CN117937087A - Radio frequency micro-coaxial device processing method based on 3D printing and MEMS hybrid technology - Google Patents
Radio frequency micro-coaxial device processing method based on 3D printing and MEMS hybrid technology Download PDFInfo
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Abstract
The invention discloses a radio frequency micro-coaxial device processing method based on a 3D printing and MEMS hybrid technology, and belongs to the technical field of micro-nano processing. The method comprises the following steps: the method comprises the steps of mixing a machining flow of a metal radio frequency transmission line at the micro-coaxial axis, an integrated machining flow of an organic framework of a radio frequency micro-coaxial device, and a flow of jointing and assembling the organic framework of the radio frequency micro-coaxial device and the metal radio frequency transmission line; according to the invention, the 3D printing process and the MEMS process are reasonably selected, and the cost can be greatly reduced by adopting the hybrid 3D printing-MEMS process, and in addition, the error caused by lamination can be reduced by the integrated forming advantage of 3D printing, so that the performance of the radio frequency device is improved.
Description
Technical Field
The invention relates to the field of radio frequency device manufacturing, in particular to a manufacturing technology of a micro-coaxial structure radio frequency device applied to a high-frequency W wave band and a terahertz wave band, and particularly discloses a radio frequency micro-coaxial device processing method based on a 3D printing and MEMS (micro-electro-mechanical System) hybrid process, belonging to the technical field of micro-nano processing.
Background
The three-dimensional metal micro-coaxial structure is the most promising structure for realizing the terahertz wave band device, the structure is extremely low in electromagnetic loss, and the interference of stray signals is reduced due to the cladding of the metal shell, but the three-dimensional metal micro-coaxial structure is quite expensive to process. Because the structure belongs to a three-dimensional structure, the traditional MEMS technology needs to be disassembled into a plurality of plane structures for processing, and then the whole three-dimensional structure can be manufactured through continuous lamination. Not only is the processing cost enormous, but also the alignment from layer to layer and the error perturbation can greatly impact the final electromagnetic performance of the device. On the other hand, the metal transmission line is usually manufactured through a traditional MEMS electroplating process, an electroplating mold is manufactured through a photoetching process in the electroplating process, then the mold is filled through electroplating, and finally the mold, namely the sacrificial layer, is removed to realize the processing of the metal transmission line, so that materials are consumed. The conventional MEMS technology has failed to meet the manufacturing requirements of three-dimensional metal micro-coaxial structures.
3D prints has the ability of making 3D complex structure, can integrated into one piece moreover, and processing cost greatly reduced. 3D printing also has its limitations, namely, limitations of printing materials and limitations of processing accuracy. Current 3D printing techniques can only print non-conductive materials; on the other hand, the existing 3D printing technology can integrally form a single transmission line without positioning requirements, and cannot meet the alignment requirements in the manufacturing process of the cross-arrangement mutual coupling radio frequency transmission line. Therefore, the conductive structure of the three-dimensional metal micro-coaxial structure cannot be manufactured by the 3D printing technique.
In order to overcome the inherent defects of the traditional MEMS process and break through the material limitation of the 3D printing processing mode and the bottleneck of low precision, the invention aims to provide a process for processing a radio frequency micro-coaxial device based on the mixing of 3D printing and MEMS.
Disclosure of Invention
The invention aims to overcome the defects of the background technology, provide a radio frequency micro-coaxial device processing mode which is low in cost, simple and feasible, achieve the aim of processing a three-dimensional metal micro-coaxial structure device with excellent radio frequency performance, and solve the technical problems that the cost of manufacturing the three-dimensional metal micro-coaxial structure device by the traditional MEMS technology is high, consumables and a 3D printing technology cannot directly print out the three-dimensional metal micro-coaxial structure device.
The invention adopts the following technical scheme for realizing the purposes of the invention:
A radio frequency micro-coaxial device processing method based on a 3D printing and MEMS hybrid technology comprises the following steps:
Step 1, a mixed processing flow of a metal radio frequency transmission line at a micro-coaxial axis comprises the following steps: integrally forming a radio frequency micro-coaxial device organic framework comprising a metal grounding shell and an organic supporting structure by utilizing a 3D printing technology, electroplating a metal layer on the inner and outer surfaces of the metal grounding shell, fixing the organic supporting structure on the inner side of the metal grounding shell, and supporting a metal radio frequency transmission line positioned at the micro-coaxial axle center position by the organic supporting structure;
Step 2, the integrated processing flow of the organic framework of the radio frequency micro-coaxial device is as follows: printing a metal radio frequency transmission line organic framework by using a 3D printing technology, and electroplating a metal layer on the surface of the metal radio frequency transmission line organic framework to prepare a metal radio frequency transmission line;
Step 3, the process of jointing and assembling the organic framework of the radio frequency micro-coaxial device and the metal radio frequency transmission line comprises the following steps: and jointing and assembling the organic framework of the radio frequency micro-coaxial device and the metal radio frequency transmission line.
