JP2001015554A - Component mounting structure for board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To implement a structure wherein capillary phenomenon is improved by providing particularly a portion, where no bumps of components and lands of a board are formed, with dummy projections or the like equivalent to the bumps of the components in order to prevent the occurrence of air bubbles and uneven filling of an insulating resin when portions for soldering the components and the board are filled with the insulating resin. SOLUTION: This component mounting structure is such that a board 3 has a land mounting region where a plurality of lands 4 are provided for electrical connection with a plurality of bumps 2 of a component 1. A land non- mounted region 50 other than the land mounting region, where lands 4 are not provided, is provided with a silk-screened film equivalent to the lands 4, whereby a clearance between a CSP(chip size package) 1 and the board 3 is filled with an insulating resin 7 satisfactorily.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate for mounting an electronic component on a substrate, and more particularly to a substrate capable of preventing uneven filling of an insulating resin filled in a soldering portion between the substrate and the electronic component for reinforcement. Related to a component mounting structure.

[0002]

2. Description of the Related Art FIGS. 13A and 13B show a conventional CSP mounted on a substrate, wherein FIG. 13A is a sectional view, FIG.
(C) is a perspective view from the top of the CSP.

[0003] CSP (CHIP SIZE PACKA)
GE) 1 is a surface-mounted component made of a semiconductor element or the like, and a plurality of bumps 2
1 are arranged in an area excluding the central portion 50. The substrate 3 has a land mounting area in which a plurality of lands 4 electrically connected to the bumps 2 of the CSP 1 are provided, and a land corresponding to the central portion 51 where the bumps 2 are not provided is provided in a land. 4 has a land unmounted area 50 where no land 4 is provided.

A conventional mounting structure of the CSP 1 on the substrate 3 is as follows.
A solder paste 5 is printed on the land 4 of the substrate 3, the bump 2 of the CSP 1 is placed on the solder paste 5, and the solder paste 5 is melted by heating by reflow, and the bump 2 is soldered to the land 4. The CSP1 is mounted on the substrate 3 by the
The insulating resin 7 for reinforcement is injected into the soldered portion using the injector 6 and filled by capillary action. By filling the insulating resin 7, the CSP 1
The breakage of the soldered portion due to the thermal stress due to the difference in the coefficient of thermal expansion between the substrate and the substrate 3, the stress due to vibration, and the like is prevented.

When the insulating resin 7 is filled by injection from all directions, there is no way for air to escape.
Since it may remain as a void (bubble), FIG.
(A) As shown in FIG.
This is performed using Then, in the filling by the conventional structure, as shown in FIG. 13C, the insulating resin 7 diffuses while flowing in the direction indicated by the arrow A due to the capillary phenomenon, but the bump 2 of the CSP 1 and the land of the substrate 3 The regions 50 and 51 where the substrate 4 is not disposed are the gap T between the CSP 1 and the substrate 3.
1 is large and the effect of the capillary phenomenon is low, so that the flow of the insulating resin 7 is slow. For this reason, there is a problem that the generation of bubbles, uneven filling, and the like are likely to occur, and the time required to reach the entire back surface of the CSP 1 becomes long.

[0006]

As described above, in the conventional mounting structure of the CSP on the board, the bump of the CSP and the land of the board are filled with the insulating resin in the soldering portion between the CSP and the board. The flow rate of the insulating resin into the areas where it is not provided is slow, causing bubbles and uneven filling.
Insulation resistance failure etc. caused by severe external ambient conditions,
There was a risk of abnormal characteristics and burning of the substrate. The present invention solves these problems by providing a dummy protrusion or the like equivalent to a CSP bump in an area where a CSP bump and a land of a substrate are not provided, thereby improving a capillary phenomenon and improving insulation. It is an object of the present invention to realize a structure in which the inflow of a conductive resin is improved.

[0007]

In order to achieve the above-mentioned object, the present invention provides a component mounting structure of a substrate in which components are mounted on a substrate via a plurality of bumps.
A land mounting area provided with a plurality of lands electrically connected to the plurality of bumps, and a non-land mounting area where the land is not provided other than the land mounting area corresponds to the land. It is characterized by being subjected to silk printing.

In a component mounting structure of a substrate in which components are mounted on a substrate via a plurality of bumps, the substrate is provided with a plurality of lands electrically connected to the plurality of bumps. In a land unmounted area having an area and the land not provided other than the land mounting area, silk printing is performed in a stepwise manner within a gap between the substrate and the component. It is a feature.

