JPH1146114A - Stacked aperture antenna and multi-layer circuit board containing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a stacked aperture antenna which is applicable to a broad band, is miniaturized and is easily manufactured by forming a conductor wall that constitutes an antenna from plural via hole conductors which are arranged in prescribed intervals and plural conductor layers that electrically connect between the via hole conductors. SOLUTION: A dielectric substrate 2 which superimposes plural dielectric layers 1 that have prescribed thickness (a) is a base material, a main conductor layer 3 is adhered on the surface of the substrate 2, and an aperture part 4 having a diameter (b) which is an emitting part of an antenna is formed on the layer 3. Plural via hole conductors 5 are formed on the periphery of the part 4 at prescribed intervals (c) in a lamination direction of the substrate 2. Plural ring-shaped sub-conductor layers 6 having an inner diameter b are formed between the layers 1 and the layers 6 are electrically connected to a via hole conductor 5 group. As a result, a circuit dielectric waveguide antenna part A that is comprises of a grid-like conductor wall 7 having a size of a×c which comprises plural via hole 5 groups and plural sub-conductor layer 6 groups is formed.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laminated aperture antenna mainly suitable for high frequencies such as microwaves and millimeter waves, and a multilayer wiring board having such an antenna.

[0002]

2. Description of the Related Art In recent years, in the field of communication technology, researches on mobile communication and inter-vehicle radar using a high frequency such as a microwave or a millimeter wave have been actively promoted. Usually, input and output of signals in communication are finally performed by an antenna. Various antennas have been studied for such high frequencies, and typical examples include a waveguide slot antenna, a microstrip antenna, and an aperture antenna.

[0003] These antennas are used by being connected to a high-frequency electric circuit. However, as a feeding path to the antennas for connecting these antennas, for example, an opening antenna or a waveguide slot antenna is used as a feed path. Waveguides and triplate lines are mainly used for microstrip antennas.

[0004] Japanese Patent Application Laid-Open No. 62-222702 discloses that
There has also been proposed a planar array antenna in which a plurality of radiating elements each having an inner surface formed by a metallized hole are provided and connected by a waveguide having a cavity.

Further, recently, in order to reduce the size of a communication system including an antenna, it has been desired to integrate the antenna with a package on which a high-frequency circuit or a high-frequency element is mounted.

[0006]

In order to use the high-frequency antenna as described above for mobile communication and inter-vehicle radar,
It is necessary that the antenna can be applied in a wide band, and that the antenna itself is light, thin, and small.

[0007] The waveguide slot antenna has the advantages that it is highly efficient and can be formed thin, but cannot be applied to a wide band, and is heavy and expensive because it is manufactured by processing a metal plate. Microstrip antennas, on the other hand, are manufactured by attaching a metal film to a dielectric sheet and forming them, so that they can be formed lightly and thinly, and can be easily manufactured. It is low and cannot be applied to a wide band.

On the other hand, a horn antenna, which is an aperture antenna, can be applied to a wide band and has extremely excellent antenna characteristics. However, since it is manufactured by processing it three-dimensionally using a metal member, it itself becomes large in size and is difficult to mount on a communication terminal, and there is a problem in terms of weight reduction.

According to the planar array antenna disclosed in Japanese Patent Application Laid-Open No. 62-222702, since the plastic is used as the base material, it can be applied lightly and in a wide band. However, there is a problem that the feeder becomes thicker because of the use of the waveguide.

Further, in the millimeter wave region, the characteristics of the entire antenna system become important. In other words, even if the individual characteristics of the antenna, the power supply circuit, the high-frequency circuit, and the like are very excellent, all of them are finally connected to form the entire system, so that the characteristics, size, and Cost and the like are also affected by the entire system. For example, when these connections are connected by a waveguide, a system can be configured without substantially impairing the performance of an antenna, a feed circuit, a high-frequency circuit, and the like. However, if they are connected by a waveguide, they often have a three-dimensional structure, and are mechanically connected by screws or the like, leading to a reduction in reliability and an increase in cost.