As a further optimization scheme of a radio frequency micro-coaxial device processing method based on a 3D printing and MEMS hybrid technology, the radio frequency micro-coaxial device organic framework integrally formed by utilizing a 3D printing technology comprises two first semi-closed structures and second semi-closed structures which are symmetrical along an axis, wherein the first semi-closed structures comprise a first part of a metal grounding shell and a first part of an organic supporting structure fixed on the inner side of the first part of the metal grounding shell, and the second semi-closed structures comprise a second part of the metal grounding shell and a second part of the organic supporting structure fixed on the inner side of the second part of the metal grounding shell.
As a still further optimization scheme of a radio frequency micro-coaxial device processing method based on a 3D printing and MEMS hybrid technology, the specific method for electroplating a metal layer on the inner and outer surfaces of a metal grounding shell in the step 1 is as follows: firstly, covering a first part of an organic supporting structure and a second part of the organic supporting structure, coating seed layers on the surfaces of a first semi-closed structure and a second semi-closed structure, and growing adhesion layers on the inner side and the outer side of the first part and the second part of the metal grounding shell; electroplating is performed on the surfaces of the first part of the metal grounding shell and the second part of the metal grounding shell where the adhesion layer is grown.
As a still further optimization scheme of the radio frequency micro-coaxial device processing method based on the 3D printing and MEMS hybrid technology, the specific method for assembling the radio frequency micro-coaxial device organic framework and the metal radio frequency transmission line by the step 3 comprises the following steps: firstly, bonding a metal radio frequency transmission line on a supporting structure in a heating and pressurizing mode; and then bonding the first semi-closed structure and the second semi-closed structure by heating and pressurizing.
As a still further optimization scheme of a radio frequency micro-coaxial device processing method based on a 3D printing and MEMS hybrid technology, step 1 is to integrally form a radio frequency micro-coaxial device organic framework comprising a metal grounding shell and an organic supporting structure by utilizing a 3D printing technology, wherein a hole is reserved on the metal grounding shell along the axial direction, and the width W Holes and holes of the hole and the width W Outer conductor of the micro-coaxial metal grounding shell meet the following conditions: w Holes and holes <0.1×W Outer conductor ,W Outer conductor is 15-25 μm and W Holes and holes is 1.5-2.5 μm.
As a still further optimization scheme of the radio frequency micro coaxial device processing method based on the 3D printing and MEMS hybrid technology, in the radio frequency micro coaxial device organic framework integrally formed by utilizing the 3D printing technology in step1, the height B1_H and the width B1_W of the metal grounding shell are equal, the width B1_W=B1_H=15 mm-25 μm, and the value range of the length B1_L of the metal grounding shell is B1_L=11 mm-12 mm.
As a still further optimization scheme of a radio frequency micro-coaxial device processing method based on a 3D printing and MEMS hybrid technology, the specific method for electroplating a metal layer on the surface of the metal radio frequency transmission line organic framework in step 2 is as follows: coating a seed layer on the surface of the metal radio frequency transmission line organic framework, and growing an adhesion layer on the surface of the metal radio frequency transmission line organic framework.
As a still further optimization scheme of the radio frequency micro-coaxial device processing method based on the 3D printing and MEMS hybrid technology, the step 1 adopts an organic material to print the radio frequency micro-coaxial device organic framework in a 3D mode, the step 2 adopts an organic material to print the metal radio frequency transmission line organic framework in a 3D mode, and the organic material comprises but is not limited to ABS, titanium alloy, chromium alloy, stainless steel and aluminum.
As a still further optimization scheme of the radio frequency micro-coaxial device processing method based on the 3D printing and MEMS hybrid process, the organic support structure first part and the organic support structure second part both comprise: the height Z1 of the organic insulating support structure supporting in the vertical longitudinal direction is 0.5×b1_h, and the height Z2 of the organic insulating support structure supporting in the horizontal transverse direction is 0.35×b1_h.
