JP2001044057A - Method and device for manufacture of deposition film with step - Google Patents
Method and device for manufacture of deposition film with stepInfo
- Publication number
- JP2001044057A JP2001044057A JP21743199A JP21743199A JP2001044057A JP 2001044057 A JP2001044057 A JP 2001044057A JP 21743199 A JP21743199 A JP 21743199A JP 21743199 A JP21743199 A JP 21743199A JP 2001044057 A JP2001044057 A JP 2001044057A
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- JP
- Japan
- Prior art keywords
- film
- forming
- vapor deposition
- opening
- fixed mask
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】この発明は、段付蒸着フィル
ムコンデンサに用いる段付蒸着フィルムの改良について
の段付蒸着フィルムの製造方法および製造装置に関する
ものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and an apparatus for producing a stepped vapor deposition film for improving a stepped vapor deposition film used for a stepped vapor deposition film capacitor.
【０００２】[0002]
【従来の技術】従来、段付蒸着フィルムコンデンサに用
いる段付蒸着フィルムは、図５に示す様に蒸発源から噴
出した蒸発金属９を、高抵抗を形成する狭い開口部１０
と低抵抗を形成する広い開口部１１を有する固定マスク
１２によって遮蔽し、クーリングキャン１３上のフィル
ム１４に付着する蒸発金属量を調整する事により形成さ
れている高抵抗部蒸着膜１５、低抵抗部蒸着膜１６、オ
イルにより蒸発金属を付着しないようにした非蒸着部１
７からなる広幅の蒸着フィルムを所定の幅にスリットす
ることにより構成されている。2. Description of the Related Art Conventionally, as shown in FIG. 5, a stepped vapor deposition film used for a stepped vapor deposition film capacitor is formed by depositing a vaporized metal 9 ejected from an evaporation source through a narrow opening 10 for forming a high resistance.
A high-resistance portion vapor-deposited film 15 formed by adjusting the amount of evaporated metal adhering to the film 14 on the cooling can 13 by being shielded by a fixed mask 12 having a wide opening 11 for forming a low resistance. Non-deposited part 1 in which evaporated metal is prevented from adhering by oil
7 is formed by slitting a wide vapor-deposited film 7 into a predetermined width.
【０００３】図６（Ａ）は従来例のマスクの形状を示
し、図６（Ｂ）は図６（Ａ）のマスクにより形成される
広幅の段付蒸着フィルムの断面図を示す。図６（Ｃ）は
図６（Ｂ）の広幅の段付蒸着フィルムを所定の幅にスリ
ットし巻回積層されてる段付蒸着フィルムコンデンサの
断面図を示す。FIG. 6A shows the shape of a conventional mask, and FIG. 6B is a cross-sectional view of a wide stepped vapor deposition film formed by the mask shown in FIG. 6A. FIG. 6C is a cross-sectional view of a stepped vapor deposition film capacitor obtained by slitting the wide stepped vapor deposition film of FIG.
【０００４】[0004]
【発明が解決しようとする課題】しかしながら、上記構
成で形成された段付蒸着フィルムの非蒸着部は、予め塗
布されたオイルが高温の蒸発金属によりガス化したオイ
ルのガス圧により蒸着金属付着を阻止し形成されるが、
同時に、蒸着金属が非蒸着部近傍に回り込み付着する
為、非蒸着部の近傍の膜厚が厚くなる課題を有してい
た。However, the non-deposited portion of the stepped vapor deposition film formed as described above has a problem in that the deposited metal adheres to the deposited metal due to the gas pressure of the oil gasified by the high-temperature evaporated metal. It is blocked and formed,
At the same time, the evaporated metal wraps around and adheres to the vicinity of the non-evaporated portion, so that there is a problem that the film thickness near the non-evaporated portion increases.
【０００５】また、蒸発金属の熱による固定マスクの熱
ひずみにより、高抵抗を形成する狭い開口部の隙間が変
化し巾方向に不均一となり、高抵抗部の膜厚のばらつき
が大きくなる課題を有していた。In addition, due to the thermal distortion of the fixed mask caused by the heat of the evaporated metal, the gap of the narrow opening for forming the high resistance changes and becomes non-uniform in the width direction. Had.
【０００６】したがって、この発明の目的は、上記課題
を解決するもので、高抵抗部の非蒸着部近傍の膜厚を均
一し、巾方向の膜厚を均一にすることにより安定した品
質を得ることができる段付蒸着フィルムの製造方法およ
び製造装置を提供することである。SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to solve the above-mentioned problems, and to obtain a stable quality by making the film thickness near the non-deposition portion of the high resistance portion uniform and making the film thickness uniform in the width direction. It is an object of the present invention to provide a method and an apparatus for producing a stepped vapor deposition film that can be used.
【０００７】[0007]
【課題を解決するための手段】上記目的を達成するため
にこの発明の請求項１記載の段付蒸着フィルムの製造方
法は、フィルム上に付着する蒸発金属量を、開口部を有
する固定マスクを用いて調整することにより、フィルム
上に高抵抗部と低抵抗部の蒸着膜を形成する段付蒸着フ
ィルムの製造方法であって、高抵抗部を形成する開口部
の非蒸着部に対応する部分のうち、少なくとも１箇所以
上を塞いだ状態で、蒸着膜を形成することを特徴とす
る。According to a first aspect of the present invention, there is provided a method for producing a stepped vapor deposition film, comprising: determining the amount of evaporated metal adhering on the film by using a fixed mask having an opening; A method of manufacturing a stepped vapor-deposited film for forming a vapor-deposited film of a high-resistance part and a low-resistance part on a film by adjusting using a part corresponding to a non-vapor-deposited part of an opening forming a high-resistance part. Among them, the method is characterized in that the deposition film is formed in a state where at least one portion is closed.
【０００８】このように、高抵抗部を形成する開口部の
非蒸着部に対応する部分のうち、少なくとも１箇所以上
を塞いだ状態で、蒸着膜を形成するので、蒸発金属の熱
による固定マスクの熱ひずみにより、高抵抗を形成する
狭い開口部の隙間が変化し難く、巾方向の高抵抗部の膜
厚のばらつきが小さくなる。また、開口部を塞いだ位置
においては、非蒸着部に対応する部分の蒸発金属量が少
なくなる。このため、蒸着金属の付着を阻止するため非
蒸着部に予め塗布されたオイルのガス圧により、高抵抗
部の非蒸着部近傍に回り込み付着する蒸発金属量も少な
くなり、非蒸着部の近傍の膜厚を均一にすることができ
る。As described above, since the deposited film is formed while at least one of the portions corresponding to the non-deposited portion of the opening forming the high resistance portion is closed, the fixed mask formed by the heat of the evaporated metal is formed. Due to the thermal strain, the gap of the narrow opening forming the high resistance is hard to change, and the variation in the film thickness of the high resistance portion in the width direction is reduced. Further, at the position where the opening is closed, the amount of evaporated metal in the portion corresponding to the non-evaporated portion is reduced. For this reason, the gas pressure of the oil previously applied to the non-deposited portion to prevent the deposition of the deposited metal reduces the amount of evaporated metal that wraps around and adheres to the non-deposited portion of the high-resistance portion, and the vicinity of the non-deposited portion. The film thickness can be made uniform.
【０００９】請求項２記載の段付蒸着フィルムの製造方
法は、フィルム上に付着する蒸発金属量を、開口部を有
する固定マスクを用いて調整することにより、フィルム
上に高抵抗部と低抵抗部の蒸着膜を形成する段付蒸着フ
ィルムの製造方法であって、高抵抗部を形成する開口部
の非蒸着部に対応する部分を塞いだ状態で、蒸着膜を形
成することを特徴とする。According to a second aspect of the present invention, there is provided a method of manufacturing a stepped vapor deposition film, wherein the amount of evaporated metal adhering to the film is adjusted using a fixed mask having an opening, so that a high resistance portion and a low resistance portion are formed on the film. A method of manufacturing a stepped vapor deposition film for forming a vapor deposition film of a portion, wherein the vapor deposition film is formed while closing a portion corresponding to a non-vapor deposition portion of an opening forming a high resistance portion. .
