JP2001005403A - Display device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce a glass substrate area for a COG(Chip on Glass) method by forming signal or power source wiring on monolithic semiconductor integrated circuits in a display panel according to the COG method. SOLUTION: A liquid crystal display panel 1, an IC chip 2 such as a monolithic semiconductor integrated circuit, and a wiring substrate which is an input substrate comprise a liquid crystal display device. In this case, in a non-display area of the liquid crystal display panel 1, wiring 5 and electrodes of signals or the like are formed for connecting between the monolithic semiconductor integrated circuits arrayed almost straight, and the electrodes are connected with the projecting electrodes formed on the circuit-forming faces of each monolithic semiconductor integrated circuit. And, through-holes 13 are formed so as to penetrate the monolithic semiconductor integrated circuits from the side of the circuit-forming face. The wiring 5 formed by being led onto the back of the circuit-forming face of the monolithic semiconductor integrated circuits through these through-holes 13 are used as the wiring for supplying signals or the like to the back and forth ones of the monolithic semiconductor integrated circuits arrayed straight.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a display device such as a liquid crystal display device and a plasma display device.

[0002]

2. Description of the Related Art Conventional display devices include, for example, a liquid crystal display device and a plasma display device. Here, a liquid crystal display device will be described as a specific example of the conventional display device. This liquid crystal display device has a CRT (Ca
It has excellent features such as low power consumption and light weight as compared with displays such as T.D.Ray.Tube, etc., and its commercial power has been enhanced by the advancement of peripheral technology, and it has been used in various products.

In particular, in a liquid crystal display device of an active matrix type using a thin film transistor (hereinafter abbreviated as a TFT) as a switching element for each pixel in a display area, a clear display image without crosstalk can be obtained. It is widely used in the field of display devices such as personal computers and car navigation systems. In general, in a liquid crystal display device, a drive circuit for operating each pixel including a TFT or the like in a display region of the liquid crystal display panel needs to be formed in a non-display region of the liquid crystal display panel. As one of the methods, there is a method in which an IC chip or the like in which a drive circuit is formed is directly mounted on a glass substrate constituting a liquid crystal display panel. Since this method is compact and has improved vibration resistance, the portability, which is a characteristic of the liquid crystal display device, is further increased, and this forming method is becoming mainstream. In this connection method, since an IC chip is directly mounted on a glass substrate, COG (Chip-On-G) is used.
This is called a “lass” method.

A specific example of a conventional display device will be described below, taking a liquid crystal display device having a drive circuit formed by such a COG method as an example. This liquid crystal display device includes a liquid crystal display panel 1, an IC chip 2 such as a monolithic semiconductor integrated circuit, and an input substrate 3, as shown in FIG. This IC chip 2 drives each pixel by controlling a TFT (not shown) formed in each pixel of the display area 4a of the liquid crystal display panel 1, and is mounted by COG in the non-display area 4b. ing.

The IC chip 2 includes a signal line I
In the case of a liquid crystal display device having a C chip 2a and a scanning line IC chip 2b and a screen size of 6 to 7 ", a signal line IC
5 to 6 chips 2a and 1 to 2 scanning line IC chips
Two are used, each of which is arranged on a substantially straight line, and connected by an input signal line 8 formed on the liquid crystal display panel 1.

As shown in FIG. 5, an output terminal (not shown) of the IC chip 2 is connected to an output electrode 6 on a wiring extending from each TFT in the display area 4a to the non-display area 4b, and to an input terminal of the IC chip 2. Terminals (not shown) are connected to the input electrodes 7 formed in the non-display area 4b so as to be connected to the input electrodes 7 respectively.
The C chip 2 is mounted by COG. The input signal line 8
As shown in FIG. 4, the input electrode 7 is connected to the input electrode 7 on the liquid crystal display panel.
The power supply, reference voltage, various transfer clocks, control signals, etc. supplied from the input board 3 shown in FIG.
This is for transmitting electric power to the chip 2, and is formed at the same time when the TFT in the display area 4a is formed.

[0007] As shown in FIG. 6, routing wiring for transmitting to the IC chips 2 before and after the IC chips 2 arranged in tandem is arranged using the space below the IC chips 2. At this time, as shown in FIG. 7, a method is also used in which the input signal lines 8 have a multilayer structure and are arranged crosswise. FIG.
Shows a method of using the wiring board 10 on which the input signal lines 8 are formed. The wiring board 10 is connected to the wiring board 10 formed in the non-display area 4 b so as to supply various signals and power to the IC chip 2. A wiring board electrode 11 formed so as to be connected to the electrode 9, and a plurality of input signal lines 8 for supplying a signal to each IC chip 2 are formed, and the input signal line forming section 12 has a multilayer structure. . The wiring board 10
Is formed of a material such as a polyimide film so that it can be bent.