In this regard, the planar array antenna disclosed in Japanese Patent Application Laid-Open No. 62-222702 is excellent in realizing a wide-band antenna by integrally forming an antenna portion and a feed circuit, and is excellent as a single antenna. However, the connection with other elements such as a high-frequency circuit is poor, and it is difficult to integrate them.

Accordingly, it is an object of the present invention to provide a laminated aperture antenna which can be applied to a wide band, can be reduced in size, and can be easily manufactured by a general lamination technique. is there. Another object of the present invention is to provide a multilayer wiring board in which a high-frequency circuit can be formed and a feeder and an antenna are integrally formed.

[0013]

The present inventor has studied the above problems, and as a result, found that a part or all of the conductor wall constituting the antenna is provided in the dielectric substrate on which the dielectric layers are laminated. Is formed by a plurality of via-hole conductors arranged at predetermined intervals and a plurality of conductor layers arranged between dielectric layers of the dielectric substrate so as to electrically connect the plurality of via-hole conductors. The present inventors have found that it can be easily manufactured by a conventional lamination technique and can be easily integrated with a power supply path and a high-frequency circuit, and have arrived at the present invention.

That is, the laminated aperture antenna according to the present invention comprises:
A main conductor layer having an opening of a predetermined size is formed on the surface of a dielectric substrate formed by laminating a plurality of dielectric layers, and is formed in a stacking direction at a predetermined interval around the opening of the main conductor layer. A plurality of via-hole conductor groups and a plurality of sub-conductor layers formed between the dielectric layers so as to electrically connect the plurality of via-hole conductor groups. Power supply path for performing
It is characterized by having.

[0015] Further, in addition to the above configuration, the present invention provides that at least a part of the antenna conductor wall is formed so as to gradually expand toward an outer space, that the opening has a recess, and that the recess is , Formed so as to gradually spread toward the outer space, the plurality of via-hole conductors,
The transmission signal is arranged in the transmission direction so that the power supply line is electrically connected between the pair of main conductor layers for the power supply line and the main conductor layers. And a feeder via-hole conductor arranged in two rows at an interval equal to or less than 1/2 of the laminated waveguide, wherein a part of the main conductor layer is a conductor wall of the hollow waveguide antenna. And a plurality of antennas arranged in an array.

Further, the multilayer wiring board of the present invention has a main conductor layer having an opening of a predetermined size formed on a surface of a dielectric substrate formed by laminating a plurality of dielectric layers; A plurality of via-hole conductor groups formed in the stacking direction at predetermined intervals around the opening, and a plurality of sub-conductor layers formed between the dielectric layers so as to electrically connect the plurality of via-hole conductor groups. And a high-frequency circuit connected to the power supply path, the power supply path being used to supply power. Further, a cavity for accommodating a semiconductor element and hermetically sealing the semiconductor element is formed in a part of the dielectric substrate.

In the laminated aperture antenna of the present invention, since the antenna conductor wall is formed by a combination of the via hole conductor formed based on the lamination technology and the conductor layer disposed between the dielectric layers, the antenna is easily formed. It is possible to manufacture an aperture antenna which can be applied to a wide band at a low cost. In other words, even if the size of the manufactured antenna is slightly displaced, it can be used at the design frequency, so that the design is facilitated and the manufacturing accuracy is relaxed, and as a result, the antenna can be manufactured at low cost. .

Further, since the above-mentioned antenna can be formed by a conventional lamination technique, it can be integrally formed in a normal multilayer wiring board, and at the same time, a feed line to the antenna and a high-frequency circuit are formed at the same time. it can. Further, the power supply path is formed by a pair of main conductor layers and via-hole conductors arranged in two rows at an interval of 1/2 or less of a transmission signal wavelength in a transmission direction so as to electrically connect the main conductor layers. Accordingly, the loss of energy in the power supply path can be suppressed low, and at the same time, since the dielectric waveguide is used, the size of the substrate can be reduced as compared with a normal waveguide, so that the substrate itself can be formed thin and small.

