CN114122656A - Electronic device, waveguide structure thereof and manufacturing method of waveguide structure - Google Patents
Electronic device, waveguide structure thereof and manufacturing method of waveguide structure Download PDFInfo
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- CN114122656A CN114122656A CN202010894237.4A CN202010894237A CN114122656A CN 114122656 A CN114122656 A CN 114122656A CN 202010894237 A CN202010894237 A CN 202010894237A CN 114122656 A CN114122656 A CN 114122656A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
- H01P3/12—Hollow waveguides
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P11/00—Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type
- H01P11/001—Manufacturing waveguides or transmission lines of the waveguide type
- H01P11/002—Manufacturing hollow waveguides
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Abstract
The invention discloses an electronic device, a waveguide tube structure thereof and a manufacturing method of the waveguide tube structure. The electronic device comprises a control module, an antenna module and a waveguide structure connected between the control module and the antenna module. The waveguide structure includes an insulating carrier and an electrically conductive metallic member. The insulating carrier includes first insulating carrier and the second insulating carrier of mutually supporting with first insulating carrier, and first insulating carrier has first recess, and the second insulating carrier has the second recess that communicates each other with first recess. The conductive metal part comprises a first conductor accommodated in the first groove of the first insulating carrier and a second conductor accommodated in the second groove of the second insulating carrier, and the conductive metal part is provided with a through channel penetrating through the conductive metal part. Thereby, the electromagnetic wave can be transmitted in the through channel provided by the conductive metal piece.
Description
Technical Field
The present disclosure relates to waveguide structures, and particularly to a waveguide structure applied to an electronic device and a method for manufacturing the waveguide structure.
Background
Waveguides can be used to transmit electromagnetic waves, but existing waveguides still have room for improvement.
Disclosure of Invention
The present invention provides an electronic device, a waveguide structure thereof, and a method for manufacturing the waveguide structure, aiming at the deficiencies of the prior art.
In order to solve the above technical problem, one of the technical solutions adopted by the present invention is to provide a waveguide structure, which includes: insulating carrier and electrically conductive metalwork. The insulating carrier comprises a first insulating carrier and a second insulating carrier matched with the first insulating carrier, the first insulating carrier is provided with a first groove, and the second insulating carrier is provided with a second groove communicated with the first groove. The conductive metal part comprises a first conductor accommodated in the first groove of the first insulating carrier and a second conductor accommodated in the second groove of the second insulating carrier, and the conductive metal part is provided with a through channel penetrating through the conductive metal part.
In order to solve the above technical problem, another technical solution adopted by the present invention is to provide an electronic device, including: control module, antenna module and connect in control module with waveguide structure between the antenna module, its characterized in that: the waveguide structure includes an insulating carrier and an electrically conductive metallic element. The insulating bearing part comprises a first insulating carrier and a second insulating carrier matched with the first insulating carrier, the first insulating carrier is provided with a first groove, and the second insulating carrier is provided with a second groove communicated with the first groove. The conductive metal part comprises a first conductor accommodated in the first groove of the first insulating carrier and a second conductor accommodated in the second groove of the second insulating carrier, and the conductive metal part is provided with a through channel penetrating through the conductive metal part.
In order to solve the above technical problem, another technical solution adopted by the present invention is to provide a method for manufacturing a waveguide structure, including: providing an insulating bearing member, wherein the insulating bearing member comprises a first insulating carrier and a second insulating carrier corresponding to the first insulating carrier, the first insulating carrier is provided with a first groove, and the second insulating carrier is provided with a second groove corresponding to the first groove; then, forming a conductive metal piece on the insulating carrier, the conductive metal piece including a first conductive body received in the first groove of the first insulating carrier and a second conductive body received in the second groove of the second insulating carrier; then, the first insulating carrier and the second insulating carrier are connected together, so that the first electric conductor and the second electric conductor are connected with each other to form a through channel penetrating through the electric-conducting metal piece.