Further, in the component mounting structure of a substrate in which components are mounted on a substrate via a plurality of bumps, the component has a bump mounting area provided with the plurality of bumps on a surface facing the substrate. A plurality of lands that are electrically connected to the plurality of bumps are provided on the substrate, and further, in a non-bump-mounted area other than the bump-mounted area of the component, in which no bump is provided, A protruding portion made of an insulating resin material is formed in a range of a gap between the substrate and the component.

Also, in the component mounting structure of a substrate in which components are mounted on a substrate via a plurality of bumps, the component has a bump mounting area provided with the plurality of bumps on a surface facing the substrate. A plurality of lands electrically connected to the plurality of bumps are provided on the substrate, and furthermore, in a bump actual unmounted area where the bump is not provided other than the bump mounting area of the component, A dummy bump smaller than the diameter of the bump is provided.

Further, in the component mounting structure of a substrate in which components are mounted on a substrate via a plurality of bumps, the substrate has a land provided with a plurality of lands electrically connected to the plurality of bumps. It has a mounting area, and a via hole is provided between each land in the land mounting area.

Further, in the component mounting structure of a substrate in which components are mounted on a substrate via a plurality of bumps, the substrate includes a land provided with a plurality of lands electrically connected to the plurality of bumps. A through-hole is provided in a land-unmounted area other than the land mounting area where the land is not provided except for the land mounting area.

[0013] Further, the substrate is further subjected to silk printing so as to surround the through hole.

In a component mounting structure of a substrate in which components are mounted on a substrate via a plurality of bumps, the substrate includes a land provided with a plurality of lands electrically connected to the plurality of bumps. A through-hole is provided in a land-unmounted area having a mounting area and the land is not provided except for the land mounting area, and the substrate is provided with a gap between the through-hole and the land mounting area. It is characterized in that silk printing is performed in a shape divided into a plurality of pieces radially outward from the through hole.

Further, in the component mounting structure of a substrate in which components are mounted on a substrate via a plurality of bumps, the component has a bump mounting area provided with the plurality of bumps on a surface facing the substrate. A plurality of lands electrically connected to the plurality of bumps are provided on the substrate, and a non-bump mounted area other than the bump mounting area of the component is provided with the bump, A protrusion is formed of an insulating resin whose height is smaller than the diameter of the bump.

In a component mounting structure of a substrate in which components are mounted on a substrate via a plurality of bumps, the substrate includes a land provided with a plurality of lands electrically connected to the plurality of bumps. In a land unmounted area having a mounting area and not provided with the land other than the land mounting area, a protrusion made of a thermosetting resin is formed in a range of a gap between the board and the component. It is characterized by becoming.

Further, in the component mounting structure of a substrate in which components are mounted on a substrate via a plurality of bumps, the substrate includes a land provided with a plurality of lands electrically connected to the plurality of bumps. A dummy land is disposed in a land unmounted area having a mounting area and no land other than the land mounting area, and a solder paste is printed on the land and the dummy land. It is characterized by the following.

[0018]

Embodiments of the present invention will be described with reference to the drawings.

FIG. 1 is a view showing a CSP mounting structure of a substrate according to a first embodiment of the present invention, wherein FIG.
(B) is a plan view, and (c) is a perspective view from the top of the CSP.

The same components from the first embodiment to the twelfth embodiment are described in the first embodiment, and the description is omitted in the other embodiments.

The assembly of the mounting structure of the CSP 1 on the substrate 3 is as follows.
The solder paste 5 is printed on the land 4 of the substrate 3, the bump 2 of the CSP 1 is placed on the solder paste 5, the solder paste 5 is melted by reflow heating, and the bump 2 is soldered to the land 4. The CSP 1 is mounted on the board 3. Next, an insulating resin 7 for reinforcement is injected into the soldering portion, which is a gap T1 between the CSP 1 and the substrate 3, by using an injector 6 and filled by capillary action. Also, the CSP (CH) used in this embodiment
IP SIZE PACKAGE 1 is a surface-mounted component made of a semiconductor element or the like. A plurality of bumps 2 are provided on the back surface of the CSP 1, and a region 51 where the bumps 2 are not provided is a central portion of the CSP 1. And so on.

