JP2000517475A - トレッドを備えたローラおよびそれを含むシステム - Google Patents
トレッドを備えたローラおよびそれを含むシステムInfo
- Publication number
- JP2000517475A JP2000517475A JP10511627A JP51162798A JP2000517475A JP 2000517475 A JP2000517475 A JP 2000517475A JP 10511627 A JP10511627 A JP 10511627A JP 51162798 A JP51162798 A JP 51162798A JP 2000517475 A JP2000517475 A JP 2000517475A
- Authority
- JP
- Japan
- Prior art keywords
- roller
- groove
- wafer
- outer edge
- side portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 claims abstract description 25
- 239000000758 substrate Substances 0.000 claims description 48
- 238000012545 processing Methods 0.000 claims description 25
- 239000000463 material Substances 0.000 claims description 15
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 claims description 3
- 238000004140 cleaning Methods 0.000 abstract description 56
- 230000008569 process Effects 0.000 abstract description 12
- 239000004065 semiconductor Substances 0.000 abstract description 11
- 239000007788 liquid Substances 0.000 abstract description 5
- 238000009987 spinning Methods 0.000 abstract 1
- 235000012431 wafers Nutrition 0.000 description 144
- 239000000243 solution Substances 0.000 description 29
- 230000007246 mechanism Effects 0.000 description 20
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 13
- 239000002245 particle Substances 0.000 description 8
- 238000004891 communication Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 238000002347 injection Methods 0.000 description 5
- 239000007924 injection Substances 0.000 description 5
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 3
- 238000007599 discharging Methods 0.000 description 3
- 238000011068 loading method Methods 0.000 description 3
- 239000007921 spray Substances 0.000 description 3
- 239000000908 ammonium hydroxide Substances 0.000 description 2
- 230000001680 brushing effect Effects 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 239000000314 lubricant Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 239000004677 Nylon Substances 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 238000010981 drying operation Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 238000000746 purification Methods 0.000 description 1
- 238000005201 scrubbing Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
-
- B08B1/32—
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B11/00—Cleaning flexible or delicate articles by methods or apparatus specially adapted thereto
- B08B11/02—Devices for holding articles during cleaning
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S134/00—Cleaning and liquid contact with solids
- Y10S134/902—Semiconductor wafer
Abstract
Description
Claims (1)
