process using the ID block 102 of the conventional substrate processing apparatus 101 includes a conveying process and a moving back process. The conveying process is a process of taking out the substrate W from the carrier C placed on the carrier placing table 113 and transporting the taken out substrate W to the processing block 103. In addition, the moving back process is a process of receiving the substrate W processed by the processing block 103 from the processing block 103 and moving the received substrate W back to the carrier C placed on the carrier stage 113 described above.

According to this embodiment, the first ID block 2 takes out the substrate W from the carrier C placed on the mounting table 13, and transports the taken out substrate W to any of the six processing layers 3A to 3F (refer to FIG. 1) One (transportation process). In addition, the second ID block 4 moves the substrate W transported from each of the six processing layers 3A to 3F back to the carrier C placed on the mounting table 47 (return process). That is, as shown in FIG. 8, the two ID blocks 2 and 4 share the substrate transportation (conveying process and moving back process) for loading and unloading the substrate W into the carrier C. Thereby, the 1st ID block 2 can convey more board|substrates W more quickly to the 6 processing layers 3A-3F (refer FIG. 1) arrange|positioned in the up-down direction. In addition, at the same time, the second ID block 4 can transport the plurality of substrates W transported from the six processing layers 3A to 3F arranged in the vertical direction to the carrier C more quickly. As a result, the throughput of the substrate processing apparatus 1 can be increased.

Moreover, as shown in FIG. 1, the substrate processing apparatus 1 includes a carrier transport mechanism 51 that transports the carrier C between the placing table 13 and the placing table 47. For example, when all the substrates W have been taken out from the carrier C placed on the stage 13, the carrier transport mechanism 51 may move the substrate W back to the carrier C by placing the substrate W on the carrier 13 The tool C is transported to the mounting table 47.

In addition, the carrier transport mechanism 51 is mounted on the single processing block 3. Previously, the carrier conveying mechanism was arranged in a horizontal direction with respect to the first ID block 2. According to the present invention, the carrier transport mechanism 51 is mounted on the single processing block 3. Therefore, it is possible to reduce the installation area of the previous carrier conveying mechanism arranged in the horizontal direction with respect to the first ID block 2. That is, the area occupied by the substrate processing apparatus 1 can be reduced.

In addition, the substrate processing apparatus 1 includes a carrier storage rack 53 mounted on the first ID block 2, the processing block 3, and the second ID block 4. The carrier transport mechanism 51 transports the carrier C between the placing table 13, the placing table 47 and the carrier storage rack 53. Previously, the carrier storage rack 53 is arranged in a horizontal direction relative to the first ID block 2. According to the present invention, the carrier storage rack 53 is mounted on the processing block 3, for example. Therefore, the installation area of the previous carrier storage rack installed in the horizontal direction with respect to the first ID block 2 can be reduced. That is, the area occupied by the substrate processing apparatus 1 can be reduced. [Example 2]

Next, the second embodiment of the present invention will be described with reference to the drawings. In addition, the description overlapping with Embodiment 1 is omitted.

In Example 1, the six processing layers 3A to 3F respectively formed a resist film after forming an anti-reflection film on the substrate W. That is, the six treatment layers 3A to 3F have been subjected to the same coating treatment as each other. In contrast, in Example 2, one treatment layer may perform the first coating treatment on the substrate W, and the other treatment layer may perform the second coating treatment on the substrate W that has been subjected to the first coating treatment.

FIG. 9 is a right side view showing the arrangement of the liquid treatment part 28 of the treatment block 3 of the second embodiment. In the treatment block 3, the three treatment layers 3A to 3C on the lower side are subjected to the first coating treatment to form an anti-reflective film, and the three treatment layers 3D to 3F on the upper side are subjected to the second coating treatment to form a resist film. .

In addition, in FIG. 9, between the second ID block 4 and the three processing layers 3D to 3F, there are provided substrate placement portions PS4B to PS6B for transportation and substrate placement portions PS4D to PS6D for retraction.

<Operation of Substrate Processing Device 1> Next, the operation of the substrate processing apparatus 1 of this embodiment will be described. Refer to Figure 9.

(Step S11) The first ID block 2 The first ID block 2 takes out the substrate W from the carrier C placed on the mounting table 13 of any of the two opening mechanisms 9, 10, and transports the taken out substrate W to one of the three processing layers 3A to 3C Either. For example, the first substrate transport mechanism TM1 takes out the substrate W from the carrier C placed on the mounting table 13 of the opening mechanism 9. The first substrate transport mechanism TM1 transports the taken-out substrate W to the substrate placement portion PS1A. In addition, the first substrate transport mechanism TM1 transports the taken-out substrate W to, for example, the processing layers 3A to 3C substantially evenly.

Furthermore, when the first substrate transport mechanism TM1 is used to take out all the substrates W from the carrier C of the opening mechanism 9, the carrier transport mechanism 51 transports the empty carrier C to the placing table 47 of the opening mechanism 45 (refer to FIG. The dotted arrow between the carrier C of the mounting table 13 and the carrier C of the mounting table 47 shown in 9).

(Step S12) Processing layers 3A to 3C of processing block 3 (first coating processing) The processing layers 3A to 3C of the processing block 3 perform the first coating process (for example, forming an anti-reflection film) on the conveyed substrate W, and the substrate W that has undergone the first coating process is transported to the second ID block 4. It will be explained in detail.

For example, in the processing layer 3A of the processing block 3, the third substrate transport mechanism TM3 shown in FIG. 1 receives the substrate W from the substrate placement portion PS1A. The third substrate transport mechanism TM3 transports the received substrate W in the order of the adhesion strengthening processing part PAHP, the cooling part CP, and the coating unit BARC. In the coating unit BARC, an anti-reflection film is formed on the substrate W. The third substrate transport mechanism TM3 transports the substrate W on which the anti-reflection film has been formed by the coating unit BARC to the substrate placement portion PS1B. In addition, the processing layers 3B and 3C are the same as the processing layer 3A, and the first coating processing is performed on the substrate W that has been transported.

(Step S13) 2nd ID block 4 The second ID block 4 transports the substrate W processed by the processing layer 3A from the processing layer 3A to the processing layer 3D where the second coating process is performed. That is, one of the two substrate transport mechanisms TM4 and TM5 transports the substrate W from the substrate placement section PS1B shown in FIG. 9 to the substrate placement section PS4B. Furthermore, the substrate W that has been subjected to the first coating process by the processing layer 3B is transported to the processing layer 3E. The substrate W subjected to the first coating process by the processing layer 3C is transported to the processing layer 3F.

(Step S14) Processing layer 3D～3F of processing block 3 (second coating processing) The processing layers 3D to 3F of the processing block 3 perform the second coating process (for example, forming a resist film) on the transported substrate W, and the substrate W that has undergone the second coating process is moved back to the second ID Block 4. It will be explained in detail.

In the processing layer 3D of the processing block 3, the third substrate transport mechanism TM3 shown in FIG. 1 receives the substrate W from the substrate placement portion PS4B. As shown in FIGS. 4 and 9, the third substrate transport mechanism TM3 transports the received substrate W in the order of the heating and cooling part PHP, the cooling part CP, the coating unit RESIST, and the heating and cooling part PHP. The third substrate transport mechanism TM3 transports the substrate W on which the resist film has been formed by the coating unit RESIST to the substrate placement portion PS4D. In addition, the processing layers 3E and 3F are the same as the processing layer 3D, and the substrate W that has been transported is subjected to the second coating process.

(Step S15) 2nd ID block 4 The second ID block 4 moves the substrate W processed by any one of the processing layers 3D to 3F back to the carrier C placed on the placing table 47 of any one of the two opening mechanisms 45 and 46. It will be explained in detail. The carrier C of the mounting table 47 is brought into a state in which the opening 48 is opened by the opening mechanism 45. The fourth substrate transport mechanism TM4 receives the substrate W from the substrate placement portion PS4D, and moves the received substrate W back to the carrier C placed on the placement table 47 of the opening mechanism 45. Furthermore, the substrate W is moved back to the carrier C stored before the coating process. In addition, when the substrate W is moved back to the carrier C placed on the mounting table 47 of the opening mechanism 46, the fifth substrate transport mechanism TM5 is used.

＜Other operation examples＞ Furthermore, the processing block 3 shown in FIG. 9 can also operate as shown in FIG. 10. In FIG. 10, between the first ID block 2 and the three processing layers 3A to 3C, there are provided substrate placement portions PS1A to PS3A for transportation and substrate placement portions PS1C to PS3C for retraction.

The first ID block 2 takes out the substrate W from the carrier C placed on the mounting table 13 of any of the two opening mechanisms 9, 10, and transports the taken out substrate W to one of the three processing layers 3A to 3C Either. The processing layers 3A to 3C of the processing block 3 perform the first coating process (for example, forming an anti-reflection film) on the conveyed substrate W, and the substrate W that has undergone the first coating process is moved back to the first ID zone Block 2. For example, in the processing layer 3A, the third substrate transport mechanism TM3 receives the substrate W from the substrate placement section PS1A, performs the first coating process, and then transports the substrate W that has undergone the first coating process to the substrate placement section PS1C .

