JP2000500265A5 - - Google Patents

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Publication number
JP2000500265A5
JP2000500265A5 JP1997507104A JP50710497A JP2000500265A5 JP 2000500265 A5 JP2000500265 A5 JP 2000500265A5 JP 1997507104 A JP1997507104 A JP 1997507104A JP 50710497 A JP50710497 A JP 50710497A JP 2000500265 A5 JP2000500265 A5 JP 2000500265A5
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1997507104A
Other languages
English (en)
Japanese (ja)
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JP2000500265A (ja
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Publication date
Application filed filed Critical
Priority claimed from PCT/DE1996/001408 external-priority patent/WO1997005644A1/de
Publication of JP2000500265A publication Critical patent/JP2000500265A/ja
Publication of JP2000500265A5 publication Critical patent/JP2000500265A5/ja
Pending legal-status Critical Current

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JP9507104A 1995-07-25 1996-07-24 高分解能透過電子顕微鏡におけるイオン薄肉化方法および装置 Pending JP2000500265A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE19527059.2 1995-07-25
DE19527059 1995-07-25
PCT/DE1996/001408 WO1997005644A1 (de) 1995-07-25 1996-07-24 Verfahren und vorrichtung zur ionendünnung in einem hochauflösenden transmissionselektronenmikroskop

Publications (2)

Publication Number Publication Date
JP2000500265A JP2000500265A (ja) 2000-01-11
JP2000500265A5 true JP2000500265A5 (enExample) 2004-08-26

Family

ID=7767678

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9507104A Pending JP2000500265A (ja) 1995-07-25 1996-07-24 高分解能透過電子顕微鏡におけるイオン薄肉化方法および装置

Country Status (5)

Country Link
US (1) US6218663B1 (enExample)
EP (1) EP0840940B1 (enExample)
JP (1) JP2000500265A (enExample)
DE (2) DE59605446D1 (enExample)
WO (1) WO1997005644A1 (enExample)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19802848B4 (de) * 1998-01-26 2012-02-02 Display Products Group,Inc. Verfahren und Vorrichtung zum Testen eines Substrats
JP2000035391A (ja) * 1998-07-16 2000-02-02 Seiko Instruments Inc 薄片化加工時の試料歪除去方法
US20040146430A1 (en) * 2002-10-15 2004-07-29 Dugas Matthew P. Solid state membrane channel device for the measurement and characterization of atomic and molecular sized samples
JP3970656B2 (ja) * 2002-03-27 2007-09-05 株式会社日立ハイテクノロジーズ 透過電子顕微鏡による試料観察方法
US7002152B2 (en) * 2003-02-15 2006-02-21 Bal-Tec Ag Sample preparation for transmission electron microscopy
DE602004021750D1 (de) 2003-07-14 2009-08-13 Fei Co Zweistrahlsystem
US7297965B2 (en) * 2004-07-14 2007-11-20 Applied Materials, Israel, Ltd. Method and apparatus for sample formation and microanalysis in a vacuum chamber
US7132673B2 (en) * 2004-07-30 2006-11-07 E.A. Fischione Instruments, Inc. Device and method for milling of material using ions
CN101069260B (zh) * 2004-08-24 2012-09-26 西拉半导体工程实验室有限公司 工件的离子束铣削及其程度的确定和控制
US7214935B2 (en) * 2004-09-30 2007-05-08 International Business Machines Corporation Transmission electron microscopy sample preparation method for electron holography
US20060076511A1 (en) * 2004-10-08 2006-04-13 Applied Materials, Inc. Shallow angle cut along a longitudinal direction of a feature in a semiconductor wafer
JP4664041B2 (ja) * 2004-10-27 2011-04-06 株式会社日立ハイテクノロジーズ 荷電粒子ビーム装置及び試料作製方法
EP1657736B1 (en) * 2004-11-15 2016-12-14 ICT Integrated Circuit Testing Gesellschaft für Halbleiterprüftechnik mbH High current density particle beam system
EP1883094B1 (en) * 2006-07-24 2012-05-02 ICT, Integrated Circuit Testing Gesellschaft für Halbleiterprüftechnik mbH Charged particle beam device and method for inspecting specimen
JP2007250542A (ja) * 2007-03-13 2007-09-27 National Institute For Materials Science 微細加工方法
JP5702552B2 (ja) * 2009-05-28 2015-04-15 エフ イー アイ カンパニFei Company デュアルビームシステムの制御方法
CN101581637B (zh) * 2009-06-19 2011-08-17 武汉钢铁(集团)公司 一种带有硅钢片涂层的电镜薄膜样品的制备方法
EP2593958B1 (en) 2010-07-14 2019-02-20 FEI Company Improved contrast for scanning confocal electron microscope
DK2710109T3 (en) * 2011-05-19 2018-01-22 Nmi Naturwissenschaftliches Und Medizinisches Institut An Der Univ Tuebingen Method and use of a device for automated positioning of a microsystem for manipulating a spherical micro object
US20230268157A1 (en) * 2020-07-03 2023-08-24 Mel-Build Corporation Specimen holder
CN114923753B (zh) * 2022-05-25 2025-07-15 江苏第三代半导体研究院有限公司 用于电子显微镜的样品的制备方法
CN115159446B (zh) * 2022-06-17 2024-07-12 燕山大学 硅微/纳米柱的制备方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2243616A1 (de) 1972-09-01 1974-03-07 Siemens Ag Korpuskularstrahlgeraet mit einer blende zwischen zwei vakuumraeumen
US4128765A (en) 1976-10-29 1978-12-05 Joseph Franks Ion beam machining techniques and apparatus
JP2811073B2 (ja) * 1988-11-01 1998-10-15 セイコーインスツルメンツ株式会社 断面加工観察装置
JPH0775156B2 (ja) * 1992-03-06 1995-08-09 ▲巌▼ 大泊 イオン照射装置及び方法
JP3132938B2 (ja) 1993-02-03 2001-02-05 セイコーインスツルメンツ株式会社 断面加工観察用荷電ビーム装置および加工方法
JP3119959B2 (ja) * 1993-02-05 2000-12-25 セイコーインスツルメンツ株式会社 集束イオンビーム装置および加工観察装置
JP2987417B2 (ja) * 1993-03-04 1999-12-06 科学技術庁金属材料技術研究所長 透過型電子顕微鏡用の薄膜試料のその場作製および観察方法並びにその装置
US5443684A (en) * 1994-02-28 1995-08-22 The United States Of America As Represented By The Secretary Of The Army Method for measuring thin film thickness
JP3221797B2 (ja) * 1994-06-14 2001-10-22 株式会社日立製作所 試料作成方法及びその装置
JP3265901B2 (ja) * 1995-03-24 2002-03-18 株式会社日立製作所 集束イオンビーム装置及び集束イオンビーム照射方法
DE29507225U1 (de) * 1995-04-29 1995-07-13 Grünewald, Wolfgang, Dr.rer.nat., 09122 Chemnitz Ionenstrahlpräparationsvorrichtung für die Elektronenmikroskopie

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