- 【特許請求の範囲】 1.間に溝を有する隣接し合う第1および第2の側面位置と、回転中に溝から 溶液を排出させるための溝と第1の側面部分の第1の外縁部との間に延びる第1 の複数のトレッドとを含むローラ。 2.回転中に溝から溶液を排出させるための溝と第2の側面部分の第2の外縁 部との間に延びる第2の複数のトレッドをさらに含む請求項1に記載のローラ。 3.第1の側面部分が中心軸を中心にして回転し、溝から第1の外縁部にかけ て大きくなる直径を有する円錐形であり、第2の側面部分が中心軸を中心に回転 し、溝から第2の外縁部にかけて大きくなる直径を有する円錐形である請求項1 に記載のローラ。 4.第1の側面部分の第1の外縁部における直径が、第2の側面部分の第2の 外縁部における直径よりも大きい請求項3に記載のローラ。 5.第1のステーションと、 第2のステーションとを含み、 第1および第2のステーションのうちの少なくとも一方が、 溝と、 第1の外縁部と、 溝と第1の外縁部との間に延びる少なくとも1つのトレッドとを有するロー ラを含む、基板を処理するシステム。 6.少なくとも1つのトレッドが、溝から溶液を排出させる複数のトレッドを 含む請求項5に記載のシステム。 7.ローラが、 第2の外縁部と、 溝と第2の外縁部との間に延びる少なくとも1つのトレッドとをさらに含む請 求項5に記載のシステム。 8.第1の側面部分が中心軸を中心にして回転し、溝から第1の外縁部にかけ て大きくなる直径を有する円錐形であり、第2の側面部分が中心軸を中心にして 回転し、溝から第2の外縁部にかけて大きくなる直径を有する円錐形である請求 項7に記載のシステム。 9.第1の側面部分の第1の外縁部における直径が、第2の側面部分の第2の 外縁部における直径よりも大きい請求項8に記載のシステム。 10.ローラが中心軸を中心に回転し、基板と溝との間の接触を介して基板に 回転運動を伝える請求項5に記載のシステム。 11.第1および第2のステーションが第1および第2のブラシ・ステーショ ンを含む請求項5に記載のシステム。 12.ローラが可撓性材料を含む請求項5に記載のシステム。 13.可撓性材料がウレタンを含む請求項12に記載のシステム。 14.溝が基板の縁部の厚さとほぼ等しい開口部を有する請求項5に記載のシ ステム。 15.ローラ内の溝において基板と接触するローラを回転させて基板に回転運 動を伝えるステップと、 ローラを回転させている間に溝から溶液を排出させるステップとを含む、基板 の回転方法。 16.溶液を排出させるステップが、ローラ内の少なくとも1つのトレッドを 使用して溝から溶液をローラの外縁部まで運ぶステップを含む請求項15に記載 の方法。 17.少なくとも1つのトレッドが、溝からローラの外縁部まで延びる複数の トレッドを含む請求項16に記載の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/705,337 | 1996-08-29 | ||
US08/705,337 US5862560A (en) | 1996-08-29 | 1996-08-29 | Roller with treading and system including the same |
PCT/US1997/011810 WO1998008622A1 (en) | 1996-08-29 | 1997-07-07 | Roller with treading and system including same |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2000517475A true JP2000517475A (ja) | 2000-12-26 |
JP4003837B2 JP4003837B2 (ja) | 2007-11-07 |
Family
ID=24833019
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP51162798A Expired - Fee Related JP4003837B2 (ja) | 1996-08-29 | 1997-07-07 | トレッドを備えたローラおよびそれを含むシステム |
Country Status (7)
Country | Link |
---|---|
US (2) | US5862560A (ja) |
EP (1) | EP0954389B1 (ja) |
JP (1) | JP4003837B2 (ja) |
KR (1) | KR100376564B1 (ja) |
AU (1) | AU3516297A (ja) |
DE (1) | DE69739033D1 (ja) |
WO (1) | WO1998008622A1 (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012027299A (ja) * | 2010-07-26 | 2012-02-09 | Mitsubishi Paper Mills Ltd | ドライフィルムレジストの薄膜化処理方法及び薄膜化処理装置 |
JP2018511931A (ja) * | 2015-02-07 | 2018-04-26 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | 湿式化学プロセス中に基板にコンタクトするための摩擦強化パターンを有する周面を用いる圧縮成形物品 |
US10610909B2 (en) | 2016-10-27 | 2020-04-07 | Gyeong-Tae KANG | Washer idler roller and wafer cleaner using same |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3330300B2 (ja) | 1997-02-28 | 2002-09-30 | 東京エレクトロン株式会社 | 基板洗浄装置 |
US6059888A (en) * | 1997-11-14 | 2000-05-09 | Creative Design Corporation | Wafer cleaning system |
JP2000228382A (ja) * | 1999-02-05 | 2000-08-15 | Sony Corp | ウエハ洗浄装置 |
US6290780B1 (en) | 1999-03-19 | 2001-09-18 | Lam Research Corporation | Method and apparatus for processing a wafer |
US6308576B1 (en) * | 1999-03-30 | 2001-10-30 | Taiwan Semiconductor Manufacturing Company, Ltd | Method for determining stress effect on a film during scrubber clean |
US6918864B1 (en) * | 1999-06-01 | 2005-07-19 | Applied Materials, Inc. | Roller that avoids substrate slippage |