The first ID block 2 transports the substrate W processed by the processing layer 3A from the processing layer 3A to the processing layer 3D where the second coating process is performed. The processing layers 3D to 3F of the processing block 3 perform the second coating process (for example, forming a resist film) on the conveyed substrate W, and the substrate W subjected to the second coating process is transported to the second ID zone Block 4. The second ID block 4 moves the substrate W processed by any one of the processing layers 3D to 3F back to the carrier C placed on the placing table 47 of any one of the two opening mechanisms 45 and 46.

According to this embodiment, for example, in a configuration that uses the processing layer 3A and the processing layer 3D to sequentially apply different coating treatments to the substrate W, the two ID blocks 2, 4 can share the loading and unloading of the substrate for the carrier C. W substrate transport and inter-layer substrate transport. [Example 3]

Next, the third embodiment of the present invention will be described with reference to the drawings. In addition, the description overlapping with Embodiments 1 and 2 is omitted.

In Example 1, the six processing layers 3A to 3F respectively formed a resist film after forming an anti-reflection film on the substrate W. That is, the six treatment layers 3A to 3F have been subjected to the same coating treatment as each other. In contrast, in Example 2, one treatment layer may perform the first coating treatment on the substrate W, and the other treatment layer may perform the second coating treatment on the substrate W subjected to the first coating treatment. In addition, the other treatment layer may perform the third coating treatment on the substrate W that has been subjected to the second coating treatment.

FIG. 11 is a right side view showing the arrangement of the liquid treatment part 28 of the treatment block 3 of the third embodiment. In the treatment block 3, the two treatment layers 3A and 3B on the lower side are subjected to the first coating treatment to form an anti-reflective film, and the two treatment layers 3C and 3D in the middle are subjected to the second coating treatment to form a resist film. . Then, the two upper processing layers 3E and 3F are subjected to a third coating process for forming a resist protective film. The coating unit for forming a resist protective film includes, for example, a holding and rotating part 37, a nozzle 38, and a nozzle moving mechanism 39 (see FIG. 2). The resist protection film is, for example, a film having water repellency. In addition, the first coating treatment, the second coating treatment, and the third coating treatment may form the following films. That is, the first coating process forms an underlayer film (SOC: Spin On Carbon), the second coating process forms an interlayer film (SOG: Spin On Glass), and the third coating process forms a resist Etching agent film.

<Operation of Substrate Processing Device 1> Next, the operation of the substrate processing apparatus 1 of this embodiment will be described. Refer to Figure 11.

(Step S21) The first ID block 2 The first ID block 2 takes out the substrate W from the carrier C placed on the table 13 of any of the two opening mechanisms 9, 10 (refer to FIG. 6), and transports the taken out substrate W to two processes Either layer 3A, 3B. For example, the first substrate transport mechanism TM1 takes out the substrate W from the carrier C placed on the mounting table 13 of the opening mechanism 9. The first substrate transport mechanism TM1 transports the taken-out substrate W to the substrate placement portion PS1A.

(Step S22) Treatment layer 3A, 3B of treatment block 3 (first coating treatment) Each processing layer 3A, 3B of the processing block 3 performs a first coating process (for example, forming an anti-reflection film) on the conveyed substrate W, and the substrate W that has been subjected to the first coating process is transported to the second ID block 4. For example, in the processing layer 3A of the processing block 3, the third substrate transport mechanism TM3 shown in FIG. 1 receives the substrate W from the substrate placement portion PS1A. The third substrate transport mechanism TM3 transports the received substrate W in the order of the adhesion strengthening processing part PAHP, the cooling part CP, and the coating unit BARC. The third substrate transport mechanism TM3 transports the substrate W on which the anti-reflection film has been formed by the coating unit BARC to the substrate placement portion PS1B.

(Step S23) 2nd ID block 4 The second ID block 4 transports the substrate W processed by the processing layer 3A from the processing layer 3A to the processing layer 3C where the second coating process is performed. That is, one of the two substrate transport mechanisms TM4 and TM5 transports the substrate W from the substrate placement section PS1B shown in FIG. 11 to the substrate placement section PS3B. Furthermore, the substrate W subjected to the first coating process by the processing layer 3B is transported to the processing layer 3D.

(Step S24) Processing layer 3C, 3D of processing block 3 (second coating processing) Each processing layer 3C, 3D of the processing block 3 performs a second coating process (for example, forming a resist film) on the conveyed substrate W, and the substrate W subjected to the second coating process is transported to the first ID zone Block 2. For example, in the processing layer 3C of the processing block 3, the third substrate transport mechanism TM3 shown in FIG. 1 receives the substrate W from the substrate placement portion PS3B. The third substrate transport mechanism TM3 transports the received substrate W in the order of the heating and cooling unit PHP, the cooling unit CP, the coating unit RESIST, and the heating and cooling unit PHP. The third substrate transport mechanism TM3 transports the substrate W on which the resist film has been formed by the coating unit RESIST to the substrate placement portion PS3A.

(Step S25) The first ID block 2 The first ID block 2 transports the substrate W processed by the processing layer 3C from the processing layer 3C to the processing layer 3E where the third coating processing is performed. That is, one of the two substrate transport mechanisms TM1 and TM2 transports the substrate W from the substrate placement section PS3A shown in FIG. 11 to the substrate placement section PS5A. Furthermore, the substrate W subjected to the second coating process by the processing layer 3D is transported to the processing layer 3F.

(Step S26) Processing layer 3E, 3F of processing block 3 (third coating processing) The processing layers 3E and 3F of the processing block 3 perform the third coating process (for example, forming a resist protective film) on the conveyed substrate W, and the substrate W subjected to the third coating process is transported to the second ID zone Block 4. For example, in the processing layer 3E of the processing block 3, the third substrate transport mechanism TM3 shown in FIG. 1 receives the substrate W from the substrate placement portion PS5A. The third substrate transport mechanism TM3 transports the received substrate W in the order of the coating unit forming the resist protective film and the heating and cooling part PHP. The third substrate transport mechanism TM3 transports the substrate W on which the resist protective film has been formed to the substrate mounting portion PS5B. Furthermore, the substrate W processed by the heating and cooling section PHP may be transported to the edge exposure section EEW, and the substrate W processed by the edge exposure section EEW may be transported to the substrate placement section PS5B.

(Step S27) 2nd ID block 4 The second ID block 4 moves the substrate W processed by any one of the processing layers 3E and 3F back to the carrier placed on the placing table 47 of any of the two opening mechanisms 45 and 46 (refer to FIG. 6) C. It will be explained in detail. The fourth substrate transport mechanism TM4 receives the substrate W from the substrate placement portion PS5B, and moves the received substrate W back to the carrier C placed on the placement table 47 of the opening mechanism 45.

According to this embodiment, each processing layer 3A to 3F transports the substrate W from the ID block as the transfer source of the substrate W to the ID block on the opposite side thereof (for example, from the first ID block 2 to the second ID block 4) . The substrate placement parts PS1A to PS6A used for substrate transportation are provided between the processing layers 3A to 3F and the first ID block 2. In addition, the substrate mounting portions PS1B to PS6B are provided between the processing layers 3A to 3F and the second ID block 4. When the substrate W is moved back to the ID block as the transfer source of the substrate W (for example, when the substrate W transferred from the first ID block 2 is moved back to the first ID block 2), it must Two types of substrate placing sections, the substrate placing section for transportation and the substrate placing section for returning, are installed in the vicinity of an ID block (for example, refer to the substrate placing sections PS2A and PS2C shown in FIG. 10). Therefore, the number of substrates W that can be placed in each of the substrate placement portion for transportation and the substrate placement portion for retraction is also limited. However, by transporting the substrate from the ID block which is the transport source of the substrate W to the ID block on the opposite side, the number of substrates W that can be placed on the substrate placing portion can be secured. In addition, since the two ID blocks 2 and 4 are transported alternately, the two ID blocks 2, 4 can substantially equally share the transfer of the substrate between the layers.

Next, other operation examples will be described with reference to FIGS. 12A to 12C. Furthermore, in FIGS. 12A to 12C, the processing block 3 includes three processing layers 3A, 3C, and 3E. Furthermore, as described above, the processing layer 3A forms an anti-reflection film for the substrate W, for example, and the processing layer 3C forms a resist film for the substrate W, for example. In addition, the processing layer 3E forms a resist protection film with respect to the substrate W, for example.

＜Other operation example 1＞ Refer to Figure 12A. The first ID block 2 takes out the substrate W from the carrier C of the mounting table 13, and transports the taken out substrate W to the processing layer 3A. The substrate W transferred to the processing layer 3A is transferred to the second ID block 4, the processing layer 3C, the second ID block 4, the processing layer 3E, and the second ID block 4 in this order. Then, the second ID block 4 stores the substrate W processed by the processing layer 3E on the carrier C of the mounting table 47. Furthermore, the three treatment layers 3A, 3C, and 3E are respectively subjected to preset coating treatments.

＜Other operation example 2＞ Refer to Figure 12B. The first ID block 2 takes out the substrate W from the carrier C of the mounting table 13, and transports the taken out substrate W to the processing layer 3A. The substrate W transferred to the processing layer 3A is transferred to the first ID block 2, the processing layer 3C, the first ID block 2, the processing layer 3E, and the second ID block 4 in this order. The second ID block 4 stores the substrate W processed by the processing layer 3E on the carrier C of the mounting table 47. Furthermore, the three treatment layers 3A, 3C, and 3E are respectively subjected to preset coating treatments.

