JP2001036240A - Manufacture of molded circuit - Google Patents

Abstract

PROBLEM TO BE SOLVED: To manufacture a molded circuit in high productivity and reliability which is provided with a three-dimensional structure and a circuit pattern superior in insulation between wirings. SOLUTION: A synthetic resin film 11 with a specified shape provided with a first through hole 10 at a specified position, a circuit pattern 9 made of conductive substance and an adhesive layer 8 are laminated to form a laminated body 20, and it is positioned and fixed in a mold 7 for forming synthetic resin so that the adhesive layer 8 lies in the position opposite to the flowing side of the synthetic resin 13. Then, the synthetic resin 13 is pressed in the mold 7 and it is flowed to fill the mold 7, and before the molded body 13 made of synthetic resin is cooled and solidified and its fluidity is lost, the molded body 13 is pressurized by a pressurizing means 14 provided in the mold 7, and while it is pressurized, the molded body 13 is cooled and solidified. The circuit pattern 9 is adhered tightly to the molded body 13 by means of the adhesive layer 8 so that a uniform and large peeling strength may be obtained, thereby forming the synthetic resin film 11 as a surface insulation layer and forming the first through hole 10 as a joint position between the circuit pattern 9 and other electric part.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a molded circuit component, and more particularly to a molded circuit capable of producing a molded circuit component having a three-dimensional circuit pattern with high productivity and high reliability. The present invention relates to a method for manufacturing a component.

[0002]

2. Description of the Related Art FIGS. 5 to 9 are explanatory views schematically showing a conventional method for manufacturing a molded circuit component. As shown in FIG. 5, in the conventional method for manufacturing a molded circuit component, after forming the first molded portion 1 with a synthetic resin containing a catalyst for electroless plating, the catalyst for electroless plating is not compounded. The surface of the first molded part 1 is exposed in a predetermined circuit pattern shape with a synthetic resin, and the second molded part 2 is formed so as to cover the remaining part. After the surface of the molded portion 1 is roughened, a conductive pattern 3 is formed on the surface by electroless plating to form a circuit pattern.

[0003]

However, as shown in FIG. 6, according to this method, the exposed surface of the first molded part 1 is roughened with a chemical, so that this chemical is used for the first molded part 1. And the second molded part 2 penetrates into the boundary, and there is a step 3 'at the boundary, which makes it difficult to obtain a flat circuit pattern. In addition, due to a slight change in molding conditions, the adhesiveness of the boundary surface is reduced, or even if there is a small gap in the boundary surface, the chemical solution for roughening forms a gap in the boundary surface, or creates a gap. I sometimes spread it.

As shown in FIG. 7, when electroless plating is performed in such a state, a conductive film 3 "is also formed in the above-mentioned space, so that a portion which should be electrically insulated originally is formed. However, defects such as low breakdown voltage are likely to occur even when electrically conductive or insulated, and in addition to significantly impairing productivity, such defects are difficult to determine only by appearance. Therefore, the reliability is low, and in order to ensure the reliability, it may be necessary to measure the electrical characteristics of all the insulating parts in some cases, and there is a problem in the process control.

[0005] Further, in the roughening step, the electroless plating catalyst adheres to the second molded portion 2, or the electroless plating catalyst elutes or falls off from the roughened surface into the plating solution in the plating step. Sometimes.

As shown in FIG. 8, in the former case, if the cleaning is insufficient, the conductive film 6 is also applied to the portion 5 to which the catalyst has adhered.
Are formed, and if not removed, defects that are problematic in electrical characteristics are likely to occur, which significantly impairs productivity. In the latter case, the compatibility of the plating solution with the synthetic resin is narrow, and if the compatibility is not good, the catalyst is liable to be eluted or dropped off in the plating solution, and there is no presence in the part where the catalyst floats. An electrolytic plating reaction occurs.