One of the advantages of the present invention is that the electronic device and the waveguide structure thereof according to the present invention can transmit electromagnetic waves in the through channel, and achieve the effects of reducing weight and reducing cost, that is, "the insulating carrier includes a first insulating carrier and a second insulating carrier cooperating with the first insulating carrier, the first insulating carrier has a first groove, the second insulating carrier has a second groove communicating with the first groove," and "the conductive metal member includes a first conductive body received in the first groove of the first insulating carrier and a second conductive body received in the second groove of the second insulating carrier, and the conductive metal member has a through channel penetrating through the conductive metal member.
One of the advantages of the present invention is that the manufacturing method of the waveguide structure provided by the present invention can transmit the electromagnetic wave in the through channel, and achieve the effects of reducing weight and reducing cost, that is, "providing an insulating carrier, the insulating carrier includes a first insulating carrier and a second insulating carrier corresponding to the first insulating carrier, the first insulating carrier has a first groove, the second insulating carrier has a second groove corresponding to the first groove," forming a conductive metal part on the insulating carrier, the conductive metal part includes a first conductive body accommodated in the first groove of the first insulating carrier and a second conductive body accommodated in the second groove of the second insulating carrier, "and" connecting the first insulating carrier and the second insulating carrier together, such that the first and second electrical conductors are connected to each other to form a through-channel through the electrically conductive metallic article ".
For a better understanding of the nature and technical content of the present invention, reference should be made to the following detailed description of the invention, taken in conjunction with the accompanying drawings, which are provided for purposes of illustration and description, and are not intended to limit the invention.
Drawings
Fig. 1 is a flowchart of a method for manufacturing a waveguide structure according to a first embodiment of the present invention.
Fig. 2 is a schematic diagram of step S100 of a method for manufacturing a waveguide structure according to a first embodiment of the present invention.
Fig. 3 is a schematic diagram of step S102 of the method for manufacturing a waveguide structure according to the first embodiment of the present invention.
Fig. 4 is a schematic diagram of step S104 of the method for manufacturing the waveguide structure according to the first embodiment of the present invention, and a schematic perspective assembly diagram of the waveguide structure according to the first embodiment of the present invention.
Fig. 5 is a side view of the waveguide structure according to the first embodiment of the present invention.
Fig. 6 is a side exploded view of a waveguide structure according to a first embodiment of the present invention.
Fig. 7 is a graph of insertion loss at different frequencies for the waveguide structure of the first embodiment of the present invention.
Fig. 8 is a side view of a waveguide structure according to a second embodiment of the present invention.
Fig. 9 is a side exploded view of a waveguide structure according to a second embodiment of the present invention.
Fig. 10 is a side view of a waveguide structure according to a third embodiment of the present invention.
Fig. 11 is a side exploded view of a waveguide structure according to a third embodiment of the present invention.
Fig. 12 is a side view of a waveguide structure according to a fourth embodiment of the present invention.
Fig. 13 is a side view of a waveguide structure according to a fifth embodiment of the present invention.
Fig. 14 is a functional block diagram of an electronic device according to a sixth embodiment of the invention.
Detailed Description
The following description is provided for the embodiments of the present disclosure relating to an electronic device, a waveguide structure thereof, and a method for manufacturing the waveguide structure, with reference to specific embodiments, and those skilled in the art will understand the advantages and effects of the present disclosure from the disclosure of the present disclosure. The invention is capable of other and different embodiments and its several details are capable of modifications and variations in various respects, all without departing from the present invention. It should be noted that the drawings of the present invention are merely schematic illustrations and are not drawn to actual dimensions. The following embodiments will further explain the related art of the present invention in detail, but the disclosure is not intended to limit the scope of the present invention. In addition, the term "or" as used herein should be taken to include any one or combination of more of the associated listed items as the case may be.