According to other operation examples 1 and 2, for example, in a configuration in which the processing layers 3A, 3C, and 3E are used to sequentially apply different coating treatments to the substrate W, the two ID blocks 2, 4 can be shared and used for the carrier C. The substrate transport for placing and removing the substrate W, and the substrate transport between layers.

＜Other operation example 3＞ Refer to Figure 12C. The first ID block 2 takes out the substrate W from the carrier C of the mounting table 13, and transports the taken out substrate W to the processing layer 3A. The substrate W transferred to the processing layer 3A is transferred to the first ID block 2, the processing layer 3C, the second ID block 4, the processing layer 3E, and the second ID block 4 in this order. The second ID block 4 stores the substrate W processed by the processing layer 3E on the carrier C of the mounting table 47. Furthermore, the three treatment layers 3A, 3C, and 3E are respectively subjected to preset coating treatments.

In the case of this operation example, the first ID block 2 transports the substrate W between the two processing layers 3A and 3C, and the second ID block 4 transports the substrate W between the two processing layers 3C and 3D. According to this example of operation, for example, in a configuration in which the substrate W is sequentially coated with different coating processes using the processing layers 3A, 3C, and 3E, the two ID blocks 2, 4 can be equally shared for the carrier C The substrate transport for placing and removing the substrate W, and the substrate transport between layers. In particular, the two ID blocks 2 and 4 can be used to equally share the transfer of the substrate between the two processing layers. Therefore, the board transfer can be performed more simply. [Example 4]

Next, the fourth embodiment of the present invention will be described with reference to the drawings. In addition, the description overlapping with Examples 1 to 3 is omitted.

In Embodiment 1, the second ID block 4 is connected to the processing block 3, and a mounting table 47 (opening mechanisms 45, 46) is provided. In this regard, in the present embodiment, the second ID block 4 is further configured to carry in and out the substrate W with respect to the exposure device EXP.

FIG. 13 is a longitudinal cross-sectional view of the substrate processing apparatus 1 of the fourth embodiment. FIG. 14 is a cross-sectional view of the substrate processing apparatus 1. FIG. 15 is a right side view of the substrate processing apparatus 1. FIG. 16 is a diagram showing a part of the left side of the substrate processing apparatus 1.

As shown in FIG. 13, the 2nd ID block 4 is comprised so that the board|substrate W is carried in and carried out with respect to the exposure apparatus EXP. The second ID block 4 also functions as an interface block. The second ID block 4 is equipped with 3 substrate transport mechanisms TM4 to TM6, multiple pre-exposure cleaning units 161, multiple post-exposure cleaning units 162, heating and cooling part PHP (PEB), and 3 mounting and cooling parts P-CP And the placement part PS9.

The fourth substrate transport mechanism TM4 and the fifth substrate transport mechanism TM5 are arranged so as to be aligned in the Y direction orthogonal to the front-rear direction (X direction). The sixth substrate transport mechanism TM6 is arranged behind the two substrate transport mechanisms TM4 and TM5 (right side in FIG. 14). The pre-exposure cleaning unit 161 and the post-exposure cleaning unit 162 are provided so as to face each other across two substrate transport mechanisms TM4 and TM5. Three cleaning units 161 and two cleaning units 162 are provided on both sides of the fourth substrate transport mechanism TM4 side and the fifth substrate transport mechanism TM5 side (refer to FIGS. 14 and 15).

The pre-exposure cleaning unit 161 cleans and dries the substrate W before exposure processing. The post-exposure cleaning unit 162 cleans and dries the exposed substrate W. Each of the cleaning units 161 and 162 includes a holding and rotating part that holds the substrate W, and a nozzle that sprays cleaning liquid and rinsing liquid onto the substrate W, for example. In addition, each cleaning unit 161, 162 may also use a brush or the like to polish the back surface and the end portion (slope portion) of the substrate W. In addition, the back surface of the substrate W refers to, for example, the surface on the opposite side of the surface on which the circuit pattern is formed.

As shown in FIG. 14, the heating-cooling part PHP of the IF block 6 is provided so that it may oppose via the 6th board|substrate conveyance mechanism TM6. On the side of the fourth substrate transport mechanism TM4 (refer to FIGS. 14 and 15), six heating and cooling parts PHP are arranged in the vertical direction. In addition, on the side of the fifth substrate transport mechanism TM5 (see FIG. 14), the six heating and cooling parts PHP are also arranged in the vertical direction.

Between the three substrate transport mechanisms TM4 to TM6, three placement and cooling parts P-CP and a placement part PS9 are provided (see FIGS. 13 and 14). The three transfer and cooling parts P-CP and the substrate transfer part PS9 are arranged in the vertical direction.

The fourth substrate transport mechanism TM4 can be mounted on 8 substrate placement parts PS1B～PS7B, PS9, 3 placement and cooling parts P-CP, cleaning units 161, 162, heating and cooling parts PHP, and the opening mechanism 45. The substrate W is transferred between the tools C.

The fifth substrate transport mechanism TM5 can be placed on the 8 substrate placement parts PS1B～PS7B, PS9, 3 placement and cooling parts P-CP, cleaning units 161, 162, heating and cooling parts PHP, and the opening mechanism 46. The substrate W is transferred between the tools C.

The sixth substrate transport mechanism TM6 can transport the substrate W between the substrate placement part PS9, the three placement and cooling parts P-CP, and the external exposure device EXP. Each of the three substrate transport mechanisms TM4 to TM6 is configured to be substantially the same as, for example, the first substrate transport mechanism TM1, so the description thereof will be omitted.

Between the first ID block 2 and the seven processing layers 3A to 3G, seven substrate placement portions PS1A to PS7A are arranged. In addition, between the seven processing layers 3A to 3G and the second ID block 4, seven substrate placement portions PS1B to PS7B are arranged.

(The composition of processing block 3) Refer to Figure 15. The processing block 3 includes seven processing layers 3A to 3G. The seven processing layers 3A to 3G are arranged to be stacked in the vertical direction (Z direction). The two processing layers 3A and 3B on the lower side are provided with a coating unit BARC for forming an anti-reflection film on the substrate W. The two processing layers 3C and 3D in the middle are provided with a coating unit RESIST for forming a resist film on the substrate W.

In addition, the three upper processing layers 3E to 3G (3E, 3F, 3G) are provided with four developing units DEV as the liquid processing section 28. The developing unit DEV performs development processing on the exposed substrate W. The 4 developing units DEV are arranged in 4 rows×1 layer. The nozzle 38 shown in Figure 14 supplies the developer.

Moreover, as shown in the treatment layer 3G of FIG. 16, the heat treatment portions 29 of the three treatment layers 3E to 3G are configured to be arranged in 5 rows×3 layers. Each of the three processing layers 3E to 3G includes one cooling part CP and 12 heating and cooling parts PHP. In addition, the number and types of units other than the liquid treatment unit 28 and the heat treatment unit 29 can be appropriately changed. In addition, FIG. 16 shows the arrangement of the heat treatment section 29 of the three treatment layers 3A, 3C, and 3G with the seven treatment layers 3A to 3G as a representative. The two treatment layers 3B and 3D are respectively provided with a heat treatment portion 29 in the same manner as the treatment layer 3A and the treatment layer 3C. In addition, the treatment layers 3E and 3F are each provided with a heat treatment portion 29 in the same manner as the treatment layer 3G.

<Operation of Substrate Processing Device 1> Next, the operation of the substrate processing apparatus 1 of this embodiment will be described. Refer to Figure 15.

(Step S31) 2nd ID block 4 The second ID block 4 takes out the substrate W from the carrier C placed on any one of the two opening mechanisms 45 and 46 of the table 47, and transports the taken out substrate W to one of the two processing layers 3A, 3B Either. It will be explained in detail. In the second ID block 4, for example, the fourth substrate transport mechanism TM4 takes out the substrate W from the carrier C placed on the placement table 47 of the opening mechanism 45, and transports the taken out substrate W to the substrate placement portion PS1B.

(Step S32) Processing layer 3A, 3B of processing block 3 (first coating processing) The processing layers 3A and 3B each perform a first coating process (for example, forming an anti-reflection film) on the transported substrate W, and transport the substrate W after the first coating process to the first ID block 2. For example, in the processing layer 3A of the processing block 3, the third substrate transport mechanism TM3 shown in FIG. 13 and FIG. 14 receives the substrate W from the substrate placement portion PS1B, and transports the received substrate W to at least the coating unit BARC. After that, the third substrate transport mechanism TM3 transports the substrate W on which the antireflection film is formed by the coating unit BARC to the substrate placement portion PS1A.

(Step S33) 1st ID block 2 The first ID block 2 performs the first coating process, and transports the transported substrate W to the processing layer 3C. That is, one of the two substrate transport mechanisms TM1 and TM2 transports the substrate W from the substrate placement section PS1A shown in FIG. 15 to the substrate placement section PS3A. Furthermore, the substrate W subjected to the first coating process by the processing layer 3B is transported to the processing layer 3D (that is, transported from the substrate placing portion PS2A to PS4A).