As shown in FIG. 9, fine particles 4 of the conductive substance generated in the liquid adhere to the surface of the second molded part 2, and a conductive film 3 ″ is formed on the adhered particles. In addition to this, the connection between the circuits was liable to occur, and in addition, the life of the plating solution was apt to be shortened due to contamination, thereby significantly impairing the productivity. Since it has to be exposed from the second molded part 2 according to the circuit pattern, it has been difficult to manufacture a circuit pattern having a three-dimensional structure.

Therefore, an object of the present invention is to provide a molded circuit component having a three-dimensional circuit pattern having excellent insulation between wirings with high productivity and high reliability. It is to provide a manufacturing method.

[0009]

The present invention provides the following method for manufacturing a molded circuit component in order to achieve the above object.

[1] A synthetic resin film having a predetermined shape in which a first through hole is provided at a predetermined position, a circuit pattern made of a conductive substance, and an adhesive layer are laminated in a synthetic resin molding die. After the laminate is positioned and fixed so that the adhesive layer faces the flow side of the synthetic resin, the synthetic resin is press-fitted into the mold, flowed and filled, and the molded body of the synthetic resin is cooled. Before solidifying and losing fluidity, the molded body of the synthetic resin is pressurized by pressurizing means disposed in the mold, and the molded body of the synthetic resin is cooled and solidified in a pressurized state. By bringing the circuit pattern into close contact with the molded body of the synthetic resin via the adhesive layer, the synthetic resin film is used as a surface insulating layer, and the through hole is formed at a joint portion between the circuit pattern and another electric component. Molded circuit parts characterized by having Manufacturing method.

[2] The method for manufacturing a molded circuit component according to [1], wherein the laminate has a three-dimensional structure.

[3] The conductive material is copper, copper alloy,
The method for producing a molded circuit component according to the above [1], which is at least one type of metal foil selected from the group consisting of aluminum and an aluminum alloy.

[4] The above-mentioned [1], wherein the conductive substance is a conductive synthetic resin or a conductive adhesive obtained by blending fine conductive metal fine pieces into a synthetic resin to impart conductivity. Method for manufacturing molded circuit parts.

[5] The fine metal piece of good conductivity is
The method for producing a molded circuit component according to the above [4], wherein the molded circuit component is made of at least one metal selected from the group consisting of copper, a copper alloy, aluminum, and an aluminum alloy.

[6] The laminate according to any one of [1] to [5], wherein the laminate is obtained by separately forming a circuit pattern made of the conductive substance and the synthetic resin film in advance and bonding them together. ] The manufacturing method of the molded circuit component according to any one of the above.

[7] The laminate is formed by applying the conductive substance to the synthetic resin film by an electroless plating method, a vapor deposition method,
The method for producing a molded circuit component according to any one of [1] to [5], wherein a circuit pattern is formed by laminating by at least one method selected from the group consisting of a sputtering method and a printing method.

[8] In the laminate, the synthetic resin film, the circuit pattern made of the conductive material, and the adhesive layer are separately formed in advance into a three-dimensional shape, and laminated by laminating them. The method for producing a molded circuit component according to the above [6].

[9] The laminate is a first multilayer film in which the synthetic resin film is laminated with a multilayer circuit pattern in which a circuit pattern made of the conductive substance and the adhesive layer are alternately laminated in a plurality of layers. And each of the adhesive layers has a second through-hole for electrically bonding the circuit patterns to each other and a first conductive film disposed on an inner surface thereof, and the first multilayer film has The molded circuit component according to any one of [1] to [5], further including a third through hole and a second conductive film for electrically connecting all the circuit patterns to each other. Manufacturing method.

[10] A second multilayer film in which the laminate is formed by repeatedly laminating a laminate in which the synthetic resin film, a circuit pattern made of a conductive substance, and an adhesive layer are laminated in a plurality of layers. The method for producing a molded circuit component according to any one of [1] to [5].