Further, by forming a high-frequency circuit in a part of the multilayer wiring substrate or forming a cavity in a part of the substrate and housing the high-frequency element in the cavity, connection with the high-frequency circuit is facilitated. Also, energy loss at the connection can be reduced. In addition, since the antenna, feed line, high-frequency circuit, and high-frequency element can be integrally configured, the entire system can be reduced in size, and can be manufactured in a series of steps using conventional multi-layer technology. A multilayer wiring board can be manufactured.

[0020]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, various embodiments of the present invention will be described with reference to FIGS. FIG. 1 is a plan view (a) of a laminated aperture antenna according to the present invention and a sectional view (b) thereof along XX. Here, 1 is a dielectric layer, 2 is a dielectric substrate, 3 is a main conductor layer, 4 is an opening, 5 is a via-hole conductor,
6 is a sub-conductor layer.

According to FIG. 1, the laminated aperture antenna of the present invention is based on a dielectric substrate 2 in which a plurality of dielectric layers 1 having a predetermined thickness a are laminated. A main conductor layer 3 is formed on the surface of the dielectric substrate 2, and the main conductor layer 3 has an opening 4 having a diameter b serving as a radiation portion of the antenna. In the dielectric substrate 2, a plurality of via-hole conductors 5 are formed around the opening 4 of the main conductor layer 3 at a predetermined interval c in the stacking direction of the dielectric substrate 2, and a plurality of via-hole conductors 5 are formed. In the group, a plurality of ring-shaped sub-conductor layers 6 having an inner diameter b formed between the dielectric layers 1 are formed, and the sub-conductor layers 6 and the plurality of via-hole conductors 5 are electrically connected. A grid-shaped conductor wall 7 having a size of × c is formed. As a result, a circular dielectric waveguide antenna section A including a lattice-shaped conductor wall 7 of a × c size formed by a plurality of via-hole conductors 5 and a plurality of sub-conductor layers 6 is formed. .

Since the conductor wall 7 needs to be formed so that electromagnetic waves do not leak, the distance a between the sub-conductor layers 6 and the distance c between the via-hole conductors 5 are equal to one signal wavelength.
It is necessary that they are arranged at an interval of / 2 or less.

Further, the circular dielectric waveguide antenna section A is
It is connected to a feed path K for feeding power to the antenna unit A. The feeding path K is provided inside the dielectric substrate 2 in the same manner as the antenna section A on the dielectric substrate 2 in which the transmission loss from the feeding path K to the antenna section A is small and the dielectric layer 1 is laminated in multiple layers. In consideration of easiness, a dielectric waveguide as proposed in Japanese Patent Application No. 8-229925 or Japanese Patent Application No. 9-1
It is desirable to form it with a dielectric line as proposed in Japanese Patent No. 07762.

FIG. 1 shows a configuration in which the feed path K is formed of a dielectric waveguide, which is composed of a pair of feed path main conductor layers 8 and 9 formed in the signal transmission direction. A group of feed-hole via-hole conductors 10 formed in the stacking direction of the dielectric layer 1 with a predetermined distance d between the main conductor layers 8 and 9;
A plurality of feed line sub-conductor layers 1 formed between dielectric layers 1 so as to electrically connect groups of feed line via hole conductors 10
It is formed from a group of rectangular dielectric waveguides with the E-plane facing up.

The feed line K made of a rectangular dielectric waveguide is connected from the side to an antenna section A made of a dielectric waveguide formed in the direction in which the dielectric substrates 2 are laminated. By forming the dielectric in the dielectric waveguide of K and the dielectric in the dielectric waveguide of the antenna section A to be continuously connected, the feed line K and the antenna section A are electromagnetically connected. can do. In this case, the main conductor layer 8 for the feed line is formed by the sub-conductor layer 6 of the cylindrical dielectric waveguide antenna section A.
And some are shared.