(Step S34) Processing layer 3C, 3D of processing block 3 (second coating processing) Each of the processing layers 3C and 3D performs a second coating process (for example, forming a resist film) on the conveyed substrate W, and conveys the substrate W after the second coating process to the second ID block 4. For example, in the processing layer 3C of the processing block 3, the third substrate transport mechanism TM3 shown in FIGS. 13 and 14 receives the substrate W from the substrate placement part PS3A. The third substrate transport mechanism TM3 transports the received substrate W to at least the coating unit RESIST. The third substrate transport mechanism TM3 transports the substrate W on which the resist film has been formed by the coating unit RESIST to the substrate placement portion PS3B.

(Step S35) 2nd ID block 4 (exposure processing performed by exposure device) The second ID block 4 carries out the substrate W processed by one of the two processing layers 3C and 3D to the exposure device EXP. In addition, the second ID block 4 is carried from the exposure device EXP into the substrate W subjected to the exposure processing by the exposure device EXP. The second ID block 4 transports the loaded substrate W to the three processing layers 3E to 3G. It will be explained in detail.

In the second ID block 4, one of the two substrate conveying mechanisms TM4 and TM5 receives the substrate W from the substrate placement part PS3B, and performs the received substrate W according to the pre-exposure cleaning unit 161, the placement and cooling part The order of P-CP transport. The sixth substrate transport mechanism TM6 transports the substrate W from the placement and cooling part P-CP to the exposure apparatus EXP. The exposure device EXP exposes the transferred substrate W.

The sixth substrate transport mechanism TM6 transports the substrate W exposed by the exposure device EXP from the exposure machine EXP to the substrate placement section PS9. One of the two substrate transport mechanisms TM4 and TM5 receives the substrate W from the substrate placement section PS9, The received substrate W is transported in the order of the post-exposure cleaning unit 162, the heating and cooling part PHP of the second ID block 4, and, for example, the substrate placing part PS5B. Furthermore, in the heating and cooling part PHP, a post-exposure bake (PEB) process is performed.

(Step S36) Processing layer 3E～3G of processing block 3 (development processing) Any one of the three processing layers 3E to 3G of the processing block 3 develops the conveyed substrate W, and conveys the developed substrate W to the first ID block 2. For example, in the processing layer 3E, the third substrate transport mechanism TM3 receives the substrate W from the substrate placement section PS5B, and arranges the received substrate W according to the cooling section CP, the developing unit DEV, the heating and cooling section PHP, and the substrate placement section PS5A. Transport in order. Furthermore, in the three processing layers 3E to 3G, the processing of the heating and cooling part PHP after the developing unit DEV can also be omitted.

(Step S37) 1st ID block 2 The first ID block 2 moves the substrate W that has been developed by any of the processing layers 3E to 3G back to the carrier C placed on the placement table 13 of any of the two opening mechanisms 9 and 10. It will be explained in detail. For example, the first substrate transport mechanism TM1 receives the substrate W from the substrate placement portion PS5A, and moves the received substrate W back to the carrier C placed on the placement table 13 of the opening mechanism 9.

According to this embodiment, each processing layer 3A to 3G transports the substrate W from the ID block as the transfer source of the substrate W to the ID block on the opposite side thereof (for example, from the first ID block 2 to the second ID block 4) . The substrate placement parts PS1A to PS7A used for substrate transport are provided between the processing layers 3A to 3G and the first ID block 2. In addition, the substrate placement portions PS1B to PS7B are provided between the processing layers 3A to 3G and the second ID block 4. When the substrate W is moved back to the ID block as the transfer source of the substrate W (for example, when the substrate W transferred from the first ID block 2 is moved back to the first ID block 2), it must Two types of substrate mounting parts, the substrate mounting part for transportation and the substrate mounting part for returning, are arranged near an ID block. Therefore, the number of substrates W that can be placed in each of the substrate placement portion for transportation and the substrate placement portion for retraction is also limited. However, by transporting the substrate from the ID block which is the transport source of the substrate W to the ID block on the opposite side, the number of substrates W that can be placed on the substrate placing portion can be secured. In addition, since the two ID blocks 2 and 4 are transported alternately, the two ID blocks 2, 4 can substantially equally share the transfer of the substrate between the layers.

Next, another operation example will be described with reference to FIGS. 17A and 17B. Furthermore, in FIGS. 17A and 17B, the processing block 3 includes three processing layers 3A, 3C, and 3E. Furthermore, as described above, the processing layer 3A forms an anti-reflection film for the substrate W, for example, and the processing layer 3C forms a resist film for the substrate W, for example. In addition, the processing layer 3E performs development processing on the substrate W, for example.

＜Other operation example 1＞ Refer to Figure 17A. The first ID block 2 takes out the substrate W from the carrier C of the mounting table 13, and transports the taken out substrate W to the processing layer 3A. The substrate W transported to the processing layer 3A and processed by the processing layer 3A is sequentially transported to the first ID block 2, the processing layer 3C (second coating process), the second ID block 4, and the exposure device EXP , The second ID block 4, the processing layer 3E (development process), and the second ID block 4. Then, the second ID block 4 stores the substrate W processed by the processing layer 3E on the carrier C of the mounting table 47.

＜Other operation example 2＞ Refer to Figure 17B. The first ID block 2 takes out the substrate W from the carrier C of the mounting table 13, and transports the taken out substrate W to the processing layer 3A. The substrate W transported to the processing layer 3A and processed by the processing layer 3A is sequentially transported to the second ID block 4, the processing layer 3C (the second coating process), the second ID block 4, and the exposure device EXP , The second ID block 4, the processing layer 3E (development process), and the second ID block 4. Then, the second ID block 4 stores the substrate W processed by the processing layer 3E on the carrier C of the mounting table 47.

According to other operation examples 1 and 2, for example, in a configuration in which the processing layers 3A, 3C, 3E and the exposure device EXP sequentially apply different coating treatments to the substrate W, the two ID blocks 2, 4 can be shared It is used for substrate transfer and interlayer side substrate transfer for loading and unloading the substrate W for the carrier C. [Example 5]

Next, the fifth embodiment of the present invention will be described with reference to the drawings. In addition, the description overlapping with Examples 1 to 4 is omitted.

In Example 4, the processing block 3 includes two processing layers 3A, 3B for forming anti-reflection films, two processing layers 3C and 3D for forming resist films, and three processing layers 3E to 3G for developing processing. . That is, the processing block 3 of Example 4 includes three types of processing layers. Regarding this aspect, in this embodiment, two processing layers may also be provided.

FIG. 18 is a right side view showing the arrangement of the liquid treatment part 28 of the treatment block 3 of the fifth embodiment. The processing block 3 includes six processing layers 3A to 3F. The three treatment layers 3A to 3C on the lower side form a resist film after forming the anti-reflective film. In addition, the three treatment layers on the upper side are subjected to development treatment.

Next, the operation of the substrate processing apparatus 1 of this embodiment will be described. Refer to Figure 18. The first ID block 2 takes out the substrate W from the carrier C of the mounting table 13, and transports the taken out substrate W to, for example, the processing layer 3A. The substrate W transported to the processing layer 3A and processed by the processing layer 3A is sequentially transported to the second ID block 4, the exposure device EXP, the second ID block 4, the processing layer 3D, and the second ID block 4. Then, the second ID block 4 stores the substrate W processed by the processing layer 3D on the carrier C of the mounting table 47. Furthermore, after the substrate W processed by the processing layer 3B is exposed, for example, the processing layer 3E is subjected to development processing. In addition, after the substrate W processed by the processing layer 3C is exposed, for example, the processing layer 3F is subjected to development processing.

＜Other operation examples＞ Refer to Figure 19. The second ID block 4 takes out the substrate W from the carrier C of the mounting table 47 and transports the taken out substrate W to the processing layer 3A. The substrate W transported to the processing layer 3A and processed by the processing layer 3A is sequentially transported to the second ID block 4, the exposure device EXP, the second ID block 4, the processing layer 3D, and the first ID block 2 in this order. Then, the first ID block 2 stores the substrate W processed by the processing layer 3E on the carrier C of the mounting table 13.

According to this embodiment, for example, in a configuration that uses the processing layers 3A, 3D, and the exposure device EXP to sequentially apply different coating treatments to the substrate W, the two ID blocks 2, 4 can be shared and used for the carrier C. The substrate transport for placing and removing the substrate W and the substrate transport between layers.

The present invention is not limited to the above-mentioned embodiment, and can be modified and implemented as follows.

(1) In the above-mentioned embodiment 1, as shown in FIG. 3, the 6 treatment layers 3A to 3F are respectively equipped with 4 liquid treatment parts 28, and the 4 liquid treatment parts 28 consist of 2 coating units BARC and 2 coating units. The unit RESIST is composed. In this regard, for example, all the four liquid treatment units 28 may be constituted by the coating unit BARC. In addition, all the four liquid processing units 28 may be constituted by the coating unit RESIST. The four liquid processing sections 28 may all be constituted by coating units that form a resist protective film.

(2) In the above embodiment 1, as shown in FIG. 3, the processing layers 3A to 3F of the processing block 3 are coated on the substrate W, but the processing layers 3A to 3F can also be developed for the substrate W deal with. In addition, each of the processing layers 3A to 3F may perform cleaning processing on the substrate W. Furthermore, in the case of cleaning the back surface of the substrate W, the substrate W can also be configured as any one of the reversing units R1 to R4 provided in the two ID blocks 2, 4 as shown by the dotted line in FIG. 2 One to flip. For example, when the front side is facing up, the substrate W is turned upside down. In addition, at least one of the substrate placement portions PS6A to PS6F between the ID block 2 and the respective processing layers 3A to 3F may be provided with a reversing unit.

