JP4011240B2 - Waveguide line - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a waveguide line suitable for a transmission line used for a communication / broadcasting transmitter / receiver or a collision-preventing radar transmitter / receiver in an automobile, and a manufacturing method thereof. The present invention relates to an improvement in a waveguide line that can be formed integrally with a member and a manufacturing method thereof.
[0002]
[Prior art]
Transmission circuits that transmit electromagnetic waves have been put to practical use after several attempts, such as a waveguide composed of a metal steel tube, a strip line composed of a dielectric substrate such as plastic, and a surface wave line.
[0003]
[Problems to be solved by the invention]
A waveguide made of metal steel pipe is generally used as a low-loss high-frequency transmission method, but its manufacturing method is to form metal by drawing, cut it to the required length, and connect Since the manufacturing method is to braze the connector, it is not suitable for mass production and is also expensive. Further, since the material is different from that of the high-frequency circuit board and the antenna, there is a problem that the molding cannot be performed integrally and the productivity is poor.
[0004]
In addition, since the same substrate material can be used for the strip line, the surface wave line, etc., it can be integrally formed with the high-frequency circuit board and the productivity is high. However, this transmission line has a problem of a low-loss transmission line and a development of a low-loss substrate material because the influence of the loss of the dielectric material constituting the substrate material is particularly large as the frequency becomes high.
[0005]
An object of the present invention is to solve the above-mentioned problems of the prior art, and is inexpensive, easy to manufacture, suitable for mass production, and a waveguide line capable of integrally forming peripheral circuit members such as an antenna and a high-frequency circuit board, and the like It is to provide a manufacturing method.
[0006]
[Means for Solving the Problems]
In order to achieve the above object, a waveguide line according to the first aspect of the present invention forms a hollow path having a height and a width corresponding to a desired frequency of an electromagnetic wave to be transmitted in an engineering plastic member. A waveguide line having a metal plating layer on the entire inner peripheral surface , and a desired high-frequency circuit board is formed integrally with the waveguide line by the engineering plastic member, and a high-frequency signal from the high-frequency circuit board A high-frequency power supply probe for supplying power to the waveguide line is provided .
[0007]
According to one embodiment of the method for manufacturing a waveguide line, the first engineering plastic member having a concave cross section and the second engineering plastic member having a plate shape are molded, and the first A metal layer is plated on the entire inner peripheral surface of the concave shape of the engineering plastic member and the inner surface portion corresponding to the concave shape of the second engineering plastic member, and the first and second engineering plastic members are combined for desired transmission. A hollow conductive path having a height and a width corresponding to the frequency of the power electromagnetic wave and having a metal plating layer provided on the entire inner peripheral surface is formed.
[0008]
According to one embodiment of the method for manufacturing a waveguide line, two engineering plastic members having an L-shaped cross section and the same shape are formed, and the entire inner circumference of each engineering plastic member A hollow conductive plate having a height and width corresponding to the desired frequency of the electromagnetic wave to be transmitted by plating the metal layer on the surface and combining the two engineering plastic members, and having a metal plating layer on the entire inner peripheral surface. The gist is to form a road.
[0009]
According to one embodiment of a method for manufacturing a waveguide line, an engineering plastic member having a hollow path having a height and width corresponding to a desired frequency of an electromagnetic wave to be transmitted is formed by extrusion molding, and the entire hollow path is formed. The gist is to form a hollow conductive path by plating a metal layer on the inner peripheral surface.
[0010]
According to one embodiment of the method for manufacturing a waveguide line, two pairs of plate-shaped engineering plastic members having the same length and different widths are formed, and a metal layer is plated on the entire surface of each engineering plastic member. And combining the two pairs of engineering plastic members to form a hollow conductive path having a height and width corresponding to the desired frequency of the electromagnetic wave to be transmitted and having a metal plating layer on the entire inner peripheral surface. The gist.
[0011]
According to an embodiment of the method for manufacturing a waveguide line, the metal layer plating method includes electroless plating and electrolytic plating, and a predetermined chemical treatment is first performed on a surface to be plated. The gist of the present invention is to perform electroless plating to make it electrically conductive, and then to treat the film to a specified thickness by electrolytic plating.
[0015]
In the waveguide line according to the first aspect of the present invention, a desired antenna can be formed integrally with the waveguide line by the engineering plastic member.
[0016]
DETAILED DESCRIPTION OF THE INVENTION
In the present invention, as described above, most of the waveguide structure is formed of an engineering plastic member, and a metal plating layer is provided on the entire inner peripheral surface of the hollow path as the hollow conductive path, thereby allowing the conventional strip line or the like to be used. Improve the transmission loss problem. Furthermore, the conventional structure of the metal waveguide and the high-frequency circuit can be integrated by integrally forming the waveguide structure portion and the peripheral circuit portion such as the high-frequency circuit portion and / or the antenna portion with the same engineering plastic member. To reduce costs and improve productivity.
[0017]
Embodiments of the present invention shown in the drawings will be described below.
FIG. 1 shows an embodiment of a waveguide line according to the present invention. In the figure, reference numeral 1 denotes an engineering plastic member molded so as to constitute a waveguide line body, and a rectangular hollow path 2 is formed. The hollow path 2 has a height H and a width W corresponding to a desired frequency of an electromagnetic wave to be transmitted, and a predetermined metal plating layer 3 is formed on the entire inner peripheral surface thereof.
[0018]
As the plastic material of the engineering plastic member 1, for example, high-precision liquid crystal polymer bakelites C810 to C820 that can be used for metal plating can be used.
