JP2001053509A - Waveguide line and manufacture thereof - Google Patents
Waveguide line and manufacture thereofInfo
- Publication number
- JP2001053509A JP2001053509A JP22729099A JP22729099A JP2001053509A JP 2001053509 A JP2001053509 A JP 2001053509A JP 22729099 A JP22729099 A JP 22729099A JP 22729099 A JP22729099 A JP 22729099A JP 2001053509 A JP2001053509 A JP 2001053509A
- Authority
- JP
- Japan
- Prior art keywords
- engineering plastic
- plastic member
- inner peripheral
- peripheral surface
- frequency
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Waveguide Aerials (AREA)
- Waveguides (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、通信、放送などの
送受信機、或いは自動車における衝突防止用レーダーの
送受信機等に用いる伝送線路に好適な導波管線路及びそ
の製造方法に係わり、特にアンテナや高周波回路基板の
周辺回路部材も一体に形成可能な導波管線路及びその製
造方法の改良に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a waveguide line suitable for a transmission / reception device for communication and broadcasting, or a transmission / reception device for a collision prevention radar in an automobile, and a method for manufacturing the same. The present invention relates to an improvement in a waveguide line in which peripheral circuit members of a high-frequency circuit board and a peripheral circuit member can be integrally formed and a method of manufacturing the same.
【０００２】[0002]
【従来の技術】電磁波を送信する伝送回路については、
金属の鋼管で構成された導波管やプラスチック等の誘電
体基板で構成されたストリップ線路や表面波線路など幾
つかの試みがなされ実用化されている。2. Description of the Related Art Regarding a transmission circuit for transmitting electromagnetic waves,
Several attempts have been made and put to practical use, such as a waveguide composed of a metal steel pipe, a strip line composed of a dielectric substrate such as plastic, and a surface wave line.
【０００３】[0003]
【発明が解決しようとする課題】低損失の高周波伝送方
法として金属の鋼管で構成された導波管が一般的に使用
されているが、その製造方法は金属を引き抜き加工によ
って成形し、必要とする長さで切断し、接続用コネクタ
をロウ付けする製造方法としているので、大量生産に向
かないし、また高価でもある。また、高周波回路基板や
アンテナとは、材料が異なるため一体での成形は不可能
であり、生産性が悪いという問題がある。A waveguide composed of a metal steel pipe is generally used as a low-loss high-frequency transmission method. The method is a manufacturing method in which the connection connector is cut at a predetermined length, and is not suitable for mass production, and is expensive. Further, since the high-frequency circuit board and the antenna are made of different materials, they cannot be integrally formed, and there is a problem that productivity is low.
【０００４】また、ストリップ線路や表面波線路など
は、同じ基板材料を用いることが可能なので、高周波回
路基板との一体成形ができ生産性は高い。しかし、この
伝送路は、基板材料を構成する誘電体の損失の影響が、
特に高周波に成る程大きく表われるので、低損失の伝送
線路としての問題、低損失の基板材料開発という問題が
ある。Further, since the same substrate material can be used for a strip line, a surface wave line, and the like, they can be integrally formed with a high-frequency circuit board, and the productivity is high. However, this transmission line is affected by the loss of the dielectric material that constitutes the substrate material,
In particular, the higher the frequency becomes, the larger the problem is. Therefore, there is a problem as a low-loss transmission line and a problem of developing a low-loss substrate material.
【０００５】本発明の目的は上記従来技術の課題を解決
するため、安価かつ製造が容易で大量生産に好適で、し
かもアンテナや高周波回路基板等の周辺回路部材も一体
に成形可能な導波管線路及びその製造方法を提供するこ
とにある。SUMMARY OF THE INVENTION An object of the present invention is to solve the above-mentioned problems of the prior art, so that the waveguide is inexpensive, easy to manufacture and suitable for mass production, and is capable of integrally molding peripheral circuit members such as an antenna and a high-frequency circuit board. An object of the present invention is to provide a line and a method of manufacturing the line.
【０００６】[0006]
【課題を解決するための手段】上記目的を達成するた
め、請求項１の発明の導波管線路は、エンジニアリング
プラスチック部材に、所望する伝送させるべき電磁波の
周波数に対応する高さと幅の中空路を形成し、かつ該中
空路の全内周面に金属メッキ層を設けたことを要旨とす
る。In order to achieve the above object, a waveguide line according to the first aspect of the present invention is a hollow waveguide having a height and width corresponding to a desired frequency of an electromagnetic wave to be transmitted to an engineering plastic member. And that a metal plating layer is provided on the entire inner peripheral surface of the hollow path.