As a treatment liquid for cleaning, for example, APM (ammonia hydrogen peroxide water mixed solution), pure water (DIW), carbonated water, hydrogen water, ammonia water (NH ₄ OH), SC1 (Standard Clean 1, standard cleaning) Liquid 1), SC2 (Standard Clean 2, Standard Clean 2), citric acid aqueous solution, FOM (hydrofluoric acid/ozone mixed chemical liquid), FPM (hydrofluoric acid/hydrogen peroxide water/pure water mixed chemical liquid ), hydrofluoric acid (HF), HCl, IPA (isopropanol), TMAH (tetramethylammonium hydroxide) and trimethyl-2-hydroxytetraethylammonium hydroxide aqueous solution (CHOLINE).

(3) In the above embodiment 2, as shown in FIG. 9, the three treatment layers 3A to 3C on the lower side of the treatment block 3 are subjected to the first coating treatment to form an anti-reflective film, and the three treatment layers 3D on the upper side ~3F Perform the second coating process to form a resist film. The three treatment layers 3A to 3C on the lower side may be subjected to backside cleaning treatment (first cleaning treatment), and the three treatment layers 3D to 3F on the upper side may be subjected to front cleaning treatment (second cleaning treatment).

The cleaning unit 81 that performs the front surface cleaning process includes, for example, as shown in FIG. The holding and rotating part 82 includes a spin chuck 86A that holds the substrate W by vacuum suction of the lower surface of the substrate W, and a driving part 88 that rotates the spin chuck 86A around the vertical axis AX4. The liquid supply unit 83 includes a nozzle 90 that ejects the processing liquid, and a pipe 92 that communicates with and connects to the nozzle 90. The spray cleaning mechanism 120 includes a spray nozzle (two-fluid nozzle) 121 and a liquid supply pipe 123 connected to the spray nozzle 121.

The nozzle 121 is supplied with a processing liquid through a liquid supply pipe 123, and also supplied with nitrogen (inert gas). The holding and rotating part 82 rotates the held substrate W. The treatment liquid is ejected from the nozzle 90 to the upper surface of the rotating substrate W. The spray nozzle 121 sprays a mist of processing liquid onto the upper surface of the rotating substrate W. Thereby, the upper surface of the substrate W, that is, the front surface of the substrate W, is cleaned. The cleaning unit 81 shown in FIG. 20A may replace the spin chuck 86A and include the spin chuck 86B shown in FIG. 20B.

In addition, the cleaning unit 81 that performs the back surface cleaning process includes, for example, as shown in FIG. 20B, a holding rotation section 82, a liquid supply section 83, and a brush cleaning mechanism 84. The spin chuck 86B holds the substrate W by contacting the ends of the substrate W with a plurality of holding pins 85. The brush cleaning mechanism 84 includes: a brush cleaning tool 94; an arm portion 96 that rotatably supports the brush cleaning tool 94 at one end; and a driving portion 98 that supports the other end of the arm portion 96 so that the arm portion 96 rotates around the vertical axis AX5. In addition, the drive unit 98 can raise and lower the arm 96. The two drive units 88 and 98 each have an electric motor. The cleaning unit 81 shown in FIG. 20B, for example, sprays the treatment liquid from the nozzle 90 to the upper surface of the rotating substrate W while bringing the brush cleaning tool 94 into contact with the upper surface of the substrate W. Thereby, the upper surface of the substrate W, that is, the back surface of the substrate W is cleaned.

In addition, in FIG. 9, the three treatment layers 3A to 3C on the lower side may be subjected to bevel cleaning treatment (first cleaning treatment), and the three treatment layers 3D to 3F on the upper side may be subjected to backside cleaning treatment (second cleaning treatment). . In addition, the so-called bevel cleaning refers to cleaning the outer edge of the substrate W by supplying a processing liquid to the outer edge of the upper surface of the substrate W using an outer edge cleaning nozzle.

(4) In the above embodiment 3, as shown in FIG. 11, the two treatment layers 3A and 3B on the lower side of the treatment block 3 are subjected to the first coating treatment to form an anti-reflective film, and the middle two treatment layers 3C , 3D performs the second coating process to form a resist film, and further, the two upper processing layers 3E and 3F perform the third coating process to form a resist protective film. In contrast, the lower treatment layers 3A and 3B may be subjected to the first cleaning treatment, the middle treatment layers 3C and 3D may be subjected to the second cleaning treatment, and the upper treatment layers 3E and 3F may be subjected to the third cleaning treatment.

(5) In the third embodiment described above, as shown in FIG. 11, the second ID block 4 transports the transported substrate W to, for example, the processing layer 3C (process A). The processing layer 3C performs specific processing on the conveyed substrate W, and conveys the substrate to the first ID block 2 (process B). The first ID block 2 transports the transported substrate W to the processing layer 3E (C process). The processing layer 3E performs specific processing on the transferred substrate W, and transfers the substrate W to the second ID block 4 (Step D). Then, the second ID block 4 moves the substrate W processed by the processing layer 3E back to the carrier C placed on the placing table 47.

It is also possible that the second ID block 4 does not move the substrate W processed by the processing layer 3E back to the carrier C, but the substrate processing apparatus 1 (or its control unit 79) operates as shown in FIG. 21. That is, the substrate processing apparatus 1 further includes two processing layers 3G and 3H that perform different processing. From the above steps A to D, the two treatment layers 3G and 3H can also perform specific treatments respectively while reciprocating between the two ID blocks 2 and 4 once. Furthermore, the substrate processing apparatus 1 may include two processing layers that perform different processings in addition to the two processing layers 3G and 3H. At this time, the two processing layers can also perform specific processing separately, while further reciprocating between the two ID blocks 2 and 4 once. Then, the operation can also be performed in the following manner: the substrate W processed by the processing layer of the final process is moved back to the carrier C placed on the placing table 47.

The operation of the substrate processing apparatus 1 shown in FIG. 21 will be described. The first ID block 2 takes out the substrate W from the carrier C of the mounting table 13, and transports the taken out substrate W to any one of the two processing layers 3A and 3B (for example, the processing layer 3A). The processing layer 3A performs the first processing on the transferred substrate W and transfers the substrate W to the second ID block 4. The second ID block 4 transfers the transferred substrate W to the processing layer 3C. The processing layer 3C performs the second processing on the transferred substrate W, and transfers the substrate W to the first ID block 2. The first ID block 2 transports the transferred substrate W to the processing layer 3E. The processing layer 3E performs the third processing on the conveyed substrate W, and conveys the substrate W to the second ID block 4.

Here, the second ID block 4 does not move the substrate W back to the carrier C of the mounting table 47, but transports the substrate W to the processing layer 3G. The processing layer 3G performs the fourth processing on the conveyed substrate W, and conveys the substrate W to the first ID block 2. The first ID block 2 transports the transferred substrate W to the processing layer 3H. The processing layer 3H performs the fifth processing on the conveyed substrate W, and conveys the substrate W to the second ID block 4. The second ID block 4 moves the substrate W processed by the final processing layer 3H to the carrier C of the mounting table 47.

The processing block 3 shown in FIG. 21 uses five processing layers 3A, 3C, 3E, 3F, and 3H to perform the first to fifth five types of processing, but seven processing layers can also be used to perform seven types of processing. In addition, in FIG. 21, when the substrate W is transported to the processing layer 3B, the substrate W subjected to the first processing by the processing layer 3B is transported to the processing layer 3D via the second ID block 4. After that, the substrate W subjected to the second processing by the processing layer 3D is transported to the processing layer 3F via the first ID block 2. Thereafter, as described above, the substrate W subjected to the third processing by the processing layer 3F is transported in the order of the processing layer 3G and the processing layer 3H.

(6) In the above embodiments 1 to 3, the first ID block 2 takes out the substrate W from the carrier C placed on the mounting table 13, and the second ID block 4 moves the substrate W processed by the processing block 3 Return to the carrier C placed on the placing table 47. In this regard, the substrate W may be transported in the opposite direction. That is, the second ID block 4 takes out the substrate W from the carrier C placed on the placing table 47, and the first ID block 2 moves the substrate W processed by the processing block 3 back to the placing on the placing table 13 With C.

(7) In the above embodiment 4, for example, as shown in FIG. 15, the first coating treatment is performed using two treatment layers 3A and 3B, but the first coating treatment can also be performed using one treatment layer. Use more than 3 processing layers. In addition, the second coating treatment is performed using two treatment layers 3C and 3D, but the second coating treatment may be performed using one treatment layer, or may be performed using three or more treatment layers. In addition, the development treatment is performed in three treatment layers 3E to 3G, but it can also be performed in one or two treatment layers, and it can also be performed in four or more treatment layers.

(8) In the fourth embodiment described above, the processing block 3 includes, for example, three processing layers 3A, 3C, and 3E that perform three different types of processing. In this regard, the processing block 3 may include, for example, four processing layers that perform four different types of processing.

FIGS. 22A to 22C and FIGS. 23A to 23C are diagrams for explaining the structure and operation of a substrate processing apparatus of a modified example. In addition, in FIGS. 22A to 23C and the following FIGS. 24A to 25B, repetitive descriptions are appropriately omitted. In FIGS. 22A to 23C and the following FIGS. 24A to 25B, the processing block 3 includes four processing layers 3A to 3D that perform four different types of processing. In addition, for example, the first treatment is performed using a single treatment layer 3A, or may be performed using a plurality of treatment layers.