【００１０】このように、高抵抗部を形成する開口部の
非蒸着部に対応する部分を塞いだ状態で、蒸着膜を形成
するので、非蒸着部に対応する部分の蒸発金属量が少な
くなる。このため、蒸着金属の付着を阻止するため非蒸
着部に予め塗布されたオイルのガス圧により、高抵抗部
の非蒸着部近傍に回り込み付着する蒸発金属量も少なく
なり、非蒸着部の近傍の膜厚を均一にすることができ
る。また、蒸発金属の熱による固定マスクの熱ひずみに
より、高抵抗を形成する狭い開口部の隙間が変化し難
く、巾方向の高抵抗部の膜厚のばらつきが小さくなる。As described above, since the deposited film is formed in a state where the portion corresponding to the non-deposition portion of the opening forming the high resistance portion is closed, the amount of evaporated metal in the portion corresponding to the non-deposition portion is reduced. . For this reason, the gas pressure of the oil previously applied to the non-deposited portion to prevent the deposition of the deposited metal reduces the amount of evaporated metal that wraps around and adheres to the non-deposited portion of the high-resistance portion, and the vicinity of the non-deposited portion. The film thickness can be made uniform. Further, due to the thermal distortion of the fixed mask due to the heat of the evaporated metal, the gap between the narrow openings for forming the high resistance is hard to change, and the variation in the film thickness of the high resistance portion in the width direction is reduced.
【００１１】請求項３記載の段付蒸着フィルムの製造方
法は、フィルム上に付着する蒸発金属量を、開口部を有
する固定マスクを用いて調整することにより、フィルム
上に高抵抗部と低抵抗部の蒸着膜を形成する段付蒸着フ
ィルムの製造方法であって、高抵抗部を形成する開口部
の非蒸着部に対応する部分の巾を狭くした状態で、蒸着
膜を形成することを特徴とする。According to a third aspect of the present invention, in the method of manufacturing a stepped vapor deposition film, the amount of evaporated metal adhering to the film is adjusted by using a fixed mask having an opening, so that a high resistance portion and a low resistance portion are formed on the film. A method of manufacturing a stepped vapor deposition film for forming a vapor deposition film of a portion, wherein the vapor deposition film is formed in a state where the width of a portion corresponding to a non-vapor deposition portion of an opening forming a high resistance portion is narrowed. And
【００１２】このように、高抵抗部を形成する開口部の
非蒸着部に対応する部分の巾を狭くした状態で、蒸着膜
を形成するので、非蒸着部に対応する部分の蒸発金属量
が少なくなる。このため、蒸着金属の付着を阻止するた
め非蒸着部に予め塗布されたオイルのガス圧により、高
抵抗部の非蒸着部近傍に回り込み付着する蒸発金属量も
少なくなり、非蒸着部の近傍の膜厚を均一にすることが
できる。また、蒸発金属の熱による固定マスクの熱ひず
みにより、高抵抗を形成する狭い開口部の隙間が変化し
難く、巾方向の高抵抗部の膜厚のばらつきが小さくな
る。As described above, since the deposited film is formed in a state where the width of the portion corresponding to the non-deposited portion of the opening forming the high resistance portion is narrowed, the amount of evaporated metal in the portion corresponding to the non-deposited portion is reduced. Less. For this reason, the gas pressure of the oil previously applied to the non-deposited portion to prevent the deposition of the deposited metal reduces the amount of evaporated metal that wraps around and adheres to the non-deposited portion of the high-resistance portion, and the vicinity of the non-deposited portion. The film thickness can be made uniform. Further, due to the thermal distortion of the fixed mask due to the heat of the evaporated metal, the gap between the narrow openings for forming the high resistance is hard to change, and the variation in the film thickness of the high resistance portion in the width direction is reduced.
【００１３】請求項４記載の段付蒸着フィルムの製造方
法は、フィルム上に付着する蒸発金属量を、開口部を有
する固定マスクを用いて調整することにより、フィルム
上に高抵抗部と低抵抗部の蒸着膜を形成する段付蒸着フ
ィルムの製造方法であって、低抵抗部を形成する開口部
と高抵抗部を形成する開口部を分離した状態で、蒸着膜
を形成することを特徴とする。According to a fourth aspect of the present invention, in the method of manufacturing a stepped vapor deposition film, the amount of evaporated metal adhering to the film is adjusted by using a fixed mask having an opening to provide a high resistance portion and a low resistance portion on the film. A method for producing a stepped vapor deposition film for forming a vapor deposition film of a part, wherein the vapor deposition film is formed in a state where an opening forming a low resistance part and an opening forming a high resistance part are separated. I do.
【００１４】このように、低抵抗部を形成する開口部と
高抵抗部を形成する開口部を分離した状態で、蒸着膜を
形成するので、蒸発金属の熱による固定マスクの熱ひず
みにより、高抵抗を形成する狭い開口部の隙間が変化し
難く、巾方向の高抵抗部の膜厚のばらつきが小さくな
る。As described above, the deposited film is formed in a state where the opening for forming the low resistance portion and the opening for forming the high resistance portion are separated from each other. The gap between the narrow openings for forming the resistance is hard to change, and the variation in the film thickness of the high resistance portion in the width direction is reduced.
【００１５】請求項５記載の段付蒸着フィルムの製造方
法は、請求項１，２または３において、固定マスクは、
低抵抗部を形成する開口部と高抵抗部を形成する開口部
を分離してなる。このように、固定マスクは、低抵抗部
を形成する開口部と高抵抗部を形成する開口部を分離し
てなるので、固定マスクの熱ひずみによる開口部の隙間
の変形がさらに小さくなり、巾方向の高抵抗部の膜厚の
ばらつきがさらに小さくなる。According to a fifth aspect of the present invention, there is provided a method of manufacturing a stepped vapor deposition film according to the first, second or third aspect, wherein the fixed mask comprises:
An opening for forming the low resistance portion and an opening for forming the high resistance portion are separated from each other. As described above, since the fixed mask is formed by separating the opening forming the low-resistance portion and the opening forming the high-resistance portion, the deformation of the gap of the opening due to the thermal strain of the fixed mask is further reduced, and the width is reduced. The variation in the film thickness of the high-resistance portion in the direction is further reduced.
【００１６】請求項６記載の段付蒸着フィルムの製造装
置は、蒸発金属を噴出する蒸発源と、蒸発源から噴出し
た蒸発金属を遮蔽し蒸着膜に高抵抗部と低抵抗部を形成
する開口部を有する固定マスクとを備え、固定マスク
は、高抵抗部を形成する開口部の非蒸着部に対応する部
分のうち、少なくとも１箇所以上を塞いでなることを特
徴とする。According to a sixth aspect of the present invention, there is provided an apparatus for manufacturing a stepped vapor deposition film, comprising: an evaporation source for ejecting the vaporized metal; and an opening for shielding the vaporized metal ejected from the evaporation source to form a high resistance portion and a low resistance portion in the vapor deposition film. And a fixed mask having a portion, wherein the fixed mask covers at least one or more portions of the opening corresponding to the non-evaporated portion of the opening forming the high-resistance portion.
【００１７】このように、蒸発源と固定マスクとを備
え、固定マスクは、高抵抗部を形成する開口部の非蒸着
部に対応する部分のうち、少なくとも１箇所以上を塞い
でいるので、蒸発金属の熱による固定マスクの熱ひずみ
により、高抵抗を形成する狭い開口部の隙間が変化し難
く、巾方向の高抵抗部の膜厚のばらつきが小さくなる。
また、開口部を塞いだ位置においては、非蒸着部に対応
する部分の蒸発金属量が少なくなる。このため、高抵抗
部の非蒸着部近傍に回り込み付着する蒸発金属量も少な
くなり、非蒸着部の近傍の膜厚を均一にすることができ
る。As described above, since the fixed mask is provided with the evaporation source and the fixed mask, at least one or more of the portions corresponding to the non-evaporated portion of the opening forming the high resistance portion is closed. Due to the heat distortion of the fixed mask due to the heat of the metal, the gap between the narrow openings forming the high resistance is hard to change, and the variation in the film thickness of the high resistance portion in the width direction is reduced.