The radio frequency coaxial device manufactured according to the processing method comprises the following components: the metal radio frequency transmission line is suspended in the resonant air cavity covered by the metal grounding shell.
The invention adopts the technical scheme and has the following beneficial effects:
(1) The processing mode combines the high precision advantage of MEMS processing and the low cost and integration advantage of 3D printing, firstly, the organic framework of the radio frequency micro-coaxial device comprising a supporting structure and a metal grounding shell is integrally formed through an organic material 3D technology, the metal grounding shell subjected to 3D printing is used as a mould for chemical treatment and MEMS electroplating, the local metallization of the organic framework of the radio frequency micro-coaxial device made of insulating materials is realized, the consumable materials of the traditional MEMS electroplating process are avoided, and the error introduced by the lamination of the traditional MEMS process is reduced; printing a nonmetallic metal radio frequency transmission line organic framework through a 3D technology, and performing chemical treatment and MEMS electroplating on the basis of the metal radio frequency transmission line organic framework to realize all metallization of the metal radio frequency transmission line organic framework made of insulating materials; and finally, the organic framework of the radio frequency micro-coaxial device is jointed with the metal radio frequency transmission line, so that the alignment requirement of the radio frequency transmission line which is provided with at least two rows of mutually coupled and is arranged in a crossed way near the axis can be met, and the complex process of multilayer stacking of the traditional MEMS process is avoided.
(2) According to the processing mode, the organic frameworks of the radio frequency micro-coaxial devices are longitudinally split, the whole organic frameworks are disassembled for electroplating, and the splicing of the whole organic frameworks is realized through simple jointing processes such as bonding in the later period, so that the processing difficulty and cost are reduced, and meanwhile, the success rate of device flow sheet is improved.
(3) The radio frequency micro coaxial device manufactured by the processing mode provided by the invention has the advantages that the metal grounding shell and the supporting structure are integrally formed by a 3D process, so that the radio frequency loss is greatly reduced, the electromagnetic loss of a metal radio frequency transmission line is reduced, and the performance of the radio frequency device is improved.
Drawings
For a better description and illustration of embodiments and/or examples of those inventions disclosed herein, reference may be made to one or more of the accompanying drawings. Additional details or examples used to describe the drawings should not be construed as limiting the scope of the disclosed invention, the presently described embodiments and/or examples, and any of the presently understood modes of carrying out the invention.
Fig. 1 is a schematic diagram of a micro-coaxial device processing process based on a conventional MEMS process.
Fig. 2 is a schematic diagram of a radio frequency micro-coaxial device processing process based on the 3D printing-MEMS hybrid process of the present invention.
Fig. 3 is a three-dimensional perspective view of a radio frequency micro-coaxial device fabricated using the process of the present invention.
Fig. 4 (a) is a critical dimension marking diagram of a rf micro-coaxial device fabricated by the processing method of the present invention, and fig. 4 (b) is a transverse cross-sectional view of a rf micro-coaxial device fabricated by the processing method of the present invention.
Fig. 5 (a) is a specific flow of the processing technology of the organic framework of the radio frequency micro-coaxial device, and fig. 5 (b) is a schematic diagram for dividing the organic framework into two semi-closed structures along the axis direction of the micro-coaxial device.
Fig. 6 is a specific flowchart of a processing process of a metal rf transmission line structure of an rf micro-coaxial device structure according to the present invention.
Fig. 7 is a specific flowchart of the structure-bonding, splicing and assembling process of the radio frequency micro coaxial device provided by the invention.
Fig. 8 is a schematic diagram comparing a micro-coaxial device processing method based on a 3D printing-MEMS hybrid process with a micro-coaxial device processing method based on a conventional MEMS process in terms of cost and processing complexity.
The reference numerals in the figures illustrate: 1. the device comprises an organic supporting structure, 1-1, a first part of the organic supporting structure, 1-2, a second part of the organic supporting structure, 2, holes, 3, a metal grounding shell, 3-1, a first part of the metal grounding shell, 3-2, a second part of the metal grounding shell, 4, a metal radio frequency transmission line, 5, a radio frequency micro-coaxial device organic framework, 6, a radio frequency micro-coaxial device organic framework growing an adhesion layer material, 7, a local metalized radio frequency micro-coaxial device organic framework, 8, a metal radio frequency transmission line organic framework, 9, a metal radio frequency transmission line organic framework growing an adhesion layer material, 10, a metalized metal radio frequency transmission line organic framework, 11, a metal thin layer, 12 and a radio frequency micro-coaxial device.