The C of the substrate according to the first embodiment of the present invention
The substrate 3 used for the SP mounting structure is provided with a plurality of lands 4 electrically connected to portions corresponding to the plurality of bumps 2 provided on the CSP 1, and the bumps 2 are not provided. A portion corresponding to the region 51 is subjected to silk printing 10 in a shape corresponding to the land 4 and arranged at the same pitch as the arrangement of the lands 4, and the land 4 and the silk printing 10 on the land 4 arrangement surface of the substrate 3 are the same. It is formed in an array of intervals. By this silk printing 10, a gap T2 between the silk printing 10 of the substrate 3 and the CSP1 is formed narrower than the gap T1 before printing as shown in FIG.

When the insulating resin 7 is filled by injection from all directions, there is no way for air to escape.
Since it may remain as a void (bubble), FIG.
As shown in the figure, the injection is performed from one side of the CSP 1 using the injector 6. Then, in the filling by the structure according to the present embodiment, as shown in FIG. 1C, the insulating resin 7 diffuses while flowing in the direction shown by the arrow A due to the capillary phenomenon. The areas 50 and 51 of the substrate 3 where the lands 4 are not disposed are the silk printing 10 of the substrate 3.
The flow of the insulating resin 7 is accelerated by the improvement of the capillary phenomenon due to the narrowing of the gap T2 between the insulating resin 7 and the CSP 1, and flows as indicated by the arrow B before the insulating resin 7 that has entered other parts, and the bump 2 It flows so that it spreads around. This allows the flow of the insulating resin 7 to spread not only from one direction but also outward while extruding air around the portion on which the silk print 10 has been applied, thereby causing voids (bubbles) and uneven filling. Generation can be prevented, and characteristic abnormalities and substrate burnout can be prevented.

Next, a CSP mounting structure of a substrate according to a second embodiment of the present invention will be described. FIG. 2 is a diagram showing a CSP mounting structure of a board according to a second embodiment of the present invention.

The C of the substrate according to the second embodiment of the present invention
The substrate 3 used for the SP mounting structure is provided with a plurality of lands 4 electrically connected to regions corresponding to the plurality of bumps 2 provided on the CSP 1, and further provided with regions where the bumps 2 are not provided. On the entire surface of the portion 50 corresponding to 51, a square-shaped silk print 11 is applied. By this silk printing 11, the gap between the silk printing 11 of the substrate 3 and the CSP 1 is formed narrower than the gap before printing over the entire surface of the square shape.

In the filling by the structure according to the second embodiment, like the structure according to the first embodiment,
The areas 50 and 51 where the bumps 2 of the CSP 1 and the lands 4 of the substrate 3 are not disposed are the silk print 11 of the substrate 3 and the CS 50
The flow of the insulating resin 7 becomes faster due to the improvement of the capillary phenomenon due to the narrowing of the gap with P1, flows before the insulating resin 7 that has entered other parts, and flows so as to spread around the bumps 2. As a result, the flow of the insulating resin 7 spreads not only from one direction but also outward while pushing out air around the portion on which the silk printing 11 has been applied. Can be prevented, and characteristic abnormalities and substrate burnout can be prevented.

In the structure according to the second embodiment, since the area of the gap narrowed by the square-shaped silk printing 11 is large, the effect of the capillary phenomenon is improved as compared with the structure of the first embodiment. are doing. Further, the present invention may be applied to a silk screen printing of a star shape or the like without being limited to the square silk screen printing 11 according to the second embodiment.

Next, a CSP mounting structure of a substrate according to a third embodiment of the present invention will be described. 3A and 3B are views showing a CSP mounting structure of a substrate according to a third embodiment of the present invention, wherein FIG. 3A is a cross-sectional view, and FIG. 3B is a plan view.

The C of the substrate according to the third embodiment of the present invention
The substrate 3 used for the SP mounting structure has a portion 50 corresponding to the region 51 where the bump 2 of the CSP 1 is not provided.
In addition, silk printing 12 is performed within a range of a gap T1 between the substrate 3 and the CSP1. This silk printing 12 is the substrate surface 3
As shown in FIG. 3, printing is performed a plurality of times in a smaller shape in a stepwise manner toward the upper side so as to form a gap T3 with the CSP1. By this silk printing 12,
The gap T1 between the substrate 3 and the CSP 1 before printing is narrowed toward the center of the region 51 where the bump 2 is not provided until the gap becomes T3 in a stepwise manner.