Further, at the position where the opening is closed, the amount of evaporated metal in the portion corresponding to the non-evaporated portion is reduced. For this reason, the amount of evaporated metal that wraps around and adheres to the non-deposition portion of the high resistance portion is reduced, and the film thickness in the vicinity of the non-deposition portion can be made uniform.
【００１８】請求項７記載の段付蒸着フィルムの製造装
置は、蒸発金属を噴出する蒸発源と、蒸発源から噴出し
た蒸発金属を遮蔽し蒸着膜に高抵抗部と低抵抗部を形成
する開口部を有する固定マスクとを備え、固定マスク
は、高抵抗を形成する狭い開口部の非蒸着部に対応する
部分を塞いでなることを特徴とする。According to a seventh aspect of the present invention, there is provided an apparatus for manufacturing a stepped vapor deposition film, comprising: an evaporation source for ejecting the vaporized metal; and an opening for shielding the vaporized metal ejected from the evaporation source to form a high resistance portion and a low resistance portion in the vapor deposition film. A fixed mask having a portion, wherein the fixed mask covers a portion corresponding to the non-evaporated portion of the narrow opening for forming the high resistance.
【００１９】このように、蒸発源と固定マスクとを備
え、固定マスクは、高抵抗部を形成する狭い開口部の非
蒸着部に対応する部分を塞いでいるので、非蒸着部に対
応する部分の蒸発金属量が少なくなる。このため、高抵
抗部の非蒸着部近傍に回り込み付着する蒸発金属量も少
なくなり、非蒸着部の近傍の膜厚を均一にすることがで
きる。また、蒸発金属の熱による固定マスクの熱ひずみ
により、高抵抗を形成する狭い開口部の隙間が変化し難
く、巾方向の高抵抗部の膜厚のばらつきが小さくなる。As described above, since the fixed mask is provided with the evaporation source and the fixed mask, the fixed mask covers the portion corresponding to the non-evaporated portion of the narrow opening forming the high-resistance portion. Decreases the amount of evaporated metal. For this reason, the amount of evaporated metal that wraps around and adheres to the non-deposition portion of the high resistance portion is reduced, and the film thickness in the vicinity of the non-deposition portion can be made uniform. Further, due to the thermal distortion of the fixed mask due to the heat of the evaporated metal, the gap between the narrow openings for forming the high resistance is hard to change, and the variation in the film thickness of the high resistance portion in the width direction is reduced.
【００２０】請求項８記載の段付蒸着フィルムの製造装
置は、蒸発金属を噴出する蒸発源と、蒸発源から噴出し
た蒸発金属を遮蔽し蒸着膜に高抵抗部と低抵抗部を形成
する開口部を有する固定マスクとを備え、固定マスク
は、高抵抗部を形成する狭い開口部の非蒸着部に対応す
る部分の巾を狭くしてなることを特徴とする。According to another aspect of the present invention, there is provided an apparatus for manufacturing a stepped vapor deposition film, comprising: an evaporation source for ejecting the vaporized metal; and an opening for shielding the vaporized metal ejected from the evaporation source to form a high resistance portion and a low resistance portion in the vapor deposition film. And a fixed mask having a portion, wherein the fixed mask is characterized in that the width of a portion corresponding to the non-deposition portion of the narrow opening forming the high-resistance portion is narrowed.
【００２１】このように、蒸発源と固定マスクとを備
え、固定マスクは、高抵抗部を形成する狭い開口部の非
蒸着部に対応する部分の巾を狭くしているので、非蒸着
部に対応する部分の蒸発金属量が少なくなる。このた
め、高抵抗部の非蒸着部近傍に回り込み付着する蒸発金
属量も少なくなり、非蒸着部の近傍の膜厚を均一にする
ことができる。また、蒸発金属の熱による固定マスクの
熱ひずみにより、高抵抗を形成する狭い開口部の隙間が
変化し難く、巾方向の高抵抗部の膜厚のばらつきが小さ
くなる。As described above, since the fixed mask is provided with the evaporation source and the fixed mask, the width of the portion corresponding to the non-deposited portion of the narrow opening forming the high-resistance portion is reduced. The amount of evaporated metal in the corresponding part is reduced. For this reason, the amount of evaporated metal that wraps around and adheres to the non-deposition portion of the high resistance portion is reduced, and the film thickness in the vicinity of the non-deposition portion can be made uniform. Further, due to the thermal distortion of the fixed mask due to the heat of the evaporated metal, the gap between the narrow openings for forming the high resistance is hard to change, and the variation in the film thickness of the high resistance portion in the width direction is reduced.
【００２２】請求項９記載の段付蒸着フィルムの製造装
置は、蒸発金属を噴出する蒸発源と、蒸発源から噴出し
た蒸発金属を遮蔽し蒸着膜に高抵抗部と低抵抗部を形成
する開口部を有する固定マスクとを備え、固定マスク
は、低抵抗部を形成する広い開口部と高抵抗部を形成す
る狭い開口部が分離してなることを特徴とする。According to a ninth aspect of the present invention, there is provided an apparatus for manufacturing a stepped vapor deposition film, comprising: an evaporation source for ejecting the vaporized metal; and an opening for shielding the vaporized metal ejected from the evaporation source to form a high resistance portion and a low resistance portion in the vapor deposition film. And a fixed mask having a portion. The fixed mask is characterized in that a wide opening forming the low resistance portion and a narrow opening forming the high resistance portion are separated from each other.
【００２３】このように、蒸発源と固定マスクとを備
え、固定マスクは、低抵抗部を形成する広い開口部と高
抵抗部を形成する狭い開口部が分離しているので、蒸発
金属の熱による固定マスクの熱ひずみにより、高抵抗を
形成する狭い開口部の隙間が変化し難く、巾方向の高抵
抗部の膜厚のばらつきが小さくなる。As described above, since the fixed mask is provided with the evaporation source and the fixed mask, the wide opening forming the low resistance portion and the narrow opening forming the high resistance portion are separated from each other. Due to the thermal strain of the fixed mask, the gap between the narrow openings forming the high resistance hardly changes, and the variation in the film thickness of the high resistance portion in the width direction is reduced.
【００２４】[0024]
【発明の実施の形態】この発明の第１の実施の形態を図
１に基づいて説明する。図１（Ａ）はこの発明の第１の
実施の形態における固定マスクの平面図、（Ｂ）は
（Ａ）の固定マスクにより形成される広幅の段付蒸着フ
ィルムの断面図、（Ｃ）は（Ｂ）の広幅の段付蒸着フィ
ルムを所定の幅にスリットし巻回積層された段付蒸着フ
ィルムコンデンサの部分断面図である。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A first embodiment of the present invention will be described with reference to FIG. 1A is a plan view of a fixed mask according to the first embodiment of the present invention, FIG. 1B is a cross-sectional view of a wide stepped vapor deposition film formed by the fixed mask of FIG. 1A, and FIG. FIG. 3B is a partial cross-sectional view of a stepped vapor deposition film capacitor obtained by slitting a wide stepped vapor deposition film having a predetermined width and winding and laminating the same.
【００２５】図５に示したものと同様この段付蒸着フィ
ルムの製造装置は、蒸発金属を噴出する蒸発源８と、こ
の蒸発源８に対向配置されたクーリングキャン１３と、
蒸発源８から噴出した蒸発金属を遮蔽し蒸着膜に高抵抗
部１５と低抵抗部１６を形成する開口部を有する固定マ
スクとを備えているが、固定マスクの構成が異なる。図
１（Ａ），（Ｂ）に示すように、固定マスク２２は、高
抵抗を形成する狭い開口部２０と低抵抗を形成する広い
開口部２１を有し、高抵抗部を形成する開口部２０の非
蒸着部１７に対応する部分のうち、少なくとも１箇所以
上を塞いでいる。この場合、開口部２０の中央に閉塞部
２０ａを形成している。Similar to the apparatus shown in FIG. 5, the apparatus for manufacturing a stepped vapor deposition film includes an evaporation source 8 for ejecting vaporized metal, a cooling can 13 opposed to the evaporation source 8, and
Although a fixed mask having openings for blocking the evaporated metal ejected from the evaporation source 8 and forming the high resistance portion 15 and the low resistance portion 16 in the deposited film is provided, the configuration of the fixed mask is different. As shown in FIGS. 1A and 1B, the fixed mask 22 has a narrow opening 20 forming a high resistance and a wide opening 21 forming a low resistance, and an opening forming a high resistance part. At least one or more of the portions corresponding to the 20 non-deposition portions 17 are closed. In this case, a closed portion 20a is formed at the center of the opening 20.