Description of the embodiments
In order that the invention may be readily understood, a more complete description of the invention will be rendered by reference to the appended drawings. Preferred embodiments of the present invention are shown in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and/or" as used herein includes any and all combinations of one or more of the associated listed items.
It will be understood that when an element or layer is referred to as being "on," "adjacent," "connected to," or "coupled to" another element or layer, it can be directly on, adjacent, connected, or coupled to the other element or layer, or intervening elements or layers may be present. In contrast, when an element is referred to as being "directly on," "directly adjacent to," "directly connected to," or "directly coupled to" another element or layer, there are no intervening elements or layers present. In the present specification, "connected" is understood to mean "electrically connected", "communicatively connected", and the like, if the connected circuits, modules, units, and the like have electrical signals or data transferred therebetween. It will be understood that, although the terms first, second, third, etc. may be used to describe various elements, components, regions, layers and/or sections, these elements, components, regions, layers and/or sections should not be limited by these terms, these terms are merely used to distinguish one element, component, region, layer or section from another element, component, region, layer or section. Thus, a first element, component, region, layer or section discussed below could be termed a second element, component, region, layer or section without departing from the teachings of the present invention.
Spatially relative terms, such as "under," "below," "beneath," "under," "above," "over," and the like, may be used herein for ease of description to describe one element or feature's relationship to another element or feature as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use and operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over and then described as "under" or "beneath" other elements, elements or features would then be oriented "on" the other elements or features. Thus, the exemplary terms "below" and "under" may include both an upper and a lower orientation. The device may be otherwise oriented, for example rotated 90 degrees, and the spatial descriptors used herein interpreted accordingly as spatial orientations of the device.
The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It is understood that "at least one" means one or more and "a plurality" means two or more. "at least part of an element" means part or all of the element. It will be further understood that the terms "comprises" and/or "comprising," when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof. As used herein, the term "and/or" includes any and all combinations of the associated listed items.
Embodiments of the invention are described herein with reference to cross-sectional illustrations that are schematic illustrations of idealized embodiments of the invention. In this way, variations from the shapes of the illustrations as a result, for example, of manufacturing techniques and/or tolerances, are to be expected. Thus, embodiments of the present invention should not be limited to the particular shapes of the regions illustrated herein, but rather include deviations in shapes that result, for example, from manufacturing. For example, a plated metal layer, which is shown as a rectangular thin layer, does not actually form a smooth and flat metal layer on the surface, but has a certain roughness and has a convex hull and a concave pit with a high and low fluctuation due to the current intensity and uneven electrolyte composition during plating. Thus, the regions illustrated in the figures are schematic in nature and their shapes are not intended to illustrate the actual shape of a region of a device and are not intended to limit the scope of the present invention.
The processing mode shown in fig. 1 is a micro-coaxial device processing mode based on a traditional MEMS technology, the three-dimensional coaxial structure is manufactured by splitting the three-dimensional coaxial structure into a plurality of planar structures through layering processing, and a 3-dimensional radio frequency structure is finally formed through continuous lamination. The most obvious disadvantage of the traditional processing mode is the expensive processing cost, each layer of processing needs expensive cost, and if one device is processed for at least more than ten times, the number of required lamination layers is continuously increased and the processing cost is correspondingly increased if the three-dimensional coaxial structure is more complicated. In addition, the alignment and lamination precision between each layer of structure can also greatly reduce the performance of the radio frequency device, a certain layer of structure has problems, the whole structure can fail, the consumable is large and the cost is high, the processing difficulty of the traditional MEMS processing mode is increased along with the improvement of the complexity, and in contrast, the 3D printing is always integrated, and the cost of the simple structure or the complex structure is of similar magnitude.
