JP2001016007A - Wiring board having transmission line - Google Patents

Wiring board having transmission line

Info

Publication number
JP2001016007A
JP2001016007A JP11184015A JP18401599A JP2001016007A JP 2001016007 A JP2001016007 A JP 2001016007A JP 11184015 A JP11184015 A JP 11184015A JP 18401599 A JP18401599 A JP 18401599A JP 2001016007 A JP2001016007 A JP 2001016007A
Authority
JP
Japan
Prior art keywords
transmission line
wiring board
dielectric layer
dimension
axis direction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11184015A
Other languages
Japanese (ja)
Inventor
Toshikatsu Takada
俊克 高田
Makoto Baba
誠 馬場
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Niterra Co Ltd
Original Assignee
NGK Spark Plug Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NGK Spark Plug Co Ltd filed Critical NGK Spark Plug Co Ltd
Priority to JP11184015A priority Critical patent/JP2001016007A/en
Publication of JP2001016007A publication Critical patent/JP2001016007A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
    • H01L2223/64—Impedance arrangements
    • H01L2223/66—High-frequency adaptations
    • H01L2223/6605—High-frequency electrical connections
    • H01L2223/6616—Vertical connections, e.g. vias
    • H01L2223/6622—Coaxial feed-throughs in active or passive substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1517—Multilayer substrate
    • H01L2924/15172—Fan-out arrangement of the internal vias
    • H01L2924/15174—Fan-out arrangement of the internal vias in different layers of the multilayer substrate

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Waveguides (AREA)

Abstract

PROBLEM TO BE SOLVED: To effectively prevent the leakage of a signal and noise from a transmission line and to prevent the occurrence of cracks near the transmission line by forming the transmission line formed of a strip line, a dielectric layer, two ground lines and two long hole-shaped via conductors where conductive materials are filled. SOLUTION: A strip line 2, ground lines 3 and 4 and long hole-shaped vias 5 and 6 are installed. A dielectric layer (transmission line part dielectric layer) formed to surround the strip line 2 is a part surrounded by the ground lines 3 and 4 and the long hole-like via conductors 5 and 6 in dielectric layers 1c and 1d. The two ground lines 3 and 4 are formed by sandwiching the transmission line part dielectric from above and below. A pair of long hole-like via conductors 5 and 6 conduct and connect the ground lines 3 and 4 and are formed to sandwich the transmission line part dielectric from the right and left. Since the long hole-shaped via conductors cover both sides of the transmission line in a wall shape, a gap between the via conductors, which exists in conventional transmission lines, does not exist.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【０００１】[0001]

【産業上の利用分野】本発明は、マイクロ波及びミリ波
等の高周波の信号を伝達するための伝送線路を有する配
線基板に関する。更には、伝送線路からの信号やノイズ
の漏れを効果的に防止するとともに、伝送線路近傍のク
ラックの発生を防止した信頼性の高い伝送線路を有する
配線基板に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wiring board having a transmission line for transmitting high-frequency signals such as microwaves and millimeter waves. Further, the present invention relates to a wiring board having a highly reliable transmission line that effectively prevents leakage of signals and noise from the transmission line and prevents generation of cracks near the transmission line.

【０００２】[0002]

【従来の技術】情報通信機器分野においては、製品の消
費電力を抑えるために、マイクロ波やミリ波の高周波信
号を如何に効率よく伝送するかが重要な問題である。伝
送線路の形態としては、導波管、誘電体導波管、ストリ
ップ線路、マイクロストリップ線路等が知られている。2. Description of the Related Art In the field of information communication equipment, how to efficiently transmit microwave or millimeter wave high-frequency signals is an important issue in order to suppress power consumption of products. As a form of the transmission line, a waveguide, a dielectric waveguide, a strip line, a microstrip line, and the like are known.

【０００３】近年は、配線基板の表面実装密度が極めて
高くなっており、配線基板の表面に伝送線路を設けるこ
とは困難である。従って、伝送線路を配線基板内に内蔵
する技術を確立することが極めて重要である。しかし、
配線基板に伝送線路を内蔵しようとする場合、伝送線路
の電磁シールドを確保するのが困難である。伝送線路を
電磁シールドする方法として、配線基板に内蔵されてい
る層間接続用のビア導体（いわゆるビアポスト）を並べ
て電磁シールドにする方法等が検討されている。In recent years, the surface mounting density of a wiring board has become extremely high, and it is difficult to provide a transmission line on the surface of the wiring board. Therefore, it is extremely important to establish a technique for incorporating a transmission line in a wiring board. But,
When trying to incorporate a transmission line in a wiring board, it is difficult to secure an electromagnetic shield for the transmission line. As a method of electromagnetically shielding a transmission line, a method of arranging via conductors (so-called via posts) for interlayer connection built in a wiring board to form an electromagnetic shield has been studied.

【０００４】伝送線路に沿って、円柱状のビアポストを
微小ピッチで形成し、高周波信号の伝送損失を抑える方
法が特開平６−２２４６０４号公報に開示されている。
また、伝送線路に沿って、円形状のビアポストを微小ピ
ッチで形成し、電磁ノイズを抑える方法が特開平８−７
８９１２号公報に開示されている。また、類似の方法が
特開平１０−３０３６１１号公報にも開示されている。Japanese Patent Application Laid-Open No. 6-224604 discloses a method in which cylindrical via posts are formed at a very small pitch along a transmission line to suppress transmission loss of a high-frequency signal.
Japanese Patent Laid-Open No. 8-7 / 1994 discloses a method of forming circular via posts at a fine pitch along a transmission line to suppress electromagnetic noise.
No. 8912. A similar method is also disclosed in JP-A-10-303611.

【０００５】これらの方法では、伝送信号がより高周波
になるに従い、シールド用のビアポストの狭ピッチ化が
必要になる。周波数が高くなれば、信号の波長が短くな
り、ビア間から信号が漏れるようになるからである。一
般には、ビア間隔は使用周波数の波長λの１／４（λ／
４）以下にする必要がある（ｎ次高調波のノイズを抑え
るには、更にその１／ｎ以下となる）。誘電率９のアル
ミナ配線基板を例にすれば、使用周波数６０ＧＨｚにお
いて、ビア間隔を０．４ｍｍ以下にする必要がある。[0005] In these methods, as the transmission signal becomes higher in frequency, the pitch of the shielding via posts needs to be reduced. This is because as the frequency increases, the wavelength of the signal decreases, and the signal leaks from between the vias. In general, the via interval is （(λ /
4) It is necessary to make it equal to or less (to suppress the noise of the n-th harmonic, it is further reduced to 1 / n or less). Taking an alumina wiring board having a dielectric constant of 9 as an example, it is necessary to set the via interval to 0.4 mm or less at an operating frequency of 60 GHz.

【０００６】しかし、ビアのピッチを狭めると、隣り合
うビア間で誘電体にクラックが発生し、気密性が低下す
る問題がある。また、伝送線路に沿って多数のビアホー
ルを形成すると、穴あけ工程が増える分、製造コストが
高くなる問題がある。However, when the pitch of the vias is reduced, cracks occur in the dielectric between adjacent vias, and there is a problem that the airtightness is reduced. Further, when a large number of via holes are formed along the transmission line, there is a problem that the manufacturing cost is increased due to an increase in the number of drilling steps.