【００２６】つぎに、上記構成の段付蒸着フィルムの製
造方法について説明する。フィルム１４上に付着する蒸
発金属量を、固定マスク２２を用いて調整することによ
り、フィルム１４上に高抵抗部１５と低抵抗部１６の蒸
着膜を形成する。このとき、高抵抗部を形成する開口部
２０の非蒸着部１７に対応する部分のうちの１箇所を閉
塞部２０ａにより塞いだ状態で蒸着膜を形成する。ま
た、図１（Ｃ）に示すように、広幅の段付蒸着フィルム
１４を所定の幅にスリットし巻回積層することで段付蒸
着フィルムコンデンサを製造する。同図において、１８
はメタリコンであり、低抵抗部１６と接続されている。Next, a method of manufacturing the stepped vapor deposition film having the above structure will be described. By adjusting the amount of evaporated metal adhering to the film 14 using the fixed mask 22, a deposited film of the high-resistance portion 15 and the low-resistance portion 16 is formed on the film 14. At this time, a deposition film is formed in a state where one of the portions corresponding to the non-deposition portion 17 of the opening 20 forming the high resistance portion is closed by the closing portion 20a. Further, as shown in FIG. 1 (C), a stepped vapor deposition film 14 is manufactured by slitting a wide stepped vapor deposition film 14 to a predetermined width and winding and laminating the same. In FIG.
Is a metallikon, which is connected to the low resistance section 16.
【００２７】以上のようにこの実施の形態によれば、固
定マスク２２は、高抵抗部１５を形成する開口部２０の
非蒸着部１７に対応する部分のうち、少なくとも１箇所
以上を塞いでいるので、蒸発金属９の熱による固定マス
ク２２の熱ひずみにより、高抵抗を形成する狭い開口部
２０の隙間が変化し難く、巾方向の高抵抗部１５の膜厚
のばらつきが小さくなる。また、開口部２０を塞いだ位
置においては、非蒸着部１７に対応する部分の蒸発金属
量が少なくなる。このため、高抵抗部１５の非蒸着部１
７近傍に回り込み付着する蒸発金属量も少なくなり、非
蒸着部１７の近傍の膜厚を均一にすることができる。As described above, according to this embodiment, the fixed mask 22 covers at least one or more of the portions corresponding to the non-evaporated portions 17 of the openings 20 forming the high-resistance portions 15. Therefore, due to the heat distortion of the fixed mask 22 due to the heat of the evaporated metal 9, the gap between the narrow openings 20 forming the high resistance hardly changes, and the variation in the film thickness of the high resistance section 15 in the width direction is reduced. In addition, at the position where the opening 20 is closed, the amount of evaporated metal in the portion corresponding to the non-evaporated portion 17 is reduced. Therefore, the non-evaporated portion 1 of the high resistance portion 15
The amount of evaporated metal wrapping around and adhering to the vicinity of 7 is also reduced, and the film thickness in the vicinity of the non-evaporated portion 17 can be made uniform.
【００２８】この発明の第２の実施の形態を図２に基づ
いて説明する。図２（Ａ）はこの発明の第２の実施の形
態における固定マスクの平面図、（Ｂ）は（Ａ）の固定
マスクにより形成される広幅の段付蒸着フィルムの断面
図、（Ｃ）は（Ｂ）の広幅の段付蒸着フィルムを所定の
幅にスリットし巻回積層された段付蒸着フィルムコンデ
ンサの部分断面図である。A second embodiment of the present invention will be described with reference to FIG. FIG. 2A is a plan view of a fixed mask according to the second embodiment of the present invention, FIG. 2B is a cross-sectional view of a wide stepped vapor deposition film formed by the fixed mask of FIG. 2A, and FIG. FIG. 3B is a partial cross-sectional view of a stepped vapor deposition film capacitor obtained by slitting a wide stepped vapor deposition film having a predetermined width and winding and laminating the same.
【００２９】第１の実施の形態と同様に蒸発源とクーリ
ングキャンと固定マスクとを備えている。図２（Ａ），
（Ｂ）に示すように、固定マスク３２は、高抵抗部１５
を形成する狭い開口部３０の非蒸着部１７に対応する部
分に閉塞部３０ａを形成して塞いでいる。As in the first embodiment, an evaporation source, a cooling can and a fixed mask are provided. FIG. 2 (A),
As shown in (B), the fixed mask 32 is
A closing portion 30a is formed and closed at a portion corresponding to the non-evaporated portion 17 of the narrow opening 30 that forms the opening.
【００３０】つぎに、上記構成の段付蒸着フィルムの製
造方法について説明する。フィルム１４上に付着する蒸
発金属量を、固定マスク３２を用いて調整することによ
り、フィルム１４上に高抵抗部１５と低抵抗部１６の蒸
着膜を形成する。このとき、高抵抗部を形成する開口部
３０の非蒸着部１７に対応する部分を閉塞部３０ａによ
り塞いだ状態で蒸着膜を形成する。また、図２（Ｃ）に
示すように、広幅の段付蒸着フィルム１４を所定の幅に
スリットし巻回積層することで段付蒸着フィルムコンデ
ンサを製造する。Next, a method of manufacturing the stepped vapor deposition film having the above structure will be described. By adjusting the amount of evaporated metal adhering on the film 14 by using the fixed mask 32, a deposited film of the high resistance portion 15 and the low resistance portion 16 is formed on the film 14. At this time, a deposition film is formed in a state where a portion of the opening 30 forming the high resistance portion corresponding to the non-deposition portion 17 is closed by the closing portion 30a. As shown in FIG. 2C, a stepped vapor deposition film capacitor is manufactured by slitting a wide stepped vapor deposition film 14 to a predetermined width and winding and laminating the same.
【００３１】以上のようにこの実施の形態によれば、固
定マスク３２は、高抵抗部１５を形成する狭い開口部３
０の非蒸着部１７に対応する部分を塞いでいるので、非
蒸着部１７への蒸発金属量が少なくなる。このため、高
抵抗部１５の非蒸着部１７近傍に回り込み付着する蒸発
金属量も少なくなり、非蒸着部１７の近傍の膜厚を均一
にすることができる。また、蒸発金属９の熱による固定
マスク３２の熱ひずみにより、高抵抗を形成する狭い開
口部３０の隙間が変化し難く、巾方向の高抵抗部１５の
膜厚のばらつきが小さくなる。As described above, according to this embodiment, the fixed mask 32 is formed in the narrow opening 3 in which the high resistance portion 15 is formed.
Since the portion corresponding to the non-evaporated portion 17 is closed, the amount of evaporated metal to the non-evaporated portion 17 is reduced. For this reason, the amount of evaporated metal that wraps around and adheres to the non-deposition portion 17 of the high resistance portion 15 is also reduced, and the film thickness in the vicinity of the non-deposition portion 17 can be made uniform. Further, due to the heat distortion of the fixed mask 32 due to the heat of the vaporized metal 9, the gap between the narrow openings 30 forming the high resistance is hard to change, and the variation in the film thickness of the high resistance section 15 in the width direction is reduced.
【００３２】この発明の第３の実施の形態を図３に基づ
いて説明する。図３（Ａ）はこの発明の第２の実施の形
態における固定マスクの平面図、（Ｂ）は（Ａ）の固定
マスクにより形成される広幅の段付蒸着フィルムの断面
図、（Ｃ）は（Ｂ）の広幅の段付蒸着フィルムを所定の
幅にスリットし巻回積層された段付蒸着フィルムコンデ
ンサの部分断面図である。A third embodiment of the present invention will be described with reference to FIG. 3A is a plan view of a fixed mask according to the second embodiment of the present invention, FIG. 3B is a cross-sectional view of a wide stepped vapor deposition film formed by the fixed mask of FIG. FIG. 3B is a partial cross-sectional view of a stepped vapor deposition film capacitor obtained by slitting a wide stepped vapor deposition film having a predetermined width and winding and laminating the same.