According to the connection structure between the antenna section A and the feed line K, when the electromagnetic wave propagating through the feed path K made of a dielectric waveguide is in the TE10 rectangular waveguide mode, the TE11 The electromagnetic wave is radiated from the opening of the circular waveguide in combination with the circular waveguide mode.

In the dielectric waveguide used as the feed line K, as shown in Japanese Patent Application No. 9-104907, the center of the waveguide is reduced in order to reduce the signal transmission loss in the feed line K. It is also possible to form only the dielectric layer located in the portion on the dielectric layer having a high dielectric constant.

The main conductor layer 3 formed on the surface of the dielectric substrate 2 functions as a flange and is formed to strengthen radio waves radiated in the front direction. If there is no electromagnetic wave, the electromagnetic wave is diffracted at the opening 4 and propagates backward.

FIG. 2 is a plan view (a) showing another embodiment of the laminated aperture antenna of the present invention and a sectional view (b) taken along the line XX of FIG. 1. In this embodiment, FIG. In the antenna, the diameter of the upper half of the cylindrical dielectric waveguide antenna section A is increased, and a cylindrical dielectric waveguide antenna section A ′ having a large diameter is provided. Thus, by increasing the diameter of the conductor wall 7 on the opening surface side, reflection at the opening 4 can be reduced.

As shown in a plan view (a) and a sectional view (b) of FIG. 3 showing still another embodiment of FIG. 3, the upper half conductive wall of the cylindrical dielectric waveguide antenna section A is shown. By providing the horn-type antenna section B in which the diameter of 7 is increased stepwise, the reflection of signals at the opening 4 can be further reduced.

Further, as shown in a plan view (a) and a cross sectional view (b) of FIG. 4 showing still another embodiment of FIG.
In the horn antenna section B of FIG. 3, a horn antenna section B ′ having a concave portion 12 that gradually expands toward the outer space inside the horn is formed.

At this time, in the cross section inside the horn antenna section B, the concave portion 12 is formed so that the proportion of the remaining dielectric 13 gradually decreases from the lower half circular dielectric waveguide antenna A toward the outer space. It is desirable to form a shape. Specifically, the dielectric layer in the concave portion 12 is formed such that the distance d between the dielectric layer and the via hole conductor 5 forming the conductive wall 7 gradually decreases toward the outer space. In such a configuration, the electromagnetic wave can be smoothly propagated from the circular dielectric waveguide antenna section A to the outer space via the horn antenna section B ′ having the concave portion 12.

FIG. 5 is a plan view (a) showing a further embodiment of an aperture antenna according to the present invention and a sectional view taken along line XX of FIG. 5 (b). The upper half of the circular dielectric waveguide antenna section A shown in FIG. 1 is formed by a circular hollow waveguide antenna section C having a diameter f, and a part of the main conductor layer 3 is a conductor wall 14 made of the circular hollow waveguide C. It was made to function as. The circular cavity waveguide antenna section C is formed by laminating dielectric layers having holes of diameter f to form a concave portion having a diameter f on the dielectric substrate 2 and connecting the circular dielectric waveguide antenna section A to the circular dielectric waveguide antenna section A. The conductor is formed on the surface other than the opening 4 existing in the above. Providing the circular cavity waveguide antenna section C on the outer space side of the circular dielectric waveguide antenna section A in this manner has an advantage of reducing the interaction with other antenna elements when forming an array. is there. In addition,
The diameter f of the circular hollow waveguide antenna section C is set to be the same as the characteristic impedance of the lower half circular dielectric waveguide.

FIG. 6 is a plan view (a) of another embodiment of the present invention, and FIG.
The diameter f of the circular hollow waveguide antenna section C is gradually widened toward the outer space to form a horn type antenna section C ′.
This makes it possible to reduce the reflection of a signal and to gradually approach the characteristic impedance of vacuum.