In the processing block 3 shown in FIG. 22A, the processing layer 3A is subjected to, for example, a first coating process, and the processing layer 3B is subjected to, for example, a second coating process. In addition, the treatment layer 3C is subjected to, for example, a third coating treatment, and the treatment layer 4D is subjected to, for example, a development treatment.

In FIG. 22A, the first ID block 2 takes out the substrate W from the carrier C of the mounting table 13, and transports the taken out substrate W to the processing layer 3A. The processing layer 3A performs a first coating process on the conveyed substrate W, and conveys the substrate W to the second ID block 4. The second ID block 4 transfers the transferred substrate W to the processing layer 3B. The processing layer 3B performs the second coating process on the conveyed substrate W, and conveys (returns) the substrate W to the second ID block 4. The second ID block 4 transfers the transferred substrate W to the processing layer 3C. The processing layer 3C performs the third coating process on the conveyed substrate W, and conveys (returns) the substrate W to the second ID block 4.

After that, the second ID block 4 carries out the substrate W processed by the processing layer 3C to the exposure device EXP. The second ID block 4 is transferred from the exposure device EXP to the substrate W subjected to the exposure processing by the exposure device EXP, and the transferred substrate W is transferred to the processing layer 3D. The processing layer 3D performs development processing on the conveyed substrate W, and conveys the substrate W to the second ID block 4. The second ID block 4 moves the transferred substrate W back to the carrier C of the mounting table 47.

Furthermore, the four processing layers 3A to 3D in FIG. 22A may be processed as follows, for example. The treatment layer 3A is subjected to a first coating treatment, and the treatment layer 3B is subjected to a second coating treatment. The treatment layer 3C is subjected to post-exposure cleaning and post-exposure baking, and the treatment layer 3D is subjected to development treatment. In this case, the arrow AR1 shown by the dashed line in FIG. 22A can also be exposed between the processing layer 3B and the processing layer 3C by the exposure device EXP. In addition, when the exposure processing is performed at the position of the arrow AR1, the substrate W processed by the processing layer 3C is transported to the processing layer 3D through the second ID block 4.

The operation of the substrate processing apparatus 1 of FIG. 22B will be described. The first ID block 2 takes out the substrate W from the carrier C of the mounting table 13. The substrate W taken out is in accordance with the processing layer 3A, the second ID block 4, the processing layer 3B, the first ID block 2, the processing layer 3C, the second ID block 4, the exposure device EXP, the second ID block 4, The processing layer 3D and the second ID block 4 are transported in order. After that, the second ID block 4 stores the substrate W processed by the processing layer 3D on the carrier C of the mounting table 47. Furthermore, each of the treatment layers 3A to 3D performs the first to fourth specific treatments, respectively.

The operation of the substrate processing apparatus 1 of FIG. 22C will be described. The first ID block 2 takes out the substrate W from the carrier C of the mounting table 13. The taken-out substrate W follows the processing layer 3A, the second ID block 4, the processing layer 3B, the second ID block 4, the exposure device EXP, the second ID block 4, the processing layer 3C, the first ID block 2, The processing layer 3D and the second ID block 4 are transported in order. After that, the second ID block 4 stores the substrate W processed by the processing layer 3D on the carrier C of the mounting table 47. Furthermore, each of the treatment layers 3A to 3D performs the first to fourth specific treatments, respectively.

In FIG. 23A, the substrate W taken out from the carrier C of the placement portion 13 of the first ID block 2 is in accordance with the processing layer 3A, the first ID block 2, the processing layer 3B, the second ID block 4, and the exposure device The EXP, the second ID block 4, the processing layer 3C, the first ID block 2, the processing layer 3D, and the second ID block 4 are transported in this order.

In FIG. 23B, the substrate W taken out from the carrier C of the placement portion 13 of the first ID block 2 is in accordance with the processing layer 3A, the first ID block 2, the processing layer 3B, the second ID block 4, the processing layer 3C, the second ID block 4, the exposure device EXP, the second ID block 4, the processing layer 3D, and the second ID block 4 are transported in this order. In addition, an arrow AR1 as shown in FIG. 23B may be used for exposure processing between the processing layer 3B and the processing layer 3C using the exposure device EXP.

In FIG. 23C, the substrate W taken out from the carrier C of the placement portion 13 of the first ID block 2 is in accordance with the processing layer 3A, the first ID block 2, the processing layer 3B, the first ID block 2, the processing layer 3C, the second ID block 4, the exposure device EXP, the second ID block 4, the processing layer 3D, and the second ID block 4 are transported in this order.

Next, the operation of the substrate processing apparatus 1 shown in FIGS. 24A to 25B will be described. In the substrate processing apparatus 1 shown in FIGS. 24A to 25B, the second ID block 4 takes out the substrate W from the carrier C of the mounting table 47, and transports the taken out substrate W to the processing layer 3A. The first ID block 2 moves the substrate W processed by the processing layer 3D back (stored) to the carrier C of the mounting table 13. The respective treatment layers 3A to 3D perform the first to fourth specific treatments, respectively.

In FIG. 24A, the substrate W taken out from the carrier C of the placement portion 47 of the second ID block 4 is in accordance with the processing layer 3A, the first ID block 2, the processing layer 3B, the second ID block 4, the processing layer 3C, the second ID block 4, the exposure device EXP, the second ID block 4, the processing layer 3D, and the first ID block 2 are transported in this order. In addition, the arrow AR1 shown by the broken line in FIG. 24A may be exposed between the processing layer 3B and the processing layer 3C by the exposure device EXP.

In FIG. 24B, the substrate W taken out from the carrier C of the placement portion 47 of the second ID block 4 is in accordance with the processing layer 3A, the first ID block 2, the processing layer 3B, the first ID block 2, the processing layer 3C, the second ID block 4, the exposure device EXP, the second ID block 4, the processing layer 3D, and the first ID block 2 are transported in this order.

In FIG. 24C, the substrate W taken out from the carrier C of the placement portion 47 of the second ID block 4 is in accordance with the processing layer 3A, the second ID block 4, the processing layer 3B, the second ID block 4, and the processing layer 3C, the second ID block 4, the exposure device EXP, the second ID block 4, the processing layer 3D, and the first ID block 2 are transported in this order. In addition, the arrow AR1 shown by the broken line in FIG. 24C may be exposed between the processing layer 3B and the processing layer 3C by the exposure device EXP.

In FIG. 25A, the substrate W taken out from the carrier C of the placement portion 47 of the second ID block 4 is in accordance with the processing layer 3A, the second ID block 4, the processing layer 3B, the first ID block 2, and the processing layer 3C, the second ID block 4, the exposure device EXP, the second ID block 4, the processing layer 3D, and the first ID block 2 are transported in this order.

In FIG. 25B, the substrate W taken out from the carrier C of the placement portion 47 of the second ID block 4 is in accordance with the processing layer 3A, the second ID block 4, the processing layer 3B, the second ID block 4, and the exposure device The EXP, the second ID block 4, the processing layer 3C, the first ID block 2, the processing layer 3D, and the first ID block 2 are transported in this order.

(9) In the above-mentioned embodiments 4 and 5, as shown in FIG. 13, the first substrate transport mechanism TM1 of the first ID block 2 is in the seven substrate placement portions PS1A to PS7A and the carrier C of the opening mechanism 9 The substrate W is transferred between. In addition, the second substrate transport mechanism TM2 transports the substrate W between the seven substrate placement portions PS1A to PS7A and the carrier C of the opening mechanism 10.

Regarding the functions of the two substrate transfer mechanisms TM1 and TM2, for example, the second substrate transfer mechanism TM2 may also transfer the substrate W between the four substrate placement portions PS1A to PS4A. In this case, the first substrate transport mechanism TM1 may also transport the substrate between the three substrate placement portions PS5A to PS7A and the carrier C of the opening mechanism 9. This action may be reversed between the first substrate transport mechanism TM1 and the second substrate transport mechanism TM2. Furthermore, for example, as shown in FIG. 26, the first substrate transport mechanism TM1 may be configured to be movable in the Y direction where the opening mechanisms 9, 10 are arranged, and the second substrate transport mechanism TM2 is arranged in the first substrate transport mechanism TM1 and Process between block 3.

(10) In the above-mentioned embodiments 4 and 5, as shown in FIG. 13, the fourth substrate transport mechanism TM4 of the second ID block 4 is in the eight substrate placement parts PS1A to PS7A, PS9, and the pre-exposure cleaning unit 161, The substrate W is transferred between the post-exposure cleaning unit 162, the heating and cooling part PHP, the three placing and cooling parts P-CP, and the carrier C placed on the opening mechanism 45. In addition, the fifth substrate transport mechanism TM5 has eight substrate placement sections PS1A to PS7A, PS9, pre-exposure cleaning unit 161, post-exposure cleaning unit 162, heating and cooling section PHP, three placement and cooling sections P-CP, and The substrate W is transferred between the carriers C placed on the opening mechanism 46.