[ first embodiment ]
Referring to fig. 1 to 5, a first embodiment of the present invention provides a method for manufacturing a waveguide structure, which includes: first, as shown in fig. 1 and fig. 2, an insulating carrier 1 is provided, where the insulating carrier 1 includes a first insulating carrier 11 and a second insulating carrier 12 corresponding to the first insulating carrier 11, the first insulating carrier 11 has a first groove 110, and the second insulating carrier 12 has a second groove 120 corresponding to the first groove 110 (S100); then, as shown in fig. 1 and fig. 3, forming a conductive metal piece 2 on the insulating carrier 1, wherein the conductive metal piece 2 includes a first conductive body 21 accommodated in the first groove 110 of the first insulating carrier 11 and a second conductive body 22 accommodated in the second groove 120 of the second insulating carrier 12 (S102); next, as shown in fig. 1 and 4, the first insulating carrier 11 and the second insulating carrier 12 are connected together, so that the first conductor 21 and the second conductor 22 are connected to each other to form a through channel 200 penetrating the conductive metal member 2 (S104). That is, as shown in fig. 4, the first conductor 21 and the second conductor 22 cooperate with each other to form an inner metal wall of the waveguide structure S, and the through channel 200 is surrounded by the inner metal wall.
For example, as shown in fig. 1 to fig. 3, in the step S102 of forming the conductive metal piece 2 on the insulating carrier 1, the method further includes: first, as shown in fig. 1 and fig. 2, a laser source (not shown) is projected onto the inner surface 1100 of the first recess 110 and the inner surface 1200 of the second recess 120 to activate surface molecules on the inner surface 1100 of the first recess 110 and surface molecules on the inner surface 1200 of the second recess 120 (S1020); then, as shown in fig. 1 and 3, the first conductor 21 and the second conductor 22 are formed on the inner surface 1100 of the first recess 110 and the inner surface 1200 of the second recess 120, respectively (S1022). It is noted that when the laser source is projected onto the inner surface 1100 of the first recess 110 and the inner surface 1200 of the second recess 120, the surface metal molecules on the inner surface 1100 of the first recess 110 and the surface metal molecules on the inner surface 1200 of the second recess 120 are activated by the laser source. In addition, the first conductor 21 and the second conductor 22 can be formed on the inner surface 1100 of the first groove 110 and the inner surface 1200 of the second groove 120 by electroplating, sputtering, coating or any processing method, respectively, and the thickness of the first conductor 21 or the second conductor 22 of the conductive metal member 2 can be between 10nm and 50 nm. However, the above-mentioned examples are only one possible embodiment and are not intended to limit the present invention.
Further, referring to fig. 4 to 7, a first embodiment of the present invention provides a waveguide structure S, which includes: an insulating carrier 1 and an electrically conductive metal part 2. First, the insulating carrier 1 comprises a first insulating carrier 11 and a second insulating carrier 12 cooperating with the first insulating carrier 11. The first insulating carrier 11 has a first groove 110, and the second insulating carrier 12 has a second groove 120 communicating with the first groove 110. In addition, the conductive metal piece 2 includes a first electrical conductor 21 accommodated in the first groove 110 of the first insulating carrier 11 and a second electrical conductor 22 accommodated in the second groove 120 of the second insulating carrier 12, and the conductive metal piece 2 has a through passage 200 penetrating the conductive metal piece 2.
For example, both the first insulating carrier 11 and the second insulating carrier 12 may be made of a plastic material or any insulating material, thereby reducing the production cost and the overall weight of the waveguide structure S. According to different requirements, the first insulating carrier 11 and the second insulating carrier 12 can be integrated into a single component, and the first conductor 21 and the second conductor 22 can be integrated into a single component. That is, the insulating carrier 1 may be a single member or may be composed of two or more members, and the conductive metallic 2 may be a single member or may be composed of two or more members. In addition, the through channel 200 may penetrate through the first electrical conductor 21 or the second electrical conductor 22 (as shown in fig. 5), and the through channel 200 may be a single through hole penetrating through the first electrical conductor 21 or the second electrical conductor 22 (as shown in fig. 5), according to different requirements. Furthermore, according to different requirements, the first conductive body 21 can be a first single conductive material layer or a first conductive composite layer, and the first conductive composite layer includes a first conductive substrate layer (e.g. Cu layer) accommodated in the first groove 110 of the first insulating carrier 11 and a first conductive capping layer (e.g. Ag, Au, Ni or Cr layer) formed on the first conductive substrate layer. Furthermore, the second electrical conductor 22 can be a second single conductive material layer or a second conductive composite layer according to different requirements, and the second conductive composite layer includes a second conductive substrate layer (e.g. Cu layer) accommodated in the second groove 120 of the second insulating carrier 12 and a second conductive covering layer (e.g. Ag, Au, Ni or Cr layer) formed on the second conductive substrate layer. However, the above-mentioned examples are only one possible embodiment and are not intended to limit the present invention.
