DE19781552T1 - Mehrschichtschaltung mit einer Durchgangsloch-Matrix-Zwischenschicht-Verbindung und Verfahren zu deren Herstellung - Google Patents

Mehrschichtschaltung mit einer Durchgangsloch-Matrix-Zwischenschicht-Verbindung und Verfahren zu deren Herstellung

Info

Publication number
DE19781552T1
DE19781552T1 DE19781552T DE19781552T DE19781552T1 DE 19781552 T1 DE19781552 T1 DE 19781552T1 DE 19781552 T DE19781552 T DE 19781552T DE 19781552 T DE19781552 T DE 19781552T DE 19781552 T1 DE19781552 T1 DE 19781552T1
Authority
DE
Germany
Prior art keywords
production
layer circuit
interlayer connection
hole matrix
matrix interlayer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE19781552T
Other languages
English (en)
Inventor
Paul Marlan Harvey
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Co
Original Assignee
Minnesota Mining and Manufacturing Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Minnesota Mining and Manufacturing Co filed Critical Minnesota Mining and Manufacturing Co
Publication of DE19781552T1 publication Critical patent/DE19781552T1/de
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/0979—Redundant conductors or connections, i.e. more than one current path between two points

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
DE19781552T 1996-06-14 1997-05-05 Mehrschichtschaltung mit einer Durchgangsloch-Matrix-Zwischenschicht-Verbindung und Verfahren zu deren Herstellung Withdrawn DE19781552T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/663,626 US5753976A (en) 1996-06-14 1996-06-14 Multi-layer circuit having a via matrix interlayer connection
PCT/US1997/007588 WO1997048256A1 (en) 1996-06-14 1997-05-05 Multi-layer circuit having a via matrix interlayer connection and method for fabricating the same

Publications (1)

Publication Number Publication Date
DE19781552T1 true DE19781552T1 (de) 1999-05-12

Family

ID=24662639

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19781552T Withdrawn DE19781552T1 (de) 1996-06-14 1997-05-05 Mehrschichtschaltung mit einer Durchgangsloch-Matrix-Zwischenschicht-Verbindung und Verfahren zu deren Herstellung

Country Status (7)

Country Link
US (2) US5753976A (de)
JP (1) JP2000512083A (de)
KR (1) KR20000016520A (de)
CN (1) CN1221551A (de)
DE (1) DE19781552T1 (de)
MY (1) MY133613A (de)
WO (1) WO1997048256A1 (de)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6043559A (en) 1996-09-09 2000-03-28 Intel Corporation Integrated circuit package which contains two in plane voltage busses and a wrap around conductive strip that connects a bond finger to one of the busses
WO1998025306A1 (fr) * 1996-12-04 1998-06-11 Samsung Electronics Co., Ltd. Circuit integre hybride hyperfrequence et de grande puissance
US6137178A (en) * 1998-06-17 2000-10-24 Siemens Aktiengesellschaft Semiconductor metalization system and method
US6262579B1 (en) 1998-11-13 2001-07-17 Kulicke & Soffa Holdings, Inc. Method and structure for detecting open vias in high density interconnect substrates
KR20030007753A (ko) * 2000-05-31 2003-01-23 허니웰 인터내셔날 인코포레이티드 채움 방법
US6800232B2 (en) * 2000-05-31 2004-10-05 Ttm Advanced Circuits, Inc. PCB support plate method for PCB via fill
US6855385B2 (en) * 2000-05-31 2005-02-15 Ttm Advanced Circuits, Inc. PCB support plate for PCB via fill
US6454154B1 (en) 2000-05-31 2002-09-24 Honeywell Advanced Circuits, Inc. Filling device
US6506332B2 (en) 2000-05-31 2003-01-14 Honeywell International Inc. Filling method
JP2003535465A (ja) 2000-05-31 2003-11-25 ハネウエル・インターナシヨナル・インコーポレーテツド 充填装置
KR100396695B1 (ko) * 2000-11-01 2003-09-02 엘지.필립스 엘시디 주식회사 에천트 및 이를 이용한 전자기기용 기판의 제조방법
US7088002B2 (en) 2000-12-18 2006-08-08 Intel Corporation Interconnect
US7340076B2 (en) * 2001-05-10 2008-03-04 Digimarc Corporation Digital watermarks for unmanned vehicle navigation
US20020169962A1 (en) * 2001-05-10 2002-11-14 Brundage Trent J. Digital watermarks used in automation equipment
JP2004006538A (ja) * 2002-05-31 2004-01-08 Toshiba Corp コネクタの固定構造、印刷配線板およびコネクタ固定方法
US6867121B2 (en) * 2003-01-16 2005-03-15 International Business Machines Corporation Method of apparatus for interconnecting a relatively fine pitch circuit layer and adjacent power plane(s) in a laminated construction
US7253510B2 (en) * 2003-01-16 2007-08-07 International Business Machines Corporation Ball grid array package construction with raised solder ball pads
US6876088B2 (en) 2003-01-16 2005-04-05 International Business Machines Corporation Flex-based IC package construction employing a balanced lamination
US20040173803A1 (en) * 2003-03-05 2004-09-09 Advanced Micro Devices, Inc. Interconnect structure having improved stress migration reliability
US8525402B2 (en) 2006-09-11 2013-09-03 3M Innovative Properties Company Illumination devices and methods for making the same
US8581393B2 (en) 2006-09-21 2013-11-12 3M Innovative Properties Company Thermally conductive LED assembly
US7847404B1 (en) * 2007-03-29 2010-12-07 Integrated Device Technology, Inc. Circuit board assembly and packaged integrated circuit device with power and ground channels
TWI356480B (en) * 2007-05-07 2012-01-11 Siliconware Precision Industries Co Ltd Semiconductor package substrate
CN107960004A (zh) * 2016-10-14 2018-04-24 鹏鼎控股(深圳)股份有限公司 可伸缩电路板及其制作方法
TWI711355B (zh) * 2019-12-10 2020-11-21 欣興電子股份有限公司 電路板及其製造方法