【０００７】[0007]

【発明が解決しようとする課題】本発明は、マイクロ波
及びミリ波等の高周波の信号を伝達するための伝送線路
を有する配線基板において、伝送線路からの信号やノイ
ズの漏れを効果的に防止するとともに、伝送線路近傍の
気密性の低下を防止した信頼性の高い伝送線路を有する
配線基板を提供することを目的とする。また、多層技術
を用いて伝送線路を基板内に内蔵して、従来よりも表面
実装密度の高い伝送線路を有する配線基板を提供するこ
とを目的とする。SUMMARY OF THE INVENTION The present invention provides a wiring board having a transmission line for transmitting high-frequency signals such as microwaves and millimeter waves, which effectively prevents leakage of signals and noise from the transmission line. It is another object of the present invention to provide a wiring board having a highly reliable transmission line in which a decrease in airtightness near the transmission line is prevented. It is another object of the present invention to provide a wiring board having a transmission line with a higher surface mounting density than a conventional one, in which the transmission line is built in the substrate by using a multilayer technology.

【０００８】[0008]

【課題を解決するための手段】請求項１の発明は、スト
リップ線路と、該ストリップ線路を包囲するように形成
された誘電体層と、該誘電体層を上下から挟むように形
成された２つのグランド線路と、該両グランド線路間を
導通接続するとともに、前記誘電体層を左右から挟むよ
うに形成された、導電材料を充填してなる２つの長孔状
ビア導体とからなる伝送線路を形成した配線基板を要旨
とする。これは、いわゆるストリップライン構造の伝送
線路に該当する。According to a first aspect of the present invention, a strip line, a dielectric layer formed so as to surround the strip line, and a dielectric layer formed so as to sandwich the dielectric layer from above and below. A transmission line composed of two ground lines and two elongated via conductors filled with a conductive material and formed to sandwich the dielectric layer from the left and right while electrically connecting between the two ground lines. The formed wiring board is a gist. This corresponds to a transmission line having a so-called stripline structure.

【０００９】請求項２の発明は、誘電体層を上下から挟
むように形成された２つのグランド線路と、該両グラン
ド線路間を導通接続するとともに、前記誘電体層を左右
から挟むように形成された、導電材料を充填してなる２
つの長孔状ビア導体とからなる伝送線路を形成した配線
基板を要旨とする。これは、いわゆる導波管構造の伝送
線路に該当する。According to a second aspect of the present invention, two ground lines are formed so as to sandwich the dielectric layer from above and below, the two ground lines are electrically connected, and the dielectric layer is formed so as to sandwich between the left and right. 2 filled with conductive material
A gist is a wiring board on which a transmission line including two long-hole via conductors is formed. This corresponds to a transmission line having a so-called waveguide structure.

【００１０】本発明の特徴は、伝送線路の側壁に該当す
る導体部分が、誘電体層を左右から挟むように形成され
た、導電材料を充填してなる２つの長孔状ビア導体で形
成されている点にある。従来の複数のビア導体を並べた
一対の「ビア群」を用いる場合と異なり、伝送線路の両
脇を長孔状ビア導体で囲うことで、伝送線路からの信号
やノイズの漏れを確実に防止できるようになる。また、
特開平８−７８９１２号公報の図４及び図５に開示され
ているような、長孔状の、いわゆる貫通スルーホールビ
ア構造を用いた伝送線路では、積層技術を用いて基板内
部に伝送線路を内蔵することはできないが、本発明のよ
うに、導電材料が充填された、いわゆるフィルドビア構
造を用いた伝送線路にすれば、積層技術を用いて基板内
部に伝送線路を容易に内蔵できる。その結果、基板の表
面にデッドスペースが発生せず、基板の表面実装密度を
向上することができる。A feature of the present invention is that the conductor portion corresponding to the side wall of the transmission line is formed of two elongated via conductors formed so as to sandwich the dielectric layer from right and left and filled with a conductive material. It is in the point. Unlike the conventional case of using a pair of "via groups" in which multiple via conductors are lined up, the transmission line is reliably prevented from leaking signals and noise by enclosing both sides of the transmission line with long-hole-shaped via conductors become able to. Also,
In a transmission line using a so-called through-hole via structure having a long hole shape as disclosed in FIGS. 4 and 5 of JP-A-8-78912, a transmission line is formed inside a substrate by using a lamination technique. Although a transmission line using a so-called filled via structure filled with a conductive material as in the present invention can not be built in, a transmission line can be easily built in a substrate using a lamination technique. As a result, no dead space is generated on the surface of the substrate, and the surface mounting density of the substrate can be improved.

【００１１】ここにいう「長孔状ビア」とは、ビアの平
面形状が短軸と長軸とを有する形状であることをいう。
具体的には、図５に示すように、楕円状、長円状、長方
形状（角をＲ面取りまたはＣ面取りした長方形状を含
む）が挙げられる。加工の容易さや応力集中のし難さを
考慮すれば、長円状が最も好ましい。セラミックス配線
基板であれば、セラミックスグリーンシートに金型等を
用いて穴あけ加工すればよい。樹脂配線基板であれば、
フォトリソグラフィやレーザー加工を用いて穴あけ加工
すればよい。The term "elongated via" as used herein means that the planar shape of the via is a shape having a short axis and a long axis.
Specifically, as shown in FIG. 5, an elliptical shape, an elliptical shape, and a rectangular shape (including a rectangular shape in which corners are rounded or chamfered) are included. Considering the ease of processing and the difficulty of stress concentration, an oval shape is most preferable. In the case of a ceramic wiring substrate, a hole may be formed in a ceramic green sheet using a mold or the like. If it is a resin wiring board,
Drilling may be performed using photolithography or laser processing.

【００１２】誘電体層としては、樹脂等の有機系、セラ
ミックス等の無機系、有機−無機複合系等を用いること
ができる。有機系としては、感光性エポキシ系樹脂、感
光性ポリイミド系樹脂、テフロン等のフッ素系樹脂等を
用いるのが好ましい。無機系としては、アルミナ、窒化
アルミニウム、ムライト、ＳｉＣ、チタン酸バリウム、
ガラス−セラミックス複合材料等を用いることができ
る。これらを任意に組み合わせた有機−無機複合系であ
ってもよい。導電材料としては、誘電体層が樹脂系が無
機系かによって製造方法に適した材料が選ばれる。樹脂
系の場合、銅、金、パラジウム、白金、銀、ニッケル、
ロジウム等が用いられる。無機系の場合、銀、金、パラ
ジウム、白金、金、ニッケル、ロジウム、タングステ
ン、モリブデン等が用いられる。As the dielectric layer, an organic material such as a resin, an inorganic material such as a ceramic, an organic-inorganic composite material, or the like can be used. As the organic resin, it is preferable to use a photosensitive epoxy resin, a photosensitive polyimide resin, a fluorine resin such as Teflon, or the like. As inorganic materials, alumina, aluminum nitride, mullite, SiC, barium titanate,
A glass-ceramic composite material or the like can be used. An organic-inorganic composite system obtained by arbitrarily combining these may be used. As the conductive material, a material suitable for the manufacturing method is selected depending on whether the resin material of the dielectric layer is inorganic or not. In the case of resin, copper, gold, palladium, platinum, silver, nickel,
Rhodium or the like is used. In the case of an inorganic material, silver, gold, palladium, platinum, gold, nickel, rhodium, tungsten, molybdenum, or the like is used.

【００１３】長孔状ビアへの導電材料の充填方法として
は、セラミック基板に形成した貫通孔内に導電ペースト
を充填して焼成する厚膜法、セラミックグリーンシート
に形成した貫通孔内に導電ペーストを充填して、セラミ
ックと導体を同時に焼成するする同時焼成法、プラスチ
ック基板の樹脂絶縁層にフォトリソグラフィやレーザー
加工を用いて形成した貫通孔内に、導電フィラーを含む
樹脂ペーストを印刷充填する印刷法やメッキにより金属
を充填する充填メッキ法等を用いることができる。[0013] As a method of filling a conductive material into a long hole-shaped via, a thick film method in which a conductive paste is filled in a through-hole formed in a ceramic substrate and sintering, a conductive paste is filled in a through-hole formed in a ceramic green sheet. And firing the ceramic and conductor at the same time, printing by filling and filling the resin paste containing conductive filler into the through holes formed by photolithography and laser processing on the resin insulation layer of the plastic substrate For example, a filling plating method of filling a metal by plating or plating can be used.