For example, as shown in fig. 5 and fig. 6, the first insulating carrier 11 includes two first recesses 111 (i.e., first recessed spaces) and a first protrusion 112 located between the two first recesses 111. The second insulating carrier 12 includes two second protrusions 121 and a second recess 122 (i.e., a second recess space) between the two second protrusions 121. The two second protrusions 121 can be respectively received in the two first recesses 111, and the first protrusions 112 can be received in the second recesses 122, so that the first insulating carrier 11 and the second insulating carrier 12 can be connected together by being matched with each other. Furthermore, the first groove 110 of the first insulating carrier 11 and the first conductor 21 of the conductive metal member 2 are both disposed inside the first protrusion 112 of the first insulating carrier 11, and the second groove 120 of the second insulating carrier 12 and the second conductor 22 of the conductive metal member 2 are both disposed below the second recess 122 of the second insulating carrier 12. However, the above-mentioned examples are only one possible embodiment and are not intended to limit the present invention.
For example, as shown in fig. 7, the waveguide structure S of the present invention can be applied as a millimeter-wave waveguide (millimeter-wave waveguide). The invention adopts the through channel 200 with the length of 50mm and the size of the carrying surface of 3.01X.55mm2Conditions (3) the results of the experiment were: the insertion loss (S21) of the waveguide structure S in the millimeter wave frequency band can be less than 1dB, and the insertion loss of the waveguide structure S in the center frequency 78GHz of the radar application frequency band (about 76-81 GHz) for vehicles is about 0.13dB, so the waveguide structure S has the characteristic of lower electrical transmission loss.
[ second embodiment ]
Referring to fig. 8 and 9, a second embodiment of the present invention provides a waveguide structure S, which includes: an insulating carrier 1 and an electrically conductive metal part 2. As can be seen from the comparison between fig. 8 and fig. 5 and the comparison between fig. 9 and fig. 6, the greatest difference between the second embodiment and the first embodiment of the present invention is: in the second embodiment, the through channel 200 simultaneously penetrates both the first electrical conductor 21 and the second electrical conductor 22, and the through channel 200 is two through grooves 2000 respectively penetrating the first electrical conductor 21 and the second electrical conductor 22 and communicating with each other. That is, the through channel 200 may penetrate through one of the first electrical conductor 21 and the second electrical conductor 22 (as shown in fig. 5 or fig. 6 of the first embodiment) or both the first electrical conductor 21 and the second electrical conductor 22 (as shown in fig. 8 or fig. 9 of the second embodiment), according to different requirements.
[ third embodiment ]
Referring to fig. 10 and 11, a third embodiment of the present invention provides a waveguide structure S, which includes: an insulating carrier 1 and an electrically conductive metal part 2. As can be seen from the comparison between fig. 10 and fig. 5 and the comparison between fig. 11 and fig. 6, the greatest difference between the third embodiment and the first embodiment of the present invention is: in the third embodiment, the first insulating carrier 11 includes at least the first positioning portion 113, the second insulating carrier 12 includes at least the second positioning portion 123, and the at least the first positioning portion 113 and the at least the second positioning portion 123 can cooperate with each other to position or limit the relative position of the first insulating carrier 11 and the second insulating carrier 12. For example, as shown in fig. 11, two first positioning portions 113 (i.e., two recessed portions) of the first insulating carrier 11 can be respectively disposed below the two first recessed portions 111, and two second positioning portions 123 (i.e., two protruding portions) of the second insulating carrier 12 can be respectively disposed on the second protruding portions 121. However, the above-mentioned examples are only one possible embodiment and are not intended to limit the present invention.