[0020]

Embodiments of the present invention will be specifically described below with reference to the drawings. FIG. 1 is a cross-sectional view schematically showing one embodiment of a method for manufacturing a molded circuit component of the present invention. As shown in FIG. 1 (a), the method of manufacturing a molded circuit component of the present invention is different from the conventional technology of forming a circuit pattern of a conductive material directly on the surface of a synthetic resin molded product by an electroless plating method. It is completely different from a synthetic resin film 11 having a predetermined shape (for example, a three-dimensional shape) in which a first through hole 10 is provided at a predetermined position in a synthetic resin molding die 7 and a conductive material. Circuit pattern 9
The laminate 20 on which the adhesive layer 8 is laminated is positioned and fixed using, for example, the positioning pin 12 so that the adhesive layer 8 faces the flow side of the synthetic resin 13.
Is press-fitted into a mold 7 and filled by flowing.

Next, as shown in FIG. 1 (b), before the molded body 13 of the synthetic resin is cooled and solidified and loses its fluidity, the pressurizing means 14 (pressurized) provided in the mold 7 is used. The means 14 is not particularly limited, and a general-purpose means can be used)
For example, by operating in the direction of arrow 15, the synthetic resin molded body 13 is pressurized, and the synthetic resin molded body 13 is kept pressed.
Is cooled and solidified, and the circuit pattern 9 is
Is adhered to the synthetic resin molded body 13 so as to obtain a uniform and high peel strength.
1 is a surface insulating layer, and the first through hole 10 is a joint between the circuit pattern 9 and another electric component.

In general, when a synthetic resin is cooled and solidified in a mold, heat shrinkage and crystallization shrinkage occur. To compensate for the shrinkage, the synthetic resin is press-fitted through the gate 13 '. The position differs depending on each position of the molded body, and the synthetic resin to be press-fitted is not uniformly filled, which causes an uneven cooling rate. Therefore, as in the present invention, by applying pressure by the pressurizing mechanism 14 to equalize the contraction in the thickness direction and the pressure applied to the inner wall surface of the mold,
Adhesion between the adhesive layer 8 and the molded body 13 is made uniform, and a molded circuit component can be manufactured with high reliability overall.

Here, the synthetic resin film 11 is not particularly limited, but preferred examples thereof include films of polybutylene terephthalate, polyphenylene sulfide, syndiotactic crystalline polystyrene, polyether sulfone, polyetherimide and the like. Can be.

The conductive material constituting the circuit pattern 9 is not particularly limited as long as it is a metal which is generally used as a conductive material. For example, gold, silver, copper, tin, aluminum and synthetic resin Among them, those having a large amount incorporated therein to impart conductivity can be cited, but productivity,
From the viewpoints of various properties such as mechanical strength and abrasion resistance, ease of forming a thin film, and generation of whiskers due to constant load of external force,
Preferred are foils of copper, copper alloys, aluminum, aluminum alloys and the like.

When the circuit pattern 9 is formed by a printing method, a paste-like synthetic resin or an adhesive provided with conductivity by blending fine metal pieces having good conductivity is used as the conductive substance. After printing the circuit pattern, it is preferable to heat and cure the circuit pattern.

In the present invention, as described above, in order to form the circuit pattern 9 on the synthetic resin film 11, the laminated body 20 in which the synthetic resin film 11, the circuit pattern 9 and the adhesive layer 8 are laminated is formed. And a configuration in which the circuit pattern 9 is brought into close contact with the synthetic resin molded body 13 via the adhesive layer 8 is adopted.

FIG. 2 is a sectional view schematically showing one embodiment of the formation of a laminate in the method of manufacturing a molded circuit component of the present invention. As shown in FIGS. 2A to 2C, a circuit pattern 9 made of a conductive substance and a synthetic resin film 11 having a first through-hole 10 can be separately affixed separately as this laminate. It is preferable to form the laminate 19 by shaping it into a shape (for example, a three-dimensional shape) and bonding them together.

