JP2001053089A5 - - Google Patents

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Publication number
JP2001053089A5
JP2001053089A5 JP1999222713A JP22271399A JP2001053089A5 JP 2001053089 A5 JP2001053089 A5 JP 2001053089A5 JP 1999222713 A JP1999222713 A JP 1999222713A JP 22271399 A JP22271399 A JP 22271399A JP 2001053089 A5 JP2001053089 A5 JP 2001053089A5
Authority
JP
Japan
Prior art keywords
work
presser
feeder
temperature control
down movement
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1999222713A
Other languages
English (en)
Japanese (ja)
Other versions
JP2001053089A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP11222713A priority Critical patent/JP2001053089A/ja
Priority claimed from JP11222713A external-priority patent/JP2001053089A/ja
Publication of JP2001053089A publication Critical patent/JP2001053089A/ja
Publication of JP2001053089A5 publication Critical patent/JP2001053089A5/ja
Pending legal-status Critical Current

Links

JP11222713A 1999-08-05 1999-08-05 半導体装置の製造方法およびそれに使用されるレジン塗布装置 Pending JP2001053089A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11222713A JP2001053089A (ja) 1999-08-05 1999-08-05 半導体装置の製造方法およびそれに使用されるレジン塗布装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11222713A JP2001053089A (ja) 1999-08-05 1999-08-05 半導体装置の製造方法およびそれに使用されるレジン塗布装置

Publications (2)

Publication Number Publication Date
JP2001053089A JP2001053089A (ja) 2001-02-23
JP2001053089A5 true JP2001053089A5 (enExample) 2005-02-03

Family

ID=16786748

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11222713A Pending JP2001053089A (ja) 1999-08-05 1999-08-05 半導体装置の製造方法およびそれに使用されるレジン塗布装置

Country Status (1)

Country Link
JP (1) JP2001053089A (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4739588B2 (ja) * 2001-07-11 2011-08-03 本田技研工業株式会社 燃料電池用セパレータのシール材塗布方法
US20050001869A1 (en) * 2003-05-23 2005-01-06 Nordson Corporation Viscous material noncontact jetting system
JP2009050828A (ja) * 2007-08-29 2009-03-12 Shibaura Mechatronics Corp ペースト塗布装置及びペースト塗布方法
CN105792946B (zh) 2013-12-06 2019-03-22 武藏工业株式会社 液体材料涂布装置
CN112827752B (zh) * 2020-12-31 2023-06-09 湖北壹威电子科技有限公司 一种芯片封装用注脂设备及芯片封装工艺

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