Next, an example of an antenna in which the above various antennas are arranged in an array will be described. First, FIG.
FIG. 2 is a plan view of an array antenna in which an aperture antenna including the cylindrical dielectric waveguide antenna unit A shown in FIG. 1 is arranged in an array. According to the array antenna of FIG.
The signal fed to the signal input unit 15 provided in the feed path K is repeatedly radiated three times to reach the sixteen aperture antennas 16 and radiated.

FIG. 8 is a plan view of an array antenna in which an aperture antenna having a circular dielectric waveguide antenna portion A and a horn antenna portion B 'having a concave portion 12 shown in FIG. 4 is arranged in an array. Similarly to FIG. 7, the signal from the signal input unit 15 repeats the T branch three times and reaches the 16 aperture antennas 17 to be radiated.

FIG. 9 is a plan view of an array antenna in which aperture antennas having the circular dielectric waveguide antenna section A and the cylindrical waveguide antenna C of FIG. 5 are arranged in an array. Similarly, the signal from the signal input unit 15 is
By repeating the T branch three times, 16 aperture antennas 18
And is emitted.

Each of the above-described aperture antennas of the present invention includes at least a cylindrical dielectric waveguide antenna section A, and the connection between the antenna section A and the feed line K is not limited. Although the feed line K shows a structure in the case of the TE10 mode in which the E surface is formed of a rectangular dielectric waveguide in which the E plane is parallel to the laminated surface of the dielectric layers, the connection structure is not limited to this. Absent.

For example, the electric field component of the electromagnetic wave propagating through the feed line K may be in the direction of lamination of the dielectric layers.
For example, the mode of an electromagnetic wave propagating through a dielectric waveguide is T
In the case of the E10 mode, when the H plane is parallel to the lamination plane of the dielectric layer, the aperture antenna needs to have an electric field component in the lamination plane. Therefore, in the connection structure described with reference to FIG. It is impossible to directly feed power from the feeding path K to the cylindrical dielectric waveguide antenna section A.

In such a case, as shown in FIG. 10, a conductor composed of the through-hole conductor 5 'and the sub-conductor layer 6' at the connection portion of the cylindrical dielectric waveguide antenna section A with the feed line K is provided. By bending the wall 7 'in a stepwise manner and bending the H-plane of the dielectric waveguide, the direction of the electric field can be bent in the lamination plane, and power can be supplied to the antenna section A. Others
As shown in FIG. 11, a feed line K made of a dielectric waveguide is provided below the cylindrical dielectric waveguide antenna section A, and one of the feeder main conductor layers 8 of the dielectric waveguide is provided. By forming a slot 19 in the section and electromagnetically coupling through the slot 19, power can be supplied to the antenna section A.

As a property of the electromagnetic wave radiated from the antenna, a polarization characteristic is also important.

In the above embodiments, the structure in which the linearly polarized wave is mainly radiated is shown. However, the circularly polarized wave can be easily generated by changing the arrangement of the feed line K. Becomes

For example, as shown in FIG. 12, two feeding paths K1 and K2 are connected to the antenna 17 in FIG.
Further, a circularly polarized wave can be generated by shifting the phase of the electromagnetic wave fed from each feed line by 90 °. To shift the phase by 90 ° can be realized by setting the difference in length from the T branch point of the feed lines K1 and K2 to the antenna 17 to be １ ／ of the wavelength in the waveguide.

FIG. 13 shows an embodiment in which the aperture surface of the aperture antenna is rectangular (quadrangle).