【０００７】請求項２の発明の導波管線路の製造方法
は、断面が凹型の形状を有する第１のエンジニアリング
プラスチック部材と、板状の形状を有する第２のエンジ
ニアリングプラスチック部材を成形し、第１のエンジニ
アリングプラスチック部材の凹型の全内周面及び第２の
エンジニアリングプラスチック部材の上記凹型に対応す
る内面部分に金属層をメッキし、上記第１及び第２のエ
ンジニアリングプラスチック部材を組み合わせて、所望
する伝送させるべき電磁波の周波数に対応する高さと幅
を有しかつ全内周面に金属メッキ層が設けられた中空導
電路を形成することを要旨とする。According to a second aspect of the invention, there is provided a method for manufacturing a waveguide line, comprising forming a first engineering plastic member having a concave cross section and a second engineering plastic member having a plate-like shape. A metal layer is plated on the entire inner peripheral surface of the concave shape of the first engineering plastic member and the inner surface portion corresponding to the concave shape of the second engineering plastic member, and the first and second engineering plastic members are combined and desired. The gist is to form a hollow conductive path having a height and a width corresponding to the frequency of the electromagnetic wave to be transmitted and having a metal plating layer provided on the entire inner peripheral surface.
【０００８】請求項３の発明の導波管線路の製造方法
は、断面がＬ字形の形状を有するエンジニアリングプラ
スチック部材を２個成形し、該各エンジニアリングプラ
スチック部材の全内周面に金属層をメッキし、上記２個
のエンジニアリングプラスチック部材を組み合わせて所
望する伝送させるべき電磁波の周波数に対応する高さと
幅を有しかつ全内周面に金属メッキ層が設けられた中空
導電路を形成することを要旨とする。According to a third aspect of the invention, there is provided a method for manufacturing a waveguide line, comprising forming two engineering plastic members having an L-shaped cross section, and plating a metal layer on the entire inner peripheral surface of each engineering plastic member. Then, a hollow conductive path having a height and a width corresponding to the frequency of the electromagnetic wave to be transmitted in combination with the two engineering plastic members and forming a metal plating layer on the entire inner peripheral surface is formed. Make a summary.
【０００９】請求項４の発明の導波管線路の製造方法
は、所望する伝送させるべき電磁波の周波数に対応する
高さと幅の中空路を有するエンジニアリングプラスチッ
ク部材を押し出し成形により成形し、該中空路の全内周
面に金属層をメッキして中空導電路を形成することを要
旨とする。According to a fourth aspect of the present invention, there is provided a waveguide line manufacturing method, wherein an engineering plastic member having a hollow passage having a height and a width corresponding to a desired frequency of an electromagnetic wave to be transmitted is formed by extrusion. The gist of the present invention is to form a hollow conductive path by plating a metal layer on the entire inner peripheral surface of the above.
【００１０】請求項５の発明の導波管線路の製造方法
は、長さが同一で、幅の異なる２対の板状のエンジニア
リングプラスチック部材を成形し、各エンジニアリング
プラスチック部材の一面全面に金属層をメッキし、上記
２対のエンジニアリングプラスチック部材を組み合わせ
て所望する伝送させるべき電磁波の周波数に対応する高
さと幅を有しかつ全内周面に金属メッキ層が設けられた
中空導電路を形成することを要旨とする。According to a fifth aspect of the present invention, there is provided a waveguide line manufacturing method, wherein two pairs of plate-shaped engineering plastic members having the same length and different widths are formed, and a metal layer is formed on one entire surface of each engineering plastic member. To form a hollow conductive path having a height and width corresponding to the frequency of an electromagnetic wave to be transmitted as desired by combining the above two pairs of engineering plastic members and having a metal plating layer provided on the entire inner peripheral surface. That is the gist.
【００１１】請求項６の発明の導波管線路の製造方法
は、請求項２の発明において、前記金属層のメッキ加工
方法は、無電解メッキ加工と電解メッキ加工から成るこ
とを要旨とする。A method of manufacturing a waveguide line according to a sixth aspect of the present invention is characterized in that, in the invention of the second aspect, the method of plating the metal layer comprises electroless plating and electrolytic plating.
【００１２】請求項７の発明の導波管線路の製造方法
は、請求項３の発明において、前記金属層のメッキ加工
方法は、無電解メッキ加工と電解メッキ加工から成るこ
とを要旨とする。A method of manufacturing a waveguide according to a seventh aspect of the present invention is characterized in that, in the third aspect of the present invention, the method of plating the metal layer comprises electroless plating and electrolytic plating.
【００１３】請求項８の発明の導波管線路の製造方法
は、請求項４の発明において、前記金属層のメッキ加工
方法は、無電解メッキ加工と電解メッキ加工から成るこ
とを要旨とする。The method of manufacturing a waveguide line according to the invention of claim 8 is characterized in that, in the invention of claim 4, the method of plating the metal layer comprises electroless plating and electrolytic plating.