In the filling by the structure according to the third embodiment, as in the structure according to the first embodiment,
The areas 50 and 51 where the bumps 2 of the CSP 1 and the lands 4 of the substrate 3 are not disposed are the silk printing 12 of the substrate 3 and the CS
The flow of the insulating resin 7 is accelerated toward the center part due to the improvement of the capillary phenomenon due to the stepwise narrowing of the gap with P1, and flows faster than the insulating resin 7 that has entered other parts. It flows to spread around 2. Thereby, the flow of the insulating resin 7 is not only from one direction but also spreads while pushing air outward, centering on the portion where the silk printing 12 has been applied, so that voids (bubbles) and uneven filling are generated. Generation can be prevented, and characteristic abnormalities and substrate burnout can be prevented.

In the third embodiment, silk printing 1
2 is printed a plurality of times stepwise, and the gap is narrowed as shown by T3 in FIG. 3A, so that the capillary phenomenon is further improved.

Next, a CSP mounting structure of a substrate according to a fourth embodiment of the present invention will be described. FIG. 4 is a diagram showing a CSP mounting structure of a board according to a fourth embodiment of the present invention.

The C of the substrate according to the fourth embodiment of the present invention
On the back surface of the CSP 1 used in the SP mounting structure, a projection 13 made of an insulating resin material is formed in advance in a region 51 where the bump 2 is not provided, within a gap T1 between the substrate 3 and the CSP 1. The gap T4 between the protruding portion 13 and the substrate 3 is smaller than the gap T1 in other portions.

In the filling by the structure according to the fourth embodiment, as in the structure according to the first embodiment,
The regions 50 and 51 where the bumps 2 of the CSP 1 and the lands 4 of the substrate 3 are not provided are insulated by the improvement of the capillary phenomenon due to the narrowing of the gap T4 between the protrusion 13 provided on the back surface of the CSP 1 and the substrate 3. The flow of the conductive resin 7 causes the protrusion 1
3 flows faster than the insulating resin 7 that has entered other parts, and flows so as to spread around the bumps 2. Accordingly, the flow of the insulating resin 7 is not only from one direction but also spreads while pushing air outward from the protrusion 13 as a center. Abnormality and burnout of the substrate can be prevented.

Next, a CSP mounting structure of a substrate according to a fifth embodiment of the present invention will be described. FIG. 5 is a diagram showing a CSP mounting structure of a substrate according to a fifth embodiment of the present invention.

The C of the substrate according to the fifth embodiment of the present invention
On the back surface of the CSP 1 used for the SP mounting structure, a dummy bump 14 not for a connection terminal smaller than the diameter of the bump 2 is previously provided in a region 51 where the bump 2 is not provided, in the same arrangement as the bump 2. Arranged at pitch, CSP1
The bumps 2 and the dummy bumps 14 on the back surface are formed at the same interval. By providing the dummy bumps 14, the gap T between the substrate 3 and the bumps 14 is formed as shown in FIG.
5 is formed narrower than the gap T1 before the arrangement.

In the filling by the structure according to the fifth embodiment, as in the structure according to the first embodiment,
The regions 50 and 51 where the bumps 2 of the CSP 1 and the lands 4 of the substrate 3 are not disposed are due to the improvement of the capillary phenomenon due to the narrow gap T5 between the dummy bump 14 provided on the back surface of the CSP 1 and the substrate 3. The flow of the insulating resin 7 becomes faster toward the dummy bumps 14, flows before the insulating resin 7 that has entered other parts, and flows so as to spread around the bumps 2. Thereby, the flow of the insulating resin 7 is not only from one direction but also spreads while pushing out air around the dummy bumps 14 so that voids (bubbles) and uneven filling are prevented. Characteristic abnormalities and substrate burnout can be prevented. In the fifth embodiment, the cost can be reduced by providing the dummy bumps 14 in the same process as the bumps 2 on the back surface of the CSP 1.

Next, a CSP mounting structure of a substrate according to a sixth embodiment of the present invention will be described. FIG. 6 is a diagram showing a CSP mounting structure of a board according to a sixth embodiment of the present invention.