【００１４】請求項１又は請求項２に記載の長孔状ビア
の短径方向の寸法としては、０．０３〜０．５ｍｍの範
囲が好ましい。０．０３ｍｍ未満では、長孔状ビアホー
ル内に導電材料を均一に充填するのが困難になるからで
ある。また、０．５ｍｍを越えると、長孔状ビアホール
内に充填された導電材料と誘電体材料との熱膨張係数等
の物性値の不一致に起因して、誘電体層と長孔状ビアの
間に隙間を生じたり、長孔状ビア周辺の誘電体層にクラ
ックが発生するからである。かかる物性値の不一致に起
因する不具合をより効果的に低減するために、特には、
０．０３〜０．２５ｍｍの範囲が好ましい。The dimension of the long hole via in the minor diameter direction according to the first or second aspect is preferably in the range of 0.03 to 0.5 mm. If the thickness is less than 0.03 mm, it becomes difficult to uniformly fill the conductive material into the elongated via hole. On the other hand, if the thickness exceeds 0.5 mm, the distance between the dielectric layer and the long-hole-shaped via becomes large due to the inconsistency in physical properties such as the coefficient of thermal expansion between the conductive material and the dielectric material filled in the long-hole-shaped via hole. This is because a gap is formed in the dielectric layer and cracks are generated in the dielectric layer around the elongated via. In order to more effectively reduce the inconvenience caused by the mismatch of the physical property values, in particular,
A range of 0.03 to 0.25 mm is preferred.

【００１５】請求項３の発明は、長孔状ビア導体のアス
ペクト比（長径方向の寸法／短径方向の寸法）が１５０
０以下（但し、１を越える）である伝送線路を有する配
線基板を要旨とし、請求項１又は請求項２に記載の発明
の好ましい構成を例示したものである。かかる高いアス
ペクト比を有する長孔状ビア導体を用いれば、伝送線路
を有効に引き回すことができるため、設計の自由度を大
幅に増大できる。According to a third aspect of the present invention, the aspect ratio (dimension in the major axis direction / dimension in the minor axis direction) of the elongated via conductor is 150.
The gist of the present invention is a wiring board having a transmission line of 0 or less (however, more than 1), and exemplifies a preferred configuration of the invention according to claim 1 or 2. The use of such a long-hole-shaped via conductor having a high aspect ratio makes it possible to effectively route the transmission line, thereby greatly increasing the degree of freedom in design.

【００１６】長孔状ビア導体のアスペクト比の下限値
は、原則的には１を越える範囲であるが、線路として引
き回す実益上、好ましくは２以上、より好ましくは５以
上である。長孔状ビア導体のアスペクト比の上限値は、
長孔状ビアの気密性等の信頼性を確保するために１５０
０以下であることが好ましい。The lower limit of the aspect ratio of the elongated via conductor is, in principle, in a range exceeding 1, but it is preferably 2 or more, more preferably 5 or more, in terms of practical use as a line. The upper limit of the aspect ratio of the long-hole via conductor is
150 to ensure reliability such as airtightness of long hole vias
It is preferably 0 or less.

【００１７】「アスペクト比が１５００以下」というこ
とは、具体例を示すと、「長孔状ビアの短径方向の寸法
が０．０３ｍｍのとき、長径方向の寸法が４５ｍｍ以
下」ということである。長孔状ビアの短径方向の寸法と
しては、前述したように、好ましくは０．０３〜０．５
ｍｍ、より好ましくは０．０３〜０．２５ｍｍの範囲を
選択することができる。The phrase "the aspect ratio is 1500 or less" means, specifically, that "when the dimension of the long hole-shaped via in the minor axis direction is 0.03 mm, the dimension in the major axis direction is 45 mm or less". . As described above, the dimension of the elongated via in the minor axis direction is preferably 0.03 to 0.5.
mm, more preferably in the range of 0.03 to 0.25 mm.

【００１８】請求項４の発明は、長孔状ビア導体のアス
ペクト比（長径方向の寸法／短径方向の寸法）が９００
以下（但し、１を越える）である伝送線路を有する配線
基板を要旨とし、請求項１又は請求項２に記載の発明の
より好ましい構成を例示したものである。かかる高いア
スペクト比を有する長孔状ビア導体を用いれば、伝送線
路を有効に引き回して設計の自由度を大幅に増大できる
とともに、長孔状ビアの気密性等の信頼性をより一層向
上できる。According to a fourth aspect of the present invention, the aspect ratio (dimension in the major axis direction / dimension in the minor axis direction) of the elongated via conductor is 900.
The gist of the present invention is a wiring board having a transmission line that is as follows (however, exceeds 1), and illustrates a more preferable configuration of the invention according to claim 1 or 2. The use of such a long-hole-shaped via conductor having a high aspect ratio can effectively route the transmission line, greatly increase the degree of freedom in design, and further improve the reliability of the long-hole-shaped via, such as airtightness.

【００１９】長孔状ビア導体のアスペクト比の下限値
は、原則的には１を越える範囲であるが、線路として引
き回す実益上、好ましくは２以上、より好ましくは５以
上である。一方、長孔状ビア導体のアスペクト比の上限
値は、長孔状ビアの気密性等の信頼性をより一層高める
ために、９００以下であることが好ましい。The lower limit of the aspect ratio of the elongated via conductor is, in principle, in the range of more than 1, but is preferably 2 or more, more preferably 5 or more for practical use as a line. On the other hand, the upper limit of the aspect ratio of the elongated via conductor is preferably 900 or less in order to further enhance the reliability of the elongated via, such as airtightness.

【００２０】「アスペクト比が９００以下」ということ
は、具体例を示すと、「長孔状ビア導体の短径方向の寸
法が０．０５ｍｍのとき、長径方向の寸法が４５ｍｍ以
下」ということである。長孔状ビア導体の短径方向の寸
法としては、前述したように、好ましくは０．０３〜
０．５ｍｍ、より好ましくは０．０３〜０．２５ｍｍの
範囲を選択することができる。The expression "the aspect ratio is 900 or less" means, specifically, that "when the dimension of the long hole via conductor in the minor axis direction is 0.05 mm, the dimension in the major axis direction is 45 mm or less." is there. As described above, the dimension of the long hole-shaped via conductor in the minor diameter direction is preferably from 0.03 to
A range of 0.5 mm, more preferably 0.03 to 0.25 mm can be selected.

【００２１】請求項５の発明は、前記伝送線路が１以上
の屈曲部を有することを要旨とする。いかに長い長孔状
ビア導体を形成しても、直線状にのみ引き回したので
は、近年の電子機器の小型化、高密度配線化に対応でき
ない。そこで、本発明では、配線基板内に内蔵可能な、
導電材料を充填した長孔状ビア導体を用いた伝送線路を
任意に屈曲させて、配線基板表面の高密度実装を実現し
たものである。According to a fifth aspect of the present invention, the transmission line has at least one bent portion. No matter how long a long via-hole conductor is formed, it is not possible to cope with recent miniaturization and high-density wiring of an electronic device if it is routed only linearly. Therefore, in the present invention, it can be built in the wiring board,
A transmission line using a long-hole via conductor filled with a conductive material is arbitrarily bent to realize high-density mounting on the surface of a wiring board.