As shown in FIG. 2D, FIGS.
The adhesive layer 8 is formed on the circuit pattern 9 side of the laminate 19 obtained in (c), and the laminate is pressed by the molds 7a and 7b.
May be formed. Alternatively, the laminated body 20 may be formed by forming the synthetic resin film 11, the circuit pattern 9, and the adhesive layer 8 separately in advance into a three-dimensional shape, bonding and laminating them. In this case, it is preferable that the molding process is performed under a temperature condition in which the adhesive layer 8 hardly causes a curing reaction.

In addition, the laminate 20 is formed by laminating a conductive substance on the synthetic resin film 11 by at least one method selected from the group consisting of electroless plating, vapor deposition, sputtering, and printing. Alternatively, the circuit pattern 9 may be formed.

FIG. 3 is a sectional view schematically showing another embodiment of the method for manufacturing a molded circuit component according to the present invention. As shown in FIG. 3, the laminate has a plurality of synthetic resin films 11 each having a predetermined shape in which first through holes 10 are provided at predetermined positions, and a plurality of circuit patterns 9 and adhesive layers 8 each formed of a conductive substance. A second through-hole 10 ′ for electrically bonding the circuit patterns 9 to each other, and a second through hole 10 ′ for each of the adhesive layers 8, comprising It has a first conductive coating (not shown) disposed on the inner surface, and the multilayer film 22 has a third through hole 10 ″ for electrically connecting all the circuit patterns 9 to each other, and a third through hole 10 ″ therein. It has a second conductive film (not shown) formed on the wall surface, and by this configuration, a molded circuit component having a multilayer circuit pattern can be manufactured with high productivity and high reliability.

FIG. 4 is a cross-sectional view schematically showing another embodiment of the method for manufacturing a molded circuit component of the present invention. As shown in FIG. 4, as described above, a laminate obtained by laminating the synthetic resin film 11, the circuit pattern 9 made of a conductive substance, and the adhesive layer 8 is repeatedly laminated in a plurality of layers. It may be composed of the multilayer film 23. With this configuration, a molded circuit component having a multilayer circuit pattern can be manufactured with high productivity and high reliability.

[0032]

As described above, according to the present invention, it is not necessary to expose the first molded portion from the second molded portion according to the circuit pattern unlike the prior art, and the molded product is directly exposed to the chemical solution. Because there is no contact,
A molded circuit component having a three-dimensional structure having a circuit pattern with excellent insulation between wirings can be manufactured with high productivity and high reliability without a conductive substance adhering to unnecessary portions. In addition, if there is a defect in the circuit pattern on the synthetic resin film, it can be found and removed at the stage of forming the circuit pattern before checking at the final stage, and the formation and molding of the circuit pattern can be performed in parallel. Therefore, high productivity can be realized.

[0033]

[Brief description of the drawings]

FIG. 1 is a cross-sectional view schematically showing one embodiment of a method for manufacturing a molded circuit component of the present invention.

FIG. 2 is a cross-sectional view schematically showing one embodiment of forming a laminate in the method for manufacturing a molded circuit component of the present invention.

FIG. 3 is a cross-sectional view schematically showing another embodiment of the method for manufacturing a molded circuit component of the present invention.

FIG. 4 is a cross-sectional view schematically showing another embodiment of the method for manufacturing a molded circuit component of the present invention.

FIG. 5 is an explanatory view schematically showing a conventional method for manufacturing a molded circuit component.

FIG. 6 is an explanatory view schematically showing a conventional method for manufacturing a molded circuit component.

FIG. 7 is an explanatory view schematically showing a conventional method for manufacturing a molded circuit component.

FIG. 8 is an explanatory view schematically showing a conventional method for manufacturing a molded circuit component.

FIG. 9 is an explanatory view schematically showing a conventional method for manufacturing a molded circuit component.