【００３３】第１の実施の形態と同様に蒸発源とクーリ
ングキャンと固定マスクとを備えている。図３（Ａ），
（Ｂ）に示すように、固定マスク４２は、高抵抗部１５
を形成する狭い開口部４０の非蒸着部１７に対応する部
分に凸部４０ａを形成して巾を狭くしている。As in the first embodiment, an evaporation source, a cooling can and a fixed mask are provided. FIG. 3 (A),
As shown in (B), the fixed mask 42 is
The convex portion 40a is formed in a portion corresponding to the non-evaporated portion 17 of the narrow opening portion 40 for forming a narrower width.
【００３４】つぎに、上記構成の段付蒸着フィルムの製
造方法について説明する。フィルム１４上に付着する蒸
発金属量を、固定マスク４２を用いて調整することによ
り、フィルム１４上に高抵抗部１５と低抵抗部１６の蒸
着膜を形成する。このとき、高抵抗部を形成する開口部
４０の非蒸着部１７に対応する部分の巾を凸部４０ａに
より狭くした状態で蒸着膜を形成する。また、図３
（Ｃ）に示すように、広幅の段付蒸着フィルム１４を所
定の幅にスリットし巻回積層することで段付蒸着フィル
ムコンデンサを製造する。Next, a method of manufacturing the stepped vapor deposition film having the above structure will be described. By adjusting the amount of evaporated metal adhering on the film 14 using the fixed mask 42, a deposited film of the high resistance portion 15 and the low resistance portion 16 is formed on the film 14. At this time, the deposited film is formed in a state where the width of the portion corresponding to the non-deposited portion 17 of the opening 40 forming the high resistance portion is narrowed by the convex portion 40a. FIG.
As shown in (C), a stepped vapor deposition film capacitor is manufactured by slitting a wide stepped vapor deposition film 14 to a predetermined width and winding and laminating.
【００３５】以上のようにこの実施の形態によれば、固
定マスク４２は、高抵抗部を形成する狭い開口部４０の
非蒸着部１７に対応する部分の巾を狭くしているので、
非蒸着部１７に対応する部分の蒸発金属量が少なくな
り、第２の実施の形態と同様の効果が得られる。As described above, according to this embodiment, the width of the fixed mask 42 corresponding to the non-deposited portion 17 of the narrow opening 40 forming the high-resistance portion is reduced.
The amount of evaporated metal in the portion corresponding to the non-evaporated portion 17 is reduced, and the same effect as in the second embodiment can be obtained.
【００３６】この発明の第４の実施の形態を図４に基づ
いて説明する。図４（Ａ）はこの発明の第２の実施の形
態における固定マスクの平面図、（Ｂ）は（Ａ）の固定
マスクにより形成される広幅の段付蒸着フィルムの断面
図、（Ｃ）は（Ｂ）の広幅の段付蒸着フィルムを所定の
幅にスリットし巻回積層された段付蒸着フィルムコンデ
ンサの部分断面図である。A fourth embodiment of the present invention will be described with reference to FIG. FIG. 4A is a plan view of a fixed mask according to the second embodiment of the present invention, FIG. 4B is a cross-sectional view of a wide stepped vapor deposition film formed by the fixed mask of FIG. FIG. 3B is a partial cross-sectional view of a stepped vapor deposition film capacitor obtained by slitting a wide stepped vapor deposition film having a predetermined width and winding and laminating the same.
【００３７】第１の実施の形態と同様に蒸発源とクーリ
ングキャンと固定マスクとを備えている。図４（Ａ），
（Ｂ）に示すように、固定マスク５２は、低抵抗部を形
成する広い開口部５１と高抵抗部を形成する狭い開口部
５０が分離している。As in the first embodiment, an evaporation source, a cooling can and a fixed mask are provided. FIG. 4 (A),
As shown in (B), in the fixed mask 52, a wide opening 51 forming a low resistance portion and a narrow opening 50 forming a high resistance portion are separated.
【００３８】つぎに、上記構成の段付蒸着フィルムの製
造方法について説明する。フィルム１４上に付着する蒸
発金属量を、固定マスク５２を用いて調整することによ
り、フィルム１４上に高抵抗部１５と低抵抗部１６の蒸
着膜を形成する。このとき、低抵抗部を形成する開口部
５１と高抵抗部を形成する開口部５０を分離した状態で
蒸着膜を形成する。また、図４（Ｃ）に示すように、広
幅の段付蒸着フィルム１４を所定の幅にスリットし巻回
積層することで段付蒸着フィルムコンデンサを製造す
る。Next, a method of manufacturing the stepped vapor deposition film having the above structure will be described. By adjusting the amount of evaporated metal adhering on the film 14 using the fixed mask 52, a vapor deposition film of the high resistance portion 15 and the low resistance portion 16 is formed on the film 14. At this time, the deposition film is formed in a state where the opening 51 forming the low resistance portion and the opening 50 forming the high resistance portion are separated. Further, as shown in FIG. 4C, a stepped vapor deposition film 14 is manufactured by slitting a wide stepped vapor deposition film 14 to a predetermined width and winding and laminating the same.
【００３９】以上のように実施の形態によれば、固定マ
スク５２は、低抵抗部を形成する広い開口部５１と高抵
抗部を形成する狭い開口部５０が分離しているので、蒸
発金属９の熱による固定マスク５２の熱ひずみにより、
高抵抗を形成する狭い開口部５０の隙間が変化し難く、
巾方向の高抵抗部１５の膜厚のばらつきが小さくなる。As described above, according to the embodiment, the fixed mask 52 has the wide opening 51 forming the low-resistance portion and the narrow opening 50 forming the high-resistance portion separated from each other. Due to the thermal strain of the fixed mask 52 due to the heat of
The gap of the narrow opening 50 forming high resistance is hard to change,
Variations in the film thickness of the high resistance portion 15 in the width direction are reduced.
【００４０】なお、第４の実施の形態のように低抵抗部
を形成する広い開口部と高抵抗部を形成する狭い開口部
が分離する構成を第１〜３の実施の形態に適用してもよ
い。The structure in which the wide opening forming the low resistance portion and the narrow opening forming the high resistance portion are separated from each other as in the fourth embodiment is applied to the first to third embodiments. Is also good.
【００４１】[0041]
【発明の効果】この発明の請求項１記載の段付蒸着フィ
ルムの製造方法によれば、高抵抗部を形成する開口部の
非蒸着部に対応する部分のうち、少なくとも１箇所以上
を塞いだ状態で、蒸着膜を形成するので、蒸発金属の熱
による固定マスクの熱ひずみにより、高抵抗を形成する
狭い開口部の隙間が変化し難く、巾方向の高抵抗部の膜
厚のばらつきが小さくなる。また、開口部を塞いだ位置
においては、非蒸着部に対応する部分の蒸発金属量が少
なくなる。このため、蒸着金属の付着を阻止するため非
蒸着部に予め塗布されたオイルのガス圧により、高抵抗
部の非蒸着部近傍に回り込み付着する蒸発金属量も少な
くなり、非蒸着部の近傍の膜厚を均一にすることができ
る。したがって、コンデンサに用いる金属化フィルムに
適用してその工業的価値は大である。According to the method for manufacturing a stepped vapor-deposited film according to the first aspect of the present invention, at least one or more of the portions corresponding to the non-deposited portions of the openings forming the high-resistance portions are closed. Since the deposited film is formed in this state, the gap between the narrow openings forming the high resistance is unlikely to change due to the thermal strain of the fixed mask due to the heat of the evaporated metal, and the variation in the film thickness of the high resistance section in the width direction is small. Become. Further, at the position where the opening is closed, the amount of evaporated metal in the portion corresponding to the non-evaporated portion is reduced. For this reason, the gas pressure of the oil previously applied to the non-deposited portion to prevent the deposition of the deposited metal reduces the amount of evaporated metal that wraps around and adheres to the non-deposited portion of the high-resistance portion, and the vicinity of the non-deposited portion. The film thickness can be made uniform. Therefore, its industrial value is great when applied to a metallized film used for a capacitor.