【００２２】屈曲部を有する伝送線路の長径寸法は、伝
送線路の幅の中点を通る仮想線の長さで表わされる。す
なわち、屈曲部を有する伝送線路のアスペクト比は、
「前記仮想線の長さ／長孔状ビアの短径方向の寸法」で
表わされる。The major dimension of the transmission line having the bent portion is represented by the length of an imaginary line passing through the midpoint of the width of the transmission line. That is, the aspect ratio of the transmission line having the bent portion is
It is expressed by “the length of the virtual line / the dimension of the long hole-shaped via in the minor axis direction”.

【００２３】屈曲部を有する長孔状ビアホールの形成
は、前述した金型打ち抜き、レーザー加工、フォトリソ
グラフィ等の公知技術を用いて形成可能である。ビアの
水平方向の断面形状が屈曲部を有するように長孔状ビア
ホールを形成すればよい。The formation of the elongated via hole having a bent portion can be performed by using a known technique such as die punching, laser processing, photolithography and the like. The elongated via hole may be formed so that the horizontal cross-sectional shape of the via has a bent portion.

【００２４】金型を用いる場合は、２つ以上の長孔形状
の打ち抜きピンを組み合わせて形成できる。フォトリソ
グラフィやレーザー加工機を用いる場合は、屈曲部を有
するフォトマスクを用いたり、数値制御によりレーザー
光線を走査して屈曲部を有する長孔状ビアホールを形成
すればよい。When a mold is used, it can be formed by combining two or more long-hole punching pins. When photolithography or a laser processing machine is used, a photomask having a bent portion may be used, or a laser beam may be scanned by numerical control to form an elongated via hole having a bent portion.

【００２５】請求項６に記載の発明は、長孔状ビア導体
の長径方向の寸法が４５mm以下（但し、短径方向の寸法
を越える）であるとともに、前記誘電体層がセラミック
ス又はガラス−セラミックス複合材料からなる伝送線路
を有する配線基板を要旨とし、請求項１乃至請求項５に
記載の伝送線路を有する配線基板の好ましい構成をより
具体的に例示したものである。According to a sixth aspect of the present invention, the long hole-shaped via conductor has a dimension in the major axis direction of 45 mm or less (however, exceeds the dimension in the minor axis direction) and the dielectric layer is made of ceramic or glass-ceramic. A gist of the present invention is a wiring board having a transmission line made of a composite material, and more specifically exemplifies a preferable configuration of the wiring board having a transmission line according to any one of claims 1 to 5.

【００２６】長孔状ビア導体の長径方向の寸法を４５mm
以下（但し、短径方向の寸法を越える）に規定した理由
は、誘電体層を形成するこれらセラミックス系材料と導
電材料との熱膨張係数等の物性値の不一致以外にも、焼
成収縮の不一致が問題となるからである。長孔状ビア導
体の長径方向の寸法を４５mm以下（但し、短径方向の寸
法を越える）に規定すれば、焼成収縮の不一致に起因す
る気密性等の信頼性の低下を効果的に防止できる。The dimension of the long hole-shaped via conductor in the major axis direction is 45 mm
The reason specified below (however, exceeding the dimension in the minor axis direction) is that the ceramic material forming the dielectric layer and the conductive material do not have the same physical property values such as the coefficient of thermal expansion, but also the mismatch of the firing shrinkage. Is a problem. If the long dimension of the long via conductor is specified to be 45 mm or less (exceeding the short dimension), it is possible to effectively prevent a reduction in reliability such as airtightness due to mismatching of firing shrinkage. .

【００２７】本発明においても、長孔状ビア導体の短径
方向の寸法としては、前述したように、好ましくは０．
０３〜０．５ｍｍ、より好ましくは０．０３〜０．２５
ｍｍの範囲を選択することができる。In the present invention, as described above, the dimension of the long hole-shaped via conductor in the minor axis direction is preferably set to 0.1 mm.
03-0.5 mm, more preferably 0.03-0.25
The range of mm can be selected.

【００２８】請求項７の発明は、前記導電材料を充填し
てなる２つの長孔状ビア導体は、前記誘電体層とともに
同時焼成により形成される伝送線路を有する配線基板を
要旨とし、請求項６に記載の発明のより好ましい構成を
例示したものである。かかる長孔状ビア導体を誘電体層
と同時焼成よって一体形成することにより、従来の焼成
済み基板への厚膜印刷技術では不可能であった、配線基
板への伝送線路の内蔵が容易に可能となる。According to a seventh aspect of the present invention, the two elongated via conductors filled with the conductive material have a wiring board having a transmission line formed by simultaneous firing together with the dielectric layer. 6 illustrates a more preferred configuration of the invention described in 6. By forming such a long via conductor integrally with the dielectric layer by simultaneous firing, it is possible to easily incorporate the transmission line into the wiring substrate, which was impossible with the conventional thick film printing technology on the fired substrate. Becomes

【００２９】誘電体層としては、アルミナ、窒化アルミ
ニウム、ムライト、ＳｉＣ、チタン酸バリウム、ガラス
−セラミックス複合材料等を用いることができる。ミリ
波のような、更に高い周波数帯では、配線基板の誘電体
損失を下げる事により、伝送損失を押さえれれるため、
アルミナや窒化アルミニウム等のセラミック材料が好ま
しい。ガラス−セラミックス複合材料としては、結晶化
ガラスやホウケイ酸鉛系ガラスにアルミナ等のセラミッ
クス骨材を重量比で４０〜６０％添加した系等を用いる
のが好ましい。As the dielectric layer, alumina, aluminum nitride, mullite, SiC, barium titanate, a glass-ceramic composite material or the like can be used. In higher frequency bands such as millimeter waves, transmission loss can be suppressed by lowering the dielectric loss of the wiring board,
Ceramic materials such as alumina and aluminum nitride are preferred. As the glass-ceramic composite material, it is preferable to use a system obtained by adding 40 to 60% by weight of a ceramic aggregate such as alumina to crystallized glass or lead borosilicate glass.

【００３０】導電材料としては、誘電体層が１０００℃
以下で焼成可能な場合は、銀、金、パラジウム、白金、
金、ニッケル、ロジウム、或いは任意の組み合わせによ
る合金等の金属を用いることができるが、焼成温度が１
０００℃を越える場合は、タングステン、モリブデン等
の高融点金属を用いる。As a conductive material, the dielectric layer has a temperature of 1000 ° C.
If you can bake below, silver, gold, palladium, platinum,
Metals such as gold, nickel, rhodium or alloys of any combination can be used, but the firing temperature is 1
When the temperature exceeds 000 ° C., a high melting point metal such as tungsten or molybdenum is used.

【００３１】[0031]

【実施例】（実施例１）以下に、本発明の伝送線路を有
する配線基板の図面に基づいて説明する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS (Embodiment 1) Hereinafter, a wiring board having a transmission line according to the present invention will be described with reference to the drawings.

【００３２】図１は、請求項１に記載の伝送線路（いわ
ゆる「ストリップライン構造」の伝送線路）を有する配
線基板の一実施例の断面図を示す。図２は、請求項１に
記載の伝送線路を有する配線基板の一実施例の伝送線路
周辺部の横断面図を示す。図３は、請求項１に記載の伝
送線路を有する配線基板の一実施例の伝送線路に設けた
長孔状ビアを示す縦断面図を示す。FIG. 1 is a sectional view of an embodiment of a wiring board having a transmission line according to the first aspect (a transmission line having a so-called "strip line structure"). FIG. 2 is a cross-sectional view of a peripheral portion of a transmission line of an embodiment of the wiring board having the transmission line according to the first aspect. FIG. 3 is a longitudinal sectional view showing a slot-shaped via provided in a transmission line of an embodiment of the wiring board having the transmission line according to the first aspect.