The invention provides a radio frequency micro-coaxial device processing method based on a 3D printing-MEMS (micro electro mechanical system) mixing process, which utilizes the advantage of 3D printing integrated molding, and utilizes organic materials such as ABS (Acrylonitrile butadiene styrene), titanium alloy, chromium alloy, stainless steel, aluminum and other metal powder to integrally print out a general skeleton of the metal micro-coaxial device, and then utilizes chemical treatment, electroplating, vacuum plating and other means in the MEMS process to carry out surface treatment, so that the organic insulating skeleton has conductive performance. Although the metal powder print-formed structure is already a metal, its conductivity is far inferior to that of conventional metals, so that it is necessary to add a plating process to metalize the skeleton to improve conductivity. The processing mode avoids a complex multi-layer processing framework, and combines the high-precision advantage of MEMS processing and the low-cost and integrated advantages of 3D printing. Compared with the processing mode of the micro-coaxial device based on the traditional MEMS technology shown in fig. 1, the processing mode of the invention is easier to realize and has extremely low cost, the error caused by lamination can be reduced, the flow sheet yield is improved, and the performance of the radio frequency device is improved.
The processing mode of the radio frequency micro-coaxial device shown in fig. 2, namely the 3D printing-MEMS hybrid technology of the invention, comprises the following steps: the method comprises the steps of a metal radio frequency transmission line mixed processing flow at the micro-coaxial axis, an integrated processing flow of an organic framework of a radio frequency micro-coaxial device, an organic framework of the radio frequency micro-coaxial device and a metal radio frequency transmission line joint assembly flow. The integrated processing flow of the organic framework of the radio frequency micro-coaxial device is shown in fig. 5, and the manufacture of the metal grounding shell structure and the support structure needs to be simultaneously carried out, which comprises the manufacture of the organic framework of the radio frequency micro-coaxial device and the metallization of the organic framework of the radio frequency micro-coaxial device. The manufacturing process of the radio frequency micro-coaxial device organic framework 5 is to perform 3D printing through a high-precision SLA process, integrally print the metal grounding shell and integrally print the organic supporting structure 1 fixed on the inner wall of the metal grounding shell, wherein the process is organic matters and cannot conduct electricity. Unlike the metallization process of completely plating the metal transmission line at the micro-coaxial center, the metallization process of the rf micro-coaxial device organic skeleton is localized metallization, i.e., plating the structure with the organic support structure portion removed, because the support structure of the coaxial transmission line must be an insulating material, otherwise the current will be shorted by the support structure. The local metallization is achieved by chemical treatment followed by selective electroplating. The surface smoothness is improved by chemically treating the surface of the organic framework of the radio frequency micro-coaxial device, the surface roughness is reduced, and the adhesion layer is increased to improve the adhesion of the subsequent electroplating process, and the specific process is as follows: after the organic supporting structure 1 is covered, a seed layer is coated on the surface of the radio frequency organic framework 5, so that an adhesion layer material does not grow on the surface of the organic supporting structure 1, but an adhesion layer grows only on the inner side and the outer side of the metal grounding shell, the organic supporting structure 1 still keeps the non-conductive characteristic of the organic matters, and the radio frequency micro coaxial device organic framework 6 for growing the adhesion layer material is obtained, thereby preventing metallization of a subsequent electroplating process. The selective electroplating is to treat the organic skeleton 6 of the radio frequency micro coaxial device growing the adhesion layer material by an electroplating process, so as to realize the metallization of the metal grounding shell, a copper metal layer with the thickness of 6 mu m is covered on the surface of the metal grounding shell, and meanwhile, the non-metallization characteristic of the visible support structure is still maintained, so that the local metallization organic skeleton 7 of the radio frequency micro coaxial device is obtained. In the case of high-frequency electromagnetic wave transmission, the copper metal layer with the thickness of 6 mu m is enough for electromagnetic wave transmission; meanwhile, the metal layer formed by selective electroplating also has the function of adhesion, and the fluidity of the metal can be increased in the subsequent splicing and assembling process by heating and pressurizing, so that the metal layer is convenient for better combination and splicing.
In order to facilitate selective electroplating of the organic framework, as shown in fig. 5 (a) and 5 (b), the organic framework is longitudinally cut from a central symmetry plane, that is, the organic framework is divided into two semi-closed structures along the axis direction of the micro-coaxial device, namely, the first part of the organic framework comprises a first metal grounding shell part 3-1 and a first organic support structure part 1-1 for supporting one radio frequency transmission line, and the second part of the organic framework comprises a second metal grounding shell part 3-2 and a second organic support structure part 1-2 for supporting the other radio frequency transmission line. Therefore, the difficulty of the electroplating process is reduced, and the electromagnetic property of the radio frequency micro-coaxial device is not affected.