【００４２】この発明の請求項２記載の段付蒸着フィル
ムの製造方法によれば、高抵抗部を形成する開口部の非
蒸着部に対応する部分を塞いだ状態で、蒸着膜を形成す
るので、非蒸着部に対応する部分の蒸発金属量が少なく
なる。このため、蒸着金属の付着を阻止するため非蒸着
部に予め塗布されたオイルのガス圧により、高抵抗部の
非蒸着部近傍に回り込み付着する蒸発金属量も少なくな
り、非蒸着部の近傍の膜厚を均一にすることができる。
また、蒸発金属の熱による固定マスクの熱ひずみによ
り、高抵抗を形成する狭い開口部の隙間が変化し難く、
巾方向の高抵抗部の膜厚のばらつきが小さくなる。した
がって、コンデンサに用いる金属化フィルムに適用して
その工業的価値は大である。According to the method of manufacturing a stepped vapor-deposited film according to the second aspect of the present invention, the vapor-deposited film is formed in a state where the portion corresponding to the non-vapor-deposited portion of the opening for forming the high-resistance portion is closed. In addition, the amount of evaporated metal in the portion corresponding to the non-evaporated portion decreases. For this reason, the gas pressure of the oil previously applied to the non-deposited portion to prevent the deposition of the deposited metal reduces the amount of evaporated metal that wraps around and adheres to the non-deposited portion of the high-resistance portion, and the vicinity of the non-deposited portion. The film thickness can be made uniform.
Also, due to the heat distortion of the fixed mask due to the heat of the evaporated metal, the gap of the narrow opening that forms the high resistance is unlikely to change,
Variations in the film thickness of the high resistance portion in the width direction are reduced. Therefore, its industrial value is great when applied to a metallized film used for a capacitor.
【００４３】この発明の請求項３記載の段付蒸着フィル
ムの製造方法によれば、高抵抗部を形成する開口部の非
蒸着部に対応する部分の巾を狭くした状態で、蒸着膜を
形成するので、非蒸着部に対応する部分の蒸発金属量が
少なくなる。このため、蒸着金属の付着を阻止するため
非蒸着部に予め塗布されたオイルのガス圧により、高抵
抗部の非蒸着部近傍に回り込み付着する蒸発金属量も少
なくなり、非蒸着部の近傍の膜厚を均一にすることがで
きる。また、蒸発金属の熱による固定マスクの熱ひずみ
により、高抵抗を形成する狭い開口部の隙間が変化し難
く、巾方向の高抵抗部の膜厚のばらつきが小さくなる。
したがって、コンデンサに用いる金属化フィルムに適用
してその工業的価値は大である。According to the method of manufacturing a stepped vapor-deposited film according to the third aspect of the present invention, the vapor-deposited film is formed in a state where the width of the portion corresponding to the non-vapor-deposited portion of the opening forming the high-resistance portion is reduced. Therefore, the amount of evaporated metal in the portion corresponding to the non-evaporated portion is reduced. For this reason, the gas pressure of the oil previously applied to the non-deposited portion to prevent the deposition of the deposited metal reduces the amount of evaporated metal that wraps around and adheres to the non-deposited portion of the high-resistance portion, and the vicinity of the non-deposited portion. The film thickness can be made uniform. Further, due to the thermal distortion of the fixed mask due to the heat of the evaporated metal, the gap between the narrow openings for forming the high resistance is hard to change, and the variation in the film thickness of the high resistance portion in the width direction is reduced.
Therefore, its industrial value is great when applied to a metallized film used for a capacitor.
【００４４】この発明の請求項４記載の段付蒸着フィル
ムの製造方法によれば、低抵抗部を形成する開口部と高
抵抗部を形成する開口部を分離した状態で、蒸着膜を形
成するので、蒸発金属の熱による固定マスクの熱ひずみ
により、高抵抗を形成する狭い開口部の隙間が変化し難
く、巾方向の高抵抗部の膜厚のばらつきが小さくなる。
したがって、コンデンサに用いる金属化フィルムに適用
してその工業的価値は大である。According to the method of manufacturing a stepped vapor-deposited film according to the fourth aspect of the present invention, the vapor-deposited film is formed in a state where the opening for forming the low-resistance portion and the opening for forming the high-resistance portion are separated. Therefore, due to the heat distortion of the fixed mask due to the heat of the evaporated metal, the gap between the narrow openings forming the high resistance is unlikely to change, and the variation in the film thickness of the high resistance portion in the width direction is reduced.
Therefore, its industrial value is great when applied to a metallized film used for a capacitor.
【００４５】請求項５では、請求項１〜３において、固
定マスクは、低抵抗部を形成する開口部と高抵抗部を形
成する開口部を分離してなる。このように、固定マスク
は、低抵抗部を形成する開口部と高抵抗部を形成する開
口部を分離してなるので、固定マスクの熱ひずみによる
開口部の隙間の変形がさらに小さくなり、巾方向の高抵
抗部の膜厚のばらつきがさらに小さくなる。According to a fifth aspect, in the first to third aspects, the fixed mask is formed by separating an opening for forming the low-resistance portion and an opening for forming the high-resistance portion. As described above, since the fixed mask is formed by separating the opening forming the low-resistance portion and the opening forming the high-resistance portion, the deformation of the gap of the opening due to the thermal strain of the fixed mask is further reduced, and the width is reduced. The variation in the film thickness of the high-resistance portion in the direction is further reduced.
【００４６】この発明の請求項６記載の段付蒸着フィル
ムの製造装置によれば、蒸発源と固定マスクとを備え、
固定マスクは、高抵抗部を形成する開口部の非蒸着部に
対応する部分のうち、少なくとも１箇所以上を塞いでい
るので、蒸発金属の熱による固定マスクの熱ひずみによ
り、高抵抗を形成する狭い開口部の隙間が変化し難く、
巾方向の高抵抗部の膜厚のばらつきが小さくなる。ま
た、開口部を塞いだ位置においては、非蒸着部に対応す
る部分の蒸発金属量が少なくなる。このため、高抵抗部
の非蒸着部近傍に回り込み付着する蒸発金属量も少なく
なり、非蒸着部の近傍の膜厚を均一にすることができ
る。According to the apparatus for manufacturing a stepped vapor deposition film according to claim 6 of the present invention, the apparatus is provided with an evaporation source and a fixed mask,
Since the fixed mask covers at least one or more portions of the opening corresponding to the non-evaporated portion of the opening forming the high resistance portion, a high resistance is formed by thermal distortion of the fixed mask due to heat of the evaporated metal. It is difficult for the gap of the narrow opening to change,
Variations in the film thickness of the high resistance portion in the width direction are reduced. Further, at the position where the opening is closed, the amount of evaporated metal in the portion corresponding to the non-evaporated portion is reduced. For this reason, the amount of evaporated metal that wraps around and adheres to the non-deposition portion of the high resistance portion is reduced, and the film thickness in the vicinity of the non-deposition portion can be made uniform.
【００４７】この発明の請求項７記載の段付蒸着フィル
ムの製造装置によれば、蒸発源と固定マスクとを備え、
固定マスクは、高抵抗部を形成する狭い開口部の非蒸着
部に対応する部分を塞いでいるので、非蒸着部に対応す
る部分の蒸発金属量が少なくなる。このため、高抵抗部
の非蒸着部近傍に回り込み付着する蒸発金属量も少なく
なり、非蒸着部の近傍の膜厚を均一にすることができ
る。また、蒸発金属の熱による固定マスクの熱ひずみに
より、高抵抗を形成する狭い開口部の隙間が変化し難
く、巾方向の高抵抗部の膜厚のばらつきが小さくなる。According to the apparatus for manufacturing a stepped vapor deposition film according to claim 7 of the present invention, the apparatus is provided with an evaporation source and a fixed mask,
Since the fixed mask covers the portion corresponding to the non-deposition portion of the narrow opening forming the high resistance portion, the amount of evaporated metal in the portion corresponding to the non-deposition portion is reduced. For this reason, the amount of evaporated metal that wraps around and adheres to the non-deposition portion of the high resistance portion is reduced, and the film thickness in the vicinity of the non-deposition portion can be made uniform. Further, due to the thermal distortion of the fixed mask due to the heat of the evaporated metal, the gap between the narrow openings for forming the high resistance is hard to change, and the variation in the film thickness of the high resistance portion in the width direction is reduced.