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2468279A1 (fr) * 1979-10-19 1981-04-30 Dujardin Editions Procede de fabrication de plaques comportant au moins un circuit imprime
DE3619226A1 (de) * 1985-12-10 1987-06-11 Robotron Veb K Verdrahtungstraeger
US4720915A (en) * 1986-03-25 1988-01-26 True Grid, Ltd. Printed circuit board and process for its manufacture
JPS6437073A (en) * 1987-08-03 1989-02-07 Sony Corp Printed board
JPH01290283A (ja) * 1988-05-17 1989-11-22 Nec Corp 混成集積回路用厚膜印刷基板
US5468681A (en) * 1989-08-28 1995-11-21 Lsi Logic Corporation Process for interconnecting conductive substrates using an interposer having conductive plastic filled vias
US5184210A (en) * 1990-03-20 1993-02-02 Digital Equipment Corporation Structure for controlling impedance and cross-talk in a printed circuit substrate
US5288541A (en) * 1991-10-17 1994-02-22 International Business Machines Corporation Method for metallizing through holes in thin film substrates, and resulting devices
US5227008A (en) * 1992-01-23 1993-07-13 Minnesota Mining And Manufacturing Company Method for making flexible circuits
US5355019A (en) * 1992-03-04 1994-10-11 At&T Bell Laboratories Devices with tape automated bonding
US5291092A (en) * 1992-04-24 1994-03-01 Gte Products Corporation HID vehicle headlamp capsule assembly
US5334487A (en) * 1992-07-23 1994-08-02 International Business Machines Corporation Method for forming a patterned layer on a substrate
US5291062A (en) * 1993-03-01 1994-03-01 Motorola, Inc. Area array semiconductor device having a lid with functional contacts
US5447871A (en) * 1993-03-05 1995-09-05 Goldstein; Edward F. Electrically conductive interconnection through a body of semiconductor material
WO1994025984A1 (en) * 1993-04-23 1994-11-10 Nihon Micron Kabushiki Kaisha Ic package and method of its manufacture
US5381306A (en) * 1993-08-20 1995-01-10 Convex Computer Corporation Method and apparatus for delivering power using a multiplane power via matrix
US5448020A (en) * 1993-12-17 1995-09-05 Pendse; Rajendra D. System and method for forming a controlled impedance flex circuit
US5463250A (en) * 1994-04-29 1995-10-31 Westinghouse Electric Corp. Semiconductor component package
US5840402A (en) * 1994-06-24 1998-11-24 Sheldahl, Inc. Metallized laminate material having ordered distribution of conductive through holes
US5487218A (en) * 1994-11-21 1996-01-30 International Business Machines Corporation Method for making printed circuit boards with selectivity filled plated through holes

Also Published As

Publication number Publication date
MY133613A (en) 2007-11-30
US5753976A (en) 1998-05-19
CN1221551A (zh) 1999-06-30
WO1997048256A1 (en) 1997-12-18
US6153508A (en) 2000-11-28
JP2000512083A (ja) 2000-09-12
KR20000016520A (ko) 2000-03-25

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Legal Events

Date Code Title Description
8139 Disposal/non-payment of the annual fee