[ fourth embodiment ]
Referring to fig. 12, a fourth embodiment of the present invention provides a waveguide structure S, which includes: an insulating carrier 1 and an electrically conductive metal part 2. As can be seen from a comparison between fig. 12 and fig. 5, the greatest difference between the fourth embodiment of the present invention and the first embodiment is: the waveguide structure S in the fourth embodiment of the present invention further includes a plurality of fixing pieces 3, and the plurality of fixing pieces 3 are used to connect the first insulating carrier 11 and the second insulating carrier 12 (that is, the first insulating carrier 11 and the second insulating carrier 12 can be connected together by the plurality of fixing pieces 3). For example, the fixing member 3 may be a screw, a bolt, or any fixing structure that can fix the first insulating carrier 11 and the second insulating carrier 12. In addition, each of the fixing members 3 can penetrate through the first insulating carrier 11 (as shown in fig. 12) or the second insulating carrier 12, and the fixing member 3 can penetrate through the second projection 121 (as shown in fig. 12) of the second insulating carrier 12. It is noted that when the fixing element 3 is connected between the first insulating carrier 11 and the second insulating carrier 12, the fixing element 3 is far away from the first conductor 21 and the second conductor 22 and far away from the through channel 200. However, the above-mentioned examples are only one possible embodiment and are not intended to limit the present invention.
[ fifth embodiment ]
Referring to fig. 13, a fifth embodiment of the present invention provides a waveguide structure S, which includes: an insulating carrier 1 and an electrically conductive metal part 2. As can be seen from a comparison between fig. 13 and fig. 5, the biggest difference between the fifth embodiment of the present invention and the first embodiment is: the waveguide structure S in the fifth embodiment of the present invention further includes a plurality of fixtures 3, and the plurality of fixtures 3 are used for connecting the first insulating carrier 11 with the second insulating carrier 12 (that is, the first insulating carrier 11 and the second insulating carrier 12 can be connected together by the plurality of fixtures 3) or for connecting the first electrical conductor 21 with the second electrical conductor 22 (that is, the first electrical conductor 21 and the second electrical conductor 22 can be connected together by the plurality of fixtures 3). For example, the fixing member 3 can be a screw, a bolt, or any fixing structure or adhesive material that can fix the first insulating carrier 11 and the second insulating carrier 12 (or the first conductor 21 and the second conductor 22). In addition, each of the fixing pieces 3 can penetrate through the first insulating carrier 11 (as shown in fig. 12) or the second insulating carrier 12, and the fixing piece 3 can penetrate through the first projection 112 of the first insulating carrier 11 (as shown in fig. 13). It should be noted that when the fixing member 3 is connected between the first insulating carrier 11 and the second insulating carrier 12, the fixing member 3 contacts the first conductor 21 and the second conductor 22 and approaches the through channel 200. However, the above-mentioned examples are only one possible embodiment and are not intended to limit the present invention.
[ sixth embodiment ]
Referring to fig. 14, a sixth embodiment of the invention provides an electronic device D, which includes: a control module C, an antenna module a, and a waveguide structure S connected between the control module C and the antenna module a, and the waveguide structure S may be any one of the waveguide structures S in the first to fifth embodiments. It is noted that, in conjunction with fig. 4 and 14, the through channel 200 has a first opening 2001 connected to the control module C and a second opening 2002 connected to the antenna module a. Thus, information generated by the control module C can be transmitted to the antenna module a through the waveguide structure S, and information received by the antenna module a can be transmitted to the control module C through the waveguide structure S.
[ advantageous effects of the embodiments ]
One of the advantages of the present invention is that the electronic device D and the waveguide structure S thereof provided by the present invention can transmit electromagnetic waves in the through channel 200, and achieve the effects of reducing weight and cost, that is, "the insulating carrier 1 includes a first insulating carrier 11 and a second insulating carrier 12 cooperating with the first insulating carrier 11, the first insulating carrier 11 has a first groove 110, the second insulating carrier 12 has a second groove 120" communicating with the first groove 110, and "the conductive metal member 2 includes a first electrical conductor 21 received in the first groove 110 of the first insulating carrier 11 and a second electrical conductor 22 received in the second groove 120 of the second insulating carrier 12, and the conductive metal member 2 has a through channel 200 extending through the conductive metal member 2".