【００４８】この発明の請求項８記載の段付蒸着フィル
ムの製造装置によれば、蒸発源と固定マスクとを備え、
固定マスクは、高抵抗部を形成する狭い開口部の非蒸着
部に対応する部分の巾を狭くしているので、非蒸着部に
対応する部分の蒸発金属量が少なくなる。このため、高
抵抗部の非蒸着部近傍に回り込み付着する蒸発金属量も
少なくなり、非蒸着部の近傍の膜厚を均一にすることが
できる。また、蒸発金属の熱による固定マスクの熱ひず
みにより、高抵抗を形成する狭い開口部の隙間が変化し
難く、巾方向の高抵抗部の膜厚のばらつきが小さくな
る。According to the apparatus for manufacturing a stepped vapor deposition film according to claim 8 of the present invention, the apparatus is provided with an evaporation source and a fixed mask,
In the fixed mask, the width of the portion corresponding to the non-deposition portion of the narrow opening forming the high resistance portion is narrowed, so that the amount of evaporated metal in the portion corresponding to the non-deposition portion is reduced. For this reason, the amount of evaporated metal that wraps around and adheres to the non-deposition portion of the high resistance portion is reduced, and the film thickness in the vicinity of the non-deposition portion can be made uniform. Further, due to the thermal distortion of the fixed mask due to the heat of the evaporated metal, the gap between the narrow openings for forming the high resistance is hard to change, and the variation in the film thickness of the high resistance portion in the width direction is reduced.
【００４９】この発明の請求項９記載の段付蒸着フィル
ムの製造装置によれば、蒸発源と固定マスクとを備え、
固定マスクは、低抵抗部を形成する広い開口部と高抵抗
部を形成する狭い開口部が分離しているので、蒸発金属
の熱による固定マスクの熱ひずみにより、高抵抗を形成
する狭い開口部の隙間が変化し難く、巾方向の高抵抗部
の膜厚のばらつきが小さくなる。According to the apparatus for manufacturing a stepped vapor deposition film according to the ninth aspect of the present invention, the apparatus comprises an evaporation source and a fixed mask,
In the fixed mask, the wide opening forming the low-resistance portion and the narrow opening forming the high-resistance portion are separated from each other. Therefore, due to the heat distortion of the fixed mask due to the heat of the evaporated metal, the narrow opening forming the high resistance is formed. Of the high resistance portion in the width direction is less likely to change.
【図１】（Ａ）はこの発明の第１の実施の形態における
固定マスクの平面図、（Ｂ）は（Ａ）の固定マスクによ
り形成される広幅の段付蒸着フィルムの断面図、（Ｃ）
は（Ｂ）の段付蒸着フィルムを用いた段付蒸着フィルム
コンデンサの部分断面図である。1A is a plan view of a fixed mask according to a first embodiment of the present invention, FIG. 1B is a cross-sectional view of a wide stepped vapor deposition film formed by the fixed mask of FIG. 1A, and FIG. )
1 is a partial cross-sectional view of a stepped vapor deposition film capacitor using the stepped vapor deposition film of (B).
【図２】（Ａ）はこの発明の第２の実施の形態における
固定マスクの平面図、（Ｂ）は（Ａ）の固定マスクによ
り形成される広幅の段付蒸着フィルムの断面図、（Ｃ）
は（Ｂ）の段付蒸着フィルムを用いた段付蒸着フィルム
コンデンサの部分断面図である。2A is a plan view of a fixed mask according to a second embodiment of the present invention, FIG. 2B is a cross-sectional view of a wide stepped vapor deposition film formed by the fixed mask of FIG. )
1 is a partial cross-sectional view of a stepped vapor deposition film capacitor using the stepped vapor deposition film of (B).
【図３】（Ａ）はこの発明の第３の実施の形態における
固定マスクの平面図、（Ｂ）は（Ａ）の固定マスクによ
り形成される広幅の段付蒸着フィルムの断面図、（Ｃ）
は（Ｂ）の段付蒸着フィルムを用いた段付蒸着フィルム
コンデンサの部分断面図である。FIG. 3A is a plan view of a fixed mask according to a third embodiment of the present invention, FIG. 3B is a cross-sectional view of a wide stepped vapor deposition film formed by the fixed mask of FIG. )
1 is a partial cross-sectional view of a stepped vapor deposition film capacitor using the stepped vapor deposition film of (B).
【図４】（Ａ）はこの発明の第４の実施の形態における
固定マスクの平面図、（Ｂ）は（Ａ）の固定マスクによ
り形成される広幅の段付蒸着フィルムの断面図、（Ｃ）
は（Ｂ）の段付蒸着フィルムを用いた段付蒸着フィルム
コンデンサの部分断面図である。4A is a plan view of a fixed mask according to a fourth embodiment of the present invention, FIG. 4B is a cross-sectional view of a wide stepped vapor deposition film formed by the fixed mask of FIG. )
1 is a partial cross-sectional view of a stepped vapor deposition film capacitor using the stepped vapor deposition film of (B).
【図５】従来の段付蒸着フィルムの製造装置の斜視図で
ある。FIG. 5 is a perspective view of a conventional apparatus for manufacturing a stepped vapor deposition film.
【図６】（Ａ）は従来例の固定マスクの平面図、（Ｂ）
は（Ａ）の固定マスクにより形成される広幅の段付蒸着
フィルムの断面図、（Ｃ）は（Ｂ）の段付蒸着フィルム
を用いた段付蒸着フィルムコンデンサの部分断面図であ
る。FIG. 6A is a plan view of a conventional fixed mask, and FIG.
3A is a cross-sectional view of a wide stepped vapor deposition film formed by the fixed mask of FIG. 3A, and FIG. 4C is a partial cross-sectional view of a stepped vaporized film capacitor using the stepped vaporized film of FIG.
９ 蒸発金属 １０，２０，３０，４０，５０ 高抵抗部を形成するマ
スク開口部 １１，２１，３１，４１，５１ 低抵抗部を形成するマ
スク開口部 １２，２２，３２，４２，５２ 固定マスク １３ クーリングキャン １４ フィルム １５ 高抵抗部 １６ 低抵抗部 １７ 非蒸着部9 Evaporated metal 10, 20, 30, 40, 50 Mask opening for forming high resistance part 11, 21, 31, 41, 51 Mask opening for forming low resistance part 12, 22, 32, 42, 52 Fixed mask 13 Cooling Can 14 Film 15 High Resistance Section 16 Low Resistance Section 17 Non-Evaporated Section
───────────────────────────────────────────────────── フロントページの続き (72)発明者 岡部 繁雄 大阪府門真市大字門真1006番地 松下電器 産業株式会社内 Ｆターム(参考） 5E082 AB03 AB04 BB03 BC38 EE07 EE12 EE23 EE37 FG06 FG34 JJ02 JJ11 JJ22 ────────────────────────────────────────────────── ─── Continued on the front page (72) Inventor Shigeo Okabe 1006 Kazuma, Kadoma, Osaka Pref. F-term in Matsushita Electric Industrial Co., Ltd. (reference)
Claims (9)
口部を有する固定マスクを用いて調整することにより、
前記フィルム上に高抵抗部と低抵抗部の蒸着膜を形成す
る段付蒸着フィルムの製造方法であって、前記高抵抗部
を形成する開口部の非蒸着部に対応する部分のうち、少
なくとも１箇所以上を塞いだ状態で、前記蒸着膜を形成
することを特徴とする段付蒸着フィルムの製造方法。1. The method according to claim 1, wherein the amount of evaporated metal adhering to the film is adjusted by using a fixed mask having an opening.
A method of manufacturing a stepped vapor deposition film for forming a vapor deposition film of a high resistance portion and a low resistance portion on the film, wherein at least one of portions corresponding to a non-vapor deposition portion of an opening forming the high resistance portion. A method for producing a stepped vapor-deposited film, wherein the vapor-deposited film is formed in a state where more than one portion is closed.