[0008]

However, the above-mentioned conventional display device has the following problems. That is, in the configuration shown in FIG. 6, the wiring 8b for transmitting a signal to the IC chips 2 before and after the vertically arranged IC chips 2 is formed in the space below the IC chip 2, but the power supply and the ground potential The wiring 8b used for
Since it is necessary to lower the wiring resistance value, the wiring width is increased. As a result, the non-display area 4b becomes larger due to the increase in the size of the IC chip 2, which causes a problem that the number of glass substrates to be removed is reduced and the outer size of the entire screen of the liquid crystal display device is increased. is there.

In the configuration shown in FIG. 7, although the size of the IC chip 2 is reduced, since the input signal lines 8 are cross-wired, interference between input signals occurs and image display becomes unstable. And dielectric breakdown of the cross portion of the input signal line 8 due to static electricity or the like, causing a reduction in yield. On the other hand, in the method using the wiring board 10 shown in FIG. 8, the number of connection points is larger than that of the above-described method, the manufacturing yield is reduced, and the film-formed wiring board 10 is easily broken due to vibration or impact. There are problems such as a decrease in sex.

A similar configuration is used in a display device such as a plasma display device other than the liquid crystal display device, and the same problems as described above exist. The present invention solves the above-mentioned conventional problems, and is a display panel using a COG method. The display panel and the entire apparatus can be manufactured without reducing the number of glass substrates and the effective display area while maintaining high connection reliability. Provided is a display device capable of reducing the outer dimensions of the display device.

[0011]

According to the present invention, there is provided a display device according to the present invention, wherein a signal or a power supply line is formed on a monolithic semiconductor integrated circuit in a COG display panel. The non-display area is reduced by the area occupied by the signal or power supply wiring to reduce the area of the glass substrate for the COG method.

As described above, in the COG display panel, the external dimensions of the display panel and the entire device can be reduced without reducing the number of glass substrates and the effective display area while maintaining high connection reliability. .

[0013]

DESCRIPTION OF THE PREFERRED EMBODIMENTS A display device according to a first aspect of the present invention is a wiring device for connecting a plurality of monolithic semiconductor integrated circuits arranged substantially linearly to a non-display region of a display panel. And an electrode are formed, and the electrode is connected to the protruding electrode formed on the circuit forming surface of each monolithic semiconductor integrated circuit, so that the monolithic semiconductor integrated circuit passes through the circuit forming surface from the circuit forming surface side. A line formed by forming a hole and extending through the through hole to the surface opposite to the circuit forming surface of the monolithic semiconductor integrated circuit supplies the signal and power to the monolithic semiconductor integrated circuits before and after the linear arrangement. It is configured to be a wiring for performing.

According to this structure, since the signal or power supply wiring is formed on the monolithic semiconductor integrated circuit in the COG display panel, the non-display area is reduced by the area occupied by the signal or power supply wiring. The area of the glass substrate for the COG method is reduced. Hereinafter, a display device according to an embodiment of the present invention will be specifically described with reference to the drawings. Here, a liquid crystal display device that electrically drives a liquid crystal to display an image will be described as an example of the display device.

FIG. 1 is a partial sectional view of a liquid crystal display device which is an example of the display device of the present embodiment, FIG. 2 is a plan view thereof, and FIG.
Is a partially enlarged view of FIG. As shown in FIG. 2, the liquid crystal display device includes a liquid crystal display panel 1, an IC chip 2 such as a monolithic semiconductor integrated circuit, and a wiring substrate serving as an input substrate 3. The IC chip 2 is a liquid crystal display panel 1
Is controlled by controlling a TFT (not shown) formed in each pixel of the display region 4a of FIG.
The C chip 2 includes a signal line IC chip 2a and a scan line I chip 2a.
In the case of a liquid crystal display device having a C chip 2b and a screen size of 6 to 7 ", 5 to 6 signal line IC chips 2a and 1 to 2 scanning line IC chips 2b are used, each of which is substantially straight. The input signal lines 8 are arranged in tandem on the top and are formed on the liquid crystal display panel 1.

As shown in FIG. 3, an output terminal (not shown) of the IC chip 2 is connected to an output electrode 6 on a wiring extending from each TFT in the display area 4a to the non-display area 4b, and is connected to an input terminal of the IC chip 2. Terminals (not shown) are connected to the input electrodes 7 formed in the non-display area 4b so as to be connected to the input electrodes 7 respectively.
The C chip 2 is mounted by COG. The input signal line 8
The power supply, reference voltage, various transfer clocks, control signals, and the like supplied from the input substrate 3 shown in FIG.
This is for transmitting to the C chip 2.