One of the advantages of the present invention is that the method for manufacturing the waveguide structure S according to the present invention can transmit electromagnetic waves in the through channel 200, and achieve the effects of reducing weight and reducing cost, that is, "providing the insulating carrier 1, the insulating carrier 1 includes a first insulating carrier 11 and a second insulating carrier 12 corresponding to the first insulating carrier 11, the first insulating carrier 11 has a first groove 110, the second insulating carrier 12 has a second groove 120 corresponding to the first groove 110", "forming the conductive metal member 2 on the insulating carrier 1, the conductive metal member 2 includes a first conductive body 21 received in the first groove 110 of the first insulating carrier 11 and a second conductive body 22" received in the second groove 120 of the second insulating carrier 12, and "connecting the first insulating carrier 11 and the second insulating carrier 12 together, so that the first electrical conductor 21 and the second electrical conductor 22 are connected to each other to form a through channel 200 "that passes through the conductive metal piece 2.
The disclosure above is only a preferred and practical embodiment of the present invention, and therefore does not limit the scope of the claims of the present invention, and therefore all equivalent technical changes made by using the contents of the description and the drawings of the present invention are included in the scope of the claims of the present invention.
[ notation ] to show
Electronic device
C, control module
Antenna module
S is waveguide structure
1 insulating bearing part
11 first insulating carrier
110 the first groove
1100 inner surface
111 first recess
112 first projection
113 the first positioning part
12 second insulating carrier
120: second groove
1200 inner surface
121: second projection
122 second recess
123 second positioning part
2: conductive metal piece
200 through channel
2000 penetrating groove
2001 first opening
2002 second opening
21 first conductor
22 second electrical conductor
3: fixing piece
Claims (10)
1. A waveguide structure, characterized in that the waveguide structure comprises:
the insulating bearing piece comprises a first insulating carrier and a second insulating carrier matched with the first insulating carrier, the first insulating carrier is provided with a first groove, and the second insulating carrier is provided with a second groove communicated with the first groove; and
the conductive metal piece comprises a first conductive body accommodated in the first groove of the first insulating carrier and a second conductive body accommodated in the second groove of the second insulating carrier, and the conductive metal piece is provided with a through channel penetrating through the conductive metal piece.
2. The waveguide structure of claim 1, wherein the first and second insulating carriers are both integrally joined into a single member, and the first and second electrical conductors are both integrally joined into a single member; the through channel penetrates through one of the first electric conductor and the second electric conductor or both the first electric conductor and the second electric conductor, and the through channel is a single through hole penetrating through the first electric conductor or the second electric conductor or two through grooves respectively penetrating through the first electric conductor and the second electric conductor and communicated with each other; the first conductor is a first single conductive material layer or a first conductive composite material layer, and the second conductor is a second single conductive material layer or a second conductive composite material layer.
3. The waveguide structure according to claim 1, wherein the first insulating carrier comprises two first recesses and a first projection located between the two first recesses, and the second insulating carrier comprises two second projections and a second recess located between the two second projections, the two second projections being received in the two first recesses and the first projection being received in the second recess, respectively; wherein the first groove of the first insulating carrier and the first conductor of the conductive metal are both disposed inside the first protrusion of the first insulating carrier, and the second groove of the second insulating carrier and the second conductor of the conductive metal are both disposed below the second recess of the second insulating carrier; the first insulating carrier comprises at least a first positioning part, the second insulating carrier comprises at least a second positioning part, and the at least first positioning part and the at least second positioning part are matched with each other to position the relative positions of the first insulating carrier and the second insulating carrier.
4. The waveguide structure of claim 3, further comprising: a plurality of fasteners, each fastener passing through one of the first and second insulative carriers and connecting the first and second conductors; wherein the fixture penetrates through the first protrusion of the first insulating carrier or the second protrusion of the second insulating carrier, and the fixture contacts the first conductor and the second conductor and is close to the through channel, or the fixture is far away from the first conductor and the second conductor and is far away from the through channel; the through channel is provided with a first opening connected with the control module and a second opening connected with the antenna module, and the thickness of the conductive metal piece is between 10nm and 50 nm.