[Explanation of symbols]

 1: First molded part 2: Second molded part 3: Conductive coating 3 ′: Step 3 ″: Conductive coating on void or foreign matter 4: Fine particles of conductive substance 5: Catalyst adhering part 6: Conductive coating on catalyst adhering part 7: Mold 8: Adhesive layer 9: Circuit pattern 10: First through hole 10 ': Second through hole 10 ": Third through hole 11: Synthetic resin film 12: Positioning Pin 13: Synthetic resin or molded synthetic resin 13 ': Gate 14: Pressing means 15: Arrow indicating operation direction of pressing means 19: Laminate of synthetic resin film and circuit pattern 20: Laminate 21: Multilayer circuit Pattern 22: Multilayer film 23: Multilayer film

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 4F206 AD03 AD05 AD20 AH36 JA03 JB12 JF05 JN25 JQ81 5E346 AA02 AA04 AA12 AA15 AA16 AA22 AA43 BB01 BB16 CC31 CC32 CC34 CC42 DD02 DD13 DD16 DD17 DD23 EE01 EE50 EE33 H

Claims (10)

[Claims] 1. A synthetic resin film having a predetermined shape in which a first through hole is provided at a predetermined position in a synthetic resin molding die,
After a circuit board made of a conductive material and an adhesive layer are laminated and positioned so that the adhesive layer faces the flow side of the synthetic resin and fixed, the synthetic resin is pressed into the mold. Before the molded body of the synthetic resin is cooled and solidified and loses fluidity, the molded body of the synthetic resin is pressurized by a pressurizing means disposed in the mold, and then pressurized. The synthetic resin molded body is cooled and solidified in the state, and the circuit pattern is brought into close contact with the synthetic resin molded body via the adhesive layer, so that the synthetic resin film becomes a surface insulating layer, and A method of manufacturing a molded circuit component, wherein a through hole is formed at a joint between the circuit pattern and another electric component. 2. The method according to claim 1, wherein the laminate has a three-dimensional structure. 3. The method according to claim 1, wherein the conductive material is at least one metal foil selected from the group consisting of copper, copper alloy, aluminum, and aluminum alloy. 4. The molding according to claim 1, wherein the conductive material is a conductive synthetic resin or a conductive adhesive obtained by mixing conductive fine particles with a synthetic resin to impart conductivity. Manufacturing method of circuit parts. 5. The molded circuit component according to claim 4, wherein the fine metal pieces of good conductivity are made of at least one metal selected from the group consisting of copper, copper alloy, aluminum, and aluminum alloy. Manufacturing method. 6. The laminate according to claim 1, wherein the circuit pattern made of the conductive material and the synthetic resin film are separately formed in advance and laminated by laminating both. 4. The method for producing a molded circuit component according to claim 1. 7. The laminate, wherein the conductive substance is laminated on the synthetic resin film by at least one method selected from the group consisting of electroless plating, vapor deposition, sputtering, and printing. The method for manufacturing a molded circuit component according to any one of claims 1 to 5, wherein the circuit pattern is formed by performing the following steps. 8. The laminate according to claim 1, wherein the synthetic resin film, the circuit pattern made of the conductive material, and the adhesive layer are separately formed in advance into a three-dimensional shape, and are laminated by laminating. Item 7. The method for producing a molded circuit component according to Item 6. 9. The first multilayer film in which the laminate is formed by laminating the synthetic resin film and a multilayer circuit pattern in which a plurality of the circuit patterns made of the conductive material and the adhesive layer are alternately laminated. Each of the adhesive layers has a second through hole for electrically bonding the circuit patterns to each other and a first conductive coating disposed on an inner surface thereof, and the first multilayer film has The method for manufacturing a molded circuit component according to any one of claims 1 to 5, further comprising a third through hole and a second conductive coating for electrically connecting all the circuit patterns to each other. 10. The laminate is a second multilayer film in which a laminate obtained by laminating the synthetic resin film, a circuit pattern made of a conductive material, and an adhesive layer is repeatedly laminated in a plurality of layers. A method for manufacturing a molded circuit component according to claim 1.