【００１４】請求項９の発明の導波管線路の製造方法
は、請求項５の発明において、前記金属層のメッキ加工
方法は、無電解メッキ加工と電解メッキ加工から成るこ
とを要旨とする。According to a ninth aspect of the present invention, in the method of the fifth aspect, the plating method of the metal layer includes electroless plating and electrolytic plating.
【００１５】なお、請求項１の発明の導波管線路におい
て、所望のアンテナ及び又は高周波回路基板を前記エン
ジニアリングプラスチック部材によって導波管線路と一
体に成形することも可能である。In the waveguide line according to the first aspect of the present invention, a desired antenna and / or a high-frequency circuit board can be formed integrally with the waveguide line by the engineering plastic member.
【００１６】[0016]
【発明の実施の形態】本発明は、上述したように導波管
構造の大部分をエンジニアリングプラスチック部材で構
成し、その中空導電路として中空路の全内周面に金属メ
ッキ層を設けることにより、従来のストリップ線路等に
おける伝送損失の問題を改善する。更に導波管構造部
と、高周波回路部及び又はアンテナ部等のその周辺回路
部を同一のエンジニアリングプラスチック部材によって
一体成形することにより、従来の金属製導波管と高周波
回路との一体化の問題を改善し、コストダウンと生産性
の向上を図っている。DETAILED DESCRIPTION OF THE INVENTION As described above, the present invention is characterized in that most of the waveguide structure is made of an engineering plastic member and a metal plating layer is provided on the entire inner peripheral surface of the hollow passage as a hollow conductive passage. In addition, the problem of transmission loss in a conventional strip line or the like is improved. Furthermore, by integrally molding the waveguide structure portion and its peripheral circuit portions such as the high-frequency circuit portion and / or the antenna portion with the same engineering plastic member, the problem of integration between the conventional metal waveguide and the high-frequency circuit is solved. To reduce costs and increase productivity.
【００１７】以下、図面に示す本発明の各実施例を説明
する。図１は本発明の導波管線路の一実施例を示す。同
図において、１は導波管線路本体を構成するように成形
されたエンジニアリングプラスチック部材で、方形の中
空路２が形成されている。中空路２は、所望する伝送す
べき電磁波の周波数に対応する高さＨと幅Ｗを有し、そ
の全内周面には所定の金属メッキ層３が形成されてい
る。Hereinafter, embodiments of the present invention shown in the drawings will be described. FIG. 1 shows an embodiment of the waveguide line of the present invention. In the figure, reference numeral 1 denotes an engineering plastic member molded so as to constitute a waveguide line main body, in which a rectangular hollow path 2 is formed. The hollow path 2 has a height H and a width W corresponding to a frequency of a desired electromagnetic wave to be transmitted, and a predetermined metal plating layer 3 is formed on the entire inner peripheral surface.
【００１８】エンジニアリングプラスチック部材１のプ
ラスチック材料としては、例えば、金属メッキに対応し
うる高精度のポリプラスチック社製の液晶ポリマーのベ
ークライトＣ８１０ないしＣ８２０を用い得る。As the plastic material of the engineering plastic member 1, for example, Bakelite C810 to C820, a liquid crystal polymer made by Polyplastics, which can handle metal plating, can be used.
【００１９】そのメッキ加工方法としては、例えば、メ
ッキ対象となる面に、まず所定の薬品処理をしてから無
電解メッキ加工を行って電気的に導電性をもたせ、次い
で、電解メッキ加工により規定の膜厚となるように処理
する。なお、金属層を設ける方法としてはこれのみに限
定されないこと勿論である。As the plating method, for example, a surface to be plated is first subjected to a predetermined chemical treatment, then subjected to electroless plating to make it electrically conductive, and then specified by electrolytic plating. It is processed so as to have a film thickness of. It is needless to say that the method of providing the metal layer is not limited to this.
【００２０】前記導波管線路本体を構成する中空路２を
有するエンジニアリングプラスチック部材１は金属メッ
キに対応しうるエンジニアリングプラスチックを押し出
し成形により成形し、中空路２の全内周面に金属層３を
メッキすればよい。The engineering plastic member 1 having the hollow passage 2 constituting the waveguide line main body is formed by extruding an engineering plastic capable of coping with metal plating, and a metal layer 3 is formed on the entire inner peripheral surface of the hollow passage 2. What is necessary is just to plate.
【００２１】前記導波管線路本体の製造方法としては、
種々の方法があるが、製造及びメッキ加工の容易さ等を
勘案して下記のような方法がある。As a method of manufacturing the waveguide line body,
Although there are various methods, there are the following methods in consideration of easiness of production and plating.