US6711775B2 (en) * | 1999-06-10 | 2004-03-30 | Lam Research Corporation | System for cleaning a semiconductor wafer |
US6439245B1 (en) * | 2000-06-30 | 2002-08-27 | Lam Research Corporation | Method for transferring wafers from a conveyor system to a wafer processing station |
US6540841B1 (en) | 2000-06-30 | 2003-04-01 | Chartered Semiconductor Manufacturing Ltd. | Method and apparatus for removing contaminants from the perimeter of a semiconductor substrate |
JP2002313757A (ja) * | 2001-04-17 | 2002-10-25 | Hitachi Ltd | 半導体集積回路装置の製造方法 |
US20050172430A1 (en) * | 2003-10-28 | 2005-08-11 | Joseph Yudovsky | Wafer edge cleaning |
CN100576428C (zh) * | 2005-04-20 | 2009-12-30 | 飞思卡尔半导体公司 | 清洗电路衬底的设备 |
US7115023B1 (en) * | 2005-06-29 | 2006-10-03 | Lam Research Corporation | Process tape for cleaning or processing the edge of a semiconductor wafer |
US8234739B2 (en) * | 2006-10-03 | 2012-08-07 | Xyratex Technology Limited | Spiral brush for cleaning and conveying a substrate |
US8662008B2 (en) * | 2008-02-07 | 2014-03-04 | Sunpower Corporation | Edge coating apparatus for solar cell substrates |
US8322300B2 (en) * | 2008-02-07 | 2012-12-04 | Sunpower Corporation | Edge coating apparatus with movable roller applicator for solar cell substrates |
US8250695B2 (en) * | 2009-10-05 | 2012-08-28 | Applied Materials, Inc. | Roller assembly for a brush cleaning device in a cleaning module |
CN101716585B (zh) * | 2009-12-14 | 2012-11-14 | 中国电子科技集团公司第四十五研究所 | 化学机械抛光设备硅片清洗装置 |
JP6956578B2 (ja) | 2017-09-19 | 2021-11-02 | 株式会社荏原製作所 | ブレークイン装置及びブレークインシステム |
US11664213B2 (en) * | 2019-12-26 | 2023-05-30 | Taiwan Semiconductor Manufacturing Company, Ltd. | Bevel edge removal methods, tools, and systems |
Family Cites Families (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2335594A (en) * | 1941-08-11 | 1943-11-30 | Fmc Corp | Feed roll for corn cutters |
US2646612A (en) * | 1947-08-05 | 1953-07-28 | American Viscose Corp | Liquid pick-up and transfer means |
US2857605A (en) * | 1952-09-26 | 1958-10-28 | Norman C Weishaar | Automobile tire side-wall washing machine |
US3327721A (en) * | 1965-05-28 | 1967-06-27 | Keith L Carlson | Etching apparatus |
US3599306A (en) * | 1969-06-13 | 1971-08-17 | Beloit Corp | Roll composition |
DE2354374A1 (de) * | 1972-11-08 | 1974-07-25 | Oce Van Der Grinten Nv | Fixiereinrichtung |
US4202071A (en) * | 1978-03-20 | 1980-05-13 | Scharpf Mike A | Apparatus for washing and drying phonograph records |
JPS57186340A (en) * | 1981-05-12 | 1982-11-16 | Nippon Kogaku Kk <Nikon> | Positioning device for wafer |
JPS60143634A (ja) * | 1983-12-29 | 1985-07-29 | Fujitsu Ltd | ウエ−ハ処理方法及び装置 |
US4705711A (en) * | 1986-01-30 | 1987-11-10 | E. I. Du Pont De Nemours And Company | Polyimide covered calender rolls |
US4826071A (en) * | 1988-04-25 | 1989-05-02 | Harris Graphics | Stainless steel weld clad cylinder interconnected by a groove and gap also weld covered by stainless steel |