A circularly polarized wave can be generated by adjusting the length of two sides of a rectangle in the same manner as the principle of generating a circularly polarized wave by feeding a patch antenna at one point. That is,
The length of one side of the rectangle is slightly longer than の of the wavelength λ corresponding to the operating frequency fo, and the phase of the current at the time of fo is −45.
°, and the length of the other side is slightly shorter than λ / 2 so that the phase of the current at the time of fo is + 45 °. As a result, a 90 ° phase difference is generated, and a circularly polarized wave can be generated. When the opening surface is elliptical, circular polarization can be generated by adjusting the length of the major axis and the minor axis.

In the case where power is supplied through the slot 19 as in the embodiment of FIG. 11, two or more slots perpendicular to the main conductor layer 8 for the power supply path are formed, so that Waves can be generated.

Next, the multilayer wiring board of the present invention will be described. FIG. 14 is a cross-sectional view for explaining one embodiment. In this embodiment, the aperture antenna of FIG. The multilayer wiring board 20 is formed with an antenna having an antenna section 21 and a feed path 22 for feeding the antenna section 21 with the connection structure shown in FIG. On the side opposite to the formed surface, a high-frequency circuit 23 composed of a coplanar line is formed. The high frequency circuit 23 may be a microstrip line, a coplanar line with ground, or a dielectric waveguide line. .

A signal input section (not shown) is provided in the feed line 22 of the antenna as shown in FIGS. 9 to 11, and by connecting the signal input section to the high-frequency circuit 23, Signals can be transmitted from the high-frequency circuit to the antenna. A signal input portion between the high-frequency circuit and the feed line 22 made of a dielectric waveguide is connected to, for example, a feed pin formed of a via-hole conductor or a slot formed in a part of the main conductor layer of the dielectric waveguide. Be composed.

According to the multilayer wiring board of the present invention, as shown in FIG. 15, a cavity 25 for accommodating the high-frequency element 24 is provided together with the high-frequency circuit 23, and the semiconductor element accommodated in the cavity 25 is provided. 24 may be mounted so as to be connected to the high-frequency circuit 23 and hermetically sealed by a lid 26 made of, for example, metal. Thus, a high-frequency package integrally including the semiconductor element, the high-frequency circuit, and the antenna can be provided.

As described above, if the feeding path K is formed of a dielectric waveguide filled with a dielectric, the hermetic sealing of the cavity is not impaired. Further, as described above, since the antenna section A and the feeding path K can be manufactured by the dielectric layering technique, it is easy to simultaneously manufacture the high-frequency circuit and the cavity on the back surface.

The dielectric substrate in the antenna section and the feed path forming section is preferably made of a dielectric material having a dielectric constant as low as possible in consideration of transmission loss and required manufacturing accuracy. However, the dielectric layer on which the high-frequency circuit 23 is formed has a relative dielectric constant of 10 in consideration of the size of the high-frequency circuit 23 and the gap with the ground.
To about 15 is desirable.

The dielectric layer according to the above embodiment may be a dielectric material which can be formed into a sheet of any thickness, can be metallized at any part, can form a via-hole conductor, and can be closely laminated. It may be ceramic, resin or a mixture of resin and ceramic powder. In order to reduce transmission loss as much as possible, the dielectric loss of the dielectric material is preferably as small as possible, and is preferably 0.001 or less at a used frequency. The metallization is preferably made of a low-resistance conductor. Specifically, it is preferable that at least one of gold, silver, and copper be the main component.

[0053]

As described in detail above, the aperture antenna of the present invention is applicable to a wide band, and can be easily manufactured by the conventional multilayer technology, so that a small and inexpensive antenna can be provided. In addition, since a cavity for mounting a high-frequency circuit or a semiconductor element can be provided, a multilayer wiring board with a built-in antenna can be provided with a high function and a low cost as a whole system including the semiconductor element, the high-frequency circuit and the antenna.

[Brief description of the drawings]

FIG. 1A is a plan view showing an embodiment of a laminated aperture antenna according to the present invention, and FIG.

FIG. 2 is a plan view (a) showing another embodiment of the laminated aperture antenna of the present invention, and a cross-sectional view (b) thereof along XX.