【００２２】（ａ）図２に示すように、１ａは断面が凹
型状を有する第１のエンジニアリングプラスチック部材
で成形された導波管線路基板凹部、１ｂは板状の第２の
エンジニアリングプラスチック部材で成形された導波管
線路基板部で、凹型の溝２ａの全内周面及びこれに対応
する基板部１ｂの内面部分２ｂに金属メッキ層３ａ，３
ｂを形成する。この場合、基板１ｂの内面全体に金属メ
ッキ層を設けてもよい。次に上記基板凹部１ａと基板部
１ｂを組み合わせて、所望する伝送させるべき電磁波の
周波数に対応する高さＨ及び幅Ｗを有し、全内周面に金
属メッキ層３が設けられた中空路２を形成する。この中
空路２は導波管として機能するもので、その長さ方向Ｌ
に所定の周波数の電磁波を、Ｈ，Ｗの寸法で構成される
金属メッキされた壁面に案内されて伝搬する。上記金属
メッキ層３は、例えば、前記導電性をもたせるための無
電解メッキ加工及び規定の金属厚を得るための電解メッ
キ加工で処理し、また第１及び第２のエンジニアリング
プラスチック部材は射出成形法で成形する。(A) As shown in FIG. 2, 1a is a waveguide line substrate recess formed by a first engineering plastic member having a concave cross section, and 1b is a plate-shaped second engineering plastic member. In the molded waveguide line substrate portion, the metal plating layers 3a, 3 are formed on the entire inner peripheral surface of the concave groove 2a and the corresponding inner surface portion 2b of the substrate portion 1b.
b is formed. In this case, a metal plating layer may be provided on the entire inner surface of the substrate 1b. Next, by combining the substrate recessed portion 1a and the substrate portion 1b, a hollow passage having a height H and a width W corresponding to a desired frequency of an electromagnetic wave to be transmitted, and having a metal plating layer 3 provided on the entire inner peripheral surface. Form 2 This hollow path 2 functions as a waveguide, and its length direction L
An electromagnetic wave of a predetermined frequency is guided and propagated on a metal-plated wall having dimensions of H and W. The metal plating layer 3 is processed by, for example, electroless plating for imparting the conductivity and electrolytic plating for obtaining a specified metal thickness, and the first and second engineering plastic members are formed by injection molding. Mold with
【００２３】（ｂ）図３において、１ｃ，１ｄは断面が
Ｌ字型の形状を有するプラスチック部材で射出成形もし
くは押し出し成形したＬ型基板部で、その内周面に金属
メッキ層３ｃ，３ｄを形成する。次に上記２個のＬ型基
板部１ｃ，１ｄを組み合わせて所望する伝送させるべき
電磁波の周波数に対応する高さＨ及び幅Ｗを有し、全内
周面に金属メッキ層３が設けられた中空路２を形成す
る。(B) In FIG. 3, reference numerals 1c and 1d denote an L-shaped substrate portion formed by injection molding or extrusion molding of a plastic member having an L-shaped cross section, and metal plating layers 3c and 3d are provided on the inner peripheral surface thereof. Form. Next, the metal plating layer 3 is provided on the entire inner peripheral surface, having a height H and a width W corresponding to the frequency of an electromagnetic wave to be transmitted as desired by combining the two L-shaped substrates 1c and 1d. The hollow path 2 is formed.
【００２４】（ｃ）図４において、１２，１３は夫々長
さＬが同一で、幅Ｗ１，Ｗ２が異なる２対の板状のエン
ジニアリングプラスチック部材で成形した導波管線路基
板で、その一面全面に金属メッキ層３ｅ，３ｆを形成す
る。次に上記２対の基板１２，１３を組み合わせて所望
する伝送すべき電磁波の周波数に対応する高さＨ及び幅
Ｗを有し、全内周面に金属メッキ層３が設けられた中空
路２を形成する。(C) In FIG. 4, reference numerals 12 and 13 denote waveguide waveguide substrates formed of two pairs of plate-shaped engineering plastic members having the same length L and different widths W1 and W2, and the entire surface thereof. Then, metal plating layers 3e and 3f are formed. Next, the hollow path 2 having the height H and the width W corresponding to the frequency of the desired electromagnetic wave to be transmitted by combining the two pairs of substrates 12 and 13 and having the metal plating layer 3 provided on the entire inner peripheral surface. To form
【００２５】（ｄ）従来の導波管は金属を引き抜き加工
により成形し、夫々の導波管の接続用金具を夫々にロウ
付けしていた。しかし本発明の方法によると、エンジニ
アリングプラスチック部材を射出成形する金型として、
導波管基板部と接続用金具部を接続し一体に成形し得る
ものを用いることにより、接続用金具と導波管を一体の
形で成形できる。(D) In the conventional waveguide, a metal is formed by a drawing process, and connection fittings for the respective waveguides are brazed. However, according to the method of the present invention, as a mold for injection molding an engineering plastic member,
By using a material that connects the waveguide substrate portion and the connection metal part and can be integrally formed, the connection metal part and the waveguide can be integrally formed.