【００３３】図１において、１０は伝送線路を有する配
線基板を示す。図１、図２において、２はストリップ線
路、３及び４はグランド線路、５及び６は長孔状ビアを
示す。本発明にいう「該ストリップ線路（２）を包囲す
るように形成された誘電体層（以下、「伝送線路部誘電
体層」という）」とは、誘電体層１ｃ及び１ｄのうち、
上記３、４、５、６で囲われた部分を示す。In FIG. 1, reference numeral 10 denotes a wiring board having a transmission line. 1 and 2, reference numeral 2 denotes a strip line, 3 and 4 denote ground lines, and 5 and 6 denote elongated vias. The “dielectric layer formed so as to surround the stripline (2)” (hereinafter, referred to as “transmission line part dielectric layer”) in the present invention refers to a dielectric layer among the dielectric layers 1c and 1d.
The portions surrounded by 3, 4, 5, and 6 are shown.

【００３４】２つのクランド線路（３、４）が、伝送線
路部誘電体を上下から挟む形で形成されている。さら
に、一対の長孔状ビア（５、６）が、両グランド線路
（５、６）間を導通接続するとともに、伝送線路部誘電
体を左右から挟む形で形成されている。Two ground lines (3, 4) are formed so as to sandwich the transmission line dielectric from above and below. Further, a pair of elongated vias (5, 6) are formed so as to electrically connect the ground lines (5, 6) and sandwich the transmission line dielectric from the left and right.

【００３５】図３に示すように、この長孔状ビア導体は
壁状に伝送線路の両横を覆っているため、図１３に示す
ような、従来の伝送線路に見られるビア間の隙間が存在
しない。したがって、使用周波数の高低にかかわらず、
伝送線路からの信号の漏洩等の問題を完全に回避でき
る。As shown in FIG. 3, the elongated via conductor covers both sides of the transmission line in a wall shape, so that a gap between vias seen in the conventional transmission line as shown in FIG. not exist. Therefore, regardless of the frequency used,
Problems such as signal leakage from the transmission line can be completely avoided.

【００３６】図９は、請求項２に記載の伝送線路（いわ
ゆる「導波管構造」の伝送線路）を有する配線基板の一
実施例の断面図を示す。図１０は、請求項２に記載の伝
送線路を有する配線基板の一実施例の伝送線路周辺部の
横断面図を示す。図１１は、請求項２に記載の伝送線路
を有する配線基板の一実施例の伝送線路に設けた長孔状
ビアを示す縦断面図を示す。FIG. 9 is a sectional view of an embodiment of a wiring board having a transmission line according to the second aspect (a transmission line having a so-called "waveguide structure"). FIG. 10 is a cross-sectional view of the periphery of the transmission line of one embodiment of the wiring board having the transmission line according to the second aspect. FIG. 11 is a longitudinal sectional view showing a slot-shaped via provided in a transmission line of one embodiment of the wiring board having the transmission line according to the second aspect.

【００３７】図９において、１０は伝送線路を有する配
線基板を示す。図９、図１０において、３及び４はグラ
ンド線路、５及び６は長孔状ビア導体を示す。本発明に
いう「２つのグランド線路（３、４）」に上下から挟ま
れ、かつ、「２つの長孔状ビア導体（５、６）」に左右
から挟めれた誘電体層（以下、「伝送線路部誘電体層」
という）」とは、誘電体層１ｄのうち、上記３、４、
５、６で囲われた部分を示す。In FIG. 9, reference numeral 10 denotes a wiring board having a transmission line. 9 and 10, reference numerals 3 and 4 denote ground lines, and reference numerals 5 and 6 denote elongate via conductors. In the present invention, a dielectric layer (hereinafter, referred to as “two ground lines (3, 4)”) sandwiched from above and below and “two elongated hole-shaped via conductors (5, 6)” sandwiched from left and right. Transmission line dielectric layer ''
“)” Means the above 3, 4, and
The part enclosed by 5 and 6 is shown.

【００３８】２つのクランド線路（３、４）が、伝送線
路部誘電体を上下から挟む形で形成されている。さら
に、一対の長孔状ビア導体（５、６）が、両グランド線
路（５、６）間を導通接続するとともに、伝送線路部誘
電体を左右から挟む形で形成されている。Two ground lines (3, 4) are formed so as to sandwich the transmission line dielectric from above and below. Further, a pair of elongated via conductors (5, 6) are formed so as to electrically connect the ground lines (5, 6) and sandwich the transmission line dielectric from the left and right.

【００３９】図１１に示すように、この長孔状ビア導体
は壁状に伝送線路の両横を覆っているため、図１３に示
すような、従来の伝送線路に見られるビア間の隙間が存
在しない。したがって、使用周波数の高低にかかわら
ず、伝送線路からの信号の漏洩等の問題を完全に回避で
きる。As shown in FIG. 11, since the elongated via conductor covers both sides of the transmission line in a wall shape, a gap between vias seen in the conventional transmission line as shown in FIG. not exist. Therefore, it is possible to completely avoid problems such as signal leakage from the transmission line irrespective of the use frequency.

【００４０】また、長孔状ビアホール内には導電材料が
充填されているため、セラミックス系基板においては、
長孔状ビア導体の真上に同時焼成あるいは印刷多層によ
り誘電体層を形成して、伝送線路を配線基板内部に内蔵
できる。もちろん、樹脂製基板においても、長孔状ビア
導体の真上に絶縁層をビルドアップあるいはラミネート
して、同様に伝送線路を配線基板内部に内蔵できる。伝
送線路を配線基板内部に内蔵することで、配線基板の表
面実装密度を向上できる。In addition, since the conductive material is filled in the elongated via hole, in the case of a ceramic substrate,
By forming a dielectric layer by simultaneous firing or printed multilayer just above the long-hole via conductor, the transmission line can be built in the wiring board. Needless to say, even in the case of a resin substrate, a transmission line can be similarly built in the wiring substrate by building up or laminating an insulating layer directly above the long via conductor. By incorporating the transmission line inside the wiring board, the surface mounting density of the wiring board can be improved.

【００４１】図４〜図８は、請求項１にかかる請求項３
の製造方法を示すものであり、伝送線路にかかる部分の
みを取り上げたものである。誘電体層（１ｃ、１ｄ）に
長孔状に開けられた貫通孔（５０）に導体ペーストを充
填し、長孔状ビア導体（５、６）を形成する。スクリー
ン印刷法によりストリップ線路（２）、グランド線路
（３、４）を形成した後、積層圧着する。この積層グリ
ーン体を焼成して、伝送線路を有する配線基板１０を得
る。FIGS. 4 to 8 show a third aspect of the present invention.
And shows only a part related to the transmission line. The through holes (50) formed in the dielectric layers (1c, 1d) in a long hole shape are filled with a conductive paste to form long hole via conductors (5, 6). After the strip line (2) and the ground lines (3, 4) are formed by screen printing, they are laminated and pressed. The laminated green body is fired to obtain a wiring substrate 10 having a transmission line.

【００４２】積層した誘電体基板１には、公知の材料を
用いることができる。例えば、アルミナ、窒化アルミニ
ウム、チタン酸バリウム等のセラミックス材料や、セラ
ミックスとガラスの複合材料（いわゆるガラスセラミッ
クス材料）、または、ガラス−エポキシ複合材料（例；
ＦＲ−４）、ガラス−ＢＴ（ビスマレイミド−トリアジ
ン）複合材料、フッ素系樹脂材料（延伸多孔質ＰＴＦＥ
系材料）等の樹脂系材料を用いることができる。Known materials can be used for the laminated dielectric substrate 1. For example, a ceramic material such as alumina, aluminum nitride, barium titanate, a composite material of ceramic and glass (a so-called glass ceramic material), or a glass-epoxy composite material (eg;
FR-4), glass-BT (bismaleimide-triazine) composite material, fluororesin material (stretched porous PTFE)
Resin-based material such as a resin-based material.

