JP2000512083A - バイアマトリックス層間接続を有する多層回路及びその製造方法 - Google Patents
バイアマトリックス層間接続を有する多層回路及びその製造方法Info
- Publication number
- JP2000512083A JP2000512083A JP10501586A JP50158698A JP2000512083A JP 2000512083 A JP2000512083 A JP 2000512083A JP 10501586 A JP10501586 A JP 10501586A JP 50158698 A JP50158698 A JP 50158698A JP 2000512083 A JP2000512083 A JP 2000512083A
- Authority
- JP
- Japan
- Prior art keywords
- electrically conductive
- conductive element
- matrix
- width
- vias
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
- 239000011159 matrix material Substances 0.000 title claims abstract description 66
- 239000011229 interlayer Substances 0.000 title claims abstract description 41
- 238000004519 manufacturing process Methods 0.000 title claims description 26
- 239000010410 layer Substances 0.000 claims abstract description 38
- 239000004020 conductor Substances 0.000 claims abstract description 8
- 230000000149 penetrating effect Effects 0.000 claims abstract description 4
- 239000000758 substrate Substances 0.000 claims description 52
- 238000000034 method Methods 0.000 claims description 27
- 238000007747 plating Methods 0.000 claims description 5
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 238000000206 photolithography Methods 0.000 claims description 3
- 238000010292 electrical insulation Methods 0.000 claims 1
- 238000005530 etching Methods 0.000 claims 1
- 230000001568 sexual effect Effects 0.000 claims 1
- 238000001465 metallisation Methods 0.000 description 21
- 229920002120 photoresistant polymer Polymers 0.000 description 13
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 9
- 229910052802 copper Inorganic materials 0.000 description 9
- 239000010949 copper Substances 0.000 description 9
- 238000006073 displacement reaction Methods 0.000 description 5
- 239000004642 Polyimide Substances 0.000 description 4
- 229920001721 polyimide Polymers 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000000059 patterning Methods 0.000 description 3
- ROOXNKNUYICQNP-UHFFFAOYSA-N ammonium persulfate Chemical compound [NH4+].[NH4+].[O-]S(=O)(=O)OOS([O-])(=O)=O ROOXNKNUYICQNP-UHFFFAOYSA-N 0.000 description 2
- 238000011109 contamination Methods 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 230000001788 irregular Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- 238000009736 wetting Methods 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 1
- 229910001870 ammonium persulfate Inorganic materials 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000012459 cleaning agent Substances 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000005566 electron beam evaporation Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 229920000620 organic polymer Polymers 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/0979—Redundant conductors or connections, i.e. more than one current path between two points
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US08/663,626 | 1996-06-14 | ||
| US08/663,626 US5753976A (en) | 1996-06-14 | 1996-06-14 | Multi-layer circuit having a via matrix interlayer connection |
| PCT/US1997/007588 WO1997048256A1 (en) | 1996-06-14 | 1997-05-05 | Multi-layer circuit having a via matrix interlayer connection and method for fabricating the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2000512083A true JP2000512083A (ja) | 2000-09-12 |
| JP2000512083A5 JP2000512083A5 (enExample) | 2005-02-10 |
Family
ID=24662639
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10501586A Ceased JP2000512083A (ja) | 1996-06-14 | 1997-05-05 | バイアマトリックス層間接続を有する多層回路及びその製造方法 |
Country Status (7)
| Country | Link |
|---|---|
| US (2) | US5753976A (enExample) |
| JP (1) | JP2000512083A (enExample) |
| KR (1) | KR20000016520A (enExample) |
| CN (1) | CN1221551A (enExample) |