【００２６】（ｅ）図５において、４は導波管線路基板
部１ｂの外面に形成された高周波回路部で第２のエンジ
ニアリングプラスチック部材を射出成形する金型とし
て、導波管基板部１ｂと高周波回路部４を一体とした形
で成形可能なものを用いて成形することにより、高周波
回路と導波管を一体で成形することができる。高周波回
路部４には、所望の高周波回路パターンを形成して、各
種ＩＣ等を実装すると共に高周波給電用プローブ５によ
り高周波回路部４からの高周波信号を導波管部６に給電
し所定の伝送を行う。(E) In FIG. 5, reference numeral 4 denotes a high-frequency circuit formed on the outer surface of the waveguide substrate 1b, which is a mold for injection-molding a second engineering plastic member. The high-frequency circuit and the waveguide can be integrally formed by molding the high-frequency circuit unit 4 using a moldable body. A desired high-frequency circuit pattern is formed in the high-frequency circuit section 4, various ICs and the like are mounted, and a high-frequency signal from the high-frequency circuit section 4 is supplied to the waveguide section 6 by the high-frequency power supply probe 5 to perform predetermined transmission. I do.
【００２７】（ｆ）図６において、７は一般的な導波管
アンテナである側面にスリット構造８を有するアンテナ
部で、エンジニアリングプラスチック部材を射出成形す
る金型として導波管線路９とアンテナ部７を一体として
成形可能なものを用いて成形することにより、アンテナ
と導波管を一体で成形することができる。(F) In FIG. 6, reference numeral 7 denotes an antenna portion having a slit structure 8 on a side surface, which is a general waveguide antenna, and a waveguide line 9 and an antenna portion as a mold for injection molding an engineering plastic member. The antenna and the waveguide can be integrally formed by molding using a material that can be integrally molded with the antenna 7.
【００２８】（ｇ）図７において、１０はアンテナ部、
１１は高周波回路部で、エンジニアリングプラスチック
部材を射出成形する金型として導波管線路９、アンテナ
部１０及び高周波回路部１１を一体として成形可能なも
のを用いて成形することにより、アンテナ、高周波回路
及び導波管を一体で成形することができる。(G) In FIG. 7, reference numeral 10 denotes an antenna unit,
Numeral 11 denotes a high-frequency circuit portion, which is formed by using a mold capable of integrally molding the waveguide line 9, the antenna portion 10 and the high-frequency circuit portion 11 as a mold for injection-molding an engineering plastic member, thereby forming an antenna and a high-frequency circuit. And the waveguide can be integrally formed.
【００２９】[0029]
【発明の効果】以上説明したように本発明によれば、エ
ンジニアリングプラスチック部材を用いて導波管線路を
成形するので、加工が容易となり、大量生産が可能で安
価になる。また導波管部だけでなく、高周波回路部、ア
ンテナ部等も一体に容易に成形可能となり、全体構成の
簡略化、小型化及び軽量化を達成できる。As described above, according to the present invention, since a waveguide line is formed using an engineering plastic member, processing is facilitated, mass production is possible, and the cost is reduced. In addition, not only the waveguide portion but also the high-frequency circuit portion, the antenna portion, and the like can be easily formed integrally, so that the overall configuration can be simplified, downsized, and reduced in weight.
【図１】本発明の一実施例を示す斜視図である。FIG. 1 is a perspective view showing one embodiment of the present invention.
【図２】本発明の他の実施例を示す斜視図である。FIG. 2 is a perspective view showing another embodiment of the present invention.
【図３】本発明の更に他の実施例を示す斜視図である。FIG. 3 is a perspective view showing still another embodiment of the present invention.
【図４】本発明の更に他の実施例を示す斜視図である。FIG. 4 is a perspective view showing still another embodiment of the present invention.
【図５】本発明の更に他の実施例を示す斜視図である。FIG. 5 is a perspective view showing still another embodiment of the present invention.
【図６】本発明の更に他の実施例を示す斜視図である。FIG. 6 is a perspective view showing still another embodiment of the present invention.
【図７】本発明の更に他の実施例を示す斜視図である。FIG. 7 is a perspective view showing still another embodiment of the present invention.