【００４３】配線基板の導通抵抗を下げて伝送損失を抑
えるには、導通抵抗の小さい銅系（銅単体、銅−金属酸
化物、銅−パラジウム、銅−白金、銅−ロジウム等）配
線を使用可能な樹脂系材料や還元雰囲気での焼成が可能
な系のガラス−セラミックス材料を用いるのが好まし
い。ミリ波のような、更に高い周波数帯では、配線基板
の誘電体損失を下げる事により、伝送損失を押さえれれ
るため、アルミナや窒化アルミニウム等のセラミック材
料が好ましい。In order to suppress the transmission loss by lowering the conduction resistance of the wiring board, use a copper (copper simple substance, copper-metal oxide, copper-palladium, copper-platinum, copper-rhodium, etc.) wiring having a small conduction resistance. It is preferable to use a resin-based material that can be used or a glass-ceramic material that can be fired in a reducing atmosphere. In a higher frequency band such as a millimeter wave, transmission loss can be suppressed by lowering the dielectric loss of the wiring board, and therefore a ceramic material such as alumina or aluminum nitride is preferable.

【００４４】配線基板の導通抵抗を下げて伝送損失を抑
えるとともに、配線基板を安価に製造するには、酸化雰
囲気で焼成可能な系のガラス−セラミックス材料と銀系
（銀単体、銀−金属酸化物、銀−パラジウム、銀−白
金、銀−ロジウム等）配線を組み合わるのが好ましい。
例えば、銀系配線との同時焼結性に優れる鉛含有ガラス
−セラミックス材料を用いるのが好ましい。特には、ホ
ウケイ酸鉛系ガラスにアルミナ等のセラミックスを４０
〜６０重量部添加した系が同時焼結性が良好で好まし
い。前述した長孔状ビア導体周辺の不具合を効果的に防
止できるからである。In order to reduce the transmission loss by reducing the conduction resistance of the wiring board and to manufacture the wiring board at low cost, a glass-ceramic material which can be fired in an oxidizing atmosphere and a silver-based material (silver alone, silver-metal oxide) can be used. , Silver-palladium, silver-platinum, silver-rhodium, etc.) wiring.
For example, it is preferable to use a lead-containing glass-ceramic material having excellent co-sinterability with silver-based wiring. In particular, ceramics such as alumina are used in a lead borosilicate glass.
A system in which ６０60 parts by weight is added is preferable because the simultaneous sinterability is good. This is because it is possible to effectively prevent the above-described problem around the elongated via conductor.

【００４５】伝送線路を構成する導体（２、３、４、
５、６）には、公知の材料を用いることができる。誘電
体にアルミナや窒化アルミニウムを用いる場合には、モ
リブデン、タングステン等の高融点材料を用いることが
できる。誘電体にガラス−セラミックス材料を用いる場
合には、銀系（銀単体、銀−金属酸化物（マンガン、バ
ナジウム、ビスマス、アルミニウム、ケイ素、銅等の酸
化物）、銀−ガラス添加、銀−パラジウム、銀−白金、
銀−ロジウム等）、金系（金単体、金−金属酸化物、金
−パラジウム、金−白金、金−ロジウム等）、銅系（銅
単体、銅−金属酸化物、銅−パラジウム、銅−白金、銅
−ロジウム等）等の低抵抗材料を用いることができる。
誘電体に樹脂系材料を用いる場合は、銅等の低抵抗材料
を用いることができる。The conductors (2, 3, 4,
For 5 and 6), known materials can be used. When alumina or aluminum nitride is used for the dielectric, a high melting point material such as molybdenum or tungsten can be used. When a glass-ceramic material is used for the dielectric, silver (silver alone, silver-metal oxide (oxide of manganese, vanadium, bismuth, aluminum, silicon, copper, etc.)), silver-glass addition, silver-palladium , Silver-platinum,
Silver-rhodium, etc., gold-based (gold alone, gold-metal oxide, gold-palladium, gold-platinum, gold-rhodium, etc.), copper-based (copper alone, copper-metal oxide, copper-palladium, copper- Low-resistance materials such as platinum and copper-rhodium can be used.
When a resin material is used for the dielectric, a low-resistance material such as copper can be used.

【００４６】必要に応じて、伝送線路を構成する導体
（２、３、４、５、６）ごとに材料を変えて組み合わせ
てもよい。伝送線路以外の内部配線導体やビア導体につ
いても同様に、上記の材料を用いることができる。If necessary, the conductors (2, 3, 4, 5, 6) constituting the transmission line may be combined with different materials. The above-mentioned materials can also be used for internal wiring conductors and via conductors other than transmission lines.

【００４７】以上のような構成に基づいて形成した伝送
線路を有する配線基板は、広範囲の使用周波数において
も、信号の漏洩等の問題が無いため、種々の用途（ＭＨ
ｚ帯〜ミリ波帯）に適用可能である。A wiring board having a transmission line formed based on the above configuration has no problem such as signal leakage even in a wide range of operating frequencies.
(Z band to millimeter wave band).

【００４８】（実施例２）以下に、本発明の伝送線路を
有する配線基板を、具体的な一実施例を上げて説明す
る。ここでは、伝送線路を主体とする部分について配線
基板の作製を行い、長孔状ビア周辺の不具合の有無を評
価する。(Embodiment 2) Hereinafter, a wiring board having a transmission line according to the present invention will be described with reference to a specific embodiment. Here, a wiring board is manufactured for a portion mainly including the transmission line, and the presence or absence of a defect around the elongated via is evaluated.

【００４９】（１）セラミックスグリーンシートの作製 アルミナ粉末１００重量部に対して、バインダ成分とし
てアクリル系の樹脂を１０重量部、可塑剤としてジブチ
ルフタレートを５重量部、さらに有機溶剤としてメチル
エチルケトンを適量添加して混合し、スラリーにした
後、ドクターブレード法によりグリーンシート（厚み
０．３ｍｍ）を作製する。(1) Preparation of Ceramic Green Sheet For 100 parts by weight of alumina powder, 10 parts by weight of an acrylic resin as a binder component, 5 parts by weight of dibutyl phthalate as a plasticizer, and an appropriate amount of methyl ethyl ketone as an organic solvent were added. After mixing to form a slurry, a green sheet (thickness: 0.3 mm) is prepared by a doctor blade method.

【００５０】（２）配線用導体ペーストの作製 タングステン粉末１００重量部に対して、アルミナを５
重量部添加し、これに有機バインダとしてエチルセルロ
ース及び溶剤としてブチルカルビトールを粘度が１００
０ポイズになるように適量添加し、３本ロールミルにて
混合することにより調製する。(2) Preparation of conductor paste for wiring Alumina was added to 100 parts by weight of tungsten powder.
Parts by weight of ethyl cellulose as an organic binder and butyl carbitol as a solvent having a viscosity of 100 parts by weight.
It is prepared by adding an appropriate amount to 0 poise and mixing with a three-roll mill.

【００５１】（３）ビア用導体ペーストの作製 タングステン粉末１００重量部に対して、有機バインダ
としてエチルセルロース及び溶剤としてブチルカルビト
ールを粘度が１０万ポイズになるように適量添加し、ボ
ールミルにて混合することにより調製する。(3) Preparation of Via Conductor Paste To 100 parts by weight of tungsten powder, an appropriate amount of ethyl cellulose as an organic binder and butyl carbitol as a solvent are added so as to have a viscosity of 100,000 poise and mixed by a ball mill. Prepared.