FIGS. 3A and 3B are a plan view showing another embodiment of the laminated aperture antenna of the present invention and a cross-sectional view taken along line XX of FIG.

FIG. 4A is a plan view showing another embodiment of the laminated aperture antenna of the present invention, and FIG. 4B is a sectional view taken along line XX of FIG.

5A is a plan view showing another embodiment of the laminated aperture antenna of the present invention, and FIG. 5B is a sectional view taken along line XX of FIG.

6A is a plan view showing another embodiment of the laminated aperture antenna of the present invention, and FIG. 6B is a sectional view taken along line XX of FIG.

FIG. 7 is a plan view showing an array antenna using the stacked aperture antenna of FIG. 1;

8 is a plan view showing an array antenna using the stacked aperture antenna of FIG.

9 is a plan view showing an array antenna using the stacked aperture antenna of FIG. 5;

FIG. 10 is a cross-sectional view for explaining another example of the connection structure between the antenna section A and the feed path K in the aperture antenna of the present invention.

FIG. 11 is a cross-sectional view for explaining another example of the connection structure between the antenna unit A and the feeding path K in the aperture antenna according to the present invention.

FIG. 12 is a diagram for explaining an example of an aperture antenna for generating circularly polarized waves in the present invention.

FIG. 13 is a diagram for explaining another example of the aperture antenna for generating circularly polarized waves in the present invention.

FIG. 14 is a cross-sectional view illustrating an example of a multilayer wiring board having an aperture antenna according to the present invention.

FIG. 15 is a cross-sectional view illustrating an example of a multilayer wiring board having an aperture antenna of the present invention and a cavity for housing a semiconductor element.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Dielectric layer 2 Dielectric substrate 3 Main conductor layer 4 Opening 5 Via hole conductor 6 Subconductor layer 7 Conductor wall 23 High frequency circuit 24 Semiconductor element 25 Lid

Claims (10)

[Claims] A main conductor layer having an opening of a predetermined size adhered to a surface of a dielectric substrate formed by laminating a plurality of dielectric layers; A plurality of via-hole conductor groups formed in the stacking direction with an interval, and an antenna conductor wall including a plurality of sub-conductor layers formed between the dielectric layers so as to electrically connect the plurality of via-hole conductor groups, And a feed path for feeding power. 2. The laminated aperture antenna according to claim 1, wherein at least a part of the antenna conductor wall is formed so as to gradually expand toward an outer space. 3. The laminated aperture antenna according to claim 1, further comprising a recess in said opening. 4. A laminated aperture antenna according to claim 3, wherein said recess is formed so as to gradually widen toward an outer space. 5. A laminated aperture antenna according to claim 1, wherein said plurality of via-hole conductors are arranged at an interval of not more than の of a signal wavelength. 6. The power supply line is arranged in two rows at a distance of 1/2 or less of a transmission signal wavelength in a transmission direction so as to electrically connect the pair of power supply line main conductor layers and the main conductor layers. 2. The laminated aperture antenna according to claim 1, comprising a laminated waveguide composed of the arranged feed-hole via-hole conductors. 7. The laminated aperture antenna according to claim 1, wherein a part of the main conductor layer forms a conductor wall of the hollow waveguide antenna. 8. A laminated aperture antenna according to claim 1, wherein a plurality of antennas are arranged in an array. 9. A main conductor layer having an opening of a predetermined size formed on a surface of a dielectric substrate formed by laminating a plurality of dielectric layers, and a predetermined interval around the opening of the main conductor layer. A plurality of via-hole conductor groups formed in the stacking direction and a plurality of sub-conductor layers formed between the dielectric layers so as to electrically connect the plurality of via-hole conductor groups; And a high-frequency circuit connected to the power supply path. 10. The multilayer wiring board according to claim 9, wherein a cavity is formed in a part of said dielectric substrate for housing and hermetically sealing a semiconductor element.