The input signal line 8, the input electrode 7, and the output electrode 6 are formed simultaneously with the TFT by diverting a conductive thin film used for forming the TFT in the display area 4a. In the IC chip 2, wirings 5 for transmitting a power supply, a transfer clock, and the like to circuits on the front and rear IC chips 2 are formed on a surface opposite to the circuit forming surface 14 of the IC chip 2. As shown in FIG. 1, the wiring 5 is connected to a semiconductor integrated circuit of the IC chip 2 by a through hole 13 penetrating the IC chip 2.

In these forming methods, a semiconductor integrated circuit
After forming on the C chip 2, the input circuit portion is etched,
A vertical hole is made in the IC chip 2. Next, gold plating is applied to this vertical hole portion to make the wall surface of the vertical hole conductive. Thereafter, a lapping process is performed from the back surface until the vertical holes are exposed. afterwards,
The through holes 13 are formed by performing gold plating on the vertical holes. The wiring 5 is also formed when the through hole 13 is formed by plating.

In this embodiment, the diameter of the through hole 13 is 40 μm, and the thickness of the LSI is 130 μm. Gallium arsenide was used as the material of the IC chip 2. Liquid crystal display panel 1, IC chip 2, anisotropic conductive adhesive (ACF: Anisotropic Condu) in which conductive particles obtained by plating gold on resin balls are dispersed in an organic resin.
active / Film) 15.

As described above, according to the present embodiment, the IC
Wiring 5 for transmitting a power supply, a transfer clock, etc. to the front and rear IC chips 2 on a surface opposite to the circuit forming surface 14 of the chip 2
Is formed, and the wiring 5 is used as the input wiring 8. Therefore, the input wiring 8 is provided in the space below the IC chip 2.
And the size of the IC chip 2 can be reduced, so that the non-display area 4b of the liquid crystal display panel 1 can also be reduced, and the size of the liquid crystal display device can be reduced without reducing the number of glass substrates. Can be obtained. Further, since the wiring 5 is formed by plating, it is possible to increase the film thickness and reduce the wiring resistance value, and a stable image can be displayed.

In the above embodiment, the case of a liquid crystal display device has been described. However, similar effects can be obtained in the case of a display device other than a liquid crystal display device such as a plasma display device.

[0022]

As described above, according to the present invention, the signal or power supply wiring is formed on the monolithic semiconductor integrated circuit in the display panel of the COG system, so that only the area occupied by the signal or power supply wiring is reduced. Make the display area smaller,
The glass substrate area for the COG method can be reduced.

Therefore, in the display panel using the COG method, the external dimensions of the display panel and the entire device can be reduced without reducing the number of glass substrates and the effective display area while maintaining high connection reliability. Also,
Since a conventional film substrate is not used, the number of connection points is increased, the breakage of the film substrate can be prevented, and the reliability of the device can be improved.

[Brief description of the drawings]

FIG. 1 is a partial cross-sectional view illustrating a configuration of a liquid crystal display device which is an example of a display device according to an embodiment of the present invention.

FIG. 2 is a plan view showing a configuration of a liquid crystal display device in the embodiment.

FIG. 3 is a partially enlarged view showing the configuration of the liquid crystal display device in the embodiment.

FIG. 4 is a plan view showing a configuration of a liquid crystal display device which is an example of a conventional display device.

FIG. 5 is a partially enlarged view showing a configuration of a liquid crystal display device in the conventional example.

FIG. 6 is a layout diagram of input signal lines of the liquid crystal display device in the conventional example.

FIG. 7 is an arrangement diagram of input signal lines in a cross arrangement of the liquid crystal display device in the conventional example.

FIG. 8 is a partially enlarged view of a liquid crystal display device using a film substrate system, which is an example of a conventional display device.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Liquid crystal display panel 2 IC chip 3 Input board 4a Display area 4b Non-display area 5 Wiring 8 Input signal line 13 Through hole 14 Circuit formation surface 15 Anisotropic conductive adhesive

Claims (1)

[Claims] A plurality of monolithic semiconductor integrated circuits arranged in a substantially linear manner and a wiring such as a signal or a power supply for connecting the plurality of monolithic semiconductor integrated circuits, and an electrode; A through-hole formed so as to penetrate the monolithic semiconductor integrated circuit from the circuit-forming surface side, and the monolithic semiconductor integrated circuit is formed through the through-hole. A display characterized in that wiring formed by drawing out on a surface opposite to a circuit forming surface of a circuit is used as a wiring for supplying the signal and power to monolithic semiconductor integrated circuits before and after the linear arrangement. apparatus.