１ 導波管線路本体 ２ 中空路 ３ 金属メッキ層 １ａ 導波管線路基板凹部 １ｂ 導波管線路基板部 ２ａ 溝 ２ｂ 基板部の内面部分 １ｃ，１ｄ Ｌ型エンジニアリングプラスチック部材 DESCRIPTION OF SYMBOLS 1 Waveguide line main body 2 Hollow path 3 Metal plating layer 1a Waveguide line substrate recessed part 1b Waveguide line substrate part 2a Groove 2b Inner surface part of substrate part 1c, 1d L-type engineering plastic member
───────────────────────────────────────────────────── フロントページの続き (72)発明者 前山 利幸 東京都渋谷区神宮前６−27−８ 株式会社 京セラディーディーアイ未来通信研究所内 Ｆターム(参考） 5J014 DA03 DA06 5J045 AB01 AB06 BA02 DA04 EA07 FA06 HA01 LA04 MA03 MA06 NA01 NA07 ────────────────────────────────────────────────── ─── Continuing from the front page (72) Inventor Toshiyuki Maeyama 6-27-8 Jingumae, Shibuya-ku, Tokyo F-term in Kyocera D.I. LA04 MA03 MA06 NA01 NA07
Claims (11)
所望する伝送させるべき電磁波の周波数に対応する高さ
と幅の中空路を形成し、かつ該中空路の全内周面に金属
メッキ層を設けたことを特徴とする導波管線路。1. An engineering plastic member,
A waveguide line, wherein a hollow passage having a height and a width corresponding to a frequency of an electromagnetic wave to be transmitted is formed, and a metal plating layer is provided on the entire inner peripheral surface of the hollow passage.
ニアリングプラスチック部材と、板状の形状を有する第
２のエンジニアリングプラスチック部材を成形し、第１
のエンジニアリングプラスチック部材の凹型の全内周面
及び第２のエンジニアリングプラスチック部材の上記凹
型に対応する内面部分に金属層をメッキし、上記第１及
び第２のエンジニアリングプラスチック部材を組み合わ
せて所望する伝送させるべき電磁波の周波数に対応する
高さと幅を有しかつ全内周面に金属メッキ層が設けられ
た中空導電路を形成することを特徴とする導波管線路の
製造方法。2. A first engineering plastic member having a concave cross section and a second engineering plastic member having a plate-like shape are molded into a first engineering plastic member.
A metal layer is plated on the entire inner peripheral surface of the concave shape of the engineering plastic member and the inner surface portion corresponding to the concave shape of the second engineering plastic member, and the desired transmission is performed by combining the first and second engineering plastic members. A method for manufacturing a waveguide line, wherein a hollow conductive path having a height and a width corresponding to a frequency of an electromagnetic wave to be formed and having a metal plating layer provided on the entire inner peripheral surface is formed.
リングプラスチック部材を２個成形し、該各エンジニア
リングプラスチック部材の全内周面に金属層をメッキ
し、上記２個のエンジニアリングプラスチック部材を組
み合わせて所望する伝送させるべき電磁波の周波数に対
応する高さと幅を有しかつ全内周面に金属メッキ層が設
けられた中空導電路を形成することを特徴とする導波管
線路の製造方法。3. An engineering plastic member having an L-shaped cross section is formed by molding two engineering plastic members, a metal layer is plated on the entire inner peripheral surface of each of the engineering plastic members, and the two engineering plastic members are combined. Forming a hollow conductive path having a height and width corresponding to the frequency of an electromagnetic wave to be transmitted and having a metal plating layer provided on the entire inner peripheral surface.
に対応する高さと幅の中空路を有するエンジニアリング
プラスチック部材を押し出し成形により成形し、該中空
路の全内周面に金属層をメッキして中空導電路を形成す
ることを特徴とする導波管線路の製造方法。4. An engineering plastic member having a hollow passage having a height and width corresponding to a desired frequency of an electromagnetic wave to be transmitted is molded by extrusion, and a metal layer is plated on the entire inner peripheral surface of the hollow passage to form a hollow. A method for manufacturing a waveguide line, comprising forming a conductive path.
エンジニアリングプラスチック部材を成形し、各エンジ
ニアリングプラスチック部材の一面全面に金属層をメッ
キし、上記２対のエンジニアリングプラスチック部材を
組み合わせて所望する伝送させるべき電磁波の周波数に
対応する高さと幅を有しかつ全内周面に金属メッキ層が
設けられた中空導電路を形成することを特徴とする導波
管線路の製造方法。5. A two-plate engineering plastic member having the same length and different widths is formed, a metal layer is plated on one entire surface of each engineering plastic member, and the two pairs of engineering plastic members are combined. Forming a hollow conductive path having a height and width corresponding to the frequency of an electromagnetic wave to be transmitted and having a metal plating layer provided on the entire inner peripheral surface.
メッキ加工と電解メッキ加工から成ることを特徴とする
請求項２記載の導波管線路の製造方法。6. The method according to claim 2, wherein the plating method of the metal layer includes an electroless plating process and an electrolytic plating process.
メッキ加工と電解メッキ加工から成ることを特徴とする
請求項３記載の導波管線路の製造方法。7. The method according to claim 3, wherein the plating method of the metal layer includes an electroless plating process and an electrolytic plating process.
メッキ加工と電解メッキ加工から成ることを特徴とする
請求項４記載の導波管線路の製造方法。8. The method according to claim 4, wherein the plating method of the metal layer includes an electroless plating process and an electrolytic plating process.