For example, the fifth substrate transport mechanism TM5 may also be used in the six substrate placement sections PS3B to PS7B, PS9, the pre-exposure cleaning unit 161, the post-exposure cleaning unit 162, the heating and cooling section PHP, and the three placement and cooling sections P- The substrate W is transferred between CPs. In this case, the fourth substrate transport mechanism TM4 may also transport the substrate W between the two substrate placement portions PS1B and PS2B and the carrier C of the opening mechanism 45. This action may be reversed between the fourth substrate transport mechanism TM4 and the fifth substrate transport mechanism TM5.

(11) In each of the above-mentioned embodiments and modifications, for example, the processing block 3 shown in FIG. 15 is sequentially arranged from the lower side with two processing layers 3A, 3B for performing the first coating process, and two processing layers 3A and 3B for performing the second coating process. Two treatment layers 3C and 3D for coating treatment and three treatment layers 3E to 3G for development treatment. The arrangement of the processing layer in the upper and lower directions is not limited to this. For example, the three treatment layers 3E to 3G subjected to the development treatment may be provided below the two treatment layers 3A, 3B subjected to the first coating treatment.

(12) In each of the above embodiments and modifications, the two processing layers 3A and 3B on the lower side shown in FIG. In addition, the two processing layers 3C and 3D in the middle may be used to form a resist protective film and clean the back surface of the substrate W, respectively. The three processing layers 3E to 3G on the upper side can also be developed for the substrate W.

(13) In the above embodiments 4 and 5, the second ID block 4 functions as an interface block. As shown in FIG. 27, the second ID block 4 may also include an ID block body 200 and an interface block (hereinafter referred to as “IF block” as appropriate) 201. In this case, the ID block body 200 includes two opening mechanisms 45 and 46 and two substrate transport mechanisms TM4 and TM5. The IF block 201 includes a pre-exposure cleaning unit 161, a post-exposure cleaning unit 162, a heating and cooling unit PHP, and a sixth substrate transport mechanism TM6, and further includes two substrate transport mechanisms TM7 and TM8. Furthermore, a substrate mounting portion PS8 is provided between the ID block body 200 and the IF block 201. The substrate placement part PS8 is divided into a substrate W for transportation and a return.

(14) In each of the above-mentioned embodiments and modifications, the first ID block 2 includes two substrate transport mechanisms TM1 and TM2. As shown in FIG. 28, the first ID block 2 may also include a single substrate transport mechanism TM1. In this case, a plurality of (for example, four) mounting tables 13 may also be arranged on the wall 206 of the first ID block 2 in a row along the Y direction. In order to take out and store the substrate W on the carrier C placed on the mounting table 13, the substrate transport mechanism TM1 may also be configured to be driven by an electric motor to move in the Y direction.

In addition, the single substrate transport mechanism TM1 can also be fixed to the bottom of the first ID block 2 in a manner that does not move in the horizontal direction (especially the Y direction) as in the first embodiment. In addition, the first ID block 2 may be equipped with three or more substrate transport mechanisms.

(15) In each of the above-mentioned embodiments and modifications, the second ID block 4 includes two substrate transport mechanisms TM4 and TM5. As shown in FIG. 28, the second ID block 4 may also include a single substrate transport mechanism TM4. In this case, a plurality of (for example, four) mounting tables 47 may also be arranged on the wall 208 of the second ID block 4 in a row along the Y direction. In order to take out and store the substrate W on the carrier C placed on the mounting table 47, the substrate transport mechanism TM4 may also be configured to be driven by an electric motor to move in the Y direction.

In addition, the single substrate transport mechanism TM4 can also be fixed to the bottom of the second ID block 4 in a manner that does not move in the horizontal direction (especially the Y direction) as in the first embodiment. In addition, the second ID block 4 may be provided with three or more substrate transport mechanisms.

(16) In each of the above-mentioned embodiments and modifications, the processing layers of the processing block 3 are 6-7 layers, but it only needs to be a plurality of processing layers.

(17) In each of the above-mentioned embodiments and modifications, the processing block 3 includes a plurality of processing layers (for example, six processing layers 3A to 3F) stacked in the vertical direction. In FIG. 1, the third substrate conveying mechanism TM3 of each processing layer 3A to 3F can only use the processing block 3 to convey the substrate W between the first ID block 2 and the second ID block 4. The single processing block 3 includes, for example, at least one processing layer capable of transporting the substrate W between the two ID blocks 2 and 4. For example, in FIG. 1, the third substrate transport mechanism TM3 of the processing layer 3A receives the substrate W from the substrate placement section PS1A, and transports the received substrate W to the liquid processing section 28 and the heat treatment section 29 (refer to FIG. 2) After that, the substrate W is transported to the substrate mounting portion PS1B.

The present invention can be implemented in other specific forms without departing from its idea or essence. Therefore, as the content indicating the scope of the invention, reference should be made to the attached scope of patent applications instead of the above description.

1: Substrate processing equipment 2: The first transfer block (the first ID block) 3: processing block 3A: Processing layer 3B: Processing layer 3C: Processing layer 3D: Processing layer 3E: Processing layer 3F: Processing layer 3G: Processing layer 3H: Processing layer 4: The second transfer block (the second ID block) 8: Vehicle buffer device 9: Open the mechanism 10: Open the mechanism 13: Mounting table 14: Opening 21: Hands 23: Advance and retreat drive unit 25: Lifting and rotating drive unit 27: Transport space 28: Liquid Handling Department 29: Heat treatment department 31: Hands 32: Advance and retreat drive unit 33: Rotary drive unit 34: The first moving mechanism 35: The second moving mechanism 37: Keep rotating part 38: Nozzle 39: Nozzle moving mechanism 41: Tablet 45: opening mechanism 46: Open the mechanism 47: Mounting table 48: opening 51: Vehicle transport mechanism 53: Vehicle Storage Rack 61: Multi-joint arm (1st multi-joint arm) 62: Multi-joint arm (2nd multi-joint arm) 63: Holding part (first holding part) 64: Holding part (Second holding part) 65: Lifting drive 67: Front and rear drive unit 67A: Support Department 67B: Longitudinal 71: Input port 72: output port 73: Unprocessed substrate carrier rack 74: Empty Carrier 75: Processed substrate carrier rack 77: Orbit 79: Control Department 80: Operation Department 81: Cleaning unit 82: Keep rotating part 83: Liquid Supply Department 84: Brush cleaning mechanism 85: keep pin 86A: Spin chuck 86B: Spin chuck 88: Drive 90: nozzle 92: Piping 94: Brush cleaning tool 96: Arm 98: Drive 101: Substrate processing device 102: ID block 103: Processing block 113: Vehicle Platform 120: spray cleaning mechanism 121: Spray nozzle (two-fluid nozzle) 123: Liquid supply pipe 161: Cleaning unit before exposure 162: Cleaning unit after exposure 200: ID block ontology 201: IF block (interface block) 206: Wall 208: Wall BARC: Coating unit C: Vehicle CP: Cooling Department DEV: developing unit EXP: Exposure device OHT: External transport mechanism PAHP: Adhesive Strengthening Treatment Department P-CP: Mounting and cooling part PHP: Heating and cooling department PS1A: Board placement section PS1B: Board placement section PS1C~PS3C: Board placement section for retraction (substrate placement section) PS2A: Board placement section PS2B: Board placement section PS3A: Board placement section PS3B: Board placement section PS4A: Board placement section PS4B: Board placement section PS4D~PS6D: Board placement section for retraction (substrate placement section) PS5A: Board placement section PS5B: Board placement section PS6A: Board placement section PS6B: Board placement section PS7A: Board placement section PS7B: Board placement section PS8: Board placement section PS9: Board placement section R1~R4: flip unit RESIST: Coating unit TM1: The first substrate transport mechanism TM2: The second substrate transport mechanism TM3: The third substrate transport mechanism TM4: The fourth substrate transport mechanism TM5: The fifth substrate transport mechanism W: substrate

In order to illustrate the invention, several forms that are currently considered preferable are illustrated, but it should be understood that the invention is not limited to the configurations and solutions as shown in the drawings. FIG. 1 is a longitudinal cross-sectional view of the substrate processing apparatus of Example 1. FIG. FIG. 2 is a cross-sectional view of the substrate processing apparatus of Embodiment 1. FIG. FIG. 3 is a right side view of the substrate processing apparatus of Example 1. FIG. 4 is a diagram showing a part of the left side of the substrate processing apparatus of Example 1. FIG. Fig. 5 is a diagram showing the carrier conveying mechanism. Fig. 6 is a top view of the buffer device of the carrier. FIG. 7 is a diagram for explaining the operation of the conventional substrate processing apparatus. FIG. 8 is a diagram for explaining the operation of the substrate processing apparatus of the first embodiment. FIG. 9 is a right side view of the substrate processing apparatus of Embodiment 2, and is a diagram for explaining its operation. FIG. 10 is a diagram for explaining the operation of the substrate processing apparatus according to a modification of the second embodiment. 11 is a right side view of the substrate processing apparatus of Embodiment 3, and is a diagram for explaining its operation. 12A to 12C are diagrams for explaining the operation of the substrate processing apparatus according to the modification of the third embodiment. Fig. 13 is a longitudinal sectional view of the substrate processing apparatus of the fourth embodiment. 14 is a cross-sectional view of the substrate processing apparatus of the fourth embodiment. 15 is a right side view of the substrate processing apparatus of Embodiment 4, and is a diagram for explaining its operation. FIG. 16 is a diagram showing a part of the left side surface of the substrate processing apparatus of Example 4. FIG. 17A and 17B are diagrams for explaining the operation of the substrate processing apparatus according to a modification of the fourth embodiment. 18 is a right side view of the substrate processing apparatus of Embodiment 5, and is a diagram for explaining its operation. FIG. 19 is a diagram for explaining the operation of the substrate processing apparatus of the fifth embodiment. 20A and 20B are diagrams showing the cleaning device. FIG. 21 is a diagram for explaining the structure and operation of a substrate processing apparatus of a modified example. 22A to 22C are diagrams for explaining the structure and operation of a substrate processing apparatus of a modified example. 23A to 23C are diagrams for explaining the structure and operation of a substrate processing apparatus of a modified example. 24A to 24C are diagrams for explaining the structure and operation of a substrate processing apparatus of a modified example. 25A and 25B are diagrams for explaining the structure and operation of a substrate processing apparatus of a modified example. Fig. 26 is a cross-sectional view of the first transfer block showing a modified example. Fig. 27 is a cross-sectional view showing a second transfer block of a modified example. Fig. 28 is a cross-sectional view showing a substrate processing apparatus of a modified example.