The C of the substrate according to the sixth embodiment of the present invention
The substrate 3 used for the SP mounting structure has a mounting area provided with a plurality of lands electrically connected to the plurality of bumps 2 provided on the CSP 1, and between the lands 4 in the mounting area. Via hole 15 is provided and CSP1
The portion 50 corresponding to the central region 51 where the bump 2 is not provided is formed in a state where the land 4 is not provided.

In the filling by the structure according to the sixth embodiment, the insulating resin 7 is moved by an arrow A due to a capillary phenomenon.
The flow of the insulating resin 7 in the via holes 15 provided between the lands 4 of the substrate 3 is caused by the diffusion of the bumps 2 of the CSP 1 and the lands 4 of the substrate 3. The flow of the unfilled regions 50 and 51 is delayed by the amount flowing into the via hole 15, and the insulating resin 7
Flows from the central regions 50 and 51 and spreads around the bump 2 and the via hole 15.

As a result, the flow of the insulating resin 7 spreads not only from one direction but also outward while pushing air around the central regions 50 and 51.
It is possible to prevent the occurrence of voids (bubbles) and uneven filling, thereby preventing abnormal characteristics and burning of the substrate.

Next, a CSP mounting structure of a substrate according to a seventh embodiment of the present invention will be described. FIG. 7 is a view showing a CSP mounting structure of a board according to a seventh embodiment of the present invention.

The C of the substrate according to the seventh embodiment of the present invention
The substrate 3 used for the SP mounting structure has a mounting area provided with a plurality of lands electrically connected to the plurality of bumps 2 provided on the CSP 1, and a center where the bumps 2 of the CSP 1 are not provided. Part 50 corresponding to the part region 51
Has an insulating resin 7 filled between the substrate 3 and the CSP 1
Are provided in the suction direction 30.

In the filling by the structure according to the seventh embodiment, the insulating resin 7 is filled by the capillary phenomenon, but the region 50 where the bump 2 of the CSP 1 and the land 4 of the substrate 3 are not disposed. , 51, the flow of the insulating resin 7 is slow, and there is a possibility that uneven filling occurs. Therefore, the area 5 where the bumps 2 of the CSP 1 and the lands 4 of the substrate 3 are not disposed is provided.
Before the filled insulating resin 7 is cured through the through holes 16 provided at the positions 0 and 51, the insulating resin 7 is sucked in the suction direction 30 using a suction pump or the like, and is sucked in the region 50, 51.
Insulating resin 7 is incorporated in the portion 51 to prevent the occurrence of voids (bubbles) and uneven filling in the regions 50 and 51, thereby preventing characteristic abnormalities and burning of the substrate.

Next, a CSP mounting structure of a board according to an eighth embodiment of the present invention will be described. 8A and 8B are diagrams showing a CSP mounting structure of a board according to an eighth embodiment of the present invention, wherein FIG. 8A is a cross-sectional view, and FIG. 8B is a plan view of the board.

The C of the substrate according to the eighth embodiment of the present invention
Similarly to the structure according to the seventh embodiment, the substrate 3 used for the SP mounting structure is provided with a through hole 16 in a region 50 where the land 4 is not provided. The silk print 17 is provided so as to surround the through hole 16 in the gap. By this silk printing 17, as shown in FIG.
The gap T8 between 7 and the CSP1 is formed narrower than the gap T1 before the arrangement.

In the filling by the structure according to the eighth embodiment, the silk print 17 on the substrate 3 is added to the structure according to the seventh embodiment by adding the silk print 17 to the structure according to the seventh embodiment. The flow of the insulating resin 7 is accelerated toward the silk print 17 due to the improvement of the capillary phenomenon due to the narrowing of the gap T8, thereby further suppressing the occurrence of uneven filling. Before the filled insulating resin 7 is cured, the insulating resin 7 is sucked in the suction direction 30 using a suction pump or the like, and
Insulating resin 7 is taken in portions 0, 51 and regions 50, 51
Prevents voids (bubbles) and uneven filling in parts,
Characteristic abnormalities and substrate burnout can be prevented.

Next, a CSP mounting structure of a substrate according to a ninth embodiment of the present invention will be described. FIG. 9 is a view showing a CSP mounting structure of a board according to a ninth embodiment of the present invention.

The substrate C according to the ninth embodiment of the present invention
Similarly to the structure according to the eighth embodiment, the substrate 3 used for the SP mounting structure is provided with the through hole 16 in the region 50 where the land 4 is not provided. Is provided with a rectangular silk print 18 divided into a plurality of pieces radially outward from the through hole 16.

