JP2001037951A5 - - Google Patents
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- Publication number
- JP2001037951A5 JP2001037951A5 JP1999212124A JP21212499A JP2001037951A5 JP 2001037951 A5 JP2001037951 A5 JP 2001037951A5 JP 1999212124 A JP1999212124 A JP 1999212124A JP 21212499 A JP21212499 A JP 21212499A JP 2001037951 A5 JP2001037951 A5 JP 2001037951A5
- Authority
- JP
- Japan
- Prior art keywords
- shaped body
- disc
- transport
- endless belt
- disk
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000126 substance Substances 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP21212499A JP4386500B2 (ja) | 1999-07-27 | 1999-07-27 | 円板状体搬送装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP21212499A JP4386500B2 (ja) | 1999-07-27 | 1999-07-27 | 円板状体搬送装置 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006201245A Division JP4330604B2 (ja) | 2006-07-24 | 2006-07-24 | 円板状体搬送装置 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2001037951A JP2001037951A (ja) | 2001-02-13 |
JP2001037951A5 true JP2001037951A5 (ru) | 2006-09-21 |
JP4386500B2 JP4386500B2 (ja) | 2009-12-16 |
Family
ID=16617292
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP21212499A Expired - Fee Related JP4386500B2 (ja) | 1999-07-27 | 1999-07-27 | 円板状体搬送装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4386500B2 (ru) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7674716B2 (en) | 2004-12-29 | 2010-03-09 | Lg Chem. Ltd. | Adjuvant for chemical mechanical polishing slurry |
KR100786948B1 (ko) | 2005-12-08 | 2007-12-17 | 주식회사 엘지화학 | 연마 선택비 조절제 및 이를 함유한 cmp 슬러리 |
KR100786949B1 (ko) | 2005-12-08 | 2007-12-17 | 주식회사 엘지화학 | 연마 선택도 조절 보조제 및 이를 함유한 cmp 슬러리 |
JP5290769B2 (ja) | 2006-01-25 | 2013-09-18 | エルジー・ケム・リミテッド | Cmpスラリー及びこれを用いる半導体ウェハーの研磨方法 |
-
1999
- 1999-07-27 JP JP21212499A patent/JP4386500B2/ja not_active Expired - Fee Related
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