JPH02130922A (ja) * | 1988-11-11 | 1990-05-18 | Toshiba Corp | 半導体基板エッチング装置 |
JPH02178947A (ja) * | 1988-12-29 | 1990-07-11 | Fujitsu Ltd | 半導体ウェーハのノッチ合わせ機構 |
US5188273A (en) * | 1989-02-03 | 1993-02-23 | Helmuth Schmoock | Expander roller for webs of paper and the like |
KR0139785B1 (ko) * | 1990-03-20 | 1998-07-15 | 카자마 젠쥬 | 웨이퍼 정렬 기능을 가진 웨이퍼 카운트 장치 |
US5129876A (en) * | 1991-03-01 | 1992-07-14 | Profold, Inc. | Fold roller |
JP2815493B2 (ja) * | 1991-03-29 | 1998-10-27 | トーカロ株式会社 | めっき浴用ロール |
JPH05259264A (ja) * | 1992-03-11 | 1993-10-08 | Fujitsu Ltd | 半導体ウェーハ整列装置 |
US5485644A (en) * | 1993-03-18 | 1996-01-23 | Dainippon Screen Mfg. Co., Ltd. | Substrate treating apparatus |
US5340437A (en) * | 1993-10-08 | 1994-08-23 | Memc Electronic Materials, Inc. | Process and apparatus for etching semiconductor wafers |
TW275708B (ja) * | 1993-12-28 | 1996-05-11 | Tokyo Electron Co Ltd | |
US5566466A (en) * | 1994-07-01 | 1996-10-22 | Ontrak Systems, Inc. | Spindle assembly with improved wafer holder |
US6003185A (en) * | 1994-07-15 | 1999-12-21 | Ontrak Systems, Inc. | Hesitation free roller |
US5475889A (en) * | 1994-07-15 | 1995-12-19 | Ontrak Systems, Inc. | Automatically adjustable brush assembly for cleaning semiconductor wafers |
US5861066A (en) * | 1996-05-01 | 1999-01-19 | Ontrak Systems, Inc. | Method and apparatus for cleaning edges of contaminated substrates |
-
1996
- 1996-08-29 US US08/705,337 patent/US5862560A/en not_active Expired - Lifetime
-
1997
- 1997-07-07 KR KR10-1999-7001669A patent/KR100376564B1/ko not_active IP Right Cessation
- 1997-07-07 DE DE69739033T patent/DE69739033D1/de not_active Expired - Fee Related
- 1997-07-07 WO PCT/US1997/011810 patent/WO1998008622A1/en active IP Right Grant
- 1997-07-07 EP EP97931568A patent/EP0954389B1/en not_active Expired - Lifetime
- 1997-07-07 AU AU35162/97A patent/AU3516297A/en not_active Abandoned
- 1997-07-07 JP JP51162798A patent/JP4003837B2/ja not_active Expired - Fee Related
-
1999
- 1999-01-07 US US09/227,173 patent/US6059889A/en not_active Expired - Lifetime
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012027299A (ja) * | 2010-07-26 | 2012-02-09 | Mitsubishi Paper Mills Ltd | ドライフィルムレジストの薄膜化処理方法及び薄膜化処理装置 |
JP2018511931A (ja) * | 2015-02-07 | 2018-04-26 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | 湿式化学プロセス中に基板にコンタクトするための摩擦強化パターンを有する周面を用いる圧縮成形物品 |
US10610909B2 (en) | 2016-10-27 | 2020-04-07 | Gyeong-Tae KANG | Washer idler roller and wafer cleaner using same |
Also Published As
Publication number | Publication date |
---|---|
JP4003837B2 (ja) | 2007-11-07 |
DE69739033D1 (de) | 2008-11-20 |
US6059889A (en) | 2000-05-09 |
KR20000035931A (ko) | 2000-06-26 |
KR100376564B1 (ko) | 2003-03-17 |
WO1998008622A1 (en) | 1998-03-05 |
EP0954389A1 (en) | 1999-11-10 |
EP0954389B1 (en) | 2008-10-08 |
EP0954389A4 (en) | 2006-07-26 |
AU3516297A (en) | 1998-03-19 |
US5862560A (en) | 1999-01-26 |
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