In the filling by the structure according to the ninth embodiment, a radial silk print 18 is provided instead of the silk print 17 used in the structure according to the eighth embodiment. 7 is filled with the insulating resin 7 injected from the through-hole 16 by the injector 6 in the injection direction 31 with the CSP 1 placed below and the substrate 3 placed above. By the injection from the through hole 16, the flow of the insulating resin 7 is divided into a plurality of regions 5 through the rectangular silk printing 18 radially divided from the through hole 16.
It is swept radially around 0,51. Thereby, the flow of the insulating resin 7 to the regions 50 and 51 where the bumps 2 of the CSP 1 and the lands 4 of the substrate 3 are not provided is also performed favorably, and the radial silk printing 18 allows the insulating resin 7 to flow only in one direction. Instead, since the air spreads radially outwardly around the central regions 50 and 51 while being pushed out, voids (bubbles) and uneven filling can be prevented, and characteristic abnormalities and substrate burnout can be prevented. it can.

Next, a CSP mounting structure of a board according to a tenth embodiment of the present invention will be described. FIGS. 10A and 10B are diagrams showing a CSP mounting structure of a substrate according to a tenth embodiment of the present invention, wherein FIG. 10A is a diagram showing a state of injection of an insulating resin into the CSP, and FIG.

The back surface of the CSP 1 used for the CSP mounting structure of the substrate according to the tenth embodiment of the present invention has a state in which the back surface of the CSP 1 is directed upward to a region 51 where the bumps 2 are not provided. Then, an insulating resin having heat resistance is applied from the nozzle 8, and the insulating resin is hardened and formed on the rear surface of the CSP 1 as a protrusion 19 having a height T5 and smaller than the diameter of the bump. Due to the formation of the protrusion 19, the space between the protrusion 19 and the substrate 3 becomes a gap (T1-T5), which is smaller than the gap T1.

In the filling by the structure according to the tenth embodiment, the regions 50 and 51 where the bumps 2 of the CSP 1 and the lands 4 of the substrate 3 are not provided are formed by the protrusions added to the back surface of the CSP 1. 19 (T1-T)
5) The flow of the insulating resin 7 is accelerated toward the protruding portion 19 of the region 51 where the bumps 2 are not provided due to the improvement of the capillary phenomenon due to the narrowing of the gap T1 and the insulation penetrating into other portions. It flows before the conductive resin 7 and spreads around the bumps 2. As a result, the flow of the insulating resin 7 spreads out not only from one direction but also outwardly around the protrusion 19 while pushing air out.
It is possible to prevent the occurrence of voids (bubbles) and uneven filling, thereby preventing abnormal characteristics and burning of the substrate.

Next, a CSP mounting structure of a substrate according to an eleventh embodiment of the present invention will be described. FIGS. 11A and 11B are diagrams showing a CSP mounting structure of a substrate according to an eleventh embodiment of the present invention, wherein FIG. 11A is a diagram showing a state of injection of an insulating resin into the substrate, and FIG. 11B is a sectional view.

The substrate 3 used for the CSP mounting structure of the substrate according to the eleventh embodiment of the present invention has a plurality of lands electrically connected to the plurality of bumps 2 provided on the CSP 1. With mounting area, bump 2 of CSP1
5 corresponding to the central region 51 in which no is provided
0, the thermosetting resin is applied from the nozzle 8 and the CSP
When soldering the substrate 3 by heating, the substrate 3 and C
It is hardened and formed as a protruding projection 20 within a range of a gap T1 with SP1. Due to the formation of the protrusion 20, the space between the protrusion 20 and the CSP1 becomes a gap (T1-T6), which is smaller than the gap T1.

In the filling by the structure according to the eleventh embodiment, the regions 50 and 51 where the bumps 2 of the CSP 1 and the lands 4 of the substrate 3 are not disposed are formed by the protrusions 20 added to the substrate 3. The flow of the insulating resin 7 is accelerated toward the projecting portion 20 by the improvement of the capillary phenomenon due to the gap (T1-T6) between the insulating resin 7 and the CSP 1 being narrower than the gap T1, and the insulating resin that has entered other portions is reduced. 7 and flows so as to spread around the bump 2. Accordingly, the flow of the insulating resin 7 is not only from one direction but also spreads while pushing air outward from the protrusion 20 as a center, thereby preventing voids (bubbles) and uneven filling and preventing abnormal characteristics. And burnout of the substrate can be prevented.