| DE (1) | DE19781552T1 (enExample) |
| MY (1) | MY133613A (enExample) |
| WO (1) | WO1997048256A1 (enExample) |
Families Citing this family (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6043559A (en) | 1996-09-09 | 2000-03-28 | Intel Corporation | Integrated circuit package which contains two in plane voltage busses and a wrap around conductive strip that connects a bond finger to one of the busses |
| AU2107197A (en) * | 1996-12-04 | 1998-06-29 | Samsung Electronics Co., Ltd. | High-power microwave-frequency hybrid integrated circuit |
| US6137178A (en) * | 1998-06-17 | 2000-10-24 | Siemens Aktiengesellschaft | Semiconductor metalization system and method |
| US6262579B1 (en) | 1998-11-13 | 2001-07-17 | Kulicke & Soffa Holdings, Inc. | Method and structure for detecting open vias in high density interconnect substrates |
| CN1444839A (zh) * | 2000-05-31 | 2003-09-24 | Ttm先进电路公司 | 填充方法 |
| US6506332B2 (en) | 2000-05-31 | 2003-01-14 | Honeywell International Inc. | Filling method |
| US6800232B2 (en) * | 2000-05-31 | 2004-10-05 | Ttm Advanced Circuits, Inc. | PCB support plate method for PCB via fill |
| US6454154B1 (en) | 2000-05-31 | 2002-09-24 | Honeywell Advanced Circuits, Inc. | Filling device |
| US6855385B2 (en) * | 2000-05-31 | 2005-02-15 | Ttm Advanced Circuits, Inc. | PCB support plate for PCB via fill |
| DE10196259T1 (de) | 2000-05-31 | 2003-05-15 | Honeywell Int Inc | Füllverfahren |
| KR100396695B1 (ko) * | 2000-11-01 | 2003-09-02 | 엘지.필립스 엘시디 주식회사 | 에천트 및 이를 이용한 전자기기용 기판의 제조방법 |
| US7088002B2 (en) | 2000-12-18 | 2006-08-08 | Intel Corporation | Interconnect |
| US7340076B2 (en) * | 2001-05-10 | 2008-03-04 | Digimarc Corporation | Digital watermarks for unmanned vehicle navigation |
| US20020169962A1 (en) * | 2001-05-10 | 2002-11-14 | Brundage Trent J. | Digital watermarks used in automation equipment |
| JP2004006538A (ja) * | 2002-05-31 | 2004-01-08 | Toshiba Corp | コネクタの固定構造、印刷配線板およびコネクタ固定方法 |
| US6867121B2 (en) * | 2003-01-16 | 2005-03-15 | International Business Machines Corporation | Method of apparatus for interconnecting a relatively fine pitch circuit layer and adjacent power plane(s) in a laminated construction |
| US7253510B2 (en) | 2003-01-16 | 2007-08-07 | International Business Machines Corporation | Ball grid array package construction with raised solder ball pads |
| US6876088B2 (en) | 2003-01-16 | 2005-04-05 | International Business Machines Corporation | Flex-based IC package construction employing a balanced lamination |
| US20040173803A1 (en) * | 2003-03-05 | 2004-09-09 | Advanced Micro Devices, Inc. | Interconnect structure having improved stress migration reliability |
| TW200531611A (en) * | 2004-02-04 | 2005-09-16 | Koninkl Philips Electronics Nv | Method and apparatus for increasing routing density for a circuit board |
| US8525402B2 (en) | 2006-09-11 | 2013-09-03 | 3M Innovative Properties Company | Illumination devices and methods for making the same |
| US8581393B2 (en) | 2006-09-21 | 2013-11-12 | 3M Innovative Properties Company | Thermally conductive LED assembly |
| US7847404B1 (en) * | 2007-03-29 | 2010-12-07 | Integrated Device Technology, Inc. | Circuit board assembly and packaged integrated circuit device with power and ground channels |
| TWI356480B (en) * | 2007-05-07 | 2012-01-11 | Siliconware Precision Industries Co Ltd | Semiconductor package substrate |
| CN107960004A (zh) * | 2016-10-14 | 2018-04-24 | 鹏鼎控股(深圳)股份有限公司 | 可伸缩电路板及其制作方法 |
| TWI711355B (zh) * | 2019-12-10 | 2020-11-21 | 欣興電子股份有限公司 | 電路板及其製造方法 |
Family Cites Families (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2468279A1 (fr) * | 1979-10-19 | 1981-04-30 | Dujardin Editions | Procede de fabrication de plaques comportant au moins un circuit imprime |