[0019]
As the plating method, for example, the surface to be plated is first subjected to a predetermined chemical treatment, and then electroless plating is performed to make it electrically conductive, and then the specified film thickness is obtained by electrolytic plating. Process so that Of course, the method of providing the metal layer is not limited to this.
[0020]
The engineering plastic member 1 having the hollow path 2 constituting the waveguide line main body is formed by extruding an engineering plastic capable of supporting metal plating, and the metal layer 3 is plated on the entire inner peripheral surface of the hollow path 2. Good.
[0021]
There are various methods for manufacturing the waveguide line body, and there are the following methods in consideration of the ease of manufacturing and plating.
[0022]
(A) As shown in FIG. 2, 1a is a waveguide line substrate recess formed by a first engineering plastic member having a concave cross section, and 1b is formed by a plate-like second engineering plastic member. In the waveguide line substrate portion, metal plating layers 3a and 3b are formed on the entire inner peripheral surface of the concave groove 2a and the inner surface portion 2b of the substrate portion 1b corresponding thereto. In this case, a metal plating layer may be provided on the entire inner surface of the substrate 1b.
Next, by combining the substrate concave portion 1a and the substrate portion 1b, a hollow path having a height H and a width W corresponding to a desired frequency of the electromagnetic wave to be transmitted and the metal plating layer 3 provided on the entire inner peripheral surface 2 is formed. The hollow path 2 functions as a waveguide, and propagates an electromagnetic wave having a predetermined frequency in the length direction L while being guided by a metal-plated wall surface having dimensions of H and W. The metal plating layer 3 is processed by, for example, an electroless plating process for providing conductivity and an electrolytic plating process for obtaining a specified metal thickness, and the first and second engineering plastic members are formed by an injection molding method. Molded with.
[0023]
(B) In FIG. 3, reference numerals 1c and 1d denote L-shaped substrate portions which are injection-molded or extrusion-molded with a plastic member having an L-shaped cross section, and metal plating layers 3c and 3d are formed on the inner peripheral surface thereof.
Next, the two L-shaped substrate portions 1c and 1d are combined to have a height H and a width W corresponding to the desired frequency of the electromagnetic wave to be transmitted, and the metal plating layer 3 is provided on the entire inner peripheral surface. A hollow path 2 is formed.
[0024]
(C) In FIG. 4, 12 and 13 are waveguide line substrates formed of two pairs of plate-shaped engineering plastic members having the same length L and different widths W1 and W2, and the entire surface is metal-plated. Layers 3e and 3f are formed.
Next, a hollow path 2 having a height H and a width W corresponding to a desired frequency of electromagnetic waves to be transmitted by combining the two pairs of substrates 12 and 13 and having a metal plating layer 3 provided on the entire inner peripheral surface. Form.
[0025]
(D) In the conventional waveguide, metal is formed by drawing, and the connecting fittings of each waveguide are brazed to each other. However, according to the method of the present invention, the metal mold for injection-molding the engineering plastic member is a mold that can be molded integrally by connecting the waveguide substrate part and the metal part for connection. Can be molded in one piece.
[0026]
(E) In FIG. 5, 4 is a high-frequency circuit unit formed on the outer surface of the waveguide line substrate unit 1b. As a mold for injection-molding the second engineering plastic member, the waveguide substrate unit 1b and the high-frequency circuit unit The high frequency circuit and the waveguide can be integrally molded by molding using a material that can be molded integrally with 4.
A desired high-frequency circuit pattern is formed in the high-frequency circuit unit 4, various ICs are mounted, and a high-frequency signal from the high-frequency circuit unit 4 is fed to the waveguide unit 6 by a high-frequency power feeding probe 5 and is transmitted in a predetermined manner. I do.
[0027]
(F) In FIG. 6, reference numeral 7 denotes an antenna portion having a slit structure 8 on a side surface which is a general waveguide antenna, and the waveguide line 9 and the antenna portion 7 are integrated as a mold for injection molding an engineering plastic member. As a result, the antenna and the waveguide can be formed integrally.
[0028]
(G) In FIG. 7, 10 is an antenna section, 11 is a high-frequency circuit section, and the waveguide line 9, the antenna section 10 and the high-frequency circuit section 11 can be integrally molded as a mold for injection molding an engineering plastic member. The antenna, the high-frequency circuit, and the waveguide can be integrally formed by molding using
[0029]
【The invention's effect】
As described above, according to the present invention, since the waveguide line is formed using the engineering plastic member, processing becomes easy, mass production becomes possible, and the cost becomes low. Further, not only the waveguide part but also the high-frequency circuit part, the antenna part and the like can be easily molded integrally, and the overall configuration can be simplified, reduced in size and reduced in weight.
[Brief description of the drawings]
FIG. 1 is a perspective view showing an embodiment of the present invention.
FIG. 2 is a perspective view showing another embodiment of the present invention.
FIG. 3 is a perspective view showing still another embodiment of the present invention.
FIG. 4 is a perspective view showing still another embodiment of the present invention.
FIG. 5 is a perspective view showing still another embodiment of the present invention.
FIG. 6 is a perspective view showing still another embodiment of the present invention.
FIG. 7 is a perspective view showing still another embodiment of the present invention.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Waveguide line main body 2 Hollow path 3 Metal plating layer 1a Waveguide line board | substrate recessed part 1b Waveguide line board | substrate part 2a Groove 2b The inner surface part 1c of a board | substrate part, 1d L-type engineering plastic member

Claims (1)

The engineering plastic member is a waveguide line in which a hollow path having a height and a width corresponding to a desired frequency of an electromagnetic wave to be transmitted is formed, and a metal plating layer is provided on the entire inner peripheral surface of the hollow path,
A desired high-frequency circuit board is formed integrally with the waveguide line by the engineering plastic member,
A waveguide line comprising a high-frequency power supply probe for supplying a high-frequency signal from the high-frequency circuit board to the waveguide line.

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