5. An electronic device, the electronic device comprising: control module, antenna module and connect in control module with waveguide structure between the antenna module, its characterized in that: the waveguide structure comprises an insulating bearing piece and a conductive metal piece;
the insulating bearing piece comprises a first insulating carrier and a second insulating carrier matched with the first insulating carrier, the first insulating carrier is provided with a first groove, and the second insulating carrier is provided with a second groove communicated with the first groove;
the conductive metal part comprises a first conductor accommodated in the first groove of the first insulating carrier and a second conductor accommodated in the second groove of the second insulating carrier, and the conductive metal part is provided with a through channel penetrating through the conductive metal part.
6. The electronic device of claim 5, wherein the first insulating carrier and the second insulating carrier are both integrally combined into a single member, and the first electrical conductor and the second electrical conductor are both integrally combined into a single member; the through channel penetrates through one of the first electric conductor and the second electric conductor or both the first electric conductor and the second electric conductor simultaneously, and the through channel is a single through hole penetrating through the first electric conductor or the second electric conductor or two through grooves respectively penetrating through the first electric conductor and the second electric conductor and communicated with each other; the first conductor is a first single conductive material layer or a first conductive composite material layer, and the second conductor is a second single conductive material layer or a second conductive composite material layer.
7. The electronic device according to claim 5, wherein the first insulating carrier comprises two first recesses and a first protrusion located between the two first recesses, the second insulating carrier comprises two second protrusions and a second recess located between the two second protrusions, the two second protrusions are respectively received in the two first recesses, and the first protrusion is received in the second recess; wherein the first groove of the first insulating carrier and the first conductor of the conductive metal are both disposed inside the first protrusion of the first insulating carrier, and the second groove of the second insulating carrier and the second conductor of the conductive metal are both disposed below the second recess of the second insulating carrier; the first insulating carrier comprises at least a first positioning part, the second insulating carrier comprises at least a second positioning part, and the at least first positioning part and the at least second positioning part are matched with each other to position the relative positions of the first insulating carrier and the second insulating carrier.
8. The electronic device of claim 7, wherein the waveguide structure comprises a plurality of anchors, each anchor penetrating one of the first and second insulating supports for connecting the first and second insulating supports and for connecting the first and second electrical conductors; wherein the fixture penetrates through the first protrusion of the first insulating carrier or the second protrusion of the second insulating carrier, and the fixture contacts the first conductor and the second conductor and is close to the through channel, or the fixture is far away from the first conductor and the second conductor and is far away from the through channel; the through channel is provided with a first opening connected with the control module and a second opening connected with the antenna module, and the thickness of the conductive metal piece is between 10nm and 50 nm.
9. A method of fabricating a waveguide structure, the waveguide structure comprising:
providing an insulating bearing member, wherein the insulating bearing member comprises a first insulating carrier and a second insulating carrier corresponding to the first insulating carrier, the first insulating carrier is provided with a first groove, and the second insulating carrier is provided with a second groove corresponding to the first groove;
forming a conductive metal piece on the insulating carrier, the conductive metal piece including a first electrical conductor received in the first groove of the first insulating carrier and a second electrical conductor received in the second groove of the second insulating carrier; and
and connecting the first insulating carrier and the second insulating carrier together, so that the first electric conductor and the second electric conductor are connected with each other to form a through channel penetrating through the conductive metal piece.
10. The method of claim 9, wherein in the step of forming the electrically conductive metal on the insulating carrier, further comprising:
projecting a laser light source on the inner surface of the first groove and the inner surface of the second groove to activate surface molecules on the inner surface of the first groove and surface molecules on the inner surface of the second groove; and
forming the first and second electrical conductors on the inner surface of the first groove and the inner surface of the second groove, respectively;
the first insulating carrier and the second insulating carrier are connected together through a plurality of fixing pieces, and each fixing piece penetrates through one of the first insulating carrier and the second insulating carrier.
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| CN114122656B (en) | 2022-12-13 |
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