口部を有する固定マスクを用いて調整することにより、
前記フィルム上に高抵抗部と低抵抗部の蒸着膜を形成す
る段付蒸着フィルムの製造方法であって、前記高抵抗部
を形成する開口部の非蒸着部に対応する部分を塞いだ状
態で、前記蒸着膜を形成することを特徴とする段付蒸着
フィルムの製造方法。2. The method according to claim 1, wherein the amount of evaporated metal adhering to the film is adjusted by using a fixed mask having an opening.
A method of manufacturing a stepped vapor deposition film for forming a vapor deposition film of a high resistance portion and a low resistance portion on the film, in a state where a portion corresponding to a non-vapor deposition portion of an opening forming the high resistance portion is closed. Forming a stepped vapor-deposited film by forming the vapor-deposited film.
口部を有する固定マスクを用いて調整することにより、
前記フィルム上に高抵抗部と低抵抗部の蒸着膜を形成す
る段付蒸着フィルムの製造方法であって、前記高抵抗部
を形成する開口部の非蒸着部に対応する部分の巾を狭く
した状態で、前記蒸着膜を形成することを特徴とする段
付蒸着フィルムの製造方法。3. The amount of evaporated metal adhering on the film is adjusted by using a fixed mask having an opening,
A method of manufacturing a stepped vapor deposition film for forming a vapor deposition film of a high resistance portion and a low resistance portion on the film, wherein the width of a portion corresponding to a non-vapor deposition portion of an opening forming the high resistance portion is reduced. A method for producing a stepped vapor deposition film, wherein the vapor deposition film is formed in a state.
口部を有する固定マスクを用いて調整することにより、
前記フィルム上に高抵抗部と低抵抗部の蒸着膜を形成す
る段付蒸着フィルムの製造方法であって、前記低抵抗部
を形成する開口部と前記高抵抗部を形成する開口部を分
離した状態で、前記蒸着膜を形成することを特徴とする
段付蒸着フィルムの製造方法。4. By adjusting the amount of evaporated metal adhering on the film using a fixed mask having an opening,
A method of manufacturing a stepped vapor deposition film for forming a vapor deposition film of a high resistance part and a low resistance part on the film, wherein an opening forming the low resistance part and an opening forming the high resistance part are separated. A method for producing a stepped vapor deposition film, wherein the vapor deposition film is formed in a state.
部と高抵抗部を形成する開口部を分離してなる請求項
１，２または３記載の段付蒸着フィルムの製造方法。5. The method for producing a stepped vapor deposition film according to claim 1, wherein the fixed mask is formed by separating an opening for forming a low resistance portion and an opening for forming a high resistance portion.
源から噴出した蒸発金属を遮蔽し前記蒸着膜に高抵抗部
と低抵抗部を形成する開口部を有する固定マスクとを備
え、前記固定マスクは、前記高抵抗部を形成する開口部
の非蒸着部に対応する部分のうち、少なくとも１箇所以
上を塞いでなることを特徴とする段付蒸着フィルムの製
造装置。6. An evaporation source for ejecting an evaporated metal, and a fixed mask having an opening for shielding the evaporated metal ejected from the evaporation source and forming a high-resistance portion and a low-resistance portion in the deposited film, An apparatus for manufacturing a stepped vapor-deposited film, wherein the fixed mask covers at least one or more portions of a portion corresponding to the non-deposited portion of the opening forming the high-resistance portion.
源から噴出した蒸発金属を遮蔽し前記蒸着膜に高抵抗部
と低抵抗部を形成する開口部を有する固定マスクとを備
え、前記固定マスクは、前記高抵抗部を形成する狭い開
口部の非蒸着部に対応する部分を塞いでなることを特徴
とする段付蒸着フィルムの製造装置。7. An evaporation source for ejecting an evaporated metal, and a fixed mask having an opening for shielding the evaporated metal ejected from the evaporation source and forming a high-resistance portion and a low-resistance portion in the deposited film. An apparatus for manufacturing a stepped vapor-deposited film, wherein the fixed mask covers a portion corresponding to the non-deposited portion of the narrow opening forming the high-resistance portion.
源から噴出した蒸発金属を遮蔽し前記蒸着膜に高抵抗部
と低抵抗部を形成する開口部を有する固定マスクとを備
え、前記固定マスクは、前記高抵抗部を形成する狭い開
口部の非蒸着部に対応する部分の巾を狭くしてなること
を特徴とする段付蒸着フィルムの製造装置。8. An evaporation source for ejecting the evaporated metal, and a fixed mask having an opening for shielding the evaporated metal ejected from the evaporation source and forming a high-resistance portion and a low-resistance portion in the deposited film. An apparatus for manufacturing a stepped vapor-deposited film, wherein the fixed mask has a narrow portion corresponding to the non-deposited part of the narrow opening for forming the high-resistance part.
源から噴出した蒸発金属を遮蔽し前記蒸着膜に高抵抗部
と低抵抗部を形成する開口部を有する固定マスクとを備
え、前記固定マスクは、前記低抵抗部を形成する広い開
口部と前記高抵抗部を形成する狭い開口部が分離してな
ることを特徴とする段付蒸着フィルムの製造装置。9. An evaporation source for ejecting an evaporated metal, and a fixed mask having an opening for shielding the evaporated metal ejected from the evaporation source and forming a high-resistance portion and a low-resistance portion in the deposited film, An apparatus for manufacturing a stepped vapor deposition film, wherein the fixed mask is formed by separating a wide opening forming the low resistance portion and a narrow opening forming the high resistance portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21743199A JP4011797B2 (en) | 1999-07-30 | 1999-07-30 | Method and apparatus for producing stepped vapor deposition film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21743199A JP4011797B2 (en) | 1999-07-30 | 1999-07-30 | Method and apparatus for producing stepped vapor deposition film |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2001044057A true JP2001044057A (en) | 2001-02-16 |
| JP4011797B2 JP4011797B2 (en) | 2007-11-21 |
Family
ID=16704122
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21743199A Expired - Fee Related JP4011797B2 (en) | 1999-07-30 | 1999-07-30 | Method and apparatus for producing stepped vapor deposition film |
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| Country | Link |
|---|---|
| JP (1) | JP4011797B2 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008124245A (en) * | 2006-11-13 | 2008-05-29 | Matsushita Electric Ind Co Ltd | Method and device for manufacturing metallized film |
| CN101894669A (en) * | 2010-06-11 | 2010-11-24 | 杨文荣 | Preparation method of supervoltage CBB four-string noninductive capacitor |
| KR101573247B1 (en) * | 2014-11-03 | 2015-12-02 | 주식회사 뉴인텍 | Vacuum Metallizing Coating Film |
| US10640867B2 (en) | 2015-10-21 | 2020-05-05 | Panasonic Intellectual Property Management Co., Ltd. | Method for manufacturing metallized film |
-
1999
- 1999-07-30 JP JP21743199A patent/JP4011797B2/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008124245A (en) * | 2006-11-13 | 2008-05-29 | Matsushita Electric Ind Co Ltd | Method and device for manufacturing metallized film |
| CN101894669A (en) * | 2010-06-11 | 2010-11-24 | 杨文荣 | Preparation method of supervoltage CBB four-string noninductive capacitor |
| KR101573247B1 (en) * | 2014-11-03 | 2015-12-02 | 주식회사 뉴인텍 | Vacuum Metallizing Coating Film |
| CN105118669A (en) * | 2014-11-03 | 2015-12-02 | 纽茵泰克株式会社 | Three-step type deposited film for capacitor for improving heat dissipation and lightweight |
| WO2016072671A1 (en) * | 2014-11-03 | 2016-05-12 | 주식회사 뉴인텍 | Deposition film for triple layer capacitor and capacitor having improved heat dissipation |
| US10640867B2 (en) | 2015-10-21 | 2020-05-05 | Panasonic Intellectual Property Management Co., Ltd. | Method for manufacturing metallized film |
Also Published As
| Publication number | Publication date |
|---|---|
| JP4011797B2 (en) | 2007-11-21 |
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