メッキ加工と電解メッキ加工から成ることを特徴とする
請求項５記載の導波管線路の製造方法。9. The method according to claim 5, wherein the plating method of the metal layer comprises an electroless plating process and an electrolytic plating process.
グプラスチック部材によって導波管線路と一体に成形さ
れていることを特徴とする請求項１記載の導波管線路。10. The waveguide line according to claim 1, wherein a desired antenna is formed integrally with said waveguide line by said engineering plastic member.
アリングプラスチック部材によって導波管線路と一体に
成形されていることを特徴とする請求項１又は１０記載
の導波管線路。11. The waveguide line according to claim 1, wherein a desired high-frequency circuit board is formed integrally with the waveguide line by the engineering plastic member.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22729099A JP4011240B2 (en) | 1999-08-11 | 1999-08-11 | Waveguide line |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22729099A JP4011240B2 (en) | 1999-08-11 | 1999-08-11 | Waveguide line |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2001053509A true JP2001053509A (en) | 2001-02-23 |
| JP4011240B2 JP4011240B2 (en) | 2007-11-21 |
Family
ID=16858504
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22729099A Expired - Fee Related JP4011240B2 (en) | 1999-08-11 | 1999-08-11 | Waveguide line |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4011240B2 (en) |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2003005482A1 (en) * | 2001-07-06 | 2003-01-16 | Mitsubishi Denki Kabushiki Kaisha | Method of manufacturing waveguide, and waveguide |
| JP2005505963A (en) * | 2001-10-01 | 2005-02-24 | レイセオン・カンパニー | Slot coupled polarization radiator |
| JP2009010578A (en) * | 2007-06-27 | 2009-01-15 | Mitsubishi Electric Corp | Waveguide switch, and single-pole multi-throw waveguide switch |
| JP2009094153A (en) * | 2007-10-04 | 2009-04-30 | Olympus Corp | Wiring board and method of manufacturing the same |
| WO2009082282A1 (en) | 2007-12-20 | 2009-07-02 | Telefonaktiebolaget Lm Ericsson (Publ) | A waveguide transition arrangement |
| JP2010252092A (en) * | 2009-04-16 | 2010-11-04 | Tyco Electronics Japan Kk | Waveguide |
| JP2012529402A (en) * | 2009-06-12 | 2012-11-22 | ザ・ボーイング・カンパニー | Method and apparatus for aircraft wireless communication using fuselage stringers |
| US8559589B2 (en) | 2008-03-19 | 2013-10-15 | Koninklijke Philips N.V. | Waveguide and computed tomography system with a waveguide |
| CN111653855A (en) * | 2019-03-04 | 2020-09-11 | 莫列斯有限公司 | Waveguide tube |
| CN114122656A (en) * | 2020-08-31 | 2022-03-01 | 台湾禾邦电子有限公司 | Electronic device, waveguide structure thereof and manufacturing method of waveguide structure |
| CN115922258A (en) * | 2023-02-07 | 2023-04-07 | 河南工学院 | Casting and milling integrated forming manufacturing method for terahertz metal coating hollow rectangular waveguide cavity |
-
1999
- 1999-08-11 JP JP22729099A patent/JP4011240B2/en not_active Expired - Fee Related
Cited By (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2003005482A1 (en) * | 2001-07-06 | 2003-01-16 | Mitsubishi Denki Kabushiki Kaisha | Method of manufacturing waveguide, and waveguide |
| US7127796B2 (en) | 2001-07-06 | 2006-10-31 | Mitsubishi Denki Kabushiki Kaisha | Method of manufacturing a waveguide |
| JP2005505963A (en) * | 2001-10-01 | 2005-02-24 | レイセオン・カンパニー | Slot coupled polarization radiator |
| JP2009010578A (en) * | 2007-06-27 | 2009-01-15 | Mitsubishi Electric Corp | Waveguide switch, and single-pole multi-throw waveguide switch |
| JP2009094153A (en) * | 2007-10-04 | 2009-04-30 | Olympus Corp | Wiring board and method of manufacturing the same |
| EP2225794A1 (en) * | 2007-12-20 | 2010-09-08 | Telefonaktiebolaget LM Ericsson (publ) | A waveguide transition arrangement |
| EP2225794A4 (en) * | 2007-12-20 | 2011-12-28 | Ericsson Telefon Ab L M | A waveguide transition arrangement |
| WO2009082282A1 (en) | 2007-12-20 | 2009-07-02 | Telefonaktiebolaget Lm Ericsson (Publ) | A waveguide transition arrangement |
| US8461944B2 (en) | 2007-12-20 | 2013-06-11 | Telefonaktiebolaget L M Ericsson (Publ) | First and second U-shape waveguides joined to a dielectric carrier by a U-shape sealing frame |
| US8559589B2 (en) | 2008-03-19 | 2013-10-15 | Koninklijke Philips N.V. | Waveguide and computed tomography system with a waveguide |
| KR101661002B1 (en) * | 2009-04-16 | 2016-10-10 | 타이코 일렉트로닉스 저팬 지.케이. | Waveguide |
| JP2010252092A (en) * | 2009-04-16 | 2010-11-04 | Tyco Electronics Japan Kk | Waveguide |
| KR20120011842A (en) * | 2009-04-16 | 2012-02-08 | 타이코 일렉트로닉스 저팬 지.케이. | Waveguide |
| JP2012529402A (en) * | 2009-06-12 | 2012-11-22 | ザ・ボーイング・カンパニー | Method and apparatus for aircraft wireless communication using fuselage stringers |
| CN111653855A (en) * | 2019-03-04 | 2020-09-11 | 莫列斯有限公司 | Waveguide tube |
| CN111653855B (en) * | 2019-03-04 | 2021-10-01 | 莫列斯有限公司 | Waveguide and method for manufacturing waveguide |