As shown in fig. 6, the metal radio frequency transmission line mixing processing flow at the micro-coaxial axis specifically includes the following operations: the metal rf transmission line organic frameworks 8 are printed using 3D printing techniques and require further metallization processes because the structure is not metallic and is not capable of transmitting current. Before the metallization process, the surface 8 of the metal radio frequency transmission line organic framework is required to be treated to reduce the surface roughness and improve the adhesiveness of metal ions, that is, a seed layer is coated on the surface of the metal radio frequency transmission line organic framework 8 by a chemical treatment process to obtain a metal radio frequency transmission line organic framework 9 for growing an adhesion layer material, the surface of the metal radio frequency transmission line organic framework 9 for growing the adhesion layer material is electroplated to obtain a metallized metal radio frequency transmission line organic framework 10, and all surfaces of the metal radio frequency transmission line organic framework are covered with a layer of thin metal.
The method for processing the metal radio frequency transmission line at the micro-coaxial axle center also adopts an electroplating mode, but is different from the traditional MEMS electroplating technology in that an electroplating mould is adopted. The traditional MEMS electroplating process utilizes a photoetching process to manufacture an electroplating mold, then the mold is filled by electroplating, and finally the mold, namely the sacrificial layer, is removed by utilizing a developing solution to realize the processing of the metal transmission line, so that materials are wasted, and the waste liquid generated at the same time also pollutes the environment. According to the invention, the transmission line is directly printed by 3D printing integrated into one piece without photoetching, so that the consumable is reduced. However, the 3D printing can only print out non-conductive materials, so in the invention, the 3D printed organic structure is put into the electroplating table, and the electroplating process is carried out by taking the organic structure as a frame, so that the printed metal radio frequency transmission line organic frame wraps a layer of metal, and the processing of the metal radio frequency transmission line is realized. Although the metal radio frequency transmission line is only surrounded by a thin metal layer, the thin metal layer is sufficient for current transmission due to the skin effect of the current at high frequencies.
When the metal radio frequency transmission line at the micro coaxial axle center of the inner layer, the outer layer metal grounding shell and the organic supporting structure are printed and metallized, the joint assembly process is adopted. As shown in fig. 7, the process of assembling the organic skeleton of the rf micro-coaxial device and the metal rf transmission line includes two assembling processes, wherein the first assembling process is to assemble the metal rf transmission line 4 and the insulating organic support structure 1 at the micro-coaxial axis, and the metal rf transmission line 4 is placed on the organic support structure 1 and pressed for bonding after being cooled at the temperature by heating the metal rf transmission line 4 to enable the metal surface to have fluidity, so that the metal rf transmission line 4 and the metal rf transmission line can be bonded together on a bonding machine; the second assembly process is to join two semi-closed structures longitudinally cut along the axisymmetric plane, and the metal thin layer 11 exists at the joint contact, so that the joint assembly is realized after the heat pressing and cooling, and the radio frequency micro coaxial device 12 formed after the heat pressing and cooling is obtained. Of course, the method inevitably generates heat, which causes certain loss to metal, and also needs to select organic materials with extremely high melting point and weak thermoplasticity to manufacture organic frameworks which do not have thermoplasticity and can endure extremely high temperature, so as to ensure that the 3D printing framework is not deformed in the bonding process.
A three-dimensional perspective view of a finished rf micro-coaxial device is shown in fig. 3, the rf micro-coaxial device comprising: the metal radio frequency transmission line 4, the organic supporting structure 1, the metal grounding shell 3, the holes 2 which are convenient for electroplating the surface of the inner layer and the resonant air cavity are positioned at the micro-coaxial axis position. The resonant air cavity is the part covered by the metal grounding shell, and the metal radio frequency transmission line and the organic supporting structure are also arranged in the resonant air cavity covered by the metal grounding shell. The organic support structure is made of an insulating organic material and functions to support the metallic radio frequency transmission line such that the transmission line can be suspended within the resonant air cavity surrounded by the metallic grounded enclosure. The metal radio frequency transmission line is responsible for the transmission of radio frequency signals, the structure is suspended in the resonant air cavity and is supported by the supporting structure made of the organic non-conductor material, the structure prevents the metal radio frequency transmission line from being contacted with other materials, and radio frequency loss can be greatly reduced, so that the metal radio frequency transmission line suspended in the resonant air cavity has the characteristic of low electromagnetic loss, and the shielding effect of the metal grounding shell also reduces the interference of external electromagnetic signals on the internal radio frequency transmission line.
In the embodiment of the invention, the 3D printed metal outer conductor of the micro-coaxial device, namely the grounding shell coating the radio frequency transmission line, has the same height b1_h and width b1_w, and the length b1_l=11-12 mm, and the height b1_w=b1_h=15-25 μm.