Next, a CSP mounting structure of a substrate according to a twelfth embodiment of the present invention will be described. FIG. 12 is a view showing a CSP mounting structure of a board according to a twelfth embodiment of the present invention.

The substrate 3 used for the CSP mounting structure of the substrate according to the twelfth embodiment of the present invention is provided with a plurality of lands electrically connected to a plurality of bumps 2 provided on the CSP 1. With mounting area, bump 2 of CSP1
5 corresponding to the central region 51 in which no is provided
0, a land 21 for a dummy not for an electrode is provided, and the solder paste 5 is applied to the land 4 and the land 21 for the dummy.
When the CSP 1 is soldered to the substrate 3 by heating, the solder paste 5 on the dummy lands 21 is melted and hardened to form a solder fillet on the dummy lands 21. The gap between the solder fillet on the dummy land 21 and the CSP1 is a gap (T1-T7), which is smaller than the gap T1.

In the filling by the structure according to the twelfth embodiment, the regions 50 and 51 where the bumps 2 of the CSP 1 and the lands 4 of the substrate 3 are not disposed are filled with the dummy lands 21 of the substrate 3 and the CSP 1. The flow of the insulating resin 7 is accelerated toward the dummy land 21 by the improvement of the capillary phenomenon caused by the gap (T1-T7) between the insulating resin 7 and the gap T1 being narrower than the gap T1. It flows first and flows so as to spread around the bump 2. This allows the flow of the insulating resin 7 to spread not only from one direction but also outwardly around the dummy land 21 while extruding air, thereby preventing the occurrence of voids (bubbles) and uneven filling. Abnormality and burnout of the substrate can be prevented.

In the twelfth embodiment, the cost can be reduced by providing the dummy lands 21 on the substrate 3 in the same process as the lands 4.

[0061]

As described above, according to the present invention, when the insulating resin is filled into the soldering portion between the component and the board,
Improves the capillary phenomenon and improves the flow of the insulating resin into the area where the bumps of the parts and the lands of the board are not arranged, preventing the occurrence of bubbles and uneven filling, and preventing abnormal properties and burning of the board. be able to.

[Brief description of the drawings]

FIG. 1 shows a CSP of a substrate according to a first embodiment of the present invention.
It is a figure showing a mounting structure.

FIG. 2 shows a CSP of a substrate according to a second embodiment of the present invention.
It is a figure showing a mounting structure.

FIG. 3 shows a CSP of a substrate according to a third embodiment of the present invention.
It is a figure showing a mounting structure.

FIG. 4 shows a CSP of a substrate according to a fourth embodiment of the present invention.
It is a figure showing a mounting structure.

FIG. 5 shows a CSP of a substrate according to a fifth embodiment of the present invention.
It is a figure showing a mounting structure.

FIG. 6 shows a CSP of a substrate according to a sixth embodiment of the present invention.
It is a figure showing a mounting structure.

FIG. 7 shows a CSP of a substrate according to a seventh embodiment of the present invention.
It is a figure showing a mounting structure.

FIG. 8 shows a CSP of a substrate according to an eighth embodiment of the present invention.
It is a figure showing a mounting structure.

FIG. 9 shows a CSP of a substrate according to a ninth embodiment of the present invention.
It is a figure showing a mounting structure.

FIG. 10 is a diagram showing a C of the substrate according to the tenth embodiment of the present invention.
FIG. 3 is a diagram illustrating an SP mounting structure.

FIG. 11 is a view illustrating a C of a substrate according to an eleventh embodiment of the present invention.
FIG. 3 is a diagram illustrating an SP mounting structure.

FIG. 12 is a view illustrating a C of a substrate according to a twelfth embodiment of the present invention;
FIG. 3 is a diagram illustrating an SP mounting structure.