| DE3619226A1 (de) * | 1985-12-10 | 1987-06-11 | Robotron Veb K | Verdrahtungstraeger |
| US4720915A (en) * | 1986-03-25 | 1988-01-26 | True Grid, Ltd. | Printed circuit board and process for its manufacture |
| JPS6437073A (en) * | 1987-08-03 | 1989-02-07 | Sony Corp | Printed board |
| JPH01290283A (ja) * | 1988-05-17 | 1989-11-22 | Nec Corp | 混成集積回路用厚膜印刷基板 |
| US5468681A (en) * | 1989-08-28 | 1995-11-21 | Lsi Logic Corporation | Process for interconnecting conductive substrates using an interposer having conductive plastic filled vias |
| US5184210A (en) * | 1990-03-20 | 1993-02-02 | Digital Equipment Corporation | Structure for controlling impedance and cross-talk in a printed circuit substrate |
| US5288541A (en) * | 1991-10-17 | 1994-02-22 | International Business Machines Corporation | Method for metallizing through holes in thin film substrates, and resulting devices |
| US5227008A (en) * | 1992-01-23 | 1993-07-13 | Minnesota Mining And Manufacturing Company | Method for making flexible circuits |
| US5355019A (en) * | 1992-03-04 | 1994-10-11 | At&T Bell Laboratories | Devices with tape automated bonding |
| US5291092A (en) * | 1992-04-24 | 1994-03-01 | Gte Products Corporation | HID vehicle headlamp capsule assembly |
| US5334487A (en) * | 1992-07-23 | 1994-08-02 | International Business Machines Corporation | Method for forming a patterned layer on a substrate |
| US5291062A (en) * | 1993-03-01 | 1994-03-01 | Motorola, Inc. | Area array semiconductor device having a lid with functional contacts |
| US5447871A (en) * | 1993-03-05 | 1995-09-05 | Goldstein; Edward F. | Electrically conductive interconnection through a body of semiconductor material |
| AU6582294A (en) * | 1993-04-23 | 1994-11-21 | Nihon Micron Kabushiki Kaisha | Ic package and method of its manufacture |
| US5381306A (en) * | 1993-08-20 | 1995-01-10 | Convex Computer Corporation | Method and apparatus for delivering power using a multiplane power via matrix |
| US5448020A (en) * | 1993-12-17 | 1995-09-05 | Pendse; Rajendra D. | System and method for forming a controlled impedance flex circuit |
| US5463250A (en) * | 1994-04-29 | 1995-10-31 | Westinghouse Electric Corp. | Semiconductor component package |
| US5840402A (en) * | 1994-06-24 | 1998-11-24 | Sheldahl, Inc. | Metallized laminate material having ordered distribution of conductive through holes |
| US5487218A (en) * | 1994-11-21 | 1996-01-30 | International Business Machines Corporation | Method for making printed circuit boards with selectivity filled plated through holes |
-
1996
- 1996-06-14 US US08/663,626 patent/US5753976A/en not_active Expired - Fee Related
-
1997
- 1997-05-05 JP JP10501586A patent/JP2000512083A/ja not_active Ceased
- 1997-05-05 CN CN97195395A patent/CN1221551A/zh active Pending
- 1997-05-05 DE DE19781552T patent/DE19781552T1/de not_active Withdrawn
- 1997-05-05 KR KR1019980710108A patent/KR20000016520A/ko not_active Ceased
- 1997-05-05 WO PCT/US1997/007588 patent/WO1997048256A1/en not_active Ceased
- 1997-06-03 MY MYPI97002434A patent/MY133613A/en unknown
-
1998
- 1998-02-19 US US09/026,090 patent/US6153508A/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| US6153508A (en) | 2000-11-28 |
| US5753976A (en) | 1998-05-19 |
| DE19781552T1 (de) | 1999-05-12 |
| MY133613A (en) | 2007-11-30 |
| CN1221551A (zh) | 1999-06-30 |
| KR20000016520A (ko) | 2000-03-25 |
| WO1997048256A1 (en) | 1997-12-18 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20040506 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20040506 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20051220 |
|
| A313 | Final decision of rejection without a dissenting response from the applicant |
Free format text: JAPANESE INTERMEDIATE CODE: A313 Effective date: 20060508 |
|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20060627 |