In the embodiment of the invention, a plurality of rows of holes 2 are required to be formed on the metal grounding shell 3 along the radio frequency signal transmission direction, namely the axis direction, so that the surface of the inner framework is electroplated with metal, and the holes can be reserved while the organic framework of the radio frequency micro-coaxial device is printed in a 3D mode. In order that the hole does not influence the electromagnetic field propagation property, the size of the hole is small enough, and the width of the hole W Holes and holes is required to satisfy the following relation with the width of the W Outer conductor micro coaxial metal grounding shell: w Holes and holes <0.1×W Outer conductor , the width range of the metal grounding shell W Outer conductor in the present invention: the W Holes and holes of the hole width is 1.5-2.5 μm because of 15-25 μm. The holes are reserved in the 3D printing process, and etching of the holes after printing is not needed.
In the embodiment of the invention, the specific dimension marking is carried out on the radio frequency micro-coaxial device processed by the invention as shown in fig. 4 (a), and according to the simulation results of the dimension and the performance of the micro-coaxial device in the earlier working, the length l i of the metal radio frequency transmission line, the distance d ij of the two transmission lines and the length p i of the overlapped coupling part of the two transmission lines are all parameters affecting the performance of the micro-coaxial radio frequency device. To ensure performance of the rf coaxial device these parameters must meet the parameter ranges shown in table 1:
| Name of the name | Size range/mm | Name of the name | Size range/mm | Name of the name | Size range/mm |
| B1_L | 11~12mm | l6 | 1.96~2.04 | p1 | 0.375~0.425 |
| l1 | 1.96~2.04 | d15 | 0.03~0.05 | p2 | 0.375~0.425 |
| l2 | 1.96~2.04 | d26 | 0.09~0.11 | p3 | 0.375~0.425 |
| l5 | 1.96~2.04 | d37 | 0.07~0.09 |
In an embodiment of the present invention, as shown in fig. 4 (b), the support structure is divided into a longitudinal support structure and a lateral support structure. The height Z1 of the organic insulation supporting structure supported in the vertical longitudinal direction is 0.5 XB1_H=7.5-12.5 μm; the height Z2 of the organic insulating support structure supported in the horizontal transverse direction is 0.35 XB1_H=5.25-8.75 μm.
Fig. 8 shows a comparison between a conventional MEMS process for fabricating a micro-coaxial device and the fabrication method of the present application. In the embodiments of the present application, it can be seen by comparing the complexity of the processing, that the complexity of the 3D printing-MEMS processing process is much lower than that of the conventional MEMS process, and the most important point is the reduction of the processing cost. The cost of processing the structure by using the traditional MEMS technology is about 15-20 times of the cost of the structure.
It should be understood that, although the steps in the flowcharts of the present application are shown in order as indicated by the arrows, these steps are not necessarily performed in order as indicated by the arrows. The steps are not strictly limited to the order of execution unless explicitly recited herein, and the steps may be executed in other orders. Moreover, at least a portion of the steps in the flowcharts of this application may include a plurality of steps or stages that are not necessarily performed at the same time but may be performed at different times, nor does the order in which the steps or stages are performed necessarily performed in sequence, but may be performed alternately or alternately with at least a portion of the steps or stages in other steps or other steps.
In the description of the present specification, reference to the terms "some embodiments," "other embodiments," "desired embodiments," and the like, means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, schematic descriptions of the above terms do not necessarily refer to the same embodiment or example.
The technical features of the above-described embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above-described embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.
The above examples illustrate only a few embodiments of the invention, which are described in detail and are not to be construed as limiting the scope of the invention. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the invention, which are all within the scope of the invention. Accordingly, the scope of protection of the present invention is to be determined by the appended claims.
Claims (10)
1. The radio frequency micro-coaxial device processing method based on the 3D printing and MEMS hybrid technology is characterized by comprising the following steps:
Step 1, integrally forming a radio frequency micro-coaxial device organic framework comprising a metal grounding shell and an organic supporting structure by utilizing a 3D printing technology, electroplating a metal layer on the inner and outer surfaces of the metal grounding shell, fixing the organic supporting structure on the inner side of the metal grounding shell, and supporting a metal radio frequency transmission line positioned at the micro-coaxial axis position by the organic supporting structure;
step 2, printing a metal radio frequency transmission line organic framework by using a 3D printing technology, and electroplating a metal layer on the surface of the metal radio frequency transmission line organic framework to prepare a metal radio frequency transmission line;
and 3, jointing and assembling the radio frequency micro-coaxial device organic framework and the metal radio frequency transmission line.