【００５２】（４）伝送線路を有する配線基板の作製 図４に示すように、セラミックスグリーンシートに金型
を用いて所定の位置に伝送線路用長孔状ビアホールとを
開ける。長孔状ビアホールの形状は、以下の３種類とす
る。図４のように直線状に開けたものを「直線状」、直
角にくの字に１回曲げたものを「直角曲げ」、直角にク
ランク状に２回曲げたものを「クランク」とする。長孔
状ビアホールの寸法は焼成後の寸法で表１に示す大きさ
になるように設定する。すなわち、焼成収縮率を加味し
て、設定寸法（焼結体での寸法）の１．２倍の大きさに
開けられる。(4) Preparation of Wiring Board Having Transmission Line As shown in FIG. 4, a long hole-shaped via hole for a transmission line is opened at a predetermined position in a ceramic green sheet using a mold. The shape of the elongated via hole is the following three types. As shown in FIG. 4, a straight-open shape is called “straight”, a right-angled bent is formed as a “right-angle bent”, and a right-angle bent twice is formed as a “crank”. . The dimensions of the elongated via holes are set so as to be the dimensions shown in Table 1 after firing. That is, the size is set to 1.2 times the set dimension (dimension in the sintered body) in consideration of the firing shrinkage.

【００５３】図５に示すように、上記セラミックスグリ
ーンシートに形成した伝送線路用長孔状ビアホール内
に、充填機を用いてビア用導体ペーストを圧入する。次
いで、図７に示すように、配線用導体ペーストを用いて
ストリップ線路導体をスクリーン印刷法により形成す
る。尚、本実施例では、ストリップ線路導体のみを形成
し、グランド線路導体は形成しない。長孔状ビア自体の
気密性を評価する関係上、充填長孔状ビアを表面に露出
させる必要があるからである。As shown in FIG. 5, a conductive paste for via is pressed into a long via hole for transmission line formed in the ceramic green sheet by using a filling machine. Next, as shown in FIG. 7, a strip line conductor is formed by screen printing using a wiring conductor paste. In this embodiment, only the strip line conductor is formed, and the ground line conductor is not formed. This is because it is necessary to expose the filled elongated via to the surface in order to evaluate the airtightness of the elongated via itself.

【００５４】その後、各誘電体層（１ｃ、１ｄ）を積層
圧着する。次いで、同時焼成を行い、伝送線路を有する
配線基板の形成を完成する。Thereafter, the respective dielectric layers (1c, 1d) are laminated and pressed. Next, simultaneous firing is performed to complete the formation of the wiring substrate having the transmission line.

【００５５】リーク試験 気密性を評価するための基板は、長孔状ビア導体部分の
気密性を確認するため、上記（４）で作製した基板で評
価する。得られた配線基板の長孔状ビア導体と誘電体層
との間に不具合が発生しているか否かを、ＭＩＬ−ＳＴ
Ｄ−８８３ＣＭｅｔｈｏｄ １０１４の方法に準ずるリ
ーク試験により確認する。結果が、１×１０−8atm cc
／sec.以下のものを「○」、１×１０−8atm cc／sec.
を越え、かつ、１×１０−6atm cc／sec.以下のものを
「△」、１×１０−6atm cc／sec.を越えるものを
「×」とする。結果を表１に示す。Leak test The substrate for evaluating the airtightness is evaluated using the substrate prepared in the above (4) in order to confirm the airtightness of the elongated via conductor portion. The MIL-ST was used to determine whether or not a defect occurred between the obtained long-hole via conductor of the wiring board and the dielectric layer.
It is confirmed by a leak test according to the method of D-883 CMethod 1014. The result is 1 × 10 −8 atm cc
/ Sec. Or less, "○", 1 × 10 -8 atm cc / sec.
Over 1 × 10 −6 atm cc / sec. And below, and “×” over 1 × 10 −6 atm cc / sec. Table 1 shows the results.

【００５６】[0056]

【表１】 [Table 1]

【００５７】表１の結果より、リーク試験結果が「×」
である試料番号３を除いて、良好な結果が得られること
がわかる。伝送線路の長さが４５ｍｍを越える試料番号
８、試料番号１３、試料番号２１の結果をみると、若干
気密性が低下することがわかる。これは誘電体層と導電
材料との同時焼成時の焼成収縮差が影響しているものと
推察される。From the results shown in Table 1, the result of the leak test is “×”.
It can be seen that good results were obtained except for sample No. 3 which was. Looking at the results of Sample Nos. 8, 13, and 21 in which the length of the transmission line exceeds 45 mm, it can be seen that the hermeticity is slightly reduced. This is presumably due to the difference in firing shrinkage during simultaneous firing of the dielectric layer and the conductive material.

【００５８】本実施例では、セラミックスグリーン体の
同時焼成技術を例示しているが、感光性厚膜技術を用い
た印刷多層によっても同様の長孔状ビア導体が得られ
る。また、感光性エポキシ樹脂を誘電体層に用いたビル
ドアップ配線基板にも適用可能である。In the present embodiment, the simultaneous firing technique of the ceramic green body is exemplified. However, a similar long-hole via conductor can be obtained by printing multiple layers using a photosensitive thick film technique. Further, the present invention can be applied to a build-up wiring board using a photosensitive epoxy resin for a dielectric layer.

【００５９】[0059]

【発明の効果】本発明によれば、伝送線路からの信号や
ノイズの漏れを効果的に防止するとともに、伝送線路近
傍の気密性の低下を防止した信頼性の高い伝送線路を有
する配線基板を提供することができる。また、伝送線路
を多層技術を用いて基板内部に内蔵できるため、従来よ
りも表面実装密度を高めることができる。According to the present invention, there is provided a wiring board having a highly reliable transmission line, which effectively prevents leakage of signals and noise from the transmission line and prevents a decrease in airtightness near the transmission line. Can be provided. Further, since the transmission line can be built in the substrate by using the multilayer technology, the surface mounting density can be increased as compared with the related art.

【図面の簡単な説明】[Brief description of the drawings]

【図１】請求項１に記載の伝送線路を有する配線基板の
一実施例の断面図。FIG. 1 is a cross-sectional view of one embodiment of a wiring board having a transmission line according to claim 1.

【図２】請求項１に記載の伝送線路を有する配線基板の
一実施例の伝送線路周辺部の横断面図。FIG. 2 is a cross-sectional view of the periphery of the transmission line in one embodiment of the wiring board having the transmission line according to claim 1;

【図３】請求項１に記載の伝送線路を有する配線基板の
一実施例の伝送線路に設けた長孔状ビアを示す縦断面
図。FIG. 3 is a longitudinal sectional view showing an elongated via provided in the transmission line of one embodiment of the wiring board having the transmission line according to claim 1;

【図４】請求項１に記載の伝送線路を有する配線基板の
製造方法の説明図。FIG. 4 is an explanatory view of a method for manufacturing a wiring board having the transmission line according to claim 1.

【図５】請求項１に記載の伝送線路を有する配線基板の
製造方法の説明図。FIG. 5 is an explanatory view of a method for manufacturing a wiring board having the transmission line according to claim 1.

【図６】請求項１に記載の伝送線路を有する配線基板の
製造方法の説明図。FIG. 6 is an explanatory diagram of a method for manufacturing a wiring board having the transmission line according to claim 1.

【図７】請求項１に記載の伝送線路を有する配線基板の
製造方法の説明図。FIG. 7 is an explanatory diagram of a method for manufacturing a wiring board having the transmission line according to claim 1.

【図８】請求項１に記載の伝送線路を有する配線基板の
製造方法の説明図。FIG. 8 is an explanatory diagram of a method for manufacturing a wiring board having the transmission line according to claim 1.

