JP2001015764A5 - - Google Patents
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- JP2001015764A5 JP2001015764A5 JP2000130314A JP2000130314A JP2001015764A5 JP 2001015764 A5 JP2001015764 A5 JP 2001015764A5 JP 2000130314 A JP2000130314 A JP 2000130314A JP 2000130314 A JP2000130314 A JP 2000130314A JP 2001015764 A5 JP2001015764 A5 JP 2001015764A5
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Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000130314A JP4463377B2 (ja) | 1999-04-30 | 2000-04-28 | 半導体装置およびその作製方法 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12539299 | 1999-04-30 | ||
| JP11-125392 | 1999-04-30 | ||
| JP2000130314A JP4463377B2 (ja) | 1999-04-30 | 2000-04-28 | 半導体装置およびその作製方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2001015764A JP2001015764A (ja) | 2001-01-19 |
| JP2001015764A5 true JP2001015764A5 (hu) | 2006-04-27 |
| JP4463377B2 JP4463377B2 (ja) | 2010-05-19 |
Family
ID=26461843
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000130314A Expired - Fee Related JP4463377B2 (ja) | 1999-04-30 | 2000-04-28 | 半導体装置およびその作製方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4463377B2 (hu) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4493779B2 (ja) * | 2000-01-31 | 2010-06-30 | 株式会社半導体エネルギー研究所 | 半導体装置およびその作製方法 |
| JP2001250956A (ja) | 2000-03-08 | 2001-09-14 | Semiconductor Energy Lab Co Ltd | 半導体装置 |
| JP2002231628A (ja) * | 2001-02-01 | 2002-08-16 | Sony Corp | 半導体薄膜の形成方法及び半導体装置の製造方法、これらの方法の実施に使用する装置、並びに電気光学装置 |
| KR100400753B1 (ko) * | 2001-10-19 | 2003-10-08 | 엘지전자 주식회사 | 금속기판을 이용한 고온 다결정 실리콘 박막트랜지스터제조 방법 |
| US7973313B2 (en) * | 2003-02-24 | 2011-07-05 | Semiconductor Energy Laboratory Co., Ltd. | Thin film integrated circuit device, IC label, container comprising the thin film integrated circuit, manufacturing method of the thin film integrated circuit device, manufacturing method of the container, and management method of product having the container |
| US11482607B2 (en) * | 2018-12-05 | 2022-10-25 | Mitsubishi Electric Corporation | Semiconductor device and method for manufacturing semiconductor device |
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2000
- 2000-04-28 JP JP2000130314A patent/JP4463377B2/ja not_active Expired - Fee Related