FIG. 13 is a diagram showing a CSP mounting structure of a conventional board.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... CSP 2 ... Bump 3 ... Substrate 4 ... Land 5 ... Solder paste 6 ... Injector 7 ... Insulating resin 10, 11, 12 ... Silk printing 13 ... Projecting part 14 ... Dummy bump 15 ... Via hole 16 ... Through hole 17, 18 ... Silk printing 19, 20 ... Projecting part 21 ... Dummy land

 ────────────────────────────────────────────────── ─── Continuing from the front page (72) Inventor Norihiro Inoue 1-2-28 Goshodori, Hyogo-ku, Kobe-shi, Hyogo F-term in Fujitsu Ten Limited (Reference) 5E336 AA04 BB01 BC31 BC34 CC32 CC36 CC43 CC58 EE01 EE07 GG12 5F044 KK01 KK11 KK27 LL01 QQ00 QQ01 RR16 5F061 AA01 BA03 CA04

Claims (11)

[Claims] 1. A component mounting structure of a board having components mounted on the board via a plurality of bumps, wherein the board is provided with a plurality of lands electrically connected to the plurality of bumps. A component mounting structure for a board, comprising: a non-land mounting area having a mounting area and no land provided thereon other than the land mounting area, which is subjected to silk printing corresponding to the land. 2. A component mounting structure of a board having components mounted on the board via a plurality of bumps, wherein the board is provided with a plurality of lands electrically connected to the plurality of bumps. In a land unmounted area having an area and the land not provided other than the land mounting area, silk printing is performed in a stepwise manner within a gap between the substrate and the component. Characteristic board component mounting structure. 3. A component mounting structure of a substrate having components mounted on the substrate via a plurality of bumps, wherein the component has a bump mounting area provided with the plurality of bumps on a surface facing the substrate. A plurality of lands that are electrically connected to the plurality of bumps are provided on the substrate, and further, in a non-bump-mounted area other than the bump-mounted area of the component, in which no bump is provided, A component mounting structure for a substrate, wherein a protruding portion made of an insulating resin material is formed in a range of a gap between the substrate and the component. 4. A component mounting structure of a substrate having components mounted on the substrate via a plurality of bumps, wherein the component has a bump mounting area provided with the plurality of bumps on a surface facing the substrate. A plurality of lands that are electrically connected to the plurality of bumps are provided on the substrate, and further, in a non-bump-mounted area other than the bump-mounted area of the component, in which no bump is provided, A component mounting structure for a substrate, wherein a dummy bump smaller than the diameter of the bump is provided. 5. A component mounting structure for a board having components mounted on the board via a plurality of bumps, wherein the board has a plurality of lands electrically connected to the plurality of bumps. A component mounting structure for a substrate, comprising: a mounting area; and a via hole provided between each land in the land mounting area. 6. A component mounting structure for a board having components mounted on the board via a plurality of bumps, wherein the board has a plurality of lands electrically connected to the plurality of bumps. A component mounting structure for a board, wherein a through-hole is provided in a land non-mounting area having a mounting area and no land other than the land mounting area. 7. The component mounting structure according to claim 6, wherein the substrate is further subjected to silk printing so as to surround the through hole. 8. A component mounting structure for a board having components mounted on the board via a plurality of bumps, wherein the board is provided with a plurality of lands electrically connected to the plurality of bumps. A through-hole is provided in a land-unmounted area having a mounting area and the land is not provided except for the land mounting area, and the substrate is provided with a gap between the through-hole and the land mounting area. A component mounting structure for a board, characterized by being subjected to silk printing in a shape radially divided into a plurality of pieces radially outward from a through hole. 9. A component mounting structure of a substrate having components mounted on the substrate via a plurality of bumps, wherein the component has a bump mounting area provided with the plurality of bumps on a surface facing the substrate. A plurality of lands electrically connected to the plurality of bumps are provided on the substrate, and a non-bump mounted area other than the bump mounting area of the component is provided with the bump, A component mounting structure for a board, wherein a protruding portion made of an insulating resin having a height smaller than the diameter of the bump is formed. 10. A component mounting structure of a board having components mounted on the board via a plurality of bumps, wherein the board has a plurality of lands electrically connected to the plurality of bumps. In a land unmounted area having a mounting area and not provided with the land other than the land mounting area, a protrusion made of a thermosetting resin is formed in a range of a gap between the board and the component. A component mounting structure for a substrate, comprising: 11. A component mounting structure of a board having components mounted on the board via a plurality of bumps, wherein the board is provided with a plurality of lands electrically connected to the plurality of bumps. A dummy land is disposed in a land unmounted area having a mounting area and no land other than the land mounting area, and a solder paste is printed on the land and the dummy land. A component mounting structure of a substrate characterized by the above-mentioned.