1: Substrate processing equipment

2: The first transfer block (the first ID block)

3: processing block

4: The second transfer block (the second ID block)

13: Mounting table

47: Mounting table

C: Vehicle

W: substrate

Claims (15)

A substrate processing device that processes substrates and includes the following components: The first transfer block is provided with a first carrier mounting table, and the first carrier mounting table is used for mounting a carrier capable of accommodating a plurality of substrates; A single processing block, which is connected to the above-mentioned first transfer block, and is provided with a plurality of processing layers in the up and down direction; and The second transfer block is connected to the single processing block, and is provided with a second carrier placing table for placing the carrier; The first transfer block takes out the substrate from the carrier placed on the first carrier stage, and transports the taken-out substrate to any one of the plurality of processing layers, The plurality of processing layers respectively perform specific processing on the conveyed substrate, and convey the substrate to the second transfer block, The second transfer block moves the substrate processed by the processing layer back to the carrier placed on the second carrier placing table. Such as the substrate processing apparatus of claim 1, wherein The first transfer block takes out the substrate from the carrier placed on the first carrier stage, and transports the substrate to the first processing layer among the plurality of processing layers, The above-mentioned first processing layer performs specific processing on the transferred substrate, and transports the substrate to the above-mentioned second transfer block, The second transfer block transfers the transferred substrate to the second processing layer among the plurality of processing layers, The second processing layer performs specific processing on the conveyed substrate, and conveys the substrate to the first transfer block, The first transfer block transfers the transferred substrate to the third processing layer among the plurality of processing layers, The third processing layer performs specific processing on the transferred substrate, and transports the substrate to the second transfer block, The second transfer block moves the substrate processed by the third processing layer back to the carrier placed on the second carrier mounting table. Such as the substrate processing apparatus of claim 1, wherein The first transfer block takes out the substrate from the carrier placed on the first carrier stage, and transports the substrate to the first processing layer among the plurality of processing layers, The above-mentioned first processing layer performs specific processing on the transferred substrate, and transports the substrate to the above-mentioned second transfer block, The second transfer block transfers the transferred substrate to the second processing layer among the plurality of processing layers, The second processing layer performs specific processing on the conveyed substrate, and conveys the substrate to the second transfer block, The second transfer block moves the substrate processed by the second processing layer back to the carrier placed on the second carrier mounting table. Such as the substrate processing apparatus of claim 3, wherein The second transfer block transports the substrate processed and transported by the second processing layer to the third processing layer among the plurality of processing layers, The third processing layer performs specific processing on the transferred substrate, and transports the substrate to the second transfer block, The second transfer block moves the substrate processed by the third processing layer back to the carrier placed on the second carrier mounting table. Such as the substrate processing apparatus of claim 4, wherein The above-mentioned second transfer block is further configured to carry in and out of the board to an external device, The second transfer block carries out the substrate processed by the second processing layer to the external device, The second transfer block carries in the substrate subjected to specific processing by the external device from the external device, and transports the carried substrate to the third processing layer among the plurality of processing layers. Such as the substrate processing apparatus of claim 3, wherein The above-mentioned second transfer block is further configured to carry in and out of the board to an external device, The second transfer block carries out the substrate processed by the first processing layer to the external device, The second transfer block carries in the substrate subjected to specific processing by the external device from the external device, and transports the carried substrate to the second processing layer of the plurality of processing layers. Such as the substrate processing apparatus of claim 1, wherein The first transfer block takes out the substrate from the carrier placed on the first carrier stage, and transports the substrate to the first processing layer among the plurality of processing layers, The above-mentioned first processing layer performs specific processing on the transferred substrate, and transports the substrate to the above-mentioned first transfer block, The first transfer block transfers the transferred substrate to the second processing layer among the plurality of processing layers, The second processing layer performs specific processing on the conveyed substrate, and conveys the substrate to the second transfer block, The second transfer block moves the substrate processed by the second processing layer back to the carrier placed on the second carrier mounting table. Such as the substrate processing apparatus of claim 7, wherein The second transfer block transports the substrate processed and transported by the second processing layer to the third processing layer among the plurality of processing layers, The third processing layer performs specific processing on the transferred substrate, and transports the substrate to the second transfer block, The second transfer block moves the substrate processed by the third processing layer back to the carrier placed on the second carrier mounting table. Such as the substrate processing apparatus of claim 8, wherein The above-mentioned second transfer block is further configured to carry in and out of the board to an external device, The second transfer block carries out the substrate processed by the second processing layer to the external device, The second transfer block carries in the substrate subjected to specific processing by the external device from the external device, and transports the carried substrate to the third processing layer among the plurality of processing layers. Such as the substrate processing apparatus of claim 1, wherein The first transfer block takes out the substrate from the carrier placed on the first carrier stage, and transports the substrate to the first processing layer among the plurality of processing layers, The above-mentioned first processing layer performs specific processing on the transferred substrate, and transports the substrate to the above-mentioned first transfer block, The first transfer block transfers the transferred substrate to the second processing layer among the plurality of processing layers, The second processing layer performs specific processing on the conveyed substrate, and conveys the substrate to the first transfer block, The first transfer block transfers the transferred substrate to the third processing layer among the plurality of processing layers, The third processing layer performs specific processing on the transferred substrate, and transports the substrate to the second transfer block, The second transfer block moves the substrate processed by the third processing layer back to the carrier placed on the second carrier mounting table. Such as the substrate processing apparatus of claim 1, wherein The above-mentioned second transfer block is further configured to carry in and out of the board to an external device, The second transfer block takes out the substrate from the carrier placed on the second carrier stage, and transports the substrate to the first processing layer among the plurality of processing layers, The above-mentioned first processing layer performs specific processing on the transferred substrate, and transports the substrate to the above-mentioned second transfer block, The second transfer block carries out the substrate processed by the first processing layer to the external device, The second transfer block is carried from the external device into the substrate subjected to the specific processing by the external device, and the loaded substrate is transferred to the second processing layer of the plurality of processing layers, The second processing layer performs specific processing on the conveyed substrate, and conveys the substrate to the first transfer block, The first transfer block moves the substrate processed by the second processing layer back to the carrier placed on the first carrier mounting table. Such as the substrate processing apparatus of claim 1, wherein The above-mentioned second transfer block is further configured to carry in and out of the board to an external device, The second transfer block takes out the substrate from the carrier placed on the second carrier stage, and transports the substrate to the first processing layer among the plurality of processing layers, The above-mentioned first processing layer performs specific processing on the transferred substrate, and transports the substrate to the above-mentioned first transfer block, The first transfer block transfers the transferred substrate to the second processing layer among the plurality of processing layers, The second processing layer performs specific processing on the conveyed substrate, and conveys the substrate to the second transfer block, The second transfer block carries out the substrate processed by the second processing layer to the external device, The second transfer block is carried from the external device into the substrate subjected to the specific processing by the external device, and the loaded substrate is transferred to the third processing layer among the plurality of processing layers, The third processing layer performs specific processing on the transferred substrate, and transports the substrate to the first transfer block, The first transfer block moves the substrate processed by the third processing layer back to the carrier placed on the first carrier mounting table. Such as the substrate processing apparatus of any one of claims 1 to 12, which further includes a carrier conveying mechanism, The carrier transport mechanism transports the carrier between the first carrier placing table and the second carrier placing table. Such as the substrate processing apparatus of claim 13, wherein The carrier transport mechanism is mounted on the single processing block. A substrate transfer method, which is a substrate transfer method of a substrate processing apparatus as follows. The substrate processing apparatus includes: a first transfer block provided with a first carrier mounting table, and the first carrier mounting table is used for mounting Install a carrier that can accommodate multiple substrates; and A single processing block, which is connected to the above-mentioned first transfer block, is provided with a plurality of processing layers in the vertical direction; and the substrate transport method includes the following steps: Using the first transfer block, take out the substrate from the carrier placed on the first carrier stage, and transport the taken out substrate to any one of the plurality of processing layers; By each of the above-mentioned plural processing layers, specific processing is performed on the conveyed substrate, and the substrate is transferred to the second transfer block connected with the single processing block; and By the second transfer block, the substrate processed by the processing layer is moved back to the carrier placed on the second carrier set in the second transfer block.

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