【図９】請求項２に記載の伝送線路を有する配線基板の
一実施例の断面図。FIG. 9 is a sectional view of an embodiment of a wiring board having the transmission line according to claim 2;

【図１０】請求項２に記載の伝送線路を有する配線基板
の一実施例の伝送線路周辺部の横断面図。FIG. 10 is a cross-sectional view of the periphery of the transmission line in one embodiment of the wiring board having the transmission line according to claim 2.

【図１１】請求項２に記載の伝送線路を有する配線基板
の一実施例の伝送線路に設けた長孔状ビアを示す縦断面
図。FIG. 11 is a longitudinal sectional view showing an elongated via provided in a transmission line of one embodiment of a wiring board having the transmission line according to claim 2;

【図１２】従来の伝送線路を有する配線基板の伝送線路
に設けたビア群を示す縦断面図。FIG. 12 is a longitudinal sectional view showing a via group provided in a transmission line of a wiring board having a conventional transmission line.

【符号の説明】[Explanation of symbols]

１ 積層した誘電体基板 １ａ〜１ｆ 誘電体層 １０ 伝送線路を有する配線基板 ２ ストリップ線路 ３、４ グランド線路 ５、６ 長孔状ビア導体 ５０ 長孔状ビアホール ６０ ビア群 ６０ａ〜６０ｄ ビア群を構成するビア導体 ７ 内部配線導体 ８ ビア導体 ９ 素子 REFERENCE SIGNS LIST 1 laminated dielectric substrate 1 a to 1 f dielectric layer 10 wiring substrate having transmission line 2 strip line 3, 4 ground line 5, 6 long via conductor 50 long via hole 60 via group 60 a to 60 d Via group Via conductor 7 Internal wiring conductor 8 Via conductor 9 Element

フロントページの続き Ｆターム(参考） 5E346 AA13 AA15 AA33 AA35 AA43 BB02 BB03 BB04 BB06 BB11 BB15 CC17 CC18 CC21 CC32 CC39 DD07 DD34 EE24 FF18 GG05 GG06 GG09 HH04 5J014 BA04 CA08 CA23 CA32 CA43 CA57 DA02 Continued on front page F term (reference) 5E346 AA13 AA15 AA33 AA35 AA43 BB02 BB03 BB04 BB06 BB11 BB15 CC17 CC18 CC21 CC32 CC39 DD07 DD34 EE24 FF18 GG05 GG06 GG09 HH04 5J014 BA04 CA08 CA23 CA32 CA43 CA57 DA02

Claims (7)

【特許請求の範囲】[Claims] 【請求項１】 ストリップ線路と、グランド線路と、長
孔状ビア導体と、誘電体層とを少なくとも有する配線基
板であって、 ストリップ線路と、 該ストリップ線路を包囲するように形成された誘電体層
と、 該誘電体層を上下から挟むように形成された２つのグラ
ンド線路と、 該両グランド線路間を導通接続するとともに、前記誘電
体層を左右から挟むように形成された、導電材料を充填
してなる２つの長孔状ビア導体とからなる伝送線路を形
成したことを特徴とする伝送線路を有する配線基板。1. A wiring board having at least a strip line, a ground line, a long via conductor, and a dielectric layer, wherein the strip line and a dielectric formed so as to surround the strip line. A layer, two ground lines formed so as to sandwich the dielectric layer from above and below, and a conductive material formed so as to electrically connect the two ground lines and to sandwich the dielectric layer from left and right. A wiring board having a transmission line, wherein a transmission line including two filled via-hole-shaped via conductors is formed. 【請求項２】 グランド線路と、長孔状ビア導体と、誘
電体層とを少なくとも有する配線基板であって、 誘電体層を上下から挟むように形成された２つのグラン
ド線路と、 該両グランド線路間を導通接続するとともに、前記誘電
体層を左右から挟むように形成された、導電材料を充填
してなる２つの長孔状ビア導体とからなる伝送線路を形
成したことを特徴とする伝送線路を有する配線基板。2. A wiring board having at least a ground line, a long via conductor, and a dielectric layer, wherein the two ground lines are formed so as to sandwich the dielectric layer from above and below, and both ground lines are provided. A transmission line formed by two conductive via-filled elongated via conductors formed so as to electrically connect the lines and sandwich the dielectric layer from the left and right. A wiring board having a line. 【請求項３】 前記長孔状ビア導体のアスペクト比（長
径方向の寸法／短径方向の寸法）が１５００以下（但
し、１を越える）であることを特徴とする請求項１又は
請求項２のいずれかに記載の伝送線路を有する配線基
板。3. The method according to claim 1, wherein an aspect ratio (dimension in a major axis direction / dimension in a minor axis direction) of the elongated via conductor is 1500 or less (however, exceeds 1). A wiring board having the transmission line according to any one of the above. 【請求項４】 前記長孔状ビア導体のアスペクト比（長
径方向の寸法／短径方向の寸法）が９００以下（但し、
１を越える）であることを特徴とする請求項１又は請求
項２のいずれかに記載の伝送線路を有する配線基板。4. An aspect ratio (dimension in a major axis direction / dimension in a minor axis direction) of the long hole-shaped via conductor is 900 or less (however,
3. The wiring board having a transmission line according to claim 1, wherein the transmission line is more than 1). 【請求項５】 前記伝送線路が１以上の屈曲部を有する
ことを特徴とする請求項１乃至請求項４のいずれかに記
載の伝送線路を有する配線基板。但し、前記長孔状ビア
導体のアスペクト比は、屈曲部を有する伝送線路のアス
ペクト比（伝送線路の幅の中点を通る仮想線の長さ／長
孔状ビアの短径方向の寸法）で表わすものとする。5. The wiring board having a transmission line according to claim 1, wherein the transmission line has one or more bent portions. However, the aspect ratio of the elongated via conductor is the aspect ratio of the transmission line having the bent portion (the length of the virtual line passing through the midpoint of the width of the transmission line / the dimension in the minor axis direction of the elongated via). Shall be expressed. 【請求項６】 前記長孔状ビア導体の長径方向の寸法が
４５mm以下（但し、短径方向の寸法を越える）であると
ともに、前記誘電体層がセラミックス又はガラス−セラ
ミックス複合材料からなることを特徴とする請求項１乃
至請求項５のいずれかに記載の伝送線路を有する配線基
板。6. The method according to claim 1, wherein a dimension of the long via conductor in the major axis direction is 45 mm or less (however, exceeds a dimension in the minor axis direction), and the dielectric layer is made of ceramics or a glass-ceramic composite material. A wiring board having the transmission line according to claim 1. 【請求項７】 前記導電材料を充填してなる２つの長孔
状ビア導体は、前記誘電体層とともに同時焼成により形
成されることを特徴とする請求項６に記載の伝送線路を
有する配線基板。7. The wiring board having a transmission line according to claim 6, wherein the two elongated via conductors filled with the conductive material are formed by simultaneous firing together with the dielectric layer. .
JP11184015A 1999-06-29 1999-06-29 Wiring board having transmission line Pending JP2001016007A (en)

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JP11184015A JP2001016007A (en) 1999-06-29 1999-06-29 Wiring board having transmission line

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Publication Number Publication Date
JP2001016007A true JP2001016007A (en) 2001-01-19

Family

ID=16145855

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Application Number Title Priority Date Filing Date
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WO2014003089A1 (en) * 2012-06-29 2014-01-03 株式会社村田製作所 Flat bracket and electronic device
WO2014003088A1 (en) * 2012-06-29 2014-01-03 株式会社村田製作所 Flat cable
JP5518086B2 (en) * 2009-09-29 2014-06-11 京セラ株式会社 Device storage package and mounting structure
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