2. The method for processing the radio frequency micro-coaxial device based on the 3D printing and MEMS hybrid process according to claim 1, wherein the radio frequency micro-coaxial device organic framework integrally formed by the 3D printing technology in step 1 comprises two first semi-closed structures and second semi-closed structures which are symmetrical along an axis, the first semi-closed structures comprise a first part of a metal grounding shell and a first part of an organic supporting structure fixed on the inner side of the first part of the metal grounding shell, and the second semi-closed structures comprise a second part of the metal grounding shell and a second part of the organic supporting structure fixed on the inner side of the second part of the metal grounding shell.
3. The method for processing the radio frequency micro-coaxial device based on the 3D printing and MEMS hybrid technology according to claim 2, wherein the specific method for electroplating the metal layer on the inner and outer surfaces of the metal grounding shell in the step 1 is as follows: firstly, covering a first part of an organic supporting structure and a second part of the organic supporting structure, coating seed layers on the surfaces of a first semi-closed structure and a second semi-closed structure, and growing adhesion layers on the inner side and the outer side of the first part and the second part of the metal grounding shell; electroplating is performed on the surfaces of the first part of the metal grounding shell and the second part of the metal grounding shell where the adhesion layer is grown.
4. The method for processing the radio frequency micro-coaxial device based on the 3D printing and MEMS hybrid technology according to claim 3, wherein the specific method for assembling the radio frequency micro-coaxial device organic framework and the metal radio frequency transmission line in a joint manner in the step 3 is as follows: firstly, bonding a metal radio frequency transmission line on a supporting structure in a heating and pressurizing mode; and then bonding the first semi-closed structure and the second semi-closed structure by heating and pressurizing.
5. The method for processing the radio frequency micro-coaxial device based on the 3D printing and MEMS hybrid process according to claim 1, wherein when the radio frequency micro-coaxial device organic framework comprising the metal grounding shell and the organic supporting structure is integrally formed by the 3D printing technology in step 1, a hole is left on the metal grounding shell along the axis direction, and the hole width W Holes and holes and the micro-coaxial metal grounding shell width W Outer conductor satisfy the following conditions: w Holes and holes <0.1×W Outer conductor ,W Outer conductor is 15-25 μm and W Holes and holes is 1.5-2.5 μm.
6. The method for processing the radio frequency micro-coaxial device based on the 3D printing and MEMS hybrid technology according to claim 1, wherein in the step 1, in the radio frequency micro-coaxial device organic skeleton integrally formed by using the 3D printing technology, the height b1_h and the width b1_w of the metal grounding shell are equal, b1_w=b1_h=15 mm-25 μm, and the value range of the length b1_l of the metal grounding shell is b1_l=11 mm-12 mm.
7. The method for processing the radio frequency micro-coaxial device based on the 3D printing and MEMS hybrid technology according to claim 1, wherein the specific method for electroplating the metal layer on the surface of the metal radio frequency transmission line organic framework in step 2 is as follows: coating a seed layer on the surface of the metal radio frequency transmission line organic framework, and growing an adhesion layer on the surface of the metal radio frequency transmission line organic framework.
8. The method for processing the radio frequency micro-coaxial device based on the 3D printing and MEMS hybrid technology is characterized in that the step 1 adopts an organic material to print the organic skeleton of the radio frequency micro-coaxial device in a 3D mode, and the step 2 adopts an organic material to print the organic skeleton of a metal radio frequency transmission line in a 3D mode, wherein the organic material comprises but is not limited to ABS, titanium alloy, chromium alloy, stainless steel and aluminum.
9. The method of fabricating a radio frequency micro-coaxial device based on a hybrid 3D printing and MEMS process of claim 6, wherein the first portion of the organic support structure and the second portion of the organic support structure each comprise: the organic insulation support structure is supported in the vertical longitudinal direction, the height Z1 of the organic insulation support structure is 0.5 XB1_H, and the height Z2 of the organic insulation support structure is 0.35 XB1_H.
10. The radio frequency coaxial device made by the processing method according to claim 1, comprising: the metal radio frequency transmission line is suspended in the resonant air cavity covered by the metal grounding shell.
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