| US11233305B2 (en) | 2019-03-04 | 2022-01-25 | Molex, Llc | Waveguide comprising a conductor layer formed on a resin tube including fittings held by the resin tube and a method for forming the waveguide |
| CN114122656A (en) * | 2020-08-31 | 2022-03-01 | 台湾禾邦电子有限公司 | Electronic device, waveguide structure thereof and manufacturing method of waveguide structure |
| CN114122656B (en) * | 2020-08-31 | 2022-12-13 | 台湾禾邦电子有限公司 | Electronic device, waveguide structure thereof and manufacturing method of waveguide structure |
| CN115922258A (en) * | 2023-02-07 | 2023-04-07 | 河南工学院 | Casting and milling integrated forming manufacturing method for terahertz metal coating hollow rectangular waveguide cavity |
Also Published As
| Publication number | Publication date |
|---|---|
| JP4011240B2 (en) | 2007-11-21 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP3874279B2 (en) | Waveguide slot antenna | |
| US10833382B2 (en) | RF structure and a method of forming an RF structure | |
| US20100238085A1 (en) | Plastic waveguide slot array and method of manufacture | |
| EP0569017B1 (en) | Molded metallized plastic microwave components and processes for manufacture | |
| JP2001053509A (en) | Waveguide line and manufacture thereof | |
| US8188805B2 (en) | Triplate line-to-waveguide transducer having spacer dimensions which are larger than waveguide dimensions | |
| US10096880B2 (en) | Waveguide comprising first and second components attachable together using an extruding lip and an intruding groove | |
| KR20150046024A (en) | Waveguide tube slot antenna and wireless device provided therewith | |
| CN111211394A (en) | Coaxial-waveguide converter array, antenna array and method for manufacturing waveguide device | |
| US10454150B2 (en) | Radio frequency waveguide devices including a dielectric having other exterior surfaces with a feature thereon and coated by a metal layer | |
| Ghazali et al. | 3D Printed high functional density packaging compatible out-of-plane antennas | |
| US7382212B2 (en) | Transition between a rectangular waveguide and a microstrip line comprised of a single metallized bar | |
| Zhu et al. | Versatile manufacturing of split-block microwave devices using rapid prototyping and electroplating | |
| CN1897352A (en) | Waveguide slot antenna and manufacturing method thereof | |
| CN111180904B (en) | 5G millimeter wave antenna and manufacturing method thereof | |
| JP2002100912A (en) | Method for manufacturing waveguide circuit and waveguide circuit | |
| JP4181083B2 (en) | Plating method and high frequency line | |
| JP2004172688A (en) | Waveguide bend, waveguide plate, and high frequency apparatus | |
| CN116683167A (en) | Plastic electroplated waveguide antenna and manufacturing method thereof | |
| JPH0770885B2 (en) | Micro strip line | |
| JPH04113703A (en) | Microwave circuit | |
| Arnold | A radiating element for an active airborne antenna | |
| KR20030016152A (en) | Metal-coated antenna production means and product | |
| Shelley et al. | Use of metallised plastics in high volume antenna applications | |
| CN117937087A (en) | Radio frequency micro-coaxial device processing method based on 3D printing and MEMS hybrid technology |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| RD03 | Notification of appointment of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7423 Effective date: 20040908 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20051222 |
|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A821 Effective date: 20051226 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20061019 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20061031 |
|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20061225 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20070403 |
|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20070601 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20070828 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20070905 |
|
| R150 | Certificate of patent (=grant) or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20100914 Year of fee payment: 3 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110914 Year of fee payment: 4 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110914 Year of fee payment: 4 |
|
| S111 | Request for change of ownership or part of ownership |
Free format text: JAPANESE INTERMEDIATE CODE: R313117 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110914 Year of fee payment: 4 |
|
| R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120914 Year of fee payment: 5 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130914 Year of fee payment: 6 |
|
| LAPS